CN105590926B - 电子组件、电子模块、其制造方法以及电子装置 - Google Patents

电子组件、电子模块、其制造方法以及电子装置 Download PDF

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Publication number
CN105590926B
CN105590926B CN201510746623.8A CN201510746623A CN105590926B CN 105590926 B CN105590926 B CN 105590926B CN 201510746623 A CN201510746623 A CN 201510746623A CN 105590926 B CN105590926 B CN 105590926B
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China
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conductive pattern
electronic device
conductive
electronic
mounting
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CN201510746623.8A
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English (en)
Chinese (zh)
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CN105590926A (zh
Inventor
三宅高史
增田正道
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Canon Inc
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Canon Inc
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN201510746623.8A 2014-11-06 2015-11-05 电子组件、电子模块、其制造方法以及电子装置 Active CN105590926B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014226086A JP6566625B2 (ja) 2014-11-06 2014-11-06 電子部品、電子モジュール及びこれらの製造方法、電子機器
JP2014-226086 2014-11-06

Publications (2)

Publication Number Publication Date
CN105590926A CN105590926A (zh) 2016-05-18
CN105590926B true CN105590926B (zh) 2018-10-02

Family

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Country Status (3)

Country Link
US (1) US10236243B2 (cg-RX-API-DMAC10.html)
JP (1) JP6566625B2 (cg-RX-API-DMAC10.html)
CN (1) CN105590926B (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
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KR102435127B1 (ko) * 2015-07-06 2022-08-24 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 카메라 모듈
JP2018014462A (ja) 2016-07-22 2018-01-25 キヤノン株式会社 光学センサー及びスキャナユニット、画像形成装置
JP2020167366A (ja) * 2019-02-26 2020-10-08 ローム株式会社 半導体発光装置および半導体発光装置の製造方法
JP2020167422A (ja) * 2020-06-03 2020-10-08 キヤノン株式会社 光学センサー及びスキャナユニット、画像形成装置
TWI742720B (zh) * 2020-06-12 2021-10-11 友達光電股份有限公司 顯示裝置及其製造方法
JP7512785B2 (ja) 2020-09-15 2024-07-09 株式会社デンソー 電子装置
CN112491116B (zh) * 2020-12-08 2023-04-18 歌尔科技有限公司 一种可穿戴设备及其可拆卸密封充电结构
CN113745394B (zh) * 2021-09-08 2023-10-13 Tcl华星光电技术有限公司 发光基板及其制备方法

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CN101436571A (zh) * 2007-11-16 2009-05-20 英飞凌科技股份有限公司 电器件和方法
CN101675518A (zh) * 2007-05-10 2010-03-17 飞思卡尔半导体公司 芯片上功率引线球栅阵列封装
CN102130113A (zh) * 2006-04-27 2011-07-20 克里公司 用于半导体发光器件封装的子基板和包括其的半导体发光器件封装
CN102956587A (zh) * 2011-08-17 2013-03-06 三星电子株式会社 半导体封装、封装堆叠结构及其上封装
CN104916645A (zh) * 2014-03-13 2015-09-16 株式会社东芝 半导体装置及半导体装置的制造方法

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JPH11297876A (ja) * 1998-04-06 1999-10-29 Nec Corp ボール・グリッド・アレイの実装構造
JP2000059013A (ja) * 1998-08-05 2000-02-25 Tdk Corp 電子部品のモールド構造
JP3531573B2 (ja) 2000-03-17 2004-05-31 株式会社村田製作所 積層型セラミック電子部品およびその製造方法ならびに電子装置
JP2002164479A (ja) * 2000-11-22 2002-06-07 Niigata Seimitsu Kk 半導体装置およびその製造方法
JP2005294343A (ja) 2004-03-31 2005-10-20 Citizen Electronics Co Ltd 受光集積回路装置
US7365371B2 (en) * 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
JP2007199049A (ja) 2005-12-27 2007-08-09 Yamaha Corp 半導体装置
JP2008277325A (ja) * 2007-04-25 2008-11-13 Canon Inc 半導体装置及び半導体装置の製造方法
JP2009188086A (ja) * 2008-02-05 2009-08-20 Seiko Instruments Inc 回路基板、これを用いた電子機器及び回路基板の製造方法
JP5625340B2 (ja) * 2009-12-07 2014-11-19 富士通セミコンダクター株式会社 半導体装置とその製造方法
CN103140066B (zh) * 2011-12-02 2018-01-16 深圳富泰宏精密工业有限公司 装饰性外壳制造方法
JP2015171109A (ja) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 電子デバイス、電子機器および移動体

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CN101675518A (zh) * 2007-05-10 2010-03-17 飞思卡尔半导体公司 芯片上功率引线球栅阵列封装
CN101436571A (zh) * 2007-11-16 2009-05-20 英飞凌科技股份有限公司 电器件和方法
CN102956587A (zh) * 2011-08-17 2013-03-06 三星电子株式会社 半导体封装、封装堆叠结构及其上封装
CN104916645A (zh) * 2014-03-13 2015-09-16 株式会社东芝 半导体装置及半导体装置的制造方法

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US20160135301A1 (en) 2016-05-12
JP2016092259A (ja) 2016-05-23
US10236243B2 (en) 2019-03-19
JP6566625B2 (ja) 2019-08-28
CN105590926A (zh) 2016-05-18

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