CN105543601B - 一种镁合金智能手机壳体的表面电镀铜方法 - Google Patents
一种镁合金智能手机壳体的表面电镀铜方法 Download PDFInfo
- Publication number
- CN105543601B CN105543601B CN201610065349.2A CN201610065349A CN105543601B CN 105543601 B CN105543601 B CN 105543601B CN 201610065349 A CN201610065349 A CN 201610065349A CN 105543601 B CN105543601 B CN 105543601B
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- Prior art keywords
- magnesium alloy
- surplus
- plated
- water
- zinc
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
- C22C23/02—Alloys based on magnesium with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610065349.2A CN105543601B (zh) | 2016-01-29 | 2016-01-29 | 一种镁合金智能手机壳体的表面电镀铜方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610065349.2A CN105543601B (zh) | 2016-01-29 | 2016-01-29 | 一种镁合金智能手机壳体的表面电镀铜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105543601A CN105543601A (zh) | 2016-05-04 |
CN105543601B true CN105543601B (zh) | 2018-03-16 |
Family
ID=55823154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610065349.2A Active CN105543601B (zh) | 2016-01-29 | 2016-01-29 | 一种镁合金智能手机壳体的表面电镀铜方法 |
Country Status (1)
Country | Link |
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CN (1) | CN105543601B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106868327B (zh) * | 2017-02-08 | 2018-11-20 | 泰兴市智谷科技孵化器中心 | 一种表面具有抗菌层的镁合金智能手机壳体的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102352459A (zh) * | 2011-11-02 | 2012-02-15 | 永鑫精密材料(无锡)有限公司 | 一种手机壳体用镁合金带材的制备方法 |
CN103898572A (zh) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | 一种镁合金壳体表面电镀铜的工艺 |
-
2016
- 2016-01-29 CN CN201610065349.2A patent/CN105543601B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102352459A (zh) * | 2011-11-02 | 2012-02-15 | 永鑫精密材料(无锡)有限公司 | 一种手机壳体用镁合金带材的制备方法 |
CN103898572A (zh) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | 一种镁合金壳体表面电镀铜的工艺 |
Also Published As
Publication number | Publication date |
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CN105543601A (zh) | 2016-05-04 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Su Zhaojian Inventor before: Zhang Ying |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180208 Address after: 362600 Wolong village, Peach Town, Yongchun County, Quanzhou City, Fujian Province, No. 228 Applicant after: Fujian province Yongchun Tianlu forestry cooperatives Address before: Linxi in Hebei province Tangshan City Guye District 063100 West Building 2 Building 2 No. 9 Applicant before: Zhang Ying |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190802 Address after: 418116 Qiancheng Industrial Concentration Zone, Hongjiang City, Huaihua City, Hunan Province Patentee after: Hunan Voshida Intelligent Technology Co., Ltd. Address before: 362600 Wolong Village 228, Taocheng Town, Yongchun County, Quanzhou City, Fujian Province Patentee before: Fujian province Yongchun Tianlu forestry cooperatives |
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TR01 | Transfer of patent right |