CN105323949B - 石墨烯印刷线路结构 - Google Patents
石墨烯印刷线路结构 Download PDFInfo
- Publication number
- CN105323949B CN105323949B CN201410521827.7A CN201410521827A CN105323949B CN 105323949 B CN105323949 B CN 105323949B CN 201410521827 A CN201410521827 A CN 201410521827A CN 105323949 B CN105323949 B CN 105323949B
- Authority
- CN
- China
- Prior art keywords
- graphene
- printed wire
- filler
- nanometer sheet
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 140
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 127
- 229920005989 resin Polymers 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 30
- 239000000945 filler Substances 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000002245 particle Substances 0.000 claims abstract description 3
- -1 dimethylamino (dimethylamino) Chemical class 0.000 claims description 20
- 125000000524 functional group Chemical group 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 6
- 150000001336 alkenes Chemical class 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000003607 modifier Substances 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 239000005007 epoxy-phenolic resin Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 3
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- 229920002319 Poly(methyl acrylate) Polymers 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 3
- 235000010948 carboxy methyl cellulose Nutrition 0.000 claims description 3
- 239000008112 carboxymethyl-cellulose Substances 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920002301 cellulose acetate Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920002401 polyacrylamide Polymers 0.000 claims description 3
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229920008347 Cellulose acetate propionate Polymers 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 125000004442 acylamino group Chemical group 0.000 claims description 2
- 125000004423 acyloxy group Chemical group 0.000 claims description 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 2
- 239000011118 polyvinyl acetate Substances 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- BXEMXLDMNMKWPV-UHFFFAOYSA-N pyridine Chemical compound C1=CC=NC=C1.C1=CC=NC=C1 BXEMXLDMNMKWPV-UHFFFAOYSA-N 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims 2
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 230000004048 modification Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 abstract description 3
- 238000013021 overheating Methods 0.000 abstract description 2
- 239000002064 nanoplatelet Substances 0.000 abstract 4
- 238000010292 electrical insulation Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 32
- 239000002002 slurry Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 239000002322 conducting polymer Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 125000005504 styryl group Chemical group 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- DQEFEBPAPFSJLV-UHFFFAOYSA-N Cellulose propionate Chemical compound CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 DQEFEBPAPFSJLV-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229920006218 cellulose propionate Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BSUNTQCMCCQSQH-UHFFFAOYSA-N triazine Chemical compound C1=CN=NN=C1.C1=CN=NN=C1 BSUNTQCMCCQSQH-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Carbon And Carbon Compounds (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103124112A TWI533767B (zh) | 2014-07-14 | 2014-07-14 | 石墨烯印刷線路結構 |
TW103124112 | 2014-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105323949A CN105323949A (zh) | 2016-02-10 |
CN105323949B true CN105323949B (zh) | 2018-09-18 |
Family
ID=55068070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410521827.7A Active CN105323949B (zh) | 2014-07-14 | 2014-10-08 | 石墨烯印刷线路结构 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9460828B2 (zh) |
CN (1) | CN105323949B (zh) |
TW (1) | TWI533767B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10090078B2 (en) | 2015-10-07 | 2018-10-02 | King Fahd University Of Petroleum And Minerals | Nanocomposite films and methods of preparation thereof |
FR3052594B1 (fr) | 2016-06-10 | 2018-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a piste electriquement conductrice et procede de fabrication du dispositif |
CN107492528A (zh) * | 2016-06-13 | 2017-12-19 | 恩智浦美国有限公司 | 具有石墨烯条带的柔性半导体装置 |
FR3061800B1 (fr) * | 2017-01-12 | 2019-05-31 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur |
CN106954348A (zh) * | 2017-05-10 | 2017-07-14 | 山东金宝科创股份有限公司 | 一种利用打印法制备石墨烯线路板的方法 |
CN106973517A (zh) * | 2017-05-10 | 2017-07-21 | 山东金宝科创股份有限公司 | 一种利用加成法制备电路板的方法 |
CN109411149B (zh) * | 2017-08-18 | 2021-01-22 | 京东方科技集团股份有限公司 | 石墨烯电路图案及其制备方法、电子产品 |
WO2019104284A1 (en) | 2017-11-27 | 2019-05-31 | The Crestridge Group | Tamper-resistant electronics system and improved method of manufacturing therefor |
CN109379848A (zh) * | 2018-11-23 | 2019-02-22 | 江苏集萃微纳自动化系统与装备技术研究所有限公司 | 新型柔性印刷电路的制造方法 |
EP3723122B1 (en) | 2019-04-10 | 2023-02-15 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier comprising a double layer structure |
CN112179262B (zh) * | 2019-07-05 | 2022-11-22 | 中国科学院理化技术研究所 | 一种功能化石墨烯基柔性应变传感器及其制备方法与应用 |
CN110831342A (zh) * | 2019-11-15 | 2020-02-21 | 上海摩软通讯技术有限公司 | 一种miniLED背光模组制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102898680A (zh) * | 2011-07-29 | 2013-01-30 | 安炬科技股份有限公司 | 表面改质的石墨烯 |
CN103113786A (zh) * | 2013-03-07 | 2013-05-22 | 苏州牛剑新材料有限公司 | 一种石墨烯导电油墨及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009099707A1 (en) * | 2008-02-05 | 2009-08-13 | Crain, John, M. | Printed electronics |
US20100000441A1 (en) * | 2008-07-01 | 2010-01-07 | Jang Bor Z | Nano graphene platelet-based conductive inks |
TW201341304A (zh) * | 2012-04-06 | 2013-10-16 | Enerage Inc | 石墨烯複合材料的製備方法 |
TWI459875B (zh) * | 2012-04-20 | 2014-11-01 | Far Eastern New Century Corp | A method for preparing a circuit board having a patterned conductive layer |
US9803097B2 (en) | 2012-10-29 | 2017-10-31 | 3M Innovative Properties Company | Conductive inks and conductive polymeric coatings |
CN103319954B (zh) | 2013-07-12 | 2014-10-01 | 珠海市乐通化工股份有限公司 | 一种石墨烯导电油墨及其制备方法 |
CN103468057A (zh) | 2013-08-23 | 2013-12-25 | 苏州艾特斯环保材料有限公司 | 一种石墨烯导电油墨 |
-
2014
- 2014-07-14 TW TW103124112A patent/TWI533767B/zh active
- 2014-10-08 CN CN201410521827.7A patent/CN105323949B/zh active Active
- 2014-10-30 US US14/528,936 patent/US9460828B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102898680A (zh) * | 2011-07-29 | 2013-01-30 | 安炬科技股份有限公司 | 表面改质的石墨烯 |
CN103113786A (zh) * | 2013-03-07 | 2013-05-22 | 苏州牛剑新材料有限公司 | 一种石墨烯导电油墨及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201603656A (zh) | 2016-01-16 |
US9460828B2 (en) | 2016-10-04 |
TWI533767B (zh) | 2016-05-11 |
US20160012936A1 (en) | 2016-01-14 |
CN105323949A (zh) | 2016-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105323949B (zh) | 石墨烯印刷线路结构 | |
JP5134824B2 (ja) | 樹脂成形品製造方法 | |
WO2013161966A1 (ja) | 導電性組成物 | |
JP5185582B2 (ja) | 熱伝導性シート | |
WO2014080754A1 (ja) | 電磁波吸収フィルム及びその製造方法 | |
CN104464883A (zh) | 表面吸附分散剂的石墨烯导电浆料、其制备方法及应用 | |
TWI454377B (zh) | 具有優良成形性的環氧樹脂層壓板及其製備方法 | |
JP4635888B2 (ja) | 導電性ペーストおよび導電性回路の製造方法 | |
KR20100066780A (ko) | 전도성 페이스트와 이를 이용한 전도성 기판 | |
CN115516570B (zh) | 热界面材料 | |
JP6465368B2 (ja) | 混合グラファイトを用いた放熱材およびその製造方法 | |
JP7311415B2 (ja) | コア‐シェル構造の銀コーティングされた銅ナノワイヤを含むエポキシペースト組成物、およびそれを含む導電性フィルム | |
WO2019164002A1 (ja) | 絶縁放熱シート | |
CN108368418B (zh) | 二维热传导材料及其用途 | |
CN113754925B (zh) | 一种绝缘基材-碳纳米管杂化材料及其制备方法和用途 | |
JP2012230866A (ja) | 導電性ペースト | |
CN108659536A (zh) | 导热材料及其制备方法 | |
Kwon et al. | Thermally conducting yet electrically insulating epoxy nanocomposites containing aluminum@ electrochemically exfoliated graphene hybrid | |
JP2017034219A (ja) | 混合グラファイトを用いた放熱材 | |
JP2011054609A (ja) | 熱伝導性シート及びその製造方法 | |
TW200834612A (en) | Polymeric positive temperature coefficient thermistor and process for preparing the same | |
KR101454454B1 (ko) | 다중수소결합에 의해 고차구조를 지니는 탄소나노소재를 이용한 인쇄용 전도성 페이스트 조성물 및 그 제조방법 | |
CN107633895A (zh) | 一种凹印纳米银导电浆料及其制备方法 | |
JP5775438B2 (ja) | 銀微粒子分散液 | |
JP7084038B6 (ja) | 導電性ペースト、導電性膜、及び電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20161009 Address after: 100192 Beijing, Haidian District Road, science and technology, No. 8 (Science and technology wealth center) A block, floor 11 Applicant after: Beijing science and Technology Co., Ltd. Address before: Taiwan County, Yilan, China five knot Li Road, No. 5, three Applicant before: Enerage, Inc. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 100085 Building 301-16, No. 1 Hospital, Gaolizhang Road, Haidian District, Beijing Patentee after: Beijing Ensemble Technology Co., Ltd. (Limited Partnership) Address before: 11th Floor, Block A, 8 Xueqing Road, Haidian District, Beijing, 100192 Patentee before: Beijing science and Technology Co., Ltd. |