JP6764757B2 - Parts mounting system - Google Patents

Description

The present disclosure relates to a component mounting system consists of a loose component supplying device and the component mounting apparatus.

Conventionally, related to configured component mounting system in the loose component supplying device and the component mounting apparatus, various techniques have been proposed. For example, in the surface mounter described in Patent Document 1 below, a recording medium on which identification information is recorded is attached to each tape feeder, and the tape feeder is imaged and recognized by a CCD camera mounted on the head unit. Can be identified. Further, a storage unit is provided in the control unit of the surface mounter main body, and data related to timing adjustment between the operation of the component sending means of the tape feeder and the operation of the head of the head unit is stored for each tape feeder. Then, at the time of mounting, the data of the tape feeder to which the component should be taken out is read based on the recognition of each tape feeder, and based on this data, the control unit controls at least one of the operation of the component sending means and the operation of the head. I am trying to control one operation.

Japanese Unexamined Patent Publication No. 2000-22400

However, in the surface mounter described in Patent Document 1, the tape is unwound by the operation of the component feeding means of the tape feeder, and the unwound tape components are sequentially fed to the head take-out position. That is, there is one head take-out position for one tape feeder.

Therefore, when a loose component supply device provided with a buffer section in which a predetermined number of components are aligned is used instead of the tape feeder, a predetermined number of head take-out positions exist in the buffer section of the loose component supply device. That is, there are a plurality of head take-out positions for one loose component supply device. Therefore, when trying to control the head based on the same information as the data of the tape feeder, it is difficult for the head to take out a plurality of parts aligned in the buffer portion of the loose parts supply device.

Therefore, the present disclosure has been made in view of the above-mentioned points, and a plurality of parts aligned in the buffer portion of the loose parts supply device are arranged in a plurality of parts mounting devices based on the information regarding the loose parts supply device. and to provide a component holding component mounting system that can be taken by instrument.

The present specification is a loose parts mounting system including a loose parts supply device and a parts mounting device . In the loose parts supply device, a parts accommodating unit for accommodating a plurality of parts in a loosely stacked state and parts from the parts accommodating unit are provided. It includes a buffer unit that is conveyed and aligns a predetermined number of parts, a code storage unit that stores a unique identification code, and a supply side control unit . The supply side control unit aligns a predetermined number of parts in the buffer unit. Upon completion, a transmission process of transmitting a completion signal to the component mounting device is executed, and the component mounting device stores a plurality of component holders, a mounting side control unit, and holding conditions of the loose component supply device. The condition storage unit is provided with a plurality of holding conditions associated with the identification code, and the mounting side control unit acquires the unique identification code stored in the code storage unit. After the acquisition process, the setting process of setting the corresponding holding condition as the holding condition of the loose component supply device based on the unique identification code acquired from the loose component supply device, and the completion signal from the loose component supply device, a predetermined number of components aligned in the buffer portion of the loose component feeder, loose component mounting system performing a holding process for holding a plurality of component holders on the basis of the holding condition of the loose component feeder is disclosed.

According to the present disclosure, a plurality of parts aligned in the buffer portion of the loose parts supply device can be taken out by a plurality of component holders of the parts mounting device based on the information about the loose parts supply device.

It is explanatory drawing of the component mounting apparatus 10. It is explanatory drawing of the loose part supply apparatus 100. It is explanatory drawing of the component supply part 130. It is a block diagram which shows the electrical connection of a control device 60. It is explanatory drawing when a part is sent to the part supply part 130. It is explanatory drawing when the stock of the part to the part supply part 130 is completed. It is a block diagram which shows the electrical connection of the loose parts supply device 100. It is a schematic diagram for demonstrating the storage form of the adsorption condition file. It is a schematic diagram for demonstrating the data in the adsorption condition file. It is a flowchart for realizing the taking-out of a component by a mounting head 24. It is a flowchart for realizing the taking-out of a component by a mounting head 24.

Preferred embodiments of the present disclosure will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting device 10. In this embodiment, the left-right direction in FIG. 1 is the X-axis direction, the front-back direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

As shown in FIG. 1, the component mounting device 10 includes a transport unit 18 for transporting the substrate S, a sampling unit 21 for collecting parts, a reel parts supply device 56 for supplying reel parts, and a loose part for supplying loose parts. It includes a component supply device 100 and a control device 60 that controls the component mounting device 10. The transport unit 18 includes support plates 20 and 20 provided at intervals in the front and rear directions of FIG. 1 and extending in the left-right direction, and conveyor belts 22 and 22 provided on opposite surfaces of both support plates 20 and 20. ing. The conveyor belts 22 and 22 are bridged to the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The substrate S is placed on the upper surfaces of the pair of conveyor belts 22, 22 and conveyed from left to right. The substrate S is supported from the back surface side by a large number of supporting pins 23 erected.

The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is mounted on the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the component mounting device 10. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is slidably attached to the guide rails 28, 28 in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26 and 30 are driven by drive motors (not shown).

The mounting head 24 includes a nozzle holding portion 42 that supports a plurality of nozzles 40 for sucking parts so as to be able to move up and down. The nozzle holding portion 42 is configured to be rotatable around an axis parallel to the Z axis. In this embodiment, the mounting head 24 includes eight nozzles 40. The nozzle 40 uses pressure to attract parts to the tip of the nozzle and release the parts attracted to the tip of the nozzle. By the holder elevating device driven by the Z-axis motor 45, the nozzle 40 located at a specific phase of the rotation phase of the nozzle holding portion 42 and engaging with the holder elevating device is Z orthogonal to the X-axis and Y-axis directions. It is moved up and down in the axial direction (vertical direction). The component holding member for holding and releasing the component is described here as the nozzle 40 for sucking and releasing the component, but the present invention is not particularly limited to this, and for example, a mechanical chuck may be used.

The reel component supply device 56 includes a reel 57 around which a tape containing components is wound, and is detachably attached to a component supply device mounting base 90 provided on the front side of the component mounting device 10. This tape is unwound from the reel 57 and sent out by the feeder unit 58 to the collection position where the tape is collected by the mounting head 24. The parts camera 54 is arranged in front of the support plate 20 on the front side of the transport unit 18. The imaging range of the parts camera 54 is above the parts camera 54. When the nozzle 40 sucking the parts passes above the parts camera 54, the parts camera 54 photographs the state of the parts sucked by the nozzle 40 and outputs the image to the control device 60.

As shown in FIG. 1, the loose component supply device 100 is detachably attached to the component supply device mounting base 90 like the reel component supply device 56. As shown in FIG. 2, the bulk parts supply device 100 is equipped with a parts accommodating portion 110 for accommodating a plurality of parts in a bulk state, a parts passage 120 for aligning and transporting parts, and parts transported from the parts passage 120. A component supply unit 130 for arranging a plurality of heads 24 in the left-right direction so that the head 24 can be taken out is provided. When the loose parts supply device 100 is attached to the parts supply device mounting base 90, the parts supply unit 130 is located inside the cover 91 of the parts mounting device 10, and the parts storage unit 110 is located outside the cover 91. ing. The component accommodating portion 110 includes a bowl 111 and a vibrating portion 112 provided below the bowl 111. A spiral first transport path 113 is formed on the inner surface of the bowl 111. In the component passage 120, a second transport path 121 having a width substantially equal to the width of the component and larger than the component is formed. The component passage 120 aligns and conveys the components so that the longitudinal direction of the components is the front-rear direction. The component passage 120 is connected to the component accommodating portion 110, and specifically, is connected to the inlet end of the second transport path 121 at the terminal portion of the first transport path 113. The component supply unit 130 is provided at the tip of the component passage 120, and a plurality of components transported from the component passage 120 are aligned in the left-right direction and supplied to the component mounting device 10. As shown in FIG. 3, the component supply unit 130 includes an introduction port 131 that communicates with the second transport path 121 at one end, and a plurality of components (eight in the present embodiment) extending to the left from the introduction port 131. Has a groove 132 capable of stocking. The component supply unit 130 has a length in the left-right direction shorter than the length in the left-right direction of the bowl 111, and fits within the range in the left-right direction of the bowl 111 with the loose component supply device 100 attached to the component supply device mounting base 90. It has a positional relationship. As a result, the reel parts supply device 56 can be attached to the loose parts supply device 100 in the vicinity of the side surface of the bowl 111. The groove width of the groove portion 132 is substantially the same as the length of the component in the longitudinal direction and is larger than the length of the component. Further, the component supply unit 130 includes a first detection sensor 133 that detects a component located at the end on the introduction port 131 side and a second detection sensor 133 that detects a component located at the end opposite to the introduction port 131. It is equipped with 134. Further, the component supply unit 130 includes a component supply unit transport means (not shown) for transporting the components fed to the introduction port 131 to the left. As the conveying means for the parts supply unit, a method using vibration, a method using air, or the like can be applied.

As shown in FIG. 4, the control device 60 is configured as a microprocessor centered on a CPU 61, and has a ROM 62 for storing a processing program, an HDD 63 for storing various data, a RAM 64 used as a work area, an external device and electricity. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66. The control device 60 is bidirectionally connected to a transport unit 18, a sampling unit 21, a parts camera 54, a reel parts supply device 56, a loose parts supply device 100, and the like. The sliders 26 and 30 are equipped with position sensors (not shown), and the control device 60 controls the drive motors of the sliders 26 and 30 while inputting the position information from the position sensors.

Next, the operation of the component mounting device 10 and the loose component supply device 100 of the present embodiment configured in this way will be described. When the production of the substrate S by the component mounting device 10 is started, the loose component supply device 100 starts the component supply operation. When the parts supply work is started, the vibrating unit 112 vibrates the bowl 111. Due to this vibration, the parts housed in the bowl 111 in bulk are transported toward the parts passage 120 while being aligned along the first transport path 113. At this time, the parts are aligned so that the longitudinal direction of the parts is parallel to the traveling direction of the parts. After that, as shown in FIG. 5, the component is transferred from the first transport path 113 to the second transport path 121 of the component passage 120, and the component is longitudinally crossed on the second transport path 121 by the component passage transport means (not shown). The parts are aligned and transported to the component supply unit 130 in a direction whose direction is orthogonal to the substrate transport direction. The transporting means for the component supply section starts the transport operation when the first detection sensor 133 detects that the component has arrived at the end of the groove portion 132 of the component supply section 130 on the introduction port 131 side. The component is transported toward the end of the groove 132 opposite to the introduction port 131 by the component feeding means, but at this time, the component is transported in a posture in which the longitudinal direction of the component is orthogonal to the substrate transport direction. Orthogonal. As shown in FIG. 6, when eight parts are stocked up to the end of the groove 132 on the inlet 131 side, the first detection sensor 133 and the second detection sensor 134 continue to be ON, so that such a state is detected. Then, the transport operation of the transport means for the component supply unit is stopped, and the component is taken out by the mounting head 24. When taking out the parts by the mounting head 24, the mounting head 24 is moved to the position of the parts located at the end of the groove 132 on the introduction port 131 side, and the parts are taken out by the first nozzle 40. Next, the mounting head 24 is moved to the position of the part to the right of the removed part, and the part is taken out by the second nozzle 40. Similarly, when the components have been taken out to the eighth nozzle 40, the mounting head 24 is moved onto the substrate S and the components are mounted on the substrate S. While the mounting head 24 mounts the components on the substrate S, the loose component supply device 100 performs the same operation as described above, and stocks eight components in the component supply unit 130.

Next, the configuration and operation related to the removal of the parts supplied by the loose parts supply device 100 will be described in detail below. As shown in FIG. 7, the electrical configuration of the loose component supply device 100 is configured as a microprocessor centered on the CPU 161 in the same manner as the control device 60, and the ROM 162 for storing the processing program and various data are stored. The HDD 163, the RAM 164 used as a work area, the input / output interface 165 for exchanging electric signals with an external device, and the like are provided, and these are connected via a bus 166. The loose parts supply device 100 is connected to the transport unit 18, the sampling unit 21, the parts camera 54, the reel parts supply device 56, the control device 60, and the like in two-way communication. The loose component supply device 100 may be connected only to the control device 60 so as to be capable of bidirectional communication. Further, detection signals from both detection sensors 133 and 134 are input to the loose component supply device 100.

The ROM 162 of the loose component supply device 100 stores a processing program for realizing the flowcharts of FIGS. 10 and 11 described later, and further stores an ID (Identifier) for identifying the loose component supply device 100. Has been done. The ID of the loose parts supply device 100 is KTABC in English. The ID of the loose component supply device 100 may be stored in the HDD 163.

On the other hand, as shown in FIG. 8, a plurality of adsorption condition files are stored in the ROM 62 of the control device 60. For the file name of the suction condition file, the ID of the loose component supply device that can be attached to the component mounting device 10 is used. In the present embodiment, alphabetic characters such as KTABA, KTABB, and KTABC are used as the file name of the adsorption condition file.

Each suction condition file contains information related to the removal of parts by the mounting head 24 of the component mounting device 10. The information includes information such as a specified number and an arrangement pitch. The specified number of pieces of information is information indicating the number of parts stocked in the parts supply unit 130 of the loose parts supply device 100. The arrangement pitch information is information indicating the spacing between the parts stocked in the parts supply unit 130 of the loose parts supply device 100. Specifically, for example, as shown in FIG. 9, in the adsorption condition file having the ID of the loose component supply device 100 (KTABC in alphabetical characters) as the file name, the number 8 (pieces) is used as the specified number of information. Is stored, and the number 5 (mm) is stored as information on the arrangement pitch.

Although not shown, each suction condition file stores reference position information for taking out parts. The extraction reference position information is information indicating the position of the component to be extracted. For example, in the suction condition file whose file name is the ID of the loose parts supply device 100 (KTABC in English), the parts stocked in the parts supply unit 130 of the loose parts supply device 100 are used as the extraction reference position information. Among them, information indicating the position of the first component to be taken out is stored. It should be noted that the take-out position of the first component may be set to a fixed position for all the loose component supply devices that can be attached to the component mounting device 10. In such a case, the extraction reference position information is not essential.

When taking out the parts supplied by the loose parts supply device 100, the processing program for realizing the flowcharts of FIGS. 10 and 11 is executed by the CPU 61 of the control device 60 and the CPU 161 of the loose parts supply device 100. Specifically, as shown in FIG. 10, the CPU 61 of the control device 60 processes an ID inquiry (step S1). In this process, information indicating that the ID is inquired is transmitted to the loose parts supply device 100.

On the other hand, the CPU 161 of the loose component supply device 100 determines whether or not there is an ID inquiry (step S101). This determination is made depending on whether or not the information to inquire about the ID has been received. When there is no ID inquiry (step S101: NO), the CPU 161 of the loose component supply device 100 again determines whether or not there is an ID inquiry (step S101).

On the other hand, when there is an inquiry for the ID (step S101: YES), the CPU 161 of the loose component supply device 100 processes the answer for the ID (step S103). In this process, the CPU 161 of the loose component supply device 100 reads the ID of the loose component supply device 100 from the ROM 162, and transmits information including the read ID to the control device 60.

On the other hand, the CPU 61 of the control device 60 determines whether or not there is an ID response (step S3). This determination is made based on whether or not information including an ID has been received. If there is no ID answer (step S3: NO), the CPU 61 of the control device 60 again determines whether or not there is an ID answer (step S3).

On the other hand, when there is an answer of the ID (step S3: YES), the CPU 61 of the control device 60 performs a process of setting the adsorption condition (step S5). In this process, the CPU 61 of the control device 60 reads a suction condition file having an ID included in the received information as a file name from the HDD 63, and stores the read suction condition file in the RAM 64.

After that, as shown in FIG. 11, the CPU 61 of the control device 60 performs a process of transmitting the FEED signal (step S11). In this process, the CPU 61 of the control device 60 transmits the FEED signal to the loose component supply device 100.

On the other hand, the CPU 161 of the loose component supply device 100 determines whether or not the FEED signal has been received (step S111). When the FEED signal is not received (step S111: NO), the CPU 161 of the loose component supply device 100 determines again whether or not the FEED signal has been received (step S111).

On the other hand, when the FEED signal is received (step S111: YES), the CPU 161 of the loose component supply device 100 performs a specified number of stock completion processes (step S113). In this process, the CPU 161 of the loose parts supply device 100 causes the parts supply unit 130 to stock eight parts, which is a specified number, by operating the parts supply unit transport means. The CPU 161 of the loose component supply device 100 detects the completion of stock by continuing the ON signals from the first detection sensor 133 and the second detection sensor 134.

Further, the CPU 161 of the loose component supply device 100 processes the transmission of the COMP signal (step S115). In this process, the CPU 161 of the loose component supply device 100 transmits a COMP signal to the control device 60. After that, the CPU 161 of the loose component supply device 100 again determines whether or not the FEED signal has been received (step S111).

On the other hand, the CPU 61 of the control device 60 determines whether or not the COMP signal has been received (step S13). When the COMP signal is not received (step S13: NO), the CPU 61 of the control device 60 determines again whether or not the COMP signal has been received (step S13).

On the other hand, when the COMP signal is received (step S13: YES), the CPU 61 of the control device 60 performs a process of mounting loose parts (step S15). In this process, the CPU 61 of the control device 60 takes out the parts by the mounting head 24 of the component mounting device 10 based on the information in the suction condition file stored in the RAM 64.

That is, the CPU 61 of the control device 60 is located at the position of the component located at the end of the groove 132 on the introduction port 131 side of the component supply unit 130 of the loose component supply device 100 based on the extraction reference position information in the suction condition file. The mounting head 24 of the mounting device 10 is moved, and the component is taken out by the first nozzle 40. Next, the CPU 61 of the control device 60 moves the mounting head 24 of the component mounting device 10 by the array pitch based on the information of the array pitch in the suction condition file, and takes out the component by the second nozzle 40. Next, the CPU 61 of the control device 60 similarly takes out the parts up to the eighth nozzle 40 based on the information of the specified number in the suction condition file. When the CPU 61 of the control device 60 finishes taking out the parts up to the eighth nozzle 40, the mounting head 24 is moved onto the board S and the parts are mounted on the board S. When the CPU 61 of the control device 60 finishes taking out the parts up to the eighth nozzle 40, the processing of transmitting the FEED signal is performed again (step S11).

Incidentally, in the present embodiment, the adsorption condition is an example of the retention condition described in the claims. The ID is an example of the identification code described in the claims. The COMP signal is an example of the completion signal described in the claims. The specified number is an example of the predetermined number described in the claims. The arrangement pitch is an example of the pitch described in the claims.

The component mounting device 10 is an example of the component mounting system described in the claims. Therefore, the configuration in which the loose component supply device 100 is excluded from the component mounting device 10 is an example of the component mounting device described in the claims. The nozzle 40 is an example of the component holder described in the claims. The CPU 61 is an example of the mounting side control unit described in the claims. The ROM 62 is an example of the conditional storage unit described in the claims. The component supply unit 130 is an example of the buffer unit described in the claims. ROM 162 is an example of the code storage unit described in the claims. The CPU 161 is an example of the supply-side control unit described in the claims. The first detection sensor 133 is an example of the sensor described in the claims. The second detection sensor 134 is an example of the sensor described in the claims.

The ID reply process (step S103) and the determination process corresponding to this process (step S3) are examples of the identification code acquisition process described in the claims. The process of setting the adsorption conditions (step S5) is an example of the setting process described in the claims. The processing of transmitting the COMP signal (step S115) is an example of the transmission processing described in the claims. The processing of mounting loose parts (step S15) is an example of the holding processing described in the claims.

According to the present embodiment described above, the CPU 61 of the control device 60 is aligned with the component supply unit 130 of the loose component supply device 100 by executing the process of mounting the loose components (step S15). Is sucked by a plurality of nozzles 40 of the component mounting device 10 based on the information in the suction condition file of the loose component supply device 100. Therefore, according to the present embodiment, a plurality of parts aligned in the component supply unit 130 of the loose component supply device 100 are formed by the plurality of nozzles 40 of the component mounting device 10 based on the information regarding the loose component supply device 100. It can be taken out.

According to the present embodiment, the CPU 61 of the control device 60 executes the processing of mounting the loose parts (step S15) after receiving the COMP signal from the loose parts supply device 100 (step S13: YES). While the processing of mounting the loose parts (step S15) is being executed, the COMP signal is not transmitted or received between the control device 60 and the loose parts supply device 100. Therefore, according to the present embodiment, since a specified number of parts are taken out by transmitting and receiving one COMP signal, COMP is compared with a known technique in which a COMP signal is transmitted and received each time one part is taken out. The time required to send and receive signals is greatly reduced, and the tact time for taking out parts can be greatly reduced.

In the reel parts supply device 56, which is different from the loose parts supply device 100, one tape is sent out in response to the reception of one FEED signal, and then the COMP signal is transmitted to the parts mounting device 10. To. That is, when one COMP signal is transmitted / received between the reel component supply device 56 and the component mounting device 10, the number of components adsorbed by the nozzle 40 from the reel component supply device 56 is only one. is there.

On the other hand, in the loose component supply device 100, when one COMP signal is transmitted / received to / from the component mounting device 10 in the same manner as the reel component supply device 56, the component supply unit is described as described above. A plurality of parts aligned with the 130 are collectively attracted by the nozzle 40. That is, in the loose component supply device 100, the number of components adsorbed on the nozzle 40 based on the transmission / reception of one COMP signal is larger than that in the reel component supply device 56.

In the present embodiment, in order to take out a specified number of parts by transmitting and receiving one COMP signal, a sensor that detects that a specified number of parts are stocked in the parts supply unit 130 of the loose parts supply device 100, that is, , The first detection sensor 133 and the second detection sensor 134 are installed. Therefore, the number of sensors that detect the parts stocked in the parts supply unit 130 of the loose parts supply device 100 is a total of three, that is, the first detection sensor 133 and the second detection sensor 134.

On the other hand, when implementing a known technique in which a COMP signal is transmitted / received each time one component is taken out, the component is used for each component stocked in the component supply unit 130 of the loose component supply device 100. A sensor that detects the presence or absence of removal is required. Therefore, the number of sensors for detecting the parts stocked in the parts supply unit 130 of the loose parts supply device 100 is eight, which is equivalent to the specified number.

Therefore, according to the present embodiment, the number of sensors for detecting the parts stocked in the parts supply unit 130 of the loose parts supply device 100 is smaller than that of the above-mentioned known technique.

According to this embodiment, since the suction condition of the loose component supply device 100 is automatically set (step S5), the operation without the input of the operator becomes possible. In particular, since the loose component supply device 100 is often designed exclusively for each type of component to be supplied, it is significant that the suction conditions of the loose component supply device 100 are automatically set. That is, in the component mounting device 10, every time the loose component supply device is changed and attached, the suction condition of the attached loose component supply device is automatically set.

The present disclosure is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present embodiment.
For example, the suction condition file of the loose component supply device 100 may be stored on the loose component supply device 100 side by being stored in ROM 162 or the like of the loose component supply device 100. In such a case, the CPU 61 of the control device 60 stores the suction condition file transmitted from the loose component supply device 100 in the RAM 64. Therefore, it is not necessary to hold the suction condition file on the control device 60 side, and the ID for identifying the loose component supply device 100 is also unnecessary.

The loose component supply device 100 is a bowl feeder, which is a kind of bulk feeder, but may be another type of bulk feeder as long as it has a buffer unit in which a specified number of loose components are aligned. ..

In the present embodiment, the number of nozzles 40 of the component mounting device 10 and the number of parts (specified number) stocked in the component supply unit 130 of the loose component supply device 100 are the same eight. However, in the case where the number of parts stocked in the parts supply unit 130 is larger than the number of nozzles 40, the parts mounting device 10 and the loose parts supply device 100 provide information on the loose parts supply device 100 as follows. Parts may be taken out and stocked based on (information such as a specified number and arrangement pitch).

For example, assume that the number of nozzles 40 is six and the number of parts stocked in the parts supply unit 130 is eight. In such a case, the component mounting device 10 takes out six components from the component supply unit 130 through the first to sixth nozzles 40, and then performs a process of transmitting a FEED signal (step S11). On the other hand, in the loose component supply device 100, while the taken-out component is mounted on the substrate S (step S15), six new components are added to the component supply unit 130 in which two components remain. Parts are added and stocked (step S113).

On the other hand, in the case where the number of parts stocked in the parts supply unit 130 is smaller than the number of nozzles 40, the parts mounting device 10 and the loose parts supply device 100 are set as follows. Parts may be taken out and stocked based on the information about 100 (information such as the specified number and the arrangement pitch).

For example, assume that the number of nozzles 40 is eight and the number of parts stocked in the parts supply unit 130 is six. In such a case, the component mounting device 10 takes out six components from the component supply unit 130 through the first to sixth nozzles 40, and further, a reel component supply device 56 different from the loose component supply device 100. Therefore, the two parts are taken out by the 7th and 8th nozzles 40, and then the FEED signal transmission process is performed (step S11). On the other hand, in the loose component supply device 100, while the taken-out components are mounted on the substrate S (step S15), six new components are added to the component supply unit 130 in which no component remains. Parts are stocked (step S113).

10 Parts mounting device 40 Nozzle 61 CPU
62 ROM
100 Separate parts supply device 110 Parts storage unit 130 Parts supply unit 161 CPU
162 ROM
133 First detection sensor 134 Second detection sensor

Claims (4)

It is a loose parts mounting system including a loose parts supply device and a parts mounting device .
The loose parts supply device
A parts storage unit that stores multiple parts in bulk,
A buffer unit in which parts are transported from the component housing unit and a predetermined number of the parts are aligned ,
A code storage unit in which a unique identification code is stored, and
Equipped with a supply side control unit
The supply side control unit
In response to the completion of the alignment of the predetermined number of parts in the buffer unit, a transmission process of transmitting a completion signal to the component mounting device is executed.
The component mounting device is
With multiple parts holders
And the mounting side control unit,
A condition storage unit for storing the holding conditions of the loose component supply device is provided.
A plurality of holding conditions associated with the identification code are stored in the condition storage unit.
The mounting side control unit
An identification code acquisition process for acquiring the unique identification code stored in the code storage unit, and
A setting process for setting a corresponding holding condition as a holding condition of the loose component supply device based on the unique identification code obtained from the loose component supply device, and
After receiving the completion signal from the loose parts supply device, the predetermined number of parts aligned in the buffer portion of the loose parts supply device are held by the plurality of parts based on the holding conditions of the loose parts supply device. roses component mounting system for performing a holding process for holding in immediately. The loose component mounting system according to claim 1 , wherein the loose component supply device includes a sensor that detects that the predetermined number of components have been aligned in the buffer unit. The loose component mounting system according to claim 1 or 2, wherein the predetermined number is set as the holding condition. Pitch is set as the holding condition,
The loose component mounting system according to any one of claims 1 to 3 , wherein the pitch is an interval between parts aligned in the buffer portion of the loose component supply device.

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