CN105578757B - 印刷电路板及电子设备 - Google Patents
印刷电路板及电子设备 Download PDFInfo
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- CN105578757B CN105578757B CN201510701210.8A CN201510701210A CN105578757B CN 105578757 B CN105578757 B CN 105578757B CN 201510701210 A CN201510701210 A CN 201510701210A CN 105578757 B CN105578757 B CN 105578757B
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Abstract
本发明提供一种印刷电路板及电子设备。在封装基板的表面上相互间隔地形成多个焊盘。在印刷线路板的表面上相互间隔地形成其他多个焊盘。所述封装基板的表面与所述印刷线路板的表面相互面对。利用焊料将多个焊盘与其他多个焊盘相互接合,所述焊料在相应焊盘处具有小于等于焊料接合部的直径的30%的高度。在其他多个焊盘当中、到焊盘中的相应的一个焊盘的距离值至少大于焊盘与其他焊盘之间的平均距离值的焊盘中的各个的焊料接合面积,与焊盘中的相应的一个焊盘的焊料接合面积的比,大于等于56%且小于等于81%。
Description
技术领域
本发明涉及一种印刷电路板及包括该印刷电路板的电子设备,在该印刷电路板中,通过焊料将半导体封装的焊盘(land)与印刷线路板的焊盘互相接合。
背景技术
由于最近安装在电子设备中的半导体元件的性能的提升,要求安装有半导体元件的半导体封装的焊盘(电极)实现高引线数,以实现半导体元件的稳定且高速的操作。此外,为了满足移动设备、数字照相机等的更小及更薄的要求,需要以更细的间距排列焊盘,从而以更小的半导体封装达成高引线数。
采用球栅阵列(Ball Grid Array,BGA)和焊盘栅格阵列(Land Grid Array,LGA)来实现以细间距排列的焊盘具有多引线数的半导体封装,通过BGA和LGA,焊盘能够被密集地以栅格状排列在封装基板的下表面上。BGA半导体封装被形成为使得在半导体封装被附装到印刷线路板(母版)上之前,通过回流加热将焊锡球安装在焊盘上,从而电极具有一定高度。
然后,BGA半导体封装被附装到印刷线路板上,在该印刷线路板上,焊料被施加到焊盘上。然后,再次进行回流加热,使得BGA半导体封装被安装在印刷线路板上。
在半导体封装上未安装焊锡球的状态下,通过施加到焊盘上的焊料将LGA半导体封装直接附装到印刷线路板,然后通过回流加热将LGA半导体封装安装在印刷线路板上。如上所述,在LGA半导体封装上未安装焊锡球,因此有利于实现印刷电路板的更低的高度。此外,LGA半导体封装不需要在制造半导体封装时用于安装焊锡球的回流加热,因此有利于用于热耐久性低的半导体设备封装,从而减小在制造时的加热处理次数。
由于上述特征,LGA被频繁用于安装有图像传感器元件的图像传感器封装,在要求薄且热耐久性低的移动设备和数字照相机中,该图像传感器元件是成像半导体元件。一般地,图像传感器封装是通过将图像传感器元件安装在以凹形成型的封装基板上并且利用玻璃密封成像表面侧而形成的中空LGA半导体封装。
为了减小异物对图像传感器元件的受光单元的附着,在许多情况下,用作图像传感器封装的LGA封装的基板的基材,是特征为与有机基板相比具有更少扬尘量的陶瓷材料。陶瓷材料的特征还在于高的热传导性,因此有利于防止由于热噪声而引起的图像质量劣化,该热噪声是通过排放当长时间操作图像传感器元件用于例如实时取景拍摄以及运动图像拍摄产生的热而引起的。
然而,通过烧制来形成使用陶瓷材料的封装基板,因此由于在烧制中的收缩,在封装基板上很可能发生翘曲和起伏。因此,在使用用于封装基板的陶瓷材料的LGA半导体封装中,无法实现焊盘的平坦性。
在印刷线路板上安装具有上述低平坦性的LGA半导体封装,导致如下状态:在相互相对的封装基板的焊盘与印刷线路板的焊盘之间,一些部分具有大距离,而一些部分具有小的距离。当在这种状态下进行回流加热时,在焊盘之间的距离大的部分,结果熔融焊料被延伸。由于表面张力,延伸的熔融焊料产生减小表面积的力。即,产生减小封装基板与印刷线路板之间的距离的力。在加热处理中,在焊盘之间的距离大的部分处的焊料很可能被撕裂。
此外,减小封装基板与印刷线路板之间的距离的力乘以延伸的熔融焊料的数量,使得整体上力变大。结果,在焊盘之间的距离小的接合部的熔融焊料,被由延伸的熔融焊料产生的减小封装基板与印刷线路板之间的距离的力的总和以及半导体封装的负荷而压碎。结果,熔融焊料从焊盘展开。此外,由于焊盘之间的距离小,在这种部分的焊料也容易被压扁。展开到焊盘之外并与相邻焊盘的焊料接触的熔融焊料,导致在焊料凝固后的焊料桥接失败。
总而言之,当将翘曲或起伏的半导体封装接合到印刷线路板时,很可能发生焊料桥接失败。日本特开2005-11921号公报公开了解决该问题的方法。具体而言,在该方法中,向封装焊盘与基板焊盘之间的距离大的接合部提供更大印刷量的焊膏。通过增加熔融焊料的量,减小了由延伸的焊料施加的、减小封装基板与印刷线路板之间的距离的力。因此,促进了防止由于压扁的焊料而引起的焊料桥接失败的尝试。
此外,在日本特开2005-11921号公报中描述的方法中,在封装基板与印刷线路板之间的距离大的接合部的焊膏的印刷量大,因此焊料不太可能被撕裂。
为了实现更高灵敏度、更大量像素、以及改进的运动图像拍摄功能,如同在诸如应用集成电路(ASIC)或存储器的其他半导体封装中,在图像传感器封装中也越来越需要高引线数和更小的间距。在制造之后,由烧制而形成的陶瓷基板上的焊盘的位置大幅变化。因此,陶瓷基板需要被制造为具有大面积的焊盘,以防止安装到印刷线路板上时的失准。结果,在封装基板上的相邻焊盘之间的距离小。如上所述,未安装有焊锡球的LGA半导体封装一般用于图像传感器封装。
如同日本特开2005-11921号公报描述的方法中,为了在无焊锡球的大焊盘处实现由延伸的焊料施加的减小封装与基板之间的距离的力的熔融焊料体积,需要供给极大体积的焊膏。当大量焊膏被供给到相邻焊盘之间的距离小的部分时,在相邻焊盘处,焊膏很可能由于部件的安装或回流加热引起的焊膏的坍落而相互接触,因此焊料桥接失败很可能发生。
在焊盘之间的距离小的部分,大体积的焊料在熔融时具有大的直径,因此很可能与相邻焊盘的焊料接触,从而引起焊料桥接失败的风险。
在焊盘的直径大且焊盘之间的距离短的接合部,为了减小由于压扁的焊料之外的原因引起的焊料桥接失败,优选将焊料供给量调整为使得接合后的焊料高度变为小于等于焊盘直径的30%的值。因此,在用于图像传感器封装的半导体封装中,难以供给大量的焊料。
当将LGA半导体封装安装在印刷电路板上时,不使用焊锡球,因此仅需要利用焊膏来供给焊料。因此,与具有焊锡球的BGA半导体封装相比,在LGA半导体封装中,供给到接合部的助焊剂的量更大。通过熔融,焊膏被分离为焊料与助焊剂。如果助焊剂留在形成印刷线路板的焊盘的阻焊的凹处,可能阻碍熔融的焊料展开到印刷线路板的焊盘。结果,在涉及大量助焊剂的LGA半导体封装中,由于助焊剂留在阻焊的凹处,很漏接合头失败很可能发生。
发明内容
因此,本发明旨在减小焊料桥接失败和漏接合头失败。
根据本发明的一个方面,一种印刷电路板包括:半导体封装,其包括半导体元件和封装基板;以及印刷接线板,其上安装有所述半导体封装,其中,在所述封装基板的表面上彼此间隔地形成多个第一焊盘,其中,在所述印刷接线板的表面上彼此间隔地形成多个第二焊盘,其中,所述封装基板的表面与所述印刷接线板的表面彼此面对,并且利用焊料将所述多个第一焊盘中的各个与所述多个第二焊盘中的相应的一个第二焊盘相互接合,所述焊料在所述多个第一焊盘中的相应的一个第一焊盘处具有小于等于焊料接合部的直径的30%的高度,并且其中,在所述多个第二焊盘当中、到所述多个第一焊盘中的相应的一个第一焊盘的距离值大于所述多个第一焊盘与所述多个第二焊盘之间的平均距离值的第二焊盘中的各个的焊料接合面积,与所述第一焊盘中的相应的一个第一焊盘的焊料接合面积的比,大于等于56%且小于等于81%。
通过以下参照附图对示例性实施例的描述,本发明的其他特征将变得清楚。
附图说明
图1是例示作为根据第一示例性实施例的电子设备的示例的摄像装置的示意结构的图。
图2是例示作为根据第一示例性实施例的印刷电路板的示例的图像传感器单元的截面图。
图3是例示根据第一示例性实施例的、作为印刷电路板的示例的图像传感器单元中的封装基板的第一焊盘的焊料接合部与印刷线路板的第二焊盘的焊料接合部的截面图。
图4是例示根据第二示例性实施例的、作为印刷电路板的示例的图像传感器单元的截面图。
图5A是例示作为示例创建的图像传感器封装的一个样本的截面图。图5B是例示作为示例创建的图像传感器封装的另一个样本的截面图。图5C是例示作为示例创建的、安装了电子部件的印刷线路板的一个样本的截面图。图5D是作为示例创建的、安装了电子部件的印刷线路板的另一个样本的截面图。
图6A是例示作为比较例的图像传感器单元的X射线照片的图,其中,印刷线路板侧的焊盘的焊料接合面积与封装基板侧的焊盘的焊料接合面积的比被设置为100%。图6B是例示根据示例性实施例的图像传感器单元的X射线照片的图,其中,印刷线路板侧的焊盘的焊料接合面积与封装基板侧的焊盘的焊料接合面积的比被设置为81%。
图7是例示作为比较例的图像传感器单元的截面的照片的图,其中,印刷线路板侧的焊盘的焊料接合面积与封装基板侧的焊盘的焊料接合面积的比被设置为49%。
图8是例示作为比较例的图像传感器单元的示意性截面图,其中,印刷线路板侧的焊盘的焊料接合面积与封装基板侧的焊盘的焊料接合面积的比被设置为49%。
具体实施方式
下面将参照附图说明本发明的示例性实施例。
图1是例示作为根据本发明的第一示例性实施例的电子设备的示例的摄像装置的示意性结构的图。作为电子设备的示例的摄像装置是数字照相机(照相机)100,即,例如数字单镜头反射式照相机,包括照相机主体200以及可拆装到照相机主体200的可更换镜头(镜头镜筒)300。在图1中,可更换镜头300附装到照相机主体200。下面描述通过将可更换镜头300附装到照相机主体200形成摄像装置的情况。
照相机主体200包括壳体201,以及布置在壳体201中的镜222、快门223、作为印刷电路板的图像传感器单元400以及图像处理电路224。照相机主体200包括液晶显示器225,该液晶显示器225被固定到壳体201,使得液晶显示器225从壳体201向外部暴露。图像传感器单元400包括图像传感器封装(半导体封装)500和安装有图像半导体封装500的印刷线路板(母板)600。
可更换镜头300包括作为可更换镜头壳体的壳体301和成像光学系统311。成像光学系统311布置在壳体301中,并且当壳体301(可更换镜头300)附装到壳体201时,在图像传感器封装500聚焦光学像。成像光学系统311包括多个透镜。
壳体301包括形成有开口的镜头侧底座301a,并且壳体201包括形成有开口的照相机侧底座201a。当镜头侧底座301a与照相机侧底座201a相互嵌合时,可更换镜头300(壳体301)被附装到照相机主体200。由图1例示的箭头X指示的方向与成像光学系统311的光轴方向相对应。
经过成像光学系统311、在由箭头X指示的方向上行进的光,经过壳体301中的镜头侧底座301a的开口和壳体201中的照相机侧底座201a的开口,被导引至壳体201。在壳体201中,镜222、快门223等沿箭头X指示的方向被布置在图像传感器封装500前面。
图2是作为根据本发明的第一示例性实施例的印刷电路板的图像传感器单元400的截面图。
作为半导体封装的图像传感器封装500是LGA半导体封装。图像传感器封装500包括作为半导体元件的图像传感器元件501以及作为安装有图像传感器元件501的封装基板的陶瓷基板502。
图像传感器元件501是对聚焦的光学像进行光电转换的固态成像元件(例如互补金属氧化物半导体(CMOS)图像传感器、电耦合设备(CCD)图像传感器等)。
陶瓷基板502包括一对表面511及512。在表面511上,在绝缘体基板上形成各自由导体构成的多个焊盘(第一焊盘、封装侧焊盘)503。图像传感器元件501被安装在表面512上。在表面512上,玻璃板505被布置为不与图像传感器元件501接触。图像传感器元件501被布置在由玻璃板505和表面512限定的中空部中。
多个焊盘503在表面511上相互间隔地布置。在第一示例性实施例中,多个焊盘503被以栅格图案(阵列图案)(即,方格图案)等间距地排列。形成陶瓷基板502的绝缘体的基材是陶瓷。
印刷线路板600包括一对表面611和612。在表面611上,在绝缘体基板上形成各自由导体构成的多个焊盘(第二焊盘、基板侧焊盘)603。多个焊盘603被相互间隔地布置在表面611上。在第一示例性实施例中,多个焊盘603以与焊盘503的间距相同的等间距,以网格图案(阵列图案)(即,方格图案)排列。形成印刷线路板600的绝缘体的基材是环氧树脂玻璃。
陶瓷基板502的表面511与印刷线路板600的表面611相互面对。通过焊料700将焊盘503与相应的焊盘603接合。
图3是例示在作为印刷电路板的图像传感器单元400中、印刷线路板600的焊盘603中的一个的焊料接合部650与陶瓷基板502的焊盘503中的一个的焊料接合部550的截面图。
在第一示例性实施例中,图像传感器封装500是LGA半导体封装。因此,焊料700的高度小于BGA半导体封装中相应焊料的高度,并且小于等于焊盘503的焊料接合部550的直径的30%。
在印刷线路板600的表面611上,形成有阻焊640。通过在阻焊640上形成的开口640H,各焊盘603的焊料接合部650被暴露。焊料接合部650是与焊料700接触的部分。可以在焊盘603的表面上整体或部分地形成焊料接合部650。在第一示例性实施例中,焊料接合部650被部分地形成在焊盘603的表面上。在表面611上未形成阻焊时,在焊盘603的表面上整体形成焊料接合部650。
在陶瓷基板502的表面511上未形成阻焊,因此在焊盘503的表面上整体形成焊料接合部550。焊料接合部550是与焊料700接触的部分。未例示的阻焊可以形成在陶瓷基板502的表面511上。在这种情况下,通过在未例示的阻焊上形成的开口,各焊盘503的焊料接合部550可以被暴露。在这种情况下,可以在焊盘503的表面上整体或部分地形成焊料接合部550。
在第一示例性实施例中,焊料接合部550的面积(焊料接合面积)取决于焊盘503的大小。焊料接合部650的面积(焊料接合面积)取决于焊盘603的大小以及阻焊640的开口640H的大小。因此,通过调整焊盘503的大小能够设置焊料接合部550的面积(焊料接合面积),并且通过调整开口640H(以及焊盘603)的大小能够设置焊料接合部650的面积(焊料接合面积)。
在第一示例性实施例中,焊盘503的焊料接合部550与焊盘603的焊料接合部650通过焊料700互相接合。多个焊盘503的焊料接合部550被设置为具有相同大小的面积。
在图2中,焊盘6031到焊盘503的距离大于焊盘503与焊盘603之间的距离的平均值。在第一示例性实施例中,焊盘6031的焊料接合部650的面积与焊盘503的焊料接合部550的面积的比至少为大于等于56%且小于等于81%。焊盘6031的焊料接合部650的面积是焊盘6031的焊料接合面积。焊盘503的焊料接合部550的面积是焊盘503的焊料接合面积。作为除了焊盘6031以外的焊盘603之一的焊盘6032的焊料接合面积,与焊盘503的焊料接合面积相同。在第一示例性实施例中,在焊盘6031之间焊料接合面积大小相同,并且在焊盘6032之间也相同。
在上述第一示例性实施例中,焊盘6031的焊料接合面积与焊盘503的焊料接合面积的比被设置为小于等于81%。因此,能够减小用于减小当焊料熔融时陶瓷基板502与印刷线路板600之间的距离的力。焊盘6031的焊料接合面积与焊盘503的焊料接合面积的比被设置为大于等于56%。因此,限制了阻焊与熔融焊料之间的接触面积,从而能够便于从熔融的焊料分离出的助焊剂从焊盘6031之上的部分排出。由此能够减小漏接合头失败。
在上述情况下,在焊盘6031之间焊料接合面积为相同大小。可选地,在焊盘6031之间焊料接合面积可以不同,只要比大于等于56%且小于等于81%即可。
将描述根据本发明的第二示例性实施例的印刷电路板。图4是作为根据本发明的第二示例性实施例的印刷电路板的示例的图像传感器单元的截面图。以相同的附图标记指示与第一示例性实施例相同的结构,并将省略其描述。
当在样本当中,图像传感器封装500与印刷线路板600A的起伏形状不同时,难以在接合之前,识别在所有组合中的焊盘503与焊盘603之间的所有距离。
如图4所示,作为印刷电路板的图像传感器单元400A包括图像传感器封装500和印刷线路板600A。图像传感器封装500具有与第一示例性实施例中相同的结构。印刷线路板600A具有与第一示例性实施例中的印刷线路板600不同的结构。
如同在第一示例性实施例中,图像传感器封装500是LGA半导体封装。如同在第一示例性实施例中,图像传感器封装500包括作为半导体元件的图像传感器元件501,以及安装有图像传感器元件501的、作为封装基板的陶瓷基板502。陶瓷基板502包括一对表面511和512。在表面511上,形成有多个焊盘(第一焊盘、封装侧焊盘)503。图像传感器元件501被安装在表面512上。形成陶瓷基板502的绝缘体的基材是陶瓷。
印刷线路板600A包括一对表面611A和612A。在表面611A上,在绝缘体基材上形成有各自由导体构成的多个焊盘(第二焊盘、基板侧焊盘)603A。在表面611上,多个焊盘603A被相互间隔地布置。在第二示例性实施例中,以网格图案(阵列图案)(即,方格图案)以与焊盘503的间距相同的等间距来排列多个焊盘603A。形成印刷线路板600A的绝缘体的基材是环氧树脂玻璃。诸如连接器和芯片零件等的多个电子部件10被安装在印刷线路板600A的安装有图像传感器封装500的表面611A的相对侧的表面612A上。
陶瓷基板502的表面511与印刷线路板600A的表面611A相互面对。通过焊料700将焊盘503与相应的焊盘603A接合。
作为烧制的结果,陶瓷基板502具有不同的起伏形状,因此包括陶瓷基板502的图像传感器封装500也具有不同的起伏形状。图像传感器封装500具有大面积,因此安装有图像传感器封装500的印刷线路板600A也具有大面积。此外,由于在与安装有图像传感器封装500的表面611A相对的表面612A上安装有大量的电子部件10,因此印刷线路板600A具有多变的起伏形状。为了将图像传感器封装500与印刷线路板600A相互附装,需要通过焊料700将具有不同的起伏形状的陶瓷基板502与印刷线路板600A接合。因此,在多个样本当中,在封装侧的焊盘503与基板侧的焊盘603A之间具有长和短距离的多个接合部的图案不同。因此,难以如同在一般的传统技术中,将需要供给大量焊料的部分识别为目标。
在第二示例性实施例中,图像传感器封装500是LGA半导体封装。因此,图像传感器封装500具有焊料700的高度,焊料700的高度小于BGA半导体封装中相应的焊料的高度,并且小于等于焊盘503的焊料接合部550的直径的30%。焊盘503和焊盘603A的焊料接合部与在第一示例性实施例中相同。
在所有多个焊盘503当中,焊料接合部的面积(焊料接合面积)被设置为相同大小。
在第二示例性实施例中,多个焊盘603A中各个的焊料接合面积与焊盘503的焊料接合面积的比被设置为大于等于56%且小于等于81%。
根据第二示例性实施例,焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比被设置为小于等于81%。因此,能够实现用于减小当焊料熔融时陶瓷基板502与印刷线路板600A之间的距离的更小的力。焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比被设置为大于等于56%。因此,限制了阻焊与熔融的焊料之间的接触面积,从而能够便于从熔融的焊料分离出的助焊剂从焊盘603A之上的部分排出。由此能够减小漏接合头失败。
在以上描述中,在多个焊盘603A当中,焊料接合面积被设置为相同大小。可选地,在多个焊盘603A当中焊料接合面积可以不同,只要焊料接合面积与焊盘503的焊料接合面积的比大于等于56%且小于等于81%。
下面,将描述与上述示例性实施例(第二示例性实施例)相对应的示例(实验结果)。图5A是作为示例而创建的图像传感器封装500的样本之一的截面图。图5B是作为示例而创建的图像传感器封装500的另一样本的截面图。图5C是作为示例而创建的、安装有电子部件10的印刷线路板600A的样本之一的截面图。图5D是作为示例而创建的、安装有电子部件10的印刷线路板600A的另一样本的截面图。
图像传感器封装500是包括外形大小为34.0mm×28.4mm并安装有图像传感器元件501的陶瓷基板502的中空结构封装。图像传感器封装500的焊盘503各自具有1.0mm的直径大小,并且呈栅格状以1.2mm的间距排列。
通过数字图像校正,针对多个样本测量在焊料700的熔融温度处的焊盘503的共面性。焊盘503的共面性测量的结果指示具有最小值的样本的共面性为20μm,并且具有最大值的样本的共面性为25μm。如图5A和图5B所示,在样本之间,陶瓷基板502的起伏形状不同。陶瓷基板502的起伏形状和焊盘503的共面性中的波动主要是在烧制陶瓷基板502时引起的。
图像传感器元件501与玻璃板505中的差导致了在安装有图像传感器501和玻璃板505的陶瓷基板502的起伏形状中、以及在焊盘503的共面性中的更大波动。
印刷线路板600A具有50.0mm×50.0mm的外形大小,并且由环氧树脂玻璃材料构成。印刷线路板600A上的焊盘603A被配置在面对焊盘503的位置处。针对焊盘603A的开口的阻焊(未示出)的厚度约为25μm。
诸如连接器和芯片零件等的多个电子部件10安装在与安装有图像传感器封装500的表面611A相对的印刷线路板600A的表面612A上。如焊盘503的情况那样,针对多个样本,通过数字校正测量安装有电子部件10的、在焊料700的熔融温度处的焊盘603A的共面性。
焊盘603A的共面性的测量结果指示在具有最小值的样本中共面性是25μm,并且在具有最大值的样本中是60μm。如图5C和5D所示,在多个样本之间,印刷线路板600A的起伏形状不同。
作为电子部件10的安装处理的结果,主要在印刷接线板600A成型时发生的、在焊盘603A的共面性中和印刷线路板600A的起伏形状中的波动增加。图像传感器封装500与印刷线路板600A通过具有0.118mm3±20%的体积的焊料700而相互接合。
为了检查焊盘603A的接合面积(开口面积)与安装失败的发生之间的关系,在49%至100%的范围内改变焊盘603A的接合面积S2与焊盘503的接合面积S1的比(S2/S1)。
焊盘603A的大小在将要被接合到相应的焊盘503的所有位置处改变,而与印刷线路板600A的起伏形状无关。
接合后的焊料700的高度在约0.12μm至0.25μm的范围内,这是小于等于图像传感器封装500上的焊盘503的焊料接合部的直径的30%的高度。在下表中列举了在安装后的上述面积比与失败发生率之间的关系。
在上述表中,封装焊盘是焊盘503,而基板焊盘是焊盘603A。当焊盘503的焊料接合部的面积是S1而焊盘603A的焊料接合部的面积是S2时,面积比是S2/S1。
图6A是例示作为比较例的、图像传感器单元的X射线照片的图。在该比较例中,在印刷线路板侧的焊盘的焊料接合面积与在封装基板侧的焊盘的焊料接合面积相同,即,面积比被设置为100%。图6B是例示作为示例的、图像传感器单元400A的X射线照片的图。在该示例中,焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比被设置为81%。
当焊盘603A的焊料接合面积与焊盘503的焊料接合面积相同,即,具有100%的面积比时,以12.5%的比例发生图6A例示的焊料桥接失败。
与之相对,如表中所示,在焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比被设置为81%的示例中,如图6B所示,不发生焊料桥接失败。
如上所述,当焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比为小于等于81%时,不发生焊料桥接失败。具体而言,当焊料700熔融时产生的、减小陶瓷基板502与印刷线路板600A之间的距离的力,在焊盘503与焊盘603A之间的距离大的部分被减小。由此,能够防止焊料桥接失败。
为了获得更大的效果,可以仅在当熔融时焊料700延伸的部分,将焊盘603的焊料接合面积与焊盘503的焊料接合面积的比设置为小于等于81%。
具体而言,通过在具有比接合后在焊盘503与603的所有接合部之间的距离的平均值更大的距离的接合部处,将焊盘603的焊料接合面积与焊盘503的焊料接合面积的比设置为小于等于81%,能够防止焊料桥接失败。
如在示例性实施例中所述,在多个样本之间,图像传感器封装500和印刷线路板600A的起伏形状可能不同。因此,在接合之前,难以识别所有组合中的焊盘503与焊盘603A之间的所有距离。在这种情况下,如图2所示,在焊盘603A与焊盘503接合的所有部分处,可以将各焊盘603A的焊料接合面积与对应的焊盘503的焊料接合面积的比设置为小于等于81%。由此,能够防止焊料桥接失败,而与图像传感器封装500和印刷线路板600A的起伏形状无关。
当焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比被设置为49%时,以50%的比率发生漏接合头失败。图7是例示作为比较例的、当焊盘603X的焊料接合面积与焊盘503的焊料接合面积的比被设置为49%时的图像传感器单元的截面的照片的图。图8是例示作为比较例的、当焊盘603X的焊料接合面积与焊盘503的焊料接合面积的比被设置为49%时的图像传感器单元的示意性截面图。在图7和图8例示的、引起了漏接合头失败的截面中,助焊剂900留在由焊盘603X、焊料700以及阻焊640X限定的空间中,妨碍了焊料700铺开至焊盘603X。
在焊盘603X的焊料接合面积与焊盘503的焊料接合面积的比为49%的情况下,由于熔融焊料700与阻焊640X接触的面积大,因此妨碍了助焊剂900的排出。
通过将焊盘603A的焊料接合面积与焊盘503的焊料接合面积的比设置为大于等于56%,能够防止漏接合头失败。
如上所述,在第一示例性实施例中,当将弯曲的陶瓷基板502与印刷线路板600相互接合时,将焊盘6031的焊料接合面积与焊盘503的焊料接合面积的比设置为小于等于81%。因此,减小当焊料熔融时陶瓷基板502与印刷线路板600之间的距离的力能够被减小。结果,减小了在焊盘503与焊盘603之间的距离小的接合部处、按压并压扁熔融焊料的力,从而能够防止由压扁的焊料引起的焊料桥接失败。
通过将焊盘6031的焊料接合面积与焊盘503的焊料接合面积的比设置为大于等于56%,限制了阻焊640与熔融焊料之间的接触面积。结果,能够便于从熔融焊料分离出的助焊剂从焊盘6031之上的部分排出,从而能够减小漏接合头失败。
在第二示例性实施例中,各焊盘603A的焊料接合面积与相应焊盘503的焊料接合面积的比被设置为小于等于81%。因此,即使当陶瓷基板502与印刷线路板600A具有相互不同的起伏形状,并且焊盘503与焊盘603A之间的距离无法被预先识别时,也能够减小用于减小当焊料熔融时陶瓷基板502与印刷线路板600A之间的距离的力。结果,即使陶瓷基板502和印刷线路板600A是起伏的,在焊盘503与603A之间的距离小的接合部处、按压并压扁熔融焊料的力也被进一步减小。因此,能够更有效地减小由于压扁的焊料导致的焊料桥接失败。当在基板侧的焊盘603A的焊料接合面积与在封装侧的焊盘503的焊料接合面积的比被设置为大于等于56%时,即使陶瓷基板502和印刷线路板600A是起伏的,也能够减小漏接合头失败。
在封装基板是陶瓷基板502的情况下,由于陶瓷基板502在起伏形状方面不同,因此本发明针对需要具有更大尺寸的焊盘的半导体封装也是有效的。当大量电子部件10被安装在印刷线路板600A上时,印刷线路板600A在起伏形状方面相互不同。因此,当将半导体封装安装在印刷线路板上时,本发明是有效的。当图像传感器封装具有中空结构和大的尺寸并且在起伏形状方面涉及大的差异时,本发明也是有效的。
本发明不限于上述示例性实施例,并且能够在本发明的技术构思的范围内以各种方式变型。
在上述示例性实施例中,通过将可更换镜头300附装到照相机主体200来形成摄像装置。然而,这不应当被解释为限制。未附装可更换镜头300的照相机主体200单独用作摄像装置。在以上描述中,照相机100被分割为照相机主体200与可更换镜头300。可选地,本发明能够被应用于照相机主体200并入镜头的一体化照相机。作为以上描述中的照相机的摄像装置也可以是包括具有图像传感器封装的印刷电路板的移动设备。
在以上描述中,半导体元件是图像传感器元件,即,半导体封装是图像传感器封装。然而,这不应当被解释为限制,并且本发明可以应用于诸如存储器或存储器控制器等的不同的半导体封装。在此,安装有印刷电路板的电子设备不限于摄像装置,并且印刷电路板能够被安装在任何电子设备上。
在上述示例性实施例中,封装基板是陶瓷基板502。然而,这不应当被解释为限制。如同在印刷线路板的情况下,封装基板可以由环氧树脂玻璃材料构成。类似地,在上述描述中,如同在封装基板的情况下,由环氧树脂玻璃材料构成的印刷线路板600和600A也可以由陶瓷基板形成。
通过本发明,能够减小焊料桥接失败和漏接合头失败。
虽然参照示例性实施例对本发明进行了描述,但是应当理解,本发明并不限于所公开的示例性实施例。应当对所附权利要求的范围给予最宽的解释,以使其涵盖所有这些变型例以及等同的结构和功能。
Claims (7)
1.一种印刷电路板,该印刷电路板包括:
半导体封装,其包括半导体元件和封装基板;以及
印刷线路板,其上安装有所述半导体封装,
其中,在所述封装基板的表面上相互间隔地形成多个第一焊盘,
其中,在所述印刷线路板的表面上相互间隔地形成多个第二焊盘,
其中,所述封装基板的表面与所述印刷线路板的表面相互面对,并且利用焊料将所述多个第一焊盘中的各个与所述多个第二焊盘中的相应的一个第二焊盘相互接合,所述焊料在所述多个第一焊盘中的相应的一个第一焊盘处具有小于等于焊料接合部的直径的30%的高度,并且
其中,在所述多个第二焊盘当中、到所述多个第一焊盘中的相应的一个第一焊盘的距离值大于所述多个第一焊盘与所述多个第二焊盘之间的平均距离值的第二焊盘中的各个的焊料接合面积,与所述第一焊盘中的相应的一个第一焊盘的焊料接合面积的比,大于等于56%且小于等于81%。
2.根据权利要求1所述的印刷电路板,其中,所述多个第二焊盘中的各个的焊料接合面积与所述多个第一焊盘中的相应的一个第一焊盘的焊料接合面积的比大于等于56%且小于等于81%。
3.根据权利要求1所述印刷电路板,其中,所述封装基板包括基材是陶瓷的绝缘体。
4.根据权利要求1所述的印刷电路板,其中,在所述印刷线路板的与安装有所述半导体封装的表面相对的表面上,安装有多个电子部件。
5.根据权利要求1所述的印刷电路板,其中,所述半导体元件是图像传感器元件。
6.一种电子设备,所述电子设备包括:
根据权利要求1所述的印刷电路板;以及
壳体,其被构造为包含所述印刷电路板。
7.根据权利要求6所述的电子设备,其中,所述印刷电路板中包括的半导体元件是图像传感器元件。
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US10403571B2 (en) | 2019-09-03 |
US20160126153A1 (en) | 2016-05-05 |
US11211322B2 (en) | 2021-12-28 |
CN105578757A (zh) | 2016-05-11 |
JP6230520B2 (ja) | 2017-11-15 |
JP2016092033A (ja) | 2016-05-23 |
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