CN105441760A - 一种钛镁合金平板电脑壳体的表面电镀铜方法 - Google Patents
一种钛镁合金平板电脑壳体的表面电镀铜方法 Download PDFInfo
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Abstract
本发明公开了一种钛镁合金平板电脑壳体的表面电镀铜方法,所述钛镁合金按质量百分比由下列组分组成:5-7%的Al、3.2-3.6%的Cu、0.4-0.6%的Si、2-2.4%的Mo、0.3-0.5%的Ni、0.1-0.3%的V,32-36%的Ti,余量为Mg和不可避免的杂质,所述电镀铜方法包括如下步骤:(1)、清洗;(2)、活化;(3)、浸锌合金:浸锌液组成为:ZnSO4·7H2O32-36g/L,Na4P2O7·10H2O160-170g/L,NaF10-12g/L,KF6-8g/L,Na2CO38-12g/L,NiSO42-3g/L,磷酸15-18g/L,余量为水;在75-85℃条件下,将钛镁合金壳体坯料在锌合金浸液中浸泡10-15min;(4)、电镀铜:所述镀铜的镀液组成为:CuSO440-50g/L,CuCl212-14g/L,K2CO355-65g/L,K4P2O7·3H2O240-260g/L,C4H4O6KNa·3H2O44-48g/L,K2HPO4·3H2O55-65g/L,羟基亚乙基二瞵酸100-110g/L,植酸0.3-0.5g/L,余量为水;电镀工艺为:pH为8-8.5,电流密度为3-3.5A/dm2,温度为35-45℃。
Description
技术领域
本发明涉及电镀技术领域,尤其涉及一种钛镁合金平板电脑壳体的表面电镀铜方法。
背景技术
钛镁合金的散热性不仅比塑料高,且优于镁合金和铝合金,特别适合制作平板电脑等产品的外壳。
钛镁合金具有轻质耐用、减震、屏蔽的功能,比强度高、易于回收再利用、价格低廉的特点,可广泛使用在国防军工、交通运输、光学仪器及电子器件等工业领域。
影响钛镁合金应用的主要问题是钛镁合金的耐蚀性问题,由于镁的电位非常负,在某些条件下的耐蚀性较差,其应用范围受到很大限制。为了充分利用钛镁合金密度小、高比强度和比刚度的特点,人们一方面在不断地从合金化、热处理等方面提高镁合金的耐蚀性,另一方面就是通过表面防护方法寻求提高镁合金耐蚀的途经。
有许多工艺可在钛镁及镁合金表面上形成涂覆层,包括电镀、化学镀、转化膜、阳极氧化、有机涂层、气相沉积层等。其中最为简单有效的方法就是通过电化学方法在钛镁及镁合金基体上镀一层所需性能的金属或合金,即电镀。钛镁及镁合金表面电镀的目的有两个:一是防护,二是美观,即钛镁及镁合金表面具有防护装饰性镀层。电镀后的钛镁及镁合金产品主要用于高速运动物体的零部件上及需要搬运制品和便携产品的零部件上,其中首选的应用领域是汽车、摩托车及自行车等行业,其次是便携式电子产品,如笔记本电脑、移动电话、随身听等。
国际上比较成熟的解决钛镁及镁合金表面防腐装饰处理技术主要有两种,其一是涂料涂装,其二是金属电镀。前者是目前镁合金表面处理的传统方法,但对钛镁合金表面要求高光泽装饰、耐磨、耐热条件下使用,则涂料涂装则不能满足要求,这就需要用金属镀层来解决。然而钛镁合金在常规的电镀槽液中极不稳定,钛镁合金件不能直接进入槽液进行电镀。通常需要对钛镁及镁合金表面进行预处理,然后可用常规电镀,达到对镁合金表面防护装饰之目的。
目前钛镁及镁合金电镀进行预处理的方法国内外主要采用美国ASTM推荐的标准方法,是Dow公司开发的浸锌法,其预处理采用了浸锌和氰化物镀铜工艺。该技术不仅工艺复杂,且采用了有毒的氰化物。美国专利6068938描述了采用电镀锌之后焦磷酸盐电镀铜来代替氰化镀铜;国内也有采用焦磷酸盐代替氰化物技术;日本专利59050194描述镁合金前处理后,在镀铜时采用含有硅酸盐的镀液。上述这些工艺电镀铜镀层的均匀性、平整性以及与金属基体的结合力等方面并非十分理想。
发明内容
本发明的目的在于提出一种钛镁合金平板电脑壳体的表面电镀铜方法,该方法首先对钛镁合金的组成成分进行了调整,使其强度更高,拉伸冲压性能好,并且透过通信信号能力强,抗干扰能力强,耐摩擦磨损性能优异。同时通过对和镀铜的镀液组分的调整,克服现有技术的缺陷,使得镀层与基体的结合力更好,镀层美观、装饰性好。
为达此目的,本发明采用以下技术方案:
一种钛镁合金平板电脑壳体的表面电镀铜方法,所述钛镁合金按质量百分比由下列组分组成:5-7%的Al、3.2-3.6%的Cu、0.4-0.6%的Si、2-2.4%的Mo、0.3-0.5%的Ni、0.1-0.3%的V,32-36%的Ti,余量为Mg和不可避免的杂质,所述电镀铜方法包括如下步骤:
(1)、清洗:在65-75℃的条件下,将钛镁合金壳体坯料在碱洗液中浸泡8-10min,碱液组成为氢氧化钠74-76g/L,磷酸钠6-8g/L,余量为水,然后水洗;在35-45℃的条件下,将镁合金壳体坯料在酒石酸中浸泡40-60s,然后水洗;
(2)、活化:在室温的条件下将钛镁合金壳体坯料在活化剂中活化5-15min,然后水洗;活化液组成为柠檬酸165-175g/L、NaF200-210g/L,余量为水;
(3)、浸锌合金:浸锌液组成为:ZnSO4·7H2O32-36g/L,Na4P2O7·10H2O160-170g/L,NaF10-12g/L,KF6-8g/L,Na2CO38-12g/L,NiSO42-3g/L,磷酸15-18g/L,余量为水;在75-85℃条件下,将钛镁合金壳体坯料在锌合金浸液中浸泡10-15min;
(4)、电镀铜:所述镀铜的镀液组成为:CuSO440-50g/L,CuCl212-14g/L,K2CO355-65g/L,K4P2O7·3H2O240-260g/L,C4H4O6KNa·3H2O44-48g/L,K2HPO4·3H2O55-65g/L,羟基亚乙基二瞵酸100-110g/L,植酸0.3-0.5g/L,余量为水;电镀工艺为:pH为8-8.5,电流密度为3-3.5A/dm2,温度为35-45℃。
本发明具有如下技术效果:
1)本发明对钛镁合金的成分进行了调整,在传统钛镁合金的基本成分的基础上加入了Mo、Ni、V等元素,发挥合金元素相互作用的优势,特别是创造性的加入了Ni和V这两种元素,对钛镁合金基体形成固溶和弥散强化,得到高强度和高冲击韧性的的钛镁合金材质,使得冲压性能大幅度提高。
2)针对基材钛镁合金成分的调整,对镀液组成进行了改进,主要是对浸锌的镀液组成和电镀铜的镀液组成进行了调整和改进,镀层脱落机率降低。同时使得镀层耐磨性提高、外观光亮、结合力良好、孔隙率低。使得镀液成分与镁合金的成分相协调。
3)经采用百格刀进行检测,镀层表面无裂纹、剥落等缺陷。按照GB6461-2002盐雾评判标准进行测试,本发明的镀层远远高于标准规定的耐盐雾腐蚀时间,因此,本发明的镀层的耐腐蚀性能优异。经摩擦磨损测试,本发明的镀层的耐磨性能比现有产品提高40%以上,可以满足平板电脑壳体的需要。
具体实施方式
实施例一
一种钛镁合金平板电脑壳体的表面电镀铜方法,所述钛镁合金按质量百分比由下列组分组成:5%的Al、3.6%的Cu、0.4%的Si、2.4%的Mo、0.3%的Ni、0.3%的V,32%的Ti,余量为Mg和不可避免的杂质,所述电镀铜方法包括如下步骤:
(1)、清洗:在65-75℃的条件下,将钛镁合金壳体坯料在碱洗液中浸泡8min,碱液组成为氢氧化钠74g/L,磷酸钠8g/L,余量为水,然后水洗;在35-45℃的条件下,将镁合金壳体坯料在酒石酸中浸泡60s,然后水洗;
(2)、活化:在室温的条件下将钛镁合金壳体坯料在活化剂中活化5-15min,然后水洗;活化液组成为柠檬酸165g/L、NaF210g/L,余量为水;
(3)、浸锌合金:浸锌液组成为:ZnSO4·7H2O32g/L,Na4P2O7·10H2O170g/L,NaF10g/L,KF8g/L,Na2CO38g/L,NiSO43g/L,磷酸15g/L,余量为水;在75-85℃条件下,将钛镁合金壳体坯料在锌合金浸液中浸泡10-15min;
(4)、电镀铜:所述镀铜的镀液组成为:CuSO440g/L,CuCl214g/L,K2CO355g/L,K4P2O7·3H2O260g/L,C4H4O6KNa·3H2O44g/L,K2HPO4·3H2O65g/L,羟基亚乙基二瞵酸100g/L,植酸0.5g/L,余量为水;电镀工艺为:pH为8-8.5,电流密度为3-3.5A/dm2,温度为35-45℃。
实施例二
一种钛镁合金平板电脑壳体的表面电镀铜方法,所述钛镁合金按质量百分比由下列组分组成:7%的Al、3.2%的Cu、0.6%的Si、2%的Mo、0.5%的Ni、0.1%的V,36%的Ti,余量为Mg和不可避免的杂质,所述电镀铜方法包括如下步骤:
(1)、清洗:在65-75℃的条件下,将钛镁合金壳体坯料在碱洗液中浸泡10min,碱液组成为氢氧化钠76g/L,磷酸钠6g/L,余量为水,然后水洗;在35-45℃的条件下,将镁合金壳体坯料在酒石酸中浸泡60s,然后水洗;
(2)、活化:在室温的条件下将钛镁合金壳体坯料在活化剂中活化15min,然后水洗;活化液组成为柠檬酸175g/L、NaF200g/L,余量为水;
(3)、浸锌合金:浸锌液组成为:ZnSO4·7H2O36g/L,Na4P2O7·10H2O160g/L,NaF12g/L,KF6g/L,Na2CO312g/L,NiSO42g/L,磷酸18g/L,余量为水;在75-85℃条件下,将钛镁合金壳体坯料在锌合金浸液中浸泡10-15min;
(4)、电镀铜:所述镀铜的镀液组成为:CuSO450g/L,CuCl212g/L,K2CO365g/L,K4P2O7·3H2O240g/L,C4H4O6KNa·3H2O48g/L,K2HPO4·3H2O55g/L,羟基亚乙基二瞵酸110g/L,植酸0.3g/L,余量为水;电镀工艺为:pH为8-8.5,电流密度为3-3.5A/dm2,温度为35-45℃。
实施例三
一种钛镁合金平板电脑壳体的表面电镀铜方法,所述钛镁合金按质量百分比由下列组分组成:6%的Al、3.4%的Cu、0.5%的Si、2.2%的Mo、0.4%的Ni、0.2%的V,34%的Ti,余量为Mg和不可避免的杂质,所述电镀铜方法包括如下步骤:
(1)、清洗:在65-75℃的条件下,将钛镁合金壳体坯料在碱洗液中浸泡9min,碱液组成为氢氧化钠75g/L,磷酸钠7g/L,余量为水,然后水洗;在35-45℃的条件下,将镁合金壳体坯料在酒石酸中浸泡50s,然后水洗;
(2)、活化:在室温的条件下将钛镁合金壳体坯料在活化剂中活化10min,然后水洗;活化液组成为柠檬酸170g/L、NaF205g/L,余量为水;
(3)、浸锌合金:浸锌液组成为:ZnSO4·7H2O34g/L,Na4P2O7·10H2O165g/L,NaF11g/L,KF7g/L,Na2CO310g/L,NiSO42.5g/L,磷酸17.5g/L,余量为水;在75-85℃条件下,将钛镁合金壳体坯料在锌合金浸液中浸泡10-15min;
(4)、电镀铜:所述镀铜的镀液组成为:CuSO445g/L,CuCl213g/L,K2CO360g/L,K4P2O7·3H2O250g/L,C4H4O6KNa·3H2O46g/L,K2HPO4·3H2O60g/L,羟基亚乙基二瞵酸105g/L,植酸0.4g/L,余量为水;电镀工艺为:pH为8-8.5,电流密度为3-3.5A/dm2,温度为35-45℃。
申请人声明,本发明通过上述实施例来说明本发明的详细工艺设备和工艺流程,但本发明并不局限于上述详细工艺设备和工艺流程,即不意味着本发明必须依赖上述详细工艺设备和工艺流程才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。
Claims (1)
1.一种钛镁合金平板电脑壳体的表面电镀铜方法,其特征在于,所述钛镁合金按质量百分比由下列组分组成:5-7%的Al、3.2-3.6%的Cu、0.4-0.6%的Si、2-2.4%的Mo、0.3-0.5%的Ni、0.1-0.3%的V,32-36%的Ti,余量为Mg和不可避免的杂质,所述电镀铜方法包括如下步骤:
(1)、清洗:在约65-75℃的条件下,将钛镁合金壳体坯料在碱洗液中浸泡约8-10min,碱液组成为氢氧化钠约74-76g/L,磷酸钠6-8g/L,余量为水,然后水洗;在约35-45℃的条件下,将镁合金壳体坯料在酒石酸中浸泡约40-60s,然后水洗;
(2)、活化:在室温的条件下将钛镁合金壳体坯料在活化剂中活化约5-15min,然后水洗;活化液组成为柠檬酸165-175g/L、NaF200-210g/L,余量为水;
(3)、浸锌合金:浸锌液组成为:ZnSO4·7H2O32-36g/L,Na4P2O7·10H2O160-170g/L,NaF10-12g/L,KF6-8g/L,Na2CO38-12g/L,NiSO42-3g/L,磷酸15-18g/L,余量为水;在75-85℃条件下,将钛镁合金壳体坯料在锌合金浸液中浸泡10-15min:
(4)、电镀铜:所述镀铜的镀液组成为:CuSO440-50g/L,CuCl212-14g/L,K2CO355-65g/L,K4P2O7·3H2O240-260g/L,C4H4O6KNa·3H2O44-48g/L,K2HPO4·3H2O55-65g/L,羟基亚乙基二瞵酸100-110g/L,植酸0.3-0.5g/L,余量为水;电镀工艺为:pH为8-8.5,电流密度为3-3.5A/dm2,温度为35-45℃。
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