JP6163398B2 - 撮像素子、製造装置、製造方法 - Google Patents

撮像素子、製造装置、製造方法 Download PDF

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JP6163398B2
JP6163398B2 JP2013193376A JP2013193376A JP6163398B2 JP 6163398 B2 JP6163398 B2 JP 6163398B2 JP 2013193376 A JP2013193376 A JP 2013193376A JP 2013193376 A JP2013193376 A JP 2013193376A JP 6163398 B2 JP6163398 B2 JP 6163398B2
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shape
photoelectric conversion
correction unit
conversion unit
angle
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Japanese (ja)
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JP2015061193A (ja
JP2015061193A5 (enExample
Inventor
戸田　淳
淳 戸田
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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Priority to JP2013193376A priority Critical patent/JP6163398B2/ja
Priority to KR1020167006374A priority patent/KR102310376B1/ko
Priority to PCT/JP2014/004647 priority patent/WO2015040825A2/en
Priority to US14/911,590 priority patent/US10401619B2/en
Priority to CN201480050326.3A priority patent/CN105612619B/zh
Publication of JP2015061193A publication Critical patent/JP2015061193A/ja
Publication of JP2015061193A5 publication Critical patent/JP2015061193A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/61—Noise processing, e.g. detecting, correcting, reducing or removing noise the noise originating only from the lens unit, e.g. flare, shading, vignetting or "cos4"
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/18—Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses
    • G02B3/14—Fluid-filled or evacuated lenses of variable focal length
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B2003/0093—Simple or compound lenses characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00—Details of colour television systems
    • H04N2209/04—Picture signal generators
    • H04N2209/041—Picture signal generators using solid-state devices
    • H04N2209/042—Picture signal generators using solid-state devices having a single pick-up sensor
    • H04N2209/047—Picture signal generators using solid-state devices having a single pick-up sensor using multispectral pick-up elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lenses (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP2013193376A 2013-09-18 2013-09-18 撮像素子、製造装置、製造方法 Active JP6163398B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013193376A JP6163398B2 (ja) 2013-09-18 2013-09-18 撮像素子、製造装置、製造方法
KR1020167006374A KR102310376B1 (ko) 2013-09-18 2014-09-10 촬상 장치, 제조 장치, 제조 방법, 및 전자 기기
PCT/JP2014/004647 WO2015040825A2 (en) 2013-09-18 2014-09-10 Imaging device, manufacturing apparatus, manufacturing method, and electronic apparatus
US14/911,590 US10401619B2 (en) 2013-09-18 2014-09-10 Imaging device, manufacturing apparatus, manufacturing method, and electronic apparatus
CN201480050326.3A CN105612619B (zh) 2013-09-18 2014-09-10 成像器件、制造装置、制造方法以及电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193376A JP6163398B2 (ja) 2013-09-18 2013-09-18 撮像素子、製造装置、製造方法

Publications (3)

Publication Number Publication Date
JP2015061193A JP2015061193A (ja) 2015-03-30
JP2015061193A5 JP2015061193A5 (enExample) 2016-03-10
JP6163398B2 true JP6163398B2 (ja) 2017-07-12

Family

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JP2013193376A Active JP6163398B2 (ja) 2013-09-18 2013-09-18 撮像素子、製造装置、製造方法

Country Status (5)

Country Link
US (1) US10401619B2 (enExample)
JP (1) JP6163398B2 (enExample)
KR (1) KR102310376B1 (enExample)
CN (1) CN105612619B (enExample)
WO (1) WO2015040825A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6918409B2 (ja) * 2017-01-26 2021-08-11 ソニーセミコンダクタソリューションズ株式会社 カメラモジュールおよびその製造方法、並びに電子機器
JP2018200980A (ja) 2017-05-29 2018-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置および固体撮像素子、並びに電子機器
JP2018200423A (ja) 2017-05-29 2018-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
JP7146376B2 (ja) 2017-08-31 2022-10-04 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
US12306382B2 (en) 2018-06-08 2025-05-20 Sony Semiconductor Solutions Corporation Imaging device
DE112019002909B4 (de) 2018-06-08 2024-05-23 Sony Semiconductor Solutions Corporation Bildgebungsvorrichtung
KR102725516B1 (ko) 2018-06-08 2024-11-01 소니 세미컨덕터 솔루션즈 가부시키가이샤 촬상 장치
KR102724357B1 (ko) 2018-06-08 2024-10-30 소니 세미컨덕터 솔루션즈 가부시키가이샤 촬상 장치
JP2019213151A (ja) 2018-06-08 2019-12-12 ソニーセミコンダクタソリューションズ株式会社 撮像装置
JP2020068302A (ja) 2018-10-24 2020-04-30 ソニーセミコンダクタソリューションズ株式会社 撮像装置
EP3982410B1 (en) 2019-06-06 2025-09-10 Sony Semiconductor Solutions Corporation Imaging device
CN110365886A (zh) * 2019-08-01 2019-10-22 珠海格力电器股份有限公司 一种光学防抖摄像头模组
US12107103B2 (en) 2019-11-13 2024-10-01 Sony Semiconductor Solutions Corporation Imaging apparatus and electronic equipment for peeling off prevention in lens
KR102813299B1 (ko) * 2019-12-24 2025-05-28 삼성전자주식회사 이미지 장치 및 이미지 센싱 방법
WO2021166672A1 (ja) * 2020-02-20 2021-08-26 ソニーセミコンダクタソリューションズ株式会社 撮像装置、電子機器

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JPH1062609A (ja) * 1996-08-22 1998-03-06 Nikon Corp マイクロレンズ及び該レンズを用いた撮像装置
JPH10229180A (ja) * 1997-02-14 1998-08-25 Sony Corp 固体撮像素子
JP4270689B2 (ja) * 1999-11-24 2009-06-03 本田技研工業株式会社 太陽光発電装置
US6702483B2 (en) * 2000-02-17 2004-03-09 Canon Kabushiki Kaisha Optical element
KR100477784B1 (ko) * 2000-08-31 2005-03-22 매그나칩 반도체 유한회사 트렌치 내부의 공기로 이루어지는 집광층을 구비하는이미지 센서 및 그 제조 방법
JP4776181B2 (ja) 2004-06-02 2011-09-21 三菱電機株式会社 照明制御装置、照明装置、照明制御システム及び照明システム
JP4599497B2 (ja) 2005-03-18 2010-12-15 ヤンマー株式会社 根菜作物収穫機
JP4538353B2 (ja) 2005-03-25 2010-09-08 富士フイルム株式会社 光電変換膜積層型カラー固体撮像素子
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Also Published As

Publication number Publication date
US20160202475A1 (en) 2016-07-14
WO2015040825A2 (en) 2015-03-26
CN105612619B (zh) 2019-09-13
KR20160058779A (ko) 2016-05-25
JP2015061193A (ja) 2015-03-30
KR102310376B1 (ko) 2021-10-08
CN105612619A (zh) 2016-05-25
WO2015040825A3 (en) 2015-05-21
US10401619B2 (en) 2019-09-03

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