CN105562934B - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
- Publication number
- CN105562934B CN105562934B CN201510733981.5A CN201510733981A CN105562934B CN 105562934 B CN105562934 B CN 105562934B CN 201510733981 A CN201510733981 A CN 201510733981A CN 105562934 B CN105562934 B CN 105562934B
- Authority
- CN
- China
- Prior art keywords
- machined object
- opening
- fragment
- fluid
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012530 fluid Substances 0.000 claims abstract description 58
- 239000012634 fragment Substances 0.000 claims abstract description 52
- 230000002265 prevention Effects 0.000 claims abstract description 21
- 238000003754 machining Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000002679 ablation Methods 0.000 description 6
- 230000011218 segmentation Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014224361A JP6483404B2 (ja) | 2014-11-04 | 2014-11-04 | レーザー加工装置 |
JP2014-224361 | 2014-11-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105562934A CN105562934A (zh) | 2016-05-11 |
CN105562934B true CN105562934B (zh) | 2019-09-17 |
Family
ID=55873859
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510733981.5A Active CN105562934B (zh) | 2014-11-04 | 2015-11-03 | 激光加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6483404B2 (ko) |
KR (1) | KR102338625B1 (ko) |
CN (1) | CN105562934B (ko) |
TW (1) | TWI661888B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6124425B1 (ja) | 2015-10-26 | 2017-05-10 | 株式会社日本製鋼所 | レーザ処理装置整流装置およびレーザ処理装置 |
KR102098440B1 (ko) * | 2016-12-23 | 2020-04-07 | 주식회사 포스코 | 사이드 트리밍 장치 |
KR102092712B1 (ko) * | 2017-02-24 | 2020-03-24 | 에이피시스템 주식회사 | 레이저 처리 장치 및 방법 |
JP7102157B2 (ja) * | 2018-02-08 | 2022-07-19 | Towa株式会社 | 切断装置及び切断品の製造方法 |
CN108500454A (zh) * | 2018-04-27 | 2018-09-07 | 深圳市振华兴科技有限公司 | 吸烟吸尘装置及激光生产设备 |
JP7201343B2 (ja) * | 2018-06-19 | 2023-01-10 | 株式会社ディスコ | レーザー加工装置 |
US20230215721A1 (en) * | 2022-01-05 | 2023-07-06 | STATS ChipPAC Pte. Ltd. | Semiconductor Manufacturing Equipment and Method of Expelling Residue Through Suction Hood |
JP2024043756A (ja) * | 2022-09-20 | 2024-04-02 | 三菱重工業株式会社 | レーザ加工装置およびレーザ加工方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049887A (ja) * | 1983-08-29 | 1985-03-19 | Mitsubishi Motors Corp | レ−ザ溶接方法 |
EP1018395A2 (en) * | 1999-01-04 | 2000-07-12 | Fanuc Ltd | Laser machining apparatus |
JP2007021574A (ja) * | 2005-07-21 | 2007-02-01 | Honda Motor Co Ltd | レーザ加工ヘッド |
JP2014036987A (ja) * | 2012-08-17 | 2014-02-27 | Disco Abrasive Syst Ltd | レーザ加工装置 |
CN104096968A (zh) * | 2013-04-11 | 2014-10-15 | 株式会社迪思科 | 激光加工装置和激光加工方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3779117B2 (ja) | 1999-03-10 | 2006-05-24 | 独立行政法人科学技術振興機構 | レーザー溶接装置 |
US6186067B1 (en) * | 1999-09-30 | 2001-02-13 | Presstek, Inc. | Infrared laser-imageable lithographic printing members and methods of preparing and imaging such printing members |
JP4993886B2 (ja) | 2005-09-07 | 2012-08-08 | 株式会社ディスコ | レーザー加工装置 |
US7863542B2 (en) * | 2005-12-22 | 2011-01-04 | Sony Corporation | Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method |
JP2009166065A (ja) * | 2008-01-15 | 2009-07-30 | Nippon Densan Corp | レーザ加工方法、軸受装置、スピンドルモータ、およびディスク駆動装置 |
CN102089115A (zh) * | 2008-05-30 | 2011-06-08 | 三星钻石工业股份有限公司 | 激光加工装置及激光加工方法 |
JP5587595B2 (ja) | 2009-12-11 | 2014-09-10 | 株式会社ディスコ | レーザー加工装置 |
JP6196059B2 (ja) * | 2013-04-10 | 2017-09-13 | 株式会社ディスコ | レーザー加工装置 |
-
2014
- 2014-11-04 JP JP2014224361A patent/JP6483404B2/ja active Active
-
2015
- 2015-09-24 TW TW104131596A patent/TWI661888B/zh active
- 2015-11-03 CN CN201510733981.5A patent/CN105562934B/zh active Active
- 2015-11-03 KR KR1020150153756A patent/KR102338625B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049887A (ja) * | 1983-08-29 | 1985-03-19 | Mitsubishi Motors Corp | レ−ザ溶接方法 |
EP1018395A2 (en) * | 1999-01-04 | 2000-07-12 | Fanuc Ltd | Laser machining apparatus |
JP2007021574A (ja) * | 2005-07-21 | 2007-02-01 | Honda Motor Co Ltd | レーザ加工ヘッド |
JP2014036987A (ja) * | 2012-08-17 | 2014-02-27 | Disco Abrasive Syst Ltd | レーザ加工装置 |
CN104096968A (zh) * | 2013-04-11 | 2014-10-15 | 株式会社迪思科 | 激光加工装置和激光加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20160052433A (ko) | 2016-05-12 |
JP2016087639A (ja) | 2016-05-23 |
TWI661888B (zh) | 2019-06-11 |
CN105562934A (zh) | 2016-05-11 |
JP6483404B2 (ja) | 2019-03-13 |
TW201618878A (zh) | 2016-06-01 |
KR102338625B1 (ko) | 2021-12-14 |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |