CN105307468B

CN105307468B - Electronic component mounting system and electronic component mounting method

Info

Publication number: CN105307468B
Application number: CN201510437762.2A
Authority: CN
Inventors: 宫本哲朗
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2014-07-23
Filing date: 2015-07-23
Publication date: 2019-08-13
Anticipated expiration: 2035-07-23
Also published as: CN105307468A; JP6328511B2; JP2016025279A

Abstract

The present invention provides a kind of electronic component mounting system, is able to suppress the reduction of production efficiency.Have: substrate moving device can stop substrate in multiple rest positions in path according to the path moving substrate parallel with the 1st axis in regulation face；Mounting head, the label test section with suction nozzle and the identification label for being able to detect the substrate configured in the detection area；Head moving device, mobile mounting head in the movable range in predetermined surface are installed；Determination unit determines whether the identification for the substrate for stopping at the 1st rest position in path label can be configured in detection zone based on the location information of the identification label in movable range and substrate；Generating unit generates the temporary identifications of substrate when being determined as cannot configure identification label in the detection area；Information treatment part will be mounted with the relevant tracing information of the substrate of electronic component in the 1st rest position, be stored in storage unit in association with temporary identifications.

Description

Electronic component mounting system and electronic component mounting method

Technical field

The present invention relates to a kind of electronic component mounting system and electronic component mounting methods.

Background technique

In the production process of electronic equipment, the electronic component installation system for installing electronic component to the surface of substrate is used System.For example, the mother substrate that will install electronic component sometimes is divided into multiple submount as shown in the disclosure of patent document 1.As Mother substrate, large substrate (so-called strip substrate) sometimes bigger than the movable range of mounting head using size.

Patent document 1: Japan's registration No. 4994105 bulletin of patent

In order to obtain retrospect (traceability) information of substrate, the label test section pair being arranged in mounting head is utilized The identification label being arranged in a substrate is detected.If identifying that the position of label is restricted or mounting head (is marked in substrate Note test section) movable range be restricted, it is likely that be marked with can not be successfully test section to identification label detection. As a result, the production efficiency of electronic component mounting system is likely to decrease.

Summary of the invention

Mode of the invention is designed to provide a kind of electronic component mounting system and electronic component mounting method, It is able to suppress the reduction of production efficiency.

1st mode of the invention provides a kind of electronic component mounting system, has: substrate moving device, can be by According to the path moving substrate parallel with the 1st axis in predetermined surface, can stop in multiple rest positions in the path described in Substrate；Mounting head, with suction nozzle and label test section, which releasably keeps electronic component, label test section tool There is detection zone and is able to detect the identification label of the substrate configured in the detection zone；Head moving device is installed, Its mobile described mounting head in the movable range in the predetermined surface；Determination unit is based on the movable range and the base The location information of identification label in plate, determines whether to stop at the institute of the 1st rest position in the path The identification label for stating substrate is configured in the detection zone；Generating unit is being judged to incite somebody to action by the determination unit When the identification label configuration is in the detection zone, the temporary identifications of the substrate are generated；And information treatment part, It will be mounted with the relevant tracing information of the substrate of the electronic component in the 1st rest position, face with described When identification information be stored in storage unit in association.

In the 1st mode of the invention, it can be judged to that the path can will be stopped at using the determination unit When the identification label configuration of the substrate of 2nd rest position is in the detection zone, the mobile mounting head with So that identification label configuration is in the detection zone, by the label test section to stopping at the 2nd stop position The identification label of the substrate at place is detected, which has acquisition unit, which is based on The testing result of the identification label obtains substrate identification information, and the temporary identifications are replaced by the information treatment part The substrate identification information.

2nd mode of the invention provides a kind of electronic component mounting method comprising following step: according in regulation face The path moving substrate parallel with the 1st axis；The 1st rest position in the path stops the substrate；Mounting head, which has, inhales Mouth and label test section, the suction nozzle releasably keep electronic component, which has detection zone and be able to detect The identification of the substrate configured in the detection zone marks, in this step, in the predetermined surface based on mounting head Movable range and the substrate in the identification label location information, determine whether to stop at the described 1st and stop Stop bit sets the identification label configuration of the substrate at place in the detection zone；Be determined as by determination unit cannot be by institute When stating identification label configuration in the detection zone, the temporary identifications of the substrate are generated；And will with the described 1st Rest position is mounted with the relevant tracing information of the substrate of the electronic component, associated with the temporary identifications Ground is stored in storage unit.

In the 2nd mode of the invention, it can include the following steps: to be determined whether to stop at by the determination unit The identification label configuration of the substrate of 2nd rest position in the path is in the detection zone；It is being determined as When can will stop at the identification label configuration of the substrate of the 2nd rest position in the detection zone, The mobile mounting head is so that identification label configures in the detection zone, using the label test section to stopping It is detected in the identification label of the substrate of the 2nd rest position；Detection knot based on the identification label Fruit obtains substrate identification information；And the temporary identifications being stored in the storage unit are replaced into the substrate and are known Other information.

The effect of invention

Mode according to the present invention is able to suppress the reduction of production efficiency.

Detailed description of the invention

Fig. 1 is the schematic diagram for indicating an example of electronic component mounting system involved in the 1st embodiment.

Fig. 2 is the top view for indicating an example of electronic component mounting apparatus involved in the 1st embodiment.

Fig. 3 is the figure for indicating an example of mounting head involved in the 1st embodiment.

Fig. 4 is the figure for indicating an example of control system involved in the 1st embodiment.

Fig. 5 is the side view for indicating an example of movement for mounting head camera involved in the 1st embodiment.

Fig. 6 is the top view for indicating an example of movement for mounting head camera involved in the 1st embodiment.

Fig. 7 is the side view for indicating an example of movement for mounting head camera involved in the 1st embodiment.

Fig. 8 is the top view for indicating an example of movement for mounting head camera involved in the 1st embodiment.

Fig. 9 is the figure for indicating an example of movement for substrate moving device involved in the 1st embodiment.

Figure 10 is the figure for indicating an example of movement for substrate moving device involved in the 1st embodiment.

Figure 11 is the figure for schematically showing an example of stop control system involved in the 1st embodiment.

Figure 12 is the figure for indicating the relationship involved in the 1st embodiment between substrate and the movable range of mounting head.

Figure 13 is the functional block diagram for indicating an example of control system involved in the 1st embodiment.

Figure 14 is the flow chart for illustrating an example of electronic component mounting method involved in the 1st embodiment.

Figure 15 is the flow chart for illustrating an example of electronic component mounting method involved in the 2nd embodiment.

Figure 16 is the flow chart for illustrating an example of electronic component mounting method involved in the 3rd embodiment.

Figure 17 is the figure for indicating the relationship involved in the 4th embodiment between substrate and the movable range of mounting head.

The explanation of label

1 electronic component mounting apparatus

2 feedways

3 servers

4 cables

5 base components

6 substrate moving devices

6G delivery track

7 suction nozzles

8 mounting heads

9 installation head moving devices

10 control devices

11 suction devices

12 X-axis driving devices

12D X-axis actuator

12G X-axis portal frame

13 Y-axis driving devices

13D Y-axis actuator

13G Y-axis portal frame

14 suction nozzle driving portions

15 Z axis driving portions

16 rotary driving parts

17 shoot parts (mounting head camera)

18 range sensors

19 shoot parts (parts recognition camera)

20 suction nozzle replacing machines

21 acquisition units

22 storage units

31 determination units

32 generating units

33 information treatment parts

34 acquisition units

35 control units

36 storage units

100 electronic component mounting systems

200 control systems

300 stop control systems

C electronic component

P substrate

Specific embodiment

In the following, being illustrated referring to attached drawing to embodiment according to the present invention, but the present invention is not limited thereto.Below The structural element of each embodiment illustrated can be suitably combined.In addition, not using part-structure element sometimes.In addition, In structural element in the following embodiments, can be replaced comprising those skilled in the art and the element that is readily apparent that or Substantially the same element.

In the following description, XYZ orthogonal coordinate system is set, is closed referring to position of the XYZ orthogonal coordinate system to each section System is illustrated.A direction in horizontal plane is set as X-direction, direction orthogonal with X-direction in horizontal plane is set as Y Axis direction is set as Z-direction for orthogonal direction (vertical direction, up and down direction) is distinguished with X-direction and Y direction.Separately Outside, θ X, θ Y and θ Z-direction will be set to around the rotation of X-axis, Y-axis and Z axis (inclination) direction.X/Y plane is horizontal plane. XZ plane and YZ plane respectively with X/Y plane square crossing.

The 1st embodiment is illustrated.Fig. 1 is to indicate electronic component mounting system 100 involved in present embodiment An example schematic diagram.

As shown in Figure 1, electronic component mounting system 100 has: electronic component mounting apparatus 1, by electronic component C to base Plate P installation；And server 3, electronic component mounting apparatus 1 is managed.Electronic component mounting apparatus 1 has: supply Device 2 can supply electronic component C；And mounting head 8, the electronic component C of feedway 2 is pacified to substrate P Dress.

In the present embodiment, electronic component mounting system 100 has multiple electronic component mounting apparatus 1.Feedway 2 It is arranged in each of multiple electronic component mounting apparatus 1.Server 3 and multiple electronic component mounting apparatus 1 pass through respectively Cable 4 as LAN cable is attached.Server 3 obtains the information (signal) exported from electronic component mounting apparatus 1, right Above-mentioned multiple electronic component mounting apparatus 1 are managed respectively.

Fig. 2 is the top view for indicating an example of electronic component mounting apparatus 1 involved in present embodiment.Fig. 3 is Indicate the figure of an example of mounting head 8 involved in present embodiment.Fig. 4 is to indicate the ministry of electronics industry involved in present embodiment The block diagram of one example of the control system 200 of part mounting device 1.

As shown in Fig. 2, electronic component mounting apparatus 1 has: base component 5；Substrate moving device 6 is arranged in pedestal On component 5, it is able to maintain simultaneously moving substrate P；Mounting head 8 has the suction nozzle 7 for releasably keeping electronic component C, utilizes suction Mouth 7 keep to the electronic component C of feedway 2 and be installed to substrate P；Head moving device 9 is installed, is arranged in base portion On part 5, mounting head 8 can be made mobile；And control device 10, electronic component mounting apparatus 1 is controlled.Control device 10 and server 3 be attached via cable 4.

Substrate moving device 6 can be such that substrate P moves on base component 5.Substrate moving device 6 with substrate P surface with The parallel mode of X/Y plane is supported and moves it to substrate P.In the present embodiment, substrate moving device 6 can make Substrate P is mobile according to the path parallel with X-axis.That is, substrate moving device 6 moves substrate P along the x axis.The mobile dress of substrate Setting 6 can be such that substrate P stops respectively in multiple rest positions in path.

In the present embodiment, substrate moving device 6 includes a pair of of delivery track 6G, configures in the upper of base component 5 Surface, it is longer in the X-axis direction；And actuator, generate the power for moving substrate P along the x axis.Delivery track 6G provides the path (movement routine) of substrate P.Using the movement of actuator, substrate P moves along the x axis.Substrate moves Dynamic device 6 makes substrate P mobile from the one end of base component 5 to the other end in the X-axis direction.

The edge of the side+Y of substrate P and the edge of the side-Y are respectively supported on delivery track 6G.In delivery track 6G On, substrate P is clamped in multiple rest positions in the X-axis direction.By being clamped to substrate P, thus make substrate P with Multiple rest positions in the parallel path of X-axis stop.It is clamped by releasing, so that substrate P be enable to move along the x axis.

In addition, substrate moving device 6 can be such that substrate P moves along the y axis, can also make substrate P along the x axis and The two directions of Y direction are mobile.That is, substrate moving device 6 can be such that substrate P moves in X/Y plane.In addition, substrate is mobile Device 6 can be such that substrate P moves in this 6 directions along X-axis, Y-axis, Z axis, θ X, θ Y and θ Z.

Mounting head 8 will be from the electronic component C that feedway 2 supplies to the substrate P surface being supported on substrate moving device 6 (upper surface) installation.Substrate P is moved from the one end of base component 5 to the other end in the X-axis direction using substrate moving device 6 It is dynamic.Mounting head 8 in the X-axis direction between the one end and the other end of base component 5 by electronic component C to substrate P surface Installation.

Installation head moving device 9 can make mounting head 8 mobile in the top of substrate P.Installation head moving device 9 makes mounting head It is moved in 8 movable range in X/Y plane.Installation head moving device 9 includes X-axis driving device 12, is used to make mounting head 8 It moves along the x axis；And Y-axis driving device 13, it is used to that mounting head 8 to be made to move along the y axis.

X-axis driving device 12 includes: X-axis portal frame 12G, in a manner of moving mounting head 8 along the x axis pair Mounting head 8 is supported；And X-axis actuator 12D, it generates for making the mounting head 8 being supported on X-axis portal frame 12G along X The mobile power of axis direction.X-axis portal frame 12G guides mounting head 8 along the x axis.Utilize the dynamic of X-axis actuator 12D Make, mounting head 8 is moved along the x axis with the state being supported on X-axis portal frame 12G.

Y-axis driving device 13 includes: Y-axis portal frame 13G, move X-axis portal frame 12G along the y axis Mode is supported X-axis portal frame 12G；And Y-axis actuator 13D, it generates for making to be supported on Y-axis portal frame 13G The power that moves along the y axis of X-axis portal frame 12G.Y-axis portal frame 13G draws X-axis driving device 12 along the y axis It leads.Using the movement of Y-axis actuator 13D, X-axis driving device 12 with the state that is supported on Y-axis portal frame 13G along the y axis It is mobile.

By moving X-axis driving device 12 along the y axis using Y-axis driving device 13, to make to be supported on X-axis driving Mounting head 8 on device 12 moves along the y axis together with X-axis driving device 12.Mounting head 8 passes through X-axis driving device 12 Movement is moved along the x axis.Mounting head 8 can move in X/Y plane in the top of substrate P as a result,.

Installation head moving device 9 can make mounting head 8 mobile, and suction nozzle 7 is arranged respectively at and substrate P surface (upper table Face) opposite installation site (loading position) and from the supply position that feedway 2 supplies electronic component C (handover Position).Suction nozzle 7 keeps the electronic component C supplied from feedway 2 at supply position.Suction nozzle 7 is at supply position After keeping to electronic component C, it is transported to installation site, is carried to substrate P.In installed position by electronic component After C is carried to substrate P, suction nozzle 7 discharges electronic component C.Electronic component C is installed to substrate P as a result,.

As shown in Figures 3 and 4, mounting head 8 has the suction nozzle 7 for releasably keeping electronic component C.Mounting head 8 will supply The electronic component C of device 2 keep using suction nozzle 7 and be installed to substrate P.Suction nozzle 7 configures multiple in mounting head 8.It is multiple Suction nozzle 7 can be driven respectively.In the present embodiment, suction nozzle 7 is the absorption suction nozzle for adsorbing and keeping electronic component C.It inhales Mouth 7 includes opening, is arranged in front end；And internal flow path, it is connected with opening.The gas of the internal flow path of suction nozzle 7 by Suction device 11 comprising vacuum pump is attracted.By being carried out in the state that the front end of suction nozzle 7 is contacted with electronic component C The attraction of suction nozzle 7 acts, to adsorb in the front end of suction nozzle 7 and keep electronic component C.It is dynamic by the attraction for releasing suction nozzle 7 Make, to discharge electronic component C from suction nozzle 7.

Mounting head 8 has the suction nozzle driving portion 14 that suction nozzle 7 can be made to move along Z-direction and θ Z-direction.Suction nozzle driving Portion 14 includes: Z axis driving portion 15 moves suction nozzle 7 along Z-direction；And rotary driving part 16, make suction nozzle 7 along the side Z θ To movement (rotation).Z axis driving portion 15 includes Z axis actuator 15D, and Z axis actuator 15D generation can make suction nozzle 7 along Z axis side To mobile power.Rotary driving part 16 includes θ shaft actuator 16D, and θ shaft actuator 16D generation can make suction nozzle 7 along the side Z θ To mobile power.

That is, in the present embodiment, utilizing installation head moving device 9 and the suction nozzle driving portion being arranged in mounting head 8 14, suction nozzle 7 can move in this 4 directions along X-axis, Y-axis, Z axis and θ Z.In addition it is also possible to be suction nozzle 7 can along X-axis, Y-axis, This 6 directions Z axis, θ X, θ Y and θ Z are mobile.

In addition, mounting head 8 includes mounting head camera (shoot part) 17, the image information of object can be obtained；And Range sensor 18 is detected to opposite the distance between object.By keeping mounting head 8 mobile, to make to install Head camera 17 and range sensor 18 are moved together with suction nozzle 7.

Mounting head camera 17 can for example obtain the electronic component installed in the image information and substrate P of substrate P The image information of C.Mounting head camera 17 obtains electricity at the supply position that feedway 2 supplies electronic component C The image information of subassembly C and the image information of substrate P.It is right based on the image information obtained using mounting head camera 17 Suction nozzle 7 in X-direction and Y direction is relative to the holding position (absorption position) of electronic component C and electronic component C is adjusted relative to the installation site of substrate P.

The image information of substrate P includes the image information for the identification label B being arranged in substrate P.Mounting head camera 17 It works as the label test section that B can be marked to be detected the identification of substrate P.

Fig. 5 is the side view for schematically showing an example of movement for mounting head camera 17.Fig. 6 is schematically Indicate the top view of an example of the movement of mounting head camera 17.As shown in Figures 5 and 6, mounting head camera 17 has Detection zone MA.Detection zone MA includes the shooting area of mounting head camera 17.The shooting area packet of mounting head camera 17 The area of visual field of the optical system of camera containing mounting head 17.Mounting head camera 17 can be obtained to be configured in detection zone MA Object image information.That is, mounting head camera 17 can mark B to the identification of the substrate P configured in detection zone MA It is detected.

Fig. 7 is the side view for schematically showing an example of movement for mounting head camera 17.Fig. 8 is schematically Indicate the top view of an example of the movement of mounting head camera 17.As shown in Figures 7 and 8, it will identify that marking B to configure exists In the case where the outside of detection zone MA, mounting head camera 17 cannot detect identification label B.

In the present embodiment, identification label B includes at least one of bar code and 2 dimension codes.Mounting head camera 17 include at least one of barcode reader and 2 dimension code readers.Identification label B includes for knowing to substrate P Other identification information.

Range sensor 18 in the Z-axis direction the position of electronic component C and the position of substrate P detect.Away from It is irradiated by will test light to electronic component C and substrate P from sensor 18, and to by electronic component C and substrate P The detection light of reflection carries out light, thus in the Z-axis direction the position of electronic component C and the position of substrate P examine It surveys.Holding position and electronic component based on the testing result of range sensor 18, to electronic component C in the Z-axis direction C is adjusted relative to the installation site of substrate P.

In addition, mounting head 8 also can have test section, which marks in the upper additional bad plate such as cracking substrate (Bad Mark) etc. is detected.

As shown in Fig. 2, electronic component mounting apparatus 1 has parts recognition camera (shoot part) 19, component identification is shone Camera 19 configures on base component 5, can obtain the image information of electronic component C.Parts recognition camera 19 is side-draw under Obtain the image information of the electronic component C kept in suction nozzle 7.That is, parts recognition camera 19 obtains the lower surface of electronic component C The image information of side.Based on the image information obtained using shoot part 19, center (adsorption site) and the ministry of electronics industry of suction nozzle 7 are found out The inclination (absorption angular variation) of position offset and electronic component C between the center of part C.

In addition, electronic component mounting apparatus 1 has the suction nozzle replacing machine 20 for being replaced to suction nozzle 7.Suction nozzle replacing Machine 20 takes care of a variety of suction nozzles 7.For example, the dimension and shape with electronic component C to be mounted correspondingly carries out more suction nozzle 7 It changes.

Feedway 2 supplies electronic component C to mounting head 8 (suction nozzle 7).Feedway 2 includes feeder, to tep reel It is supported；And feeder receptacle, feeder is supported.Keep the holding tape wrapping of electronic component C in tep reel On.Tep reel is supported the holding band for keeping electronic component C.Support keeps the tep reel of band to be supported on feeder.

Tep reel is releasably supported by feeder.In the holding band being wound on tep reel, to multiple electronic component C It is kept.By making band disc spins, so that the electronic component C for keeping band to be kept is moved to supply position.In supply position Place is set, electronic component C is kept by suction nozzle 7.

Control device 10 controls electronic component mounting apparatus 1.Control device 10 includes processor and memory. Processor includes CPU (Central Processing Unit).Memory includes ROM (Read Only Memory) and RAM (Random Access Memory).Control device 10 is attached via cable 4 with server 3.Control device 10 via Cable 4 obtains the control signal from server 3, controls electronic component mounting apparatus 1.Control device 10 is via cable 4 export the various information of electronic component mounting apparatus 1 to server 3.

Control device 10 makes substrate P more after the identification for detecting substrate P using mounting head camera 17 marks B A rest position stops respectively, and electronic component C is installed to the substrate P.In the present embodiment, control device 10 is in electronics Identification label B is detected before the installation of component C, after which is exported to server 3, implements electronic component The installation of C.As a result, server 3 can manage in real time in electronic component mounting apparatus 1 by electronic component C to which Substrate P is installed.

In the following, being illustrated referring to an example of the Fig. 9 and Figure 10 to the movement of substrate moving device 6.In this embodiment party In formula, substrate P is longer large substrate (so-called strip substrate) in the X-axis direction.The ruler of substrate P in the X-axis direction The size of the very little movable range for being greater than mounting head 8 in the X-axis direction.That is, in the present embodiment, substrate P is in mounting head 8 It can not be accommodated any more in movable range.At least part of substrate P is stretched out from the movable range of mounting head 8.

The movable range of mounting head 8 is the range that suction nozzle 7 can install electronic component C to substrate P.Suction nozzle 7 can be with A part of region for configuring substrate P surface in the movable range of mounting head 8 is opposite, can be by electronic component C to the substrate P It is installed in a part of region on surface.Suction nozzle 7 can not by electronic component C to configuration mounting head 8 movable range outside Substrate P surface installed.

In addition, the movable range of mounting head 8 is that mounting head camera 17 can mark B to detect the identification of substrate P Range.Mounting head camera 17 can be opposite with the identification label B of substrate P of the configuration in the movable range of mounting head 8, energy It is enough to configure identification label B in detection zone MA.Mounting head camera 17 can be to knowledge of the configuration in detection zone MA Not Biao Ji B detected.Mounting head camera 17 can not be by the knowledge of the substrate P in the outside for the movable range configured in mounting head 8 Not Biao Ji B configuration in detection zone MA, can not to the identification mark B detect.

In the present embodiment, substrate moving device 6 conveys substrate P along +X direction.Substrate moving device 6 is in X Substrate P is clamped respectively in multiple rest positions (being at 2 in the present embodiment) in axis direction and makes its stopping.? In the state that multiple rest positions stop, electronic component C is installed to the substrate P respectively for substrate P.

It in the present embodiment, is the multiple regions smaller than the movable range of mounting head 8 by substrate P surface segmentation.It should The multiple regions on the substrate P surface after segmentation configure in order in the movable range of mounting head 8.Determine multiple stop positions, Electronic component C respectively to install the multiple regions on substrate P surface.

As shown in figure 9, determining the 1st stop position (the 1st stop position) in the path of substrate P, will include+ A part of region of substrate P including the edge of the side X configures in the movable range of mounting head 8.Control device 10 moves substrate Dynamic device 6 is controlled and stops substrate P in the 1st rest position, will include the side+X edge including substrate P one Partial region configures in the movable range of mounting head 8.Control device 10 is used to the substrate P stopped in the 1st rest position Mounting head 8 installs electronic component C.In the following description, by electronic component C to the base stopped in the 1st rest position The installation action of plate P is properly termed as the 1st installation action.

After the 1st installation action terminates, control device 10 to substrate moving device 6 controlled and by substrate P along+X Direction is mobile.

As shown in Figure 10, the 2nd stop position (the 2nd stop position) is determined in the path of substrate P, will be wrapped A part of region of substrate P including the end of the side containing-X configures in the movable range of mounting head 8.Control device 10 is to base Plate mobile device 6 is controlled and stops substrate P in the 2nd rest position, will include the side-X edge including substrate A part of region of P configures in the movable range of mounting head 8.Control device 10 is to the substrate stopped in the 2nd rest position P installs electronic component C using mounting head 8.In the following description, electronic component C is stopped in the 2nd rest position The installation action of substrate P only is properly termed as the 2nd installation action.

After the 2nd installation action terminates, control device 10 to substrate moving device 6 controlled and by substrate P along+X Direction is mobile, which is moved out.

As noted above, in the substrate P that size of the electronic component C in X-direction is longer than the movable range of mounting head 8 When installation, multiple stop positions are determined on the conveying direction (X-direction) of substrate P, control device 10 stops at this making substrate P Stop bit installs electronic component C in the state of setting stopping.

Figure 11 is schematically shown involved in present embodiment for implementing the stopping control of the stopping control of substrate P The figure of one example of system 300.Size in X-direction is less than or equal to the substrate P of the movable range of mounting head 8, can 2 pieces are moved in comprising the substrate moving device 6 including stop control system 300.Size in X-direction is greater than mounting head 8 The substrate P of movable range can move in 1 piece to comprising the substrate moving device 6 including stop control system 300.

In Figure 11, stop control system 300 is controlled in the following manner, that is, if using IN-STOP sensor with And at least one of OUT-STOP sensor detects substrate P, then based on from detecting substrate P by the time and The conveying speed of substrate P calculates the conveying distance of substrate P, controls IN motor and OUT motor, so that base Plate P stops in desired stop position.

In addition, as shown in figure 12, stop position and the 2nd stop position to the 1st time are determined, so that by A part of region (mounted region) on substrate P surface corresponding with the 1st movable range of mounting head 8 of rest position A, a part of region on the corresponding substrate P surface of the movable range of the mounting head 8 of He Yu 2 times rest positions (is mounted Region) c formation repeat region b.

Region a is the region that can be installed using the 1st installation action to electronic component C.Region c is can be using the The region that 2 installation actions install electronic component C.Repeat region b is can be using the 1st installation action and the 2nd installation It acts the two and acts the region installed to electronic component C.

Figure 13 is involved in present embodiment comprising the control system 200 including server 3 and control device 10 Functional block diagram.In addition, at least part in the function of the server 3 of following the description also may be embodied in the function of control device 10 In energy, at least part in the function of control device 10 also be may be embodied in the function of server 3.

For convenience, Figure 13 shows the example that server 3 is connected with 1 control device 10.As noted above, in this implementation In mode, electronic component mounting system 100 has multiple electronic component mounting apparatus 1 (control device 10).Multiple control devices 10 connect with server 3.

As shown in figure 13, electronic component mounting apparatus 1 has: control device 10, substrate moving device 6, mounting head are mobile Device 9 and mounting head camera (label test section) 17.Substrate moving device 6, installation head moving device 9 and mounting head Camera 17 is connect with control device 10 respectively.

Control device 10 includes: determination unit 31, the identification label B's in movable range and substrate P based on mounting head 8 Location information determines whether B can be marked to be configured at installation the identification for the substrate P for stopping at the 1st rest position in path In the detection zone MA of head camera 17；Generating unit 32 by determination unit 31 is being judged to that identification label B configuration cannot be being examined When surveying in the MA of region, the temporary identifications (interim ID) of substrate P are generated；Information treatment part 33, will in the 1st stop position Place is mounted with the relevant tracing information of the substrate P of electronic component C, is saved in association with temporary identifications；Acquisition unit 34, it detects that identification when identification label B marks the testing result of B based on mounting head camera 17, obtains substrate identification letter It ceases (substrate ID)；Control unit 35 controls substrate moving device 6 and installation head moving device 9；And storage unit 36, various data relevant to installation are stored.

Server 3 includes: acquisition unit 21, obtains the temporary identifications generated by generating unit 32；And storage unit 22, It obtains the temporary identifications associated with tracing information in information treatment part 33 and saves.

The storage unit 36 of control device 10 stores various information related with installation.The storage of storage unit 36 and electronics The related information of the mounting condition of apparatus for mounting component 10 (configuration).Mounting condition includes raw using electronic component mounting apparatus 1 Sequence when production product, instruction, setting and parameter for mounting device 1.

In the following description, information related with mounting condition is properly termed as production routine.Production routine include and peace The related information of substrate P (substrate data) of dress object, information (component count related with the electronic component C installed to the substrate P According to), keep with suction nozzle 7 the related information (adsorpting data) in the position of electronic component C and on the substrate 8 to electronic component C The related information in the position installed (carries data).

The location information of identification label B in movable range and substrate P of the determination unit 31 based on mounting head 8, determines whether The identification label B for the substrate P for stopping at the 1st rest position in path can be configured to the detection zone of mounting head camera 17 In the MA of domain.Information related with the movable range of mounting head 8 is known information, is stored in storage unit 36.Knowledge in substrate P Not Biao Ji the location information (coordinate information) of B be also known information, be stored in storage unit 36 as substrate data.

As noted above, the movable range of mounting head 8 be mounting head camera 17 can to the identification of substrate P mark B into The range of row detection.When identification in the movable range of mounting head 8 configured with substrate P marks B, mounting head camera 17 can The identification label B of the substrate P is configured in detection zone MA.On the other hand, it is not configured in the movable range of mounting head 8 When the identification of substrate P marks B, mounting head camera 17 cannot mark the identification of the substrate P B configuration in detection zone MA.

Position (1st stop position and 2nd stop position of the determination unit 31 based on the substrate P as defined in substrate moving device 6 At least one of set), the movable range (movable range of mounting head camera 17) of mounting head 8 and the identification in substrate P The location information of B is marked, determines whether mounting head camera 17 can mark B to detect the identification of substrate P.

For example, the location information of the identification label B in movable range and substrate P of the determination unit 31 based on mounting head 8, it can To whether can by the identification for the substrate P for stopping at the 1st rest position in path mark B be configured at mounting head camera 17 (whether can be detected) and be determined using 17 couples of identification label B of mounting head camera in detection zone MA.In addition, determining Whether the location information of the identification label B in movable range and substrate P of the portion 31 based on mounting head 8, can be to can will stop (it is in the detection zone MA that the identification label B of the substrate P of the 2nd rest position in path is configured at mounting head camera 17 It is no to be detected using 17 couples of identification label B of mounting head camera) determine.

As shown in figure 12, in the present embodiment, identification label B configuration is near the end of the side-X of substrate P.Such as It shown in Figure 12, is configured in the case where 1 rest position by substrate P, movable model of the identification label B configuration in mounting head 8 The outside enclosed.In the present embodiment, the position of the identification label B in movable range and substrate P of the determination unit 31 based on mounting head 8 Confidence breath, the identification for the substrate P for stopping at the 1st rest position in path cannot be marked B to be configured at mounting head by, which being determined as, shines It (cannot be detected using 17 couples of identification label B of mounting head camera) in the detection zone MA of camera 17.

As shown in figure 12, it in the case where 2 rest position, identifies by substrate P configuration and marks B configuration in mounting head In 8 movable range.In the present embodiment, the identification label in movable range and substrate P of the determination unit 31 based on mounting head 8 The location information of B is judged to B capable of being marked to be configured at installation the identification for the substrate P for stopping at the 2nd rest position in path It (can be detected using 17 couples of identification label B of mounting head camera) in the detection zone MA of head camera 17.

B is marked in the identification for being judged to stop at the substrate P of the 2nd rest position in path using determination unit 31 When being configured in the detection zone MA of mounting head camera 17, mounting head 8 is moved so that label B configuration will be identified in detection zone In the MA of domain.The identification label B for stopping at the substrate P of the 2nd rest position as a result, is detected by mounting head camera 17.

Generating unit 32 is being judged to that identification label B cannot be configured to the detection in mounting head camera 17 using determination unit 31 When in the MA of region, the temporary identifications (interim ID) of substrate P are generated.Interim ID is interim ID (the identification letter temporarily used Breath).Interim ID is for example based on the date-time that substrate P is moved in hookup wire or the electronic component for having moved in substrate P installation dress 1 model etc. is set to be determined.Interim ID is not the identification information being physically attached in substrate P by lettering etc.. It is exported, is stored in storage unit 22 from the interim ID that generating unit 32 generates to the acquisition unit 21 of server 3.

Information treatment part 33 will be mounted with the relevant tracing information of the substrate P of electronic component C in the 1st rest position, It is stored in association with temporary identifications in the storage unit 17 of server 3.Tracing information is the data for indicating production resume, Such as comprising manufacture the moment, operating personnel's name, the electronic component C installed title (type), supplied electronic component C's The information such as the movement speed of installation site and mounting head 8 of the number, electronic component C of feeder in substrate P.

Acquisition unit 34 marks the testing result of B based on the identification when mounting head camera 17 detects identification label B, It obtains substrate identification information (substrate ID).Substrate ID is the identification information based on the identification label B being arranged in substrate P, is to hold The real ID (identification information) used long.In the case where acquisition unit 34 achieves substrate ID, information treatment part 33 will be interim ID is replaced into substrate ID.That is, in the case where acquisition unit 34 achieves substrate ID, information treatment part 33 will in the 2nd stop position The place of setting is mounted with the relevant tracing information of the substrate P of electronic component C, is stored in storage unit 22 in association with substrate ID.

Control unit 35 exports the control signal controlled electronic component mounting apparatus 1.Control signal includes: starting to refer to Signal is enabled, indicates the beginning of the installation action of electronic component mounting apparatus 1；Action command signal indicates electronic component peace The content of the installation action of assembling device 1；And stop instruction signal, indicate the installation action of electronic component mounting apparatus 1 Stop.Control unit 35 can be to outputs control signal (sign on letters such as substrate moving device 6 and installation head moving devices 9 Number and action command signal), to implement installation action.Control unit 35 can be mobile to substrate moving device 6 and mounting head Equal outputs control signal (stop instruction signal) of device 9, to stop installation action.

In the following, referring to Fig.1 4, an example of the installation method of electronic component C involved in present embodiment is said It is bright.Figure 14 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.

Substrate P is moved in substrate moving device 6.Substrate moving device 6 according to the path parallel with X-axis make substrate P along+ X-direction is mobile, and the 1st rest position in the path makes substrate P stop (step SA1).

The position letter of identification label B in movable range and substrate P of the determination unit 31 based on the mounting head 8 in X/Y plane Breath determines whether to mark the identification for the substrate P for stopping at the 1st rest position in path B to be configured at mounting head photograph In the detection zone MA of machine 17 (step SA2).Whether determination unit 31 also can be determined that in detection zone MA configured with identification label B。

It is judged to that identification label B the situation in detection zone MA cannot be configured using determination unit 31 in step SA2 Under (the case where No), generating unit 32 generates the interim ID (step SA3) of substrate P.It can also be determined as detection zone in step SA2 In the case where being not configured with identification label B in the MA of domain, interim ID is generated.The interim ID of generation is exported into (step to server 3 SA4)。

The storage unit 22 of server 3 will be mounted with the relevant retrospect of the substrate P of electronic component C in the 1st rest position Information is saved in association with interim ID.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 1st rest position It installs (step SA5).

After 1 installation action, the clamping to substrate P is released.Substrate moving device 6 makes the substrate P along +X direction It is mobile, so that substrate P is stopped (step SA6) in the 2nd rest position.

The position letter of identification label B in movable range and substrate P of the determination unit 31 based on the mounting head 8 in X/Y plane Breath determines whether to mark the identification for the substrate P for stopping at the 2nd rest position in path B to be configured at mounting head photograph In the detection zone MA of machine 17.

B is marked in the identification for being judged to stop at the substrate P of the 2nd rest position in path using determination unit 31 In the case where being configured in detection zone MA, mounting head 8 is moved so that label B configuration will be identified in mounting head camera 17 In detection zone MA.Mounting head camera 17 is detected (step to the identification label B for the substrate P for stopping at the 2nd rest position Rapid SA7).

The testing result for the identification label B that acquisition unit 34 is detected based on mounting head camera 17, obtains substrate ID (step SA8)。

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 2nd rest position It installs (step SA9).

After 2 installation action, the clamping to substrate P is released.Substrate moving device 6 makes the substrate P along +X direction It moves and moves out.

Information treatment part 33 by the 1st rest position be mounted with the relevant tracing information of the substrate P of electronic component B with Interim ID is associated, and will be mounted with the relevant tracing information of the substrate P of electronic component B and base in the 2nd rest position Plate ID is associated (step SA10).

Information treatment part 33 will carry out associated interim ID, substrate ID and tracing information to the output (step of server 3 Rapid SA11).

The interim ID saved in storage unit 22 is replaced into substrate ID.Storage unit 22 will tracing information relevant to substrate P (step SA12) is saved in association with substrate ID.

The situation for being judged to identification label B capable of being configured in detection zone MA using determination unit 31 in step SA2 Under (the case where Yes), mounting head 8 is moved will identify label B configuration in the detection zone MA of mounting head camera 17. Mounting head camera 17 is detected (step SA13) to the identification label B for the substrate P for stopping at the 1st rest position.It can also In the case where to be determined as in detection zone MA in step SA2 configured with identification label B, identification label B is detected.

The testing result for the identification label B that acquisition unit 34 is detected based on mounting head camera 17, obtains substrate ID.It will take The substrate ID obtained exports (step SA14) to server 3.

The storage unit 22 of server 3 will be mounted with the relevant retrospect of the substrate P of electronic component C in the 1st rest position Information is saved in association with substrate ID.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 1st rest position It installs (step SA15).

After 1 installation action, the clamping to substrate P is released.Substrate moving device 6 makes the substrate P along +X direction It is mobile, so that substrate P is stopped (step SA16) in the 2nd rest position.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 2nd rest position It installs (step SA17).

Information treatment part 33 is associated with substrate ID by tracing information relevant to the substrate P of electronic component B is mounted with.Letter Breath processing unit 33 will carry out associated substrate ID and tracing information and export (step SA18) to server 3.

The storage unit 22 of server 3 saves tracing information relevant to substrate P with substrate ID in association.

Shown in as described above, according to the present embodiment, the identification in movable range and substrate P based on mounting head 8 The location information for marking B determines whether to stop at the identification label B configuration of the substrate P of the 1st rest position in path It is raw when being determined as cannot configure identification label B in detection zone MA in the detection zone MA of mounting head camera 17 At the interim ID of substrate P, tracing information relevant to substrate P is saved in association with interim ID, it is thus possible to inhibit The reduction of the production efficiency of electronic component mounting system 100.

For example, in order to obtain the tracing information of strip substrate and in the substrate setting identification label B in the case where, such as Fruit identified in the substrate label B position be restricted or the movable range of mounting head 8 (mounting head camera 17) by Limitation, it is likely that can not be detected using 17 couples of identification label B of mounting head camera of mounting head 8, retrospect can not be obtained Information.

If can not be detected using 17 couples of identification label B of mounting head camera of mounting head 8, such as operating personnel It needs to detect identification label B using handheld terminal.In the case, it is likely that cause electronic component mounting system 100 Production efficiency reduction.

In addition, being also likely to cause the production efficiency of electronic component mounting system 100 using following methods Reduction, this method is, just to identify that label B configuration in the detection zone MA of mounting head camera 17, and controls Substrate moving device 6 is to adjust the position of substrate P.

In the present embodiment, constant more pre-determined 1st stop position and the 2nd stop position, by can not It is generated in the case where identification label B is configured in the detection zone MA of mounting head camera 17 by the 1st rest position interim ID, so as to obtain tracing information associated with substrate P, without moving substrate P unnecessarily.

In addition, mounting head camera can be used timing appropriate (substrate P to be configured to the timing in the 2nd stop position) 17 couples of identification label B are detected, without moving substrate P redundantly.Therefore, mounting head camera 17 can successfully be carried out Detection to identification label B, inhibits the reduction of the production efficiency of electronic component mounting system 100.

The 2nd embodiment is illustrated.In the following description, to the structural portion identical or same with above embodiment Minute mark infuses identical label, simplifies or the description thereof will be omitted.

Figure 15 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.In this reality It applies in mode, the example that the installation to electronic component C to the substrate P for stopping at the 1st rest position is interrupted is illustrated.

Substrate P is moved in substrate moving device 6.Substrate moving device 6 according to the path parallel with X-axis make substrate P along+ X-direction is mobile, and the 1st rest position in the path makes substrate P stop (step SB1).

The position letter of identification label B in movable range and substrate P of the determination unit 31 based on the mounting head 8 in X/Y plane Breath determines whether to mark the identification for the substrate P for stopping at the 1st rest position in path B to be configured at mounting head photograph In the detection zone MA of machine 17 (step SB2).Whether determination unit 31 also can be determined that in detection zone MA configured with identification label B。

It is judged to that identification label B the situation in detection zone MA cannot be configured using determination unit 31 in step SB2 Under (the case where No), generating unit 32 generates the interim ID (step SB3) of substrate P.It can also be determined as detection zone in step SB2 In the case where being not configured with identification label B in the MA of domain, interim ID is generated.The interim ID of generation is exported into (step to server 3 SB4)。

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 1st rest position It installs (step SB5).

For some reason, electronic component C interrupts (step to the installation for the substrate P for stopping at the 1st rest position SB6).If installation is interrupted, the clamping (step SB7) of substrate P is released.It is clamped by releasing, to enable substrate P along X Axis direction is mobile.

If installation is interrupted, generating unit 32 generates the interim ID of substrate P.Information treatment part 33 will in the 1st stop position It is associated with interim ID that the relevant tracing information of substrate P that installation is interrupted has occurred in the place of setting.Information treatment part 33 will be closed The interim ID and tracing information of connection export (step SB8) to server 3.The storage unit 22 of server 3 will stop with the 1st The relevant tracing information of substrate P that installation is interrupted has occurred at position, is saved in association with interim ID.

If the reason of installation is interrupted is eliminated, restart installation (step SB9) of the electronic component C to substrate P.If Installation restarts, then is clamped (step SB10) to substrate P in the 1st rest position.

(step SB11) is restored to the interim ID generated in step SB8.The interim ID restored is to service The interim ID saved in the storage unit 22 of device 3 or the storage unit 36 of control device 10.Information treatment part 33 will carry out recovery Interim ID and tracing information are exported to server 3.The storage unit 22 of server 3 will be directed to and open again in the 1st rest position The tracing information for the substrate P installed that begun, is saved in association with interim ID.

1st installation action restarts (step SB12).After 1 installation action, the clamping to substrate P is released. Substrate moving device 6 moves the substrate P along +X direction, so that substrate P is stopped (step SB13) in the 2nd rest position.

B is marked in the identification for being judged to stop at the substrate P of the 2nd rest position in path using determination unit 31 In the case where being configured in detection zone MA, mounting head 8 is moved so that label B configuration will be identified in mounting head camera 17 In detection zone MA.Mounting head camera 17 is detected (step to the identification label B for the substrate P for stopping at the 2nd rest position Rapid SB14).

The testing result for the identification label B that acquisition unit 34 is detected based on mounting head camera 17, obtains substrate ID (step SB15)。

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 2nd rest position It installs (step SB16).

Information treatment part 33 will be relevant to the substrate P of installation for having restarted electronic component B in the 1st rest position Tracing information is associated with interim ID, and by be mounted with that the substrate P of electronic component B is relevant in the 2nd rest position and chase after Information of tracing back is associated with substrate ID (step SB17).

Information treatment part 33 will carry out associated interim ID, substrate ID and tracing information to the output (step of server 3 Rapid SB18).

The interim ID saved in storage unit 22 is replaced into substrate ID.Storage unit 22 will tracing information relevant to substrate P (step SB19) is saved in association with substrate ID.

The situation for being judged to identification label B capable of being configured in detection zone MA using determination unit 31 in step SB2 Under (the case where Yes), mounting head 8 is moved will identify label B configuration in the detection zone MA of mounting head camera 17. Mounting head camera 17 is detected (step SB20) to the identification label B for the substrate P for stopping at the 1st rest position.It can also In the case where to be determined as in detection zone MA in step SB2 configured with identification label B, identification label B is detected.

The testing result for the identification label B that acquisition unit 34 is detected based on mounting head camera 17, obtains substrate ID.It will take The substrate ID obtained exports (step SB21) to server 3.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 1st rest position It installs (step SB22).

For some reason, electronic component C interrupts (step to the installation for the substrate P for stopping at the 1st rest position SB23).If installation is interrupted, the clamping (step SB24) of substrate P is released.It is clamped by releasing, to enable substrate P edge X-direction is mobile.

If installation is interrupted, the substrate P phase that installation is interrupted will be had occurred in the 1st rest position in information treatment part 33 The tracing information of pass is associated with substrate ID.Information treatment part 33 will carry out associated substrate ID and tracing information to clothes Business device 3 exports (step SB25).The substrate P that installation is interrupted will has occurred in the 1st rest position in the storage unit 22 of server 3 Relevant tracing information is saved in association with substrate ID.

If the reason of installation is interrupted is eliminated, restart installation (step SB26) of the electronic component C to substrate P.Such as Fruit installation restarts, then is clamped (step SB27) to substrate P in the 1st rest position.In addition, if installation is opened again Begin, then mounting head camera 17 is detected (step SB28) to the identification label B for the substrate P for stopping at the 1st rest position.

Substrate ID and tracing information are exported (step SB29) to server 3 by information treatment part 33.Server 3 is deposited Storage portion 22 will for the 1st rest position has restarted installation substrate P tracing information, with substrate ID in association into Row saves.

1st installation action restarts (step SB30).After 1 installation action, the clamping to substrate P is released. Substrate moving device 6 moves the substrate P along +X direction, so that substrate P is stopped (step SB31) in the 2nd rest position.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 2nd rest position It installs (step SB32).

Information treatment part 33 is associated with substrate ID by tracing information relevant to the substrate P of electronic component B is mounted with.Letter Breath processing unit 33 will carry out associated substrate ID and tracing information and export (step SB33) to server 3.

As mentioned above, according to the present embodiment, it when the 1st installation action interrupts, generates and saves interim ID.? When 1 installation action restarts, generates and the interim ID saved restores, re-used to when interrupting.Exist as a result, After installation restarts before interrupting with installation, the identification information of substrate P can be associated.

The 3rd embodiment is illustrated.In the following description, to the structural portion identical or same with above embodiment Minute mark infuses identical label, simplifies or the description thereof will be omitted.

Figure 16 is the flow chart for indicating an example of electronic component mounting method involved in present embodiment.In this reality It applies in mode, electronic component C is illustrated to the example that the installation action for the substrate P for stopping at the 2nd rest position interrupts.

Substrate P is moved in substrate moving device 6.Substrate moving device 6 according to the path parallel with X-axis make substrate P along+ X-direction is mobile, and the 1st rest position in the path makes substrate P stop (step SC1).

The position letter of identification label B in movable range and substrate P of the determination unit 31 based on the mounting head 8 in X/Y plane Breath determines whether to mark the identification for the substrate P for stopping at the 1st rest position in path B to be configured at mounting head photograph In the detection zone MA of machine 17 (step SC2).Whether determination unit 31 also can be determined that in detection zone MA configured with identification label B。

It is judged to that identification label B the situation in detection zone MA cannot be configured using determination unit 31 in step SC2 Under (the case where No), generating unit 32 generates the interim ID (step SC3) of substrate P.It can also be determined as detection zone in step SC2 In the case where being not configured with identification label B in the MA of domain, interim ID is generated.The interim ID of generation is exported into (step to server 3 SC4)。

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 1st rest position It installs (step SC5).

After 1 installation action, the clamping to substrate P is released.Substrate moving device 6 makes the substrate P along +X direction It is mobile, so that substrate P is stopped (step SC6) in the 2nd rest position.

B is marked in the identification for being judged to stop at the substrate P of the 2nd rest position in path using determination unit 31 In the case where being configured in detection zone MA, mounting head 8 is moved so that label B configuration will be identified in mounting head camera 17 In detection zone MA.Mounting head camera 17 is detected (step to the identification label B for the substrate P for stopping at the 2nd rest position Rapid SC7).

The testing result for the identification label B that acquisition unit 34 is detected based on mounting head camera 17, obtains substrate ID (step SC8)。

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 2nd rest position It installs (step SC9).

For some reason, electronic component C interrupts (step to the installation for the substrate P for stopping at the 2nd rest position SC10).If installation is interrupted, the clamping (step SC11) of substrate P is released.It is clamped by releasing, to enable substrate P edge X-direction is mobile.

If installation is interrupted, the substrate P phase that installation is interrupted will be had occurred in the 2nd rest position in information treatment part 33 The tracing information of pass, it is associated (step SC12) with substrate ID and interim ID.Information treatment part 33 will carry out associated interim ID, substrate ID and tracing information export (step SC13) to server 3.The storage unit 22 of server 3 will stop with the 1st The relevant tracing information of substrate P that installation is interrupted has occurred at position, is saved in association with substrate ID and interim ID.

Interim ID is replaced into substrate ID by information treatment part 33.That is, information treatment part 33 will pacify in the 2nd rest position The relevant tracing information of substrate P for having filled electronic component C, is stored in (step in storage unit 22 with substrate ID in association SC14)。

If the reason of installation is interrupted is eliminated, restart installation (step SC15) of the electronic component C to substrate P.Such as Fruit installation restarts, then is clamped (step SC16) to substrate P in the 2nd rest position.In addition, if installation is opened again Begin, then mounting head camera 17 is detected (step SC17) to the identification label B for the substrate P for stopping at the 2nd rest position.

Substrate ID and tracing information are exported (step SC18) to server 3 by information treatment part 33.Server 3 is deposited Storage portion 22 will for the 2nd rest position has restarted installation substrate P tracing information, with substrate ID in association into Row saves.

2nd installation action restarts (step SC19).After 2 installation action, the clamping to substrate P is released. Substrate moving device 6 makes the substrate P move and move out along +X direction.

Information treatment part 33 will be relevant to the substrate P of installation for having restarted electronic component B in the 2nd rest position Tracing information is associated with substrate ID (step SC20).

The situation for being judged to identification label B capable of being configured in detection zone MA using determination unit 31 in step SC2 Under (the case where Yes), mounting head 8 is moved will identify label B configuration in the detection zone MA of mounting head camera 17. Mounting head camera 17 is detected (step SC21) to the identification label B for the substrate P for stopping at the 1st rest position.It can also In the case where to be determined as in detection zone MA in step SC2 configured with identification label B, identification label B is detected.

The testing result for the identification label B that acquisition unit 34 is detected based on mounting head camera 17, obtains substrate ID.It will take The substrate ID obtained exports (step SC22) to server 3.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 1st rest position It installs (step SC23).

After 1 installation action, the clamping to substrate P is released.Substrate moving device 6 makes the substrate P along +X direction It is mobile, so that substrate P is stopped (step SC24) in the 2nd rest position.

Control unit 35 controls mounting head 8, and electronic component C is carried out to the substrate P for stopping at the 2nd rest position It installs (step SC25).

For some reason, electronic component C interrupts (step to the installation for the substrate P for stopping at the 2nd rest position SC26).If installation is interrupted, the clamping (step SC27) of substrate P is released.It is clamped by releasing, to enable substrate P edge X-direction is mobile.

If installation is interrupted, the substrate P phase that installation is interrupted will be had occurred in the 2nd rest position in information treatment part 33 The tracing information of pass is associated with substrate ID.Information treatment part 33 will carry out associated substrate ID and tracing information to clothes Business device 3 exports (step SC28).The substrate P that installation is interrupted will has occurred in the 2nd rest position in the storage unit 22 of server 3 Relevant tracing information is saved in association with substrate ID.

If the reason of installation is interrupted is eliminated, restart installation (step SC29) of the electronic component C to substrate P.Such as Fruit installation restarts, then is clamped (step SC30) to substrate P in the 2nd rest position.In addition, if installation is opened again Begin, then mounting head camera 17 is detected (step SC31) to the identification label B for the substrate P for stopping at the 2nd rest position. In addition, the detection of identification label B also can use handheld terminal and be implemented.

Substrate ID and tracing information are exported (step SC32) to server 3 by information treatment part 33.Server 3 is deposited Storage portion 22 will for the 2nd rest position has restarted installation substrate P tracing information, with substrate ID in association into Row saves.

2nd installation action restarts (step SC33).After 2 installation action, the clamping to substrate P is released. Substrate moving device 6 makes the substrate P move and move out along +X direction.

Information treatment part 33 is associated with substrate ID by tracing information relevant to the substrate P of electronic component B is mounted with.Letter Breath processing unit 33 will carry out associated substrate ID and tracing information and export (step SC34) to server 3.

As described above, according to the present embodiment, when the 2nd installation action interrupts, substrate ID is saved.In the 2nd peace When dress movement restarts, the substrate ID saved when interrupting is re-used.Before breaking in an installation as a result, and installation is heavy After new beginning, the identification information of substrate P can be associated.

The 4th embodiment is illustrated.In the following description, to the structural portion identical or same with above embodiment Minute mark infuses identical label, simplifies or the description thereof will be omitted.

In the first embodiment described above, the 2nd embodiment and the 3rd embodiment, by the stopping of the substrate P in path Position is set as at 2.Stop position may be at 3, at 4 or more than or equal to 5 at any amount.

Figure 17 is the figure for indicating the relationship between substrate P involved in present embodiment and the movable range of mounting head 15. It is the example at 3 that Figure 17, which shows stop position,.

As shown in figure 17, following region is provided: the movable range of the mounting head 8 of the rest position with the 1st time A part of region (mounted region) a on corresponding substrate P surface；With the movable model of the mounting head 8 of the 2nd rest position Enclose a part of region (mounted region) c on corresponding substrate P surface；And the mounting head 8 of the rest position with the 3rd time A part of region (mounted region) e on the corresponding substrate P surface of movable range.Stop position to the 1st time and the 2nd time Stop position is determined, so that forming repeat region b by region a and region c.Stop position to the 2nd time and the 3rd time Stop position be determined so that forming repeat region d by region c and region e.

Region a is the region that can be installed using the 1st installation action to electronic component C.Region c is can be using the The region that 2 installation actions install electronic component C.Region e is can be carried out using the 3rd installation action to electronic component C The region of installation.Repeat region b is can be using the 1st installation action and the 2nd installation action the two movements to electronic component C The region installed.Repeat region d is can be using the 2nd installation action and the 3rd installation action the two movements to electronics The region that component C is installed.

Claims

1. a kind of electronic component mounting system, has:

Substrate moving device, can be according to the path moving substrate parallel with the 1st axis in regulation face, can be in the path Multiple rest positions stop the substrate；

Mounting head, with suction nozzle and label test section, which releasably keeps electronic component, which has Detection zone and the identification label for being able to detect the substrate configured in the detection zone；

Head moving device is installed, the mobile mounting head in the movable range in the predetermined surface；

Determination unit determines whether energy based on the location information of the identification label in the movable range and the substrate The identification label of enough substrates by the 1st rest position for stopping at the path is configured at the detection zone In；

Generating unit, it is raw when being judged to configure identification label in the detection zone by the determination unit At the temporary identifications of the substrate；And

Information treatment part, by be mounted with that the substrate of the electronic component is relevant in the 1st rest position and chase after It traces back information, is stored in storage unit in association with the temporary identifications.

2. electronic component mounting system according to claim 1, wherein

In the knowledge for the substrate for being judged to stop at the 2nd rest position in the path by the determination unit When Biao Ji not configure in the detection zone, the mobile mounting head is so that identification label is configured in the detection zone In domain, examined by identification label of the label test section to the substrate for stopping at the 2nd rest position It surveys,

The electronic component mounting system has acquisition unit, which obtains substrate based on the testing result of the identification label and know Other information,

The temporary identifications are replaced into the substrate identification information by the information treatment part.

3. a kind of electronic component mounting method comprising following step:

According to the path moving substrate parallel with the 1st axis in regulation face；

The 1st rest position in the path stops the substrate；

Mounting head has suction nozzle and label test section, which releasably keeps electronic component, which has inspection It surveys region and is able to detect the identification label of the substrate configured in the detection zone, in this step, based on installation The location information of identification label in movable range and the substrate in the predetermined surface of head determines whether to incite somebody to action The identification label configuration of the substrate of the 1st rest position is stopped in the detection zone；

When being judged to that the identification cannot be marked configuration in the detection zone by determination unit, facing for the substrate is generated When identification information；And

The relevant tracing information of the substrate of the electronic component will be mounted in the 1st rest position, and it is described Temporary identifications are stored in storage unit in association.

4. electronic component mounting method according to claim 3 comprising following step:

Determine whether to stop at the knowledge of the substrate of the 2nd rest position in the path by the determination unit It Biao Ji not configure in the detection zone；

In the identification label configuration for being judged to stop at the substrate of the 2nd rest position in the inspection When surveying in region, the mobile mounting head is so that identification label configuration utilizes the label in the detection zone Test section detects the identification label for the substrate for stopping at the 2nd rest position；

Testing result based on the identification label obtains substrate identification information；And

The temporary identifications being stored in the storage unit are replaced into the substrate identification information.