CN105308208A - Igzo溅射靶和igzo膜 - Google Patents

Igzo溅射靶和igzo膜 Download PDF

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Publication number
CN105308208A
CN105308208A CN201480002040.8A CN201480002040A CN105308208A CN 105308208 A CN105308208 A CN 105308208A CN 201480002040 A CN201480002040 A CN 201480002040A CN 105308208 A CN105308208 A CN 105308208A
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China
Prior art keywords
phase
raw material
powder
sputtering
igzo
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Pending
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CN201480002040.8A
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English (en)
Chinese (zh)
Inventor
长田幸三
角田浩二
栗原敏也
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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Publication of CN105308208A publication Critical patent/CN105308208A/zh
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3286Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5409Particle size related information expressed by specific surface values
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5418Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
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    • C04B2235/6583Oxygen containing atmosphere, e.g. with changing oxygen pressures
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
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    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/785Submicron sized grains, i.e. from 0,1 to 1 micron
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/78Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/786Micrometer sized grains, i.e. from 1 to 100 micron
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/80Phases present in the sintered or melt-cast ceramic products other than the main phase

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
CN201480002040.8A 2013-03-29 2014-03-11 Igzo溅射靶和igzo膜 Pending CN105308208A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-071170 2013-03-29
JP2013071170 2013-03-29
PCT/JP2014/056250 WO2014156601A1 (ja) 2013-03-29 2014-03-11 Igzoスパッタリングターゲット及びigzo膜

Publications (1)

Publication Number Publication Date
CN105308208A true CN105308208A (zh) 2016-02-03

Family

ID=51623584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480002040.8A Pending CN105308208A (zh) 2013-03-29 2014-03-11 Igzo溅射靶和igzo膜

Country Status (5)

Country Link
JP (1) JP5883990B2 (ja)
KR (2) KR101973873B1 (ja)
CN (1) CN105308208A (ja)
TW (1) TWI639722B (ja)
WO (1) WO2014156601A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770191A (zh) * 2018-04-18 2020-02-07 三井金属矿业株式会社 氧化物烧结体、溅射靶和氧化物薄膜的制造方法
CN114752901A (zh) * 2016-03-31 2022-07-15 捷客斯金属株式会社 氧化铟-氧化锌类(izo)溅射靶及其制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101932369B1 (ko) * 2015-02-27 2018-12-24 제이엑스금속주식회사 산화물 소결체 및 그 산화물 소결체로 이루어지는 스퍼터링 타깃

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108873A (ja) * 2009-11-18 2011-06-02 Idemitsu Kosan Co Ltd In−Ga−Zn系酸化物焼結体スパッタリングターゲット及び薄膜トランジスタ
CN102105619A (zh) * 2008-06-06 2011-06-22 出光兴产株式会社 氧化物薄膜用溅射靶及其制造方法
CN102131953A (zh) * 2008-06-27 2011-07-20 出光兴产株式会社 由InGaO3(ZnO)结晶相形成的氧化物半导体用溅射靶材及其制造方法
CN102459122A (zh) * 2009-06-05 2012-05-16 吉坤日矿日石金属株式会社 氧化物烧结体、其制造方法以及氧化物烧结体制造用原料粉末
CN102652119A (zh) * 2010-01-15 2012-08-29 出光兴产株式会社 In-Ga-O系氧化物烧结体、靶、氧化物半导体薄膜以及它们的制造方法

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JP3862385B2 (ja) 1996-11-08 2006-12-27 Dowaホールディングス株式会社 酸化スズ含有酸化インジウム粉及び焼結体の製造方法
CA2585071A1 (en) 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Field effect transistor employing an amorphous oxide
JP4807331B2 (ja) 2007-06-18 2011-11-02 住友金属鉱山株式会社 酸化インジウム系スパッタリングターゲットの製造方法
JP5403390B2 (ja) 2008-05-16 2014-01-29 出光興産株式会社 インジウム、ガリウム及び亜鉛を含む酸化物
JP4875135B2 (ja) * 2009-11-18 2012-02-15 出光興産株式会社 In−Ga−Zn−O系スパッタリングターゲット
JP5591523B2 (ja) * 2009-11-19 2014-09-17 出光興産株式会社 長期成膜時の安定性に優れたIn−Ga−Zn−O系酸化物焼結体スパッタリングターゲット
JP5596963B2 (ja) * 2009-11-19 2014-09-24 出光興産株式会社 スパッタリングターゲット及びそれを用いた薄膜トランジスタ
JP4843083B2 (ja) 2009-11-19 2011-12-21 出光興産株式会社 In−Ga−Zn系酸化物スパッタリングターゲット
JP2012052227A (ja) * 2010-08-05 2012-03-15 Mitsubishi Materials Corp スパッタリングターゲットの製造方法およびスパッタリングターゲット
JP5767015B2 (ja) * 2011-05-10 2015-08-19 出光興産株式会社 薄膜トランジスタ
JP2014062316A (ja) * 2012-09-03 2014-04-10 Idemitsu Kosan Co Ltd スパッタリングターゲット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102105619A (zh) * 2008-06-06 2011-06-22 出光兴产株式会社 氧化物薄膜用溅射靶及其制造方法
CN102131953A (zh) * 2008-06-27 2011-07-20 出光兴产株式会社 由InGaO3(ZnO)结晶相形成的氧化物半导体用溅射靶材及其制造方法
CN102459122A (zh) * 2009-06-05 2012-05-16 吉坤日矿日石金属株式会社 氧化物烧结体、其制造方法以及氧化物烧结体制造用原料粉末
JP2011108873A (ja) * 2009-11-18 2011-06-02 Idemitsu Kosan Co Ltd In−Ga−Zn系酸化物焼結体スパッタリングターゲット及び薄膜トランジスタ
CN102652119A (zh) * 2010-01-15 2012-08-29 出光兴产株式会社 In-Ga-O系氧化物烧结体、靶、氧化物半导体薄膜以及它们的制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114752901A (zh) * 2016-03-31 2022-07-15 捷客斯金属株式会社 氧化铟-氧化锌类(izo)溅射靶及其制造方法
CN110770191A (zh) * 2018-04-18 2020-02-07 三井金属矿业株式会社 氧化物烧结体、溅射靶和氧化物薄膜的制造方法
CN110770191B (zh) * 2018-04-18 2022-05-13 三井金属矿业株式会社 氧化物烧结体、溅射靶和氧化物薄膜的制造方法

Also Published As

Publication number Publication date
TW201506182A (zh) 2015-02-16
JP5883990B2 (ja) 2016-03-15
KR20170023201A (ko) 2017-03-02
KR101973873B1 (ko) 2019-04-29
TWI639722B (zh) 2018-11-01
WO2014156601A1 (ja) 2014-10-02
JPWO2014156601A1 (ja) 2017-02-16
KR20150023832A (ko) 2015-03-05

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Application publication date: 20160203