CN105562934B - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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Publication number
CN105562934B
CN105562934B CN201510733981.5A CN201510733981A CN105562934B CN 105562934 B CN105562934 B CN 105562934B CN 201510733981 A CN201510733981 A CN 201510733981A CN 105562934 B CN105562934 B CN 105562934B
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China
Prior art keywords
machined object
opening
fragment
fluid
main part
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Active
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CN201510733981.5A
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English (en)
Chinese (zh)
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CN105562934A (zh
Inventor
迈克尔·加德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication of CN105562934A publication Critical patent/CN105562934A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Dicing (AREA)
CN201510733981.5A 2014-11-04 2015-11-03 激光加工装置 Active CN105562934B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014224361A JP6483404B2 (ja) 2014-11-04 2014-11-04 レーザー加工装置
JP2014-224361 2014-11-04

Publications (2)

Publication Number Publication Date
CN105562934A CN105562934A (zh) 2016-05-11
CN105562934B true CN105562934B (zh) 2019-09-17

Family

ID=55873859

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510733981.5A Active CN105562934B (zh) 2014-11-04 2015-11-03 激光加工装置

Country Status (4)

Country Link
JP (1) JP6483404B2 (ko)
KR (1) KR102338625B1 (ko)
CN (1) CN105562934B (ko)
TW (1) TWI661888B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6124425B1 (ja) 2015-10-26 2017-05-10 株式会社日本製鋼所 レーザ処理装置整流装置およびレーザ処理装置
KR102098440B1 (ko) * 2016-12-23 2020-04-07 주식회사 포스코 사이드 트리밍 장치
KR102092712B1 (ko) * 2017-02-24 2020-03-24 에이피시스템 주식회사 레이저 처리 장치 및 방법
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN108500454A (zh) * 2018-04-27 2018-09-07 深圳市振华兴科技有限公司 吸烟吸尘装置及激光生产设备
JP7201343B2 (ja) * 2018-06-19 2023-01-10 株式会社ディスコ レーザー加工装置
US20230215721A1 (en) * 2022-01-05 2023-07-06 STATS ChipPAC Pte. Ltd. Semiconductor Manufacturing Equipment and Method of Expelling Residue Through Suction Hood
JP2024043756A (ja) * 2022-09-20 2024-04-02 三菱重工業株式会社 レーザ加工装置およびレーザ加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049887A (ja) * 1983-08-29 1985-03-19 Mitsubishi Motors Corp レ−ザ溶接方法
EP1018395A2 (en) * 1999-01-04 2000-07-12 Fanuc Ltd Laser machining apparatus
JP2007021574A (ja) * 2005-07-21 2007-02-01 Honda Motor Co Ltd レーザ加工ヘッド
JP2014036987A (ja) * 2012-08-17 2014-02-27 Disco Abrasive Syst Ltd レーザ加工装置
CN104096968A (zh) * 2013-04-11 2014-10-15 株式会社迪思科 激光加工装置和激光加工方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3779117B2 (ja) 1999-03-10 2006-05-24 独立行政法人科学技術振興機構 レーザー溶接装置
US6186067B1 (en) * 1999-09-30 2001-02-13 Presstek, Inc. Infrared laser-imageable lithographic printing members and methods of preparing and imaging such printing members
JP4993886B2 (ja) 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
US7863542B2 (en) * 2005-12-22 2011-01-04 Sony Corporation Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
JP2009166065A (ja) * 2008-01-15 2009-07-30 Nippon Densan Corp レーザ加工方法、軸受装置、スピンドルモータ、およびディスク駆動装置
CN102089115A (zh) * 2008-05-30 2011-06-08 三星钻石工业股份有限公司 激光加工装置及激光加工方法
JP5587595B2 (ja) 2009-12-11 2014-09-10 株式会社ディスコ レーザー加工装置
JP6196059B2 (ja) * 2013-04-10 2017-09-13 株式会社ディスコ レーザー加工装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049887A (ja) * 1983-08-29 1985-03-19 Mitsubishi Motors Corp レ−ザ溶接方法
EP1018395A2 (en) * 1999-01-04 2000-07-12 Fanuc Ltd Laser machining apparatus
JP2007021574A (ja) * 2005-07-21 2007-02-01 Honda Motor Co Ltd レーザ加工ヘッド
JP2014036987A (ja) * 2012-08-17 2014-02-27 Disco Abrasive Syst Ltd レーザ加工装置
CN104096968A (zh) * 2013-04-11 2014-10-15 株式会社迪思科 激光加工装置和激光加工方法

Also Published As

Publication number Publication date
KR20160052433A (ko) 2016-05-12
JP2016087639A (ja) 2016-05-23
TWI661888B (zh) 2019-06-11
CN105562934A (zh) 2016-05-11
JP6483404B2 (ja) 2019-03-13
TW201618878A (zh) 2016-06-01
KR102338625B1 (ko) 2021-12-14

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