CN105671389B - 一种镁合金智能手机壳体的表面电镀铜的镀液 - Google Patents
一种镁合金智能手机壳体的表面电镀铜的镀液 Download PDFInfo
- Publication number
- CN105671389B CN105671389B CN201610065348.8A CN201610065348A CN105671389B CN 105671389 B CN105671389 B CN 105671389B CN 201610065348 A CN201610065348 A CN 201610065348A CN 105671389 B CN105671389 B CN 105671389B
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- Prior art keywords
- plating solution
- magnesium alloy
- plated
- surplus
- copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C23/00—Alloys based on magnesium
- C22C23/02—Alloys based on magnesium with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/26—Electroplating: Baths therefor from solutions of cadmium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610065348.8A CN105671389B (zh) | 2016-01-29 | 2016-01-29 | 一种镁合金智能手机壳体的表面电镀铜的镀液 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610065348.8A CN105671389B (zh) | 2016-01-29 | 2016-01-29 | 一种镁合金智能手机壳体的表面电镀铜的镀液 |
Publications (2)
Publication Number | Publication Date |
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CN105671389A CN105671389A (zh) | 2016-06-15 |
CN105671389B true CN105671389B (zh) | 2018-03-23 |
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CN201610065348.8A Active CN105671389B (zh) | 2016-01-29 | 2016-01-29 | 一种镁合金智能手机壳体的表面电镀铜的镀液 |
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CN (1) | CN105671389B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106521574B (zh) * | 2016-12-05 | 2018-10-26 | 浙江工业大学 | 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102352459A (zh) * | 2011-11-02 | 2012-02-15 | 永鑫精密材料(无锡)有限公司 | 一种手机壳体用镁合金带材的制备方法 |
CN103838572A (zh) * | 2013-12-20 | 2014-06-04 | 北京掌阔技术有限公司 | 一种安卓开发包的打包系统和方法 |
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2016
- 2016-01-29 CN CN201610065348.8A patent/CN105671389B/zh active Active
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CN105671389A (zh) | 2016-06-15 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Su Zhaojian Inventor before: Zhang Ying |
|
CB03 | Change of inventor or designer information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180209 Address after: 362600 Wolong village, Peach Town, Yongchun County, Quanzhou City, Fujian Province, No. 228 Applicant after: Fujian province Yongchun Tianlu forestry cooperatives Address before: Linxi in Hebei province Tangshan City Guye District 063100 West Building 2 Building 2 No. 9 Applicant before: Zhang Ying |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20190725 Address after: 518000 Second Floor, Building C2, Tongfu Dongying Industrial Park, New Avenue, Shajing Street, Baoan District, Shenzhen City, Guangdong Province (C) Patentee after: SHENZHEN XINHONGSHUN TECHNOLOGY CO., LTD. Address before: 362600 Wolong Village 228, Taocheng Town, Yongchun County, Quanzhou City, Fujian Province Patentee before: Fujian province Yongchun Tianlu forestry cooperatives |
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TR01 | Transfer of patent right |