JP6420582B2 - Mounting setting device and mounting setting method - Google Patents

Description

  The present invention relates to a mounting setting device and a mounting setting method.

  2. Description of the Related Art Conventionally, as a mounting setting device for setting mounting contents for placing components on a board, each step data of mounting data is classified into a plurality of groups, group identification data is added to each step data, and executed. It has been proposed that the identification data of the power group is registered in the mounting apparatus in advance, and step data having the identification data of an arbitrary group registered in advance during the component mounting operation is sequentially executed (for example, Patent Document 1). In this apparatus, when a plurality of types of mounting boards having the same mounting position and different mounting components are produced, any kind can be used using one mounting program by registering identification data according to the type of the mounting board to be produced. Can be produced without switching time.

JP 2000-196296 A

  By the way, in the mounting process of placing components on a board, for example, a mark that prohibits the use of any board may be formed on a panel including a plurality of boards, and the mounting process may be performed after reading the mark. . Alternatively, in the mounting process, a mark relating to a component to be mounted on the board may be formed, and after mounting the mark, the component to be mounted may be determined and the mounting process may be performed. In the mounting process, the mounting process may be performed without these marks. For this reason, in the mounting apparatus, a waiting time for mounting processing may occur until the reading of the mark is completed. In this case, there is a problem that the production time becomes longer.

  This invention is made | formed in view of such a subject, and it aims at providing the mounting setting apparatus and mounting setting method which can raise production efficiency more.

  The present invention adopts the following means in order to achieve the main object described above.

The mounting setting device of the present invention
A mounting setting device that sets the mounting content of the component of the mounting device that performs the mounting process of collecting the component and placing it on the board,
Whether to place the component on the substrate based on the information portion formed on the substrate, and whether to determine the component type to be placed based on the information portion formed on the substrate Information acquisition means for acquiring mounting information including at least one of the information,
Based on the acquired mounting information, a component that places the component on the substrate without being based on the information portion formed on the substrate, and a placement that is not based on the information portion formed on the substrate Setting means for setting mounting order information including the mounting order of the components so that at least one or more of the components whose component types are determined are arranged on the board earlier;
Information output means for outputting the set mounting order information;
It is equipped with.

  In this apparatus, whether or not to place a component on the substrate based on the information portion formed on the substrate and whether or not to determine the component type to be placed based on the information portion formed on the substrate is determined. Among them, mounting information including at least one piece of information is acquired. In addition, the apparatus arranges components based on the acquired mounting information, not based on the information portion formed on the substrate, but based on the information portion formed on the substrate, and the component disposed on the substrate. The mounting order information including the mounting order of the components is set so that at least one or more of the components whose component types are determined are arranged on the board earlier. Subsequently, this apparatus outputs the set mounting order information. For this reason, this mounting order information can be used in the mounting process. For example, a mounting apparatus may perform a mounting process after acquiring information from an information unit formed on a substrate. In this mounting setting device, a mounting order for mounting components that are not based on this information part or components whose component type is determined without being based on this information part is set more preferentially. For this reason, in the mounting apparatus, processing related to the mounting process (for example, collection of components, grasping of the collection status of components, etc.) can be executed prior to acquisition of information from the information unit formed on the substrate. Therefore, production efficiency can be further increased. Here, the “information unit” may be a mark formed on the substrate, or a storage element that stores information and is disposed on the substrate.

  In the mounting setting device of the present invention, the setting means sets command information including a pre-collection command for sampling the component prior to reading the information unit on the board based on the set mounting order information, The information output means may output the set command information. In this way, the mounting apparatus can collect components prior to reading the information section according to the command information, so that the production time can be further shortened by performing the preliminary collection of components. At this time, the mounting apparatus includes a transport unit that transports the substrate, and a sampling unit that obtains information from the information unit and collects components, and the setting unit is in parallel with the transport of the substrate by the transport unit. The command information for performing the preceding collection may be set by the collection unit. In the mounting apparatus, when the component is collected after reading the information section, it is necessary to wait even while the board is being transported. Here, since the conveyance of the substrate and the sampling of the components can be executed in parallel, the production time can be further shortened.

  In the mounting setting device of the present invention, the mounting device includes one or more sampling units that sample components, and the setting unit includes at least the number of components at the start of the mounting process according to the number of components of the sampling unit. The mounting order of the components may be set. In this case, for example, since the mounting order of the number of parts to be collected in advance is set, the production efficiency can be improved more reliably.

  In the mounting setting device of the present invention, the setting means sets a mounting order in which the component having a common sampling member for sampling the component, the distance between the position of the information unit and the arrangement position of the component is shorter. The mounting order may be set so that at least one of the components and the components having a low height is arranged on the substrate first. In this way, it is possible to shorten the time required for replacing the sampling unit, shorten the movement time of the parts in the mounting process, reduce the interference of the parts, and the like, thereby further improving the production efficiency. Here, examples of the collecting member include a nozzle, a chuck, and a holding body that holds these.

  In the mounting setting device of the present invention, the information unit includes at least one of use information on whether or not each board can be used in a panel including a plurality of boards and destination information about an area where the board is used. It is good. In this way, it is possible to further increase the production efficiency in the board on which the availability information and the destination information that must be acquired before mounting on the board are formed.

The implementation setting method of the present invention includes:
A mounting setting method for setting the mounting content of the component of the mounting apparatus that performs the mounting process of collecting the component and placing it on the board,
(A) Whether to place the component on the substrate based on the information portion formed on the substrate and whether to determine the component type to be disposed based on the information portion formed on the substrate Obtaining mounting information including at least one or more pieces of information;
(B) Based on the acquired mounting information, based on the component that places the component on the substrate without being based on the information portion formed on the substrate, and on the information portion formed on the substrate Setting mounting order information including the mounting order of the components so that at least one or more of the components for which the component type to be arranged is determined is arranged on the board earlier;
(C) outputting the set mounting order information;
Is included.

  In this mounting setting method, in the same way as the mounting setting device described above, the mounting order in which components to be mounted without being based on the information part and parts whose component type is determined without being based on this information part is more preferentially mounted. Set. For this reason, in the mounting apparatus, processing related to the mounting process (for example, collection of components, grasping of the collection status of components, etc.) can be executed prior to acquisition of information from the information unit formed on the substrate. Therefore, production efficiency can be further increased. In this mounting setting method, various aspects of the mounting setting device described above may be adopted, and a configuration for realizing each function of the mounting setting device described above may be added.

1 is a schematic explanatory diagram of a mounting system 10. FIG. FIG. 3 is a block diagram showing an electrical connection relationship of the mounting system 10. An explanatory view showing an example of panel 70 including a plurality of substrates 71 and 72. Explanatory drawing showing an example of the board | substrate 73. FIG. FIG. 6 is an explanatory diagram of information stored in the HDD 83. The flowchart which shows an example of a mounting order setting process routine. The flowchart which shows an example of a mounting process routine. FIG. 6 is an explanatory diagram showing an example of movement of the mounting head 24 on the panel 70.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. FIG. 2 is a block diagram showing an electrical connection relationship of the mounting system 10. FIG. 3 is an explanatory diagram illustrating an example of a panel 70 including a plurality of substrates 71 and 72 on which the component P is mounted. FIG. 4 is an explanatory diagram illustrating an example of the substrate 73 on which the components P1 and P2 are mounted. FIG. 5 is an explanatory diagram of the mounting order information 91 and the command information 92 stored in the HDD 83. The mounting system 10 of the present embodiment includes a mounting apparatus 11 that mounts components on a board, and a mounting management computer 80 that manages and sets information related to mounting processing. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. The mounting process includes a process of placing, mounting, inserting, joining, and bonding components on a substrate.

  As shown in FIG. 1, the mounting apparatus 11 includes a transport unit 18 that transports a substrate, a sampling unit 21 that collects components, a reel unit 56 that supplies components, and a control device 60 that controls the entire apparatus (FIG. 2). See). The transport unit 18 includes support plates 20 and 20 that are provided at intervals in the front and rear direction in FIG. 1 and extend in the left-right direction, and conveyor belts 22 and 22 that are provided on the surfaces of the support plates 20 and 20 that face each other. ing. The conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The panel 70 including a plurality of substrates is carried on the upper surfaces of the pair of conveyor belts 22 and 22 and is conveyed from left to right. The panel 70 is supported from the back side thereof by a plurality of support pins 23 erected.

  The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the mounting apparatus 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26 and 30 is driven by a drive motor (not shown).

  The mounting head 24 includes a nozzle 40 that picks up and collects components, and a nozzle holder 42 that can be attached and detached with one or more nozzles 40. For example, the mounting head 24 can be attached to and detached from three types of nozzle holders 42A to 42C. The nozzle holders 42A to 42C are collectively referred to as the nozzle holder 42. The nozzle holding body 42A includes 12 nozzle holders, and 12 nozzles 40 can be mounted thereon. The nozzle holder 42B includes four nozzle holders, and can be equipped with four nozzles 40. The nozzle holder 42C can be equipped with one nozzle 40. The nozzle holding body 42A is held by the mounting head 24 in a state where it can rotate intermittently. The nozzle 40 uses pressure to adsorb components at the nozzle tip or release components adsorbed at the nozzle tip. The nozzle 40 is moved up and down in a Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder lifting device using a Z-axis motor 45 as a drive source. Here, the collecting member that collects the components is described as the nozzle 40 here, but is not particularly limited as long as the components can be collected, and may be a mechanical chuck that clamps and collects the components.

  Further, the mounting head 24 is provided with a mark camera 34 for photographing the substrate from above. The mark camera 34 is a camera that reads a mark as an information portion attached to the panel 70 (substrate), which is an imaging region below. The mark camera 34 moves in the XY direction as the mounting head 24 moves. This mark indicates whether or not a component can be arranged on the board, whether or not a component type to be arranged is determined, and the like. In addition, the mark camera 34 may read a reference mark indicating the reference position of the panel 70.

  The reel unit 56 includes a plurality of reels 57 around which a tape storing components is wound, and is detachably attached to the front side of the mounting apparatus 11. The tape is unwound from the reel 57 and sent out by the feeder unit 58 to a collection position where the tape is collected by the mounting head 24. The parts camera 54 is disposed in front of the support plate 20 on the front side of the transport unit 18. The imaging range of the parts camera 54 is above the parts camera 54. When the nozzle 40 that sucks a part passes above the part camera 54, the parts camera 54 captures the state of the part sucked by the nozzle 40 and outputs the image to the control device 60. The nozzle stocker 55 is a box that stocks a plurality of types of nozzles 40 suitable for the type of component. The nozzle 40 is detachably attached to the nozzle holder 42 of the mounting head 24.

  As shown in FIG. 2, the control device 60 is configured as a microprocessor centered on a CPU 61. The control device 60 includes a ROM 62 for storing processing programs, an HDD 63 for storing various data, a RAM 64 used as a work area, an external device and an electric device. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66. The control device 60 is connected to the transport unit 18, the sampling unit 21, the mark camera 34, the parts camera 54, the reel unit 56, and the like so as to be capable of bidirectional communication, and receives image signals from the mark camera 34 and the parts camera 54. To do. Each slider 26 and 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motor of each slider 26 and 30 while inputting position information from these position sensors.

  Here, the panel 70 (board | substrate) in which the components P are mounted by the mounting apparatus 11 is demonstrated. As shown in FIG. 3, the panel 70 includes a plurality of substrates 71 and 72. A mark forming portion 75 as an information portion is formed on the substrate 71. The mark forming portion 75 represents availability information regarding whether or not each substrate can be used in a panel including a plurality of substrates. The mark forming portion 75 is an area indicating that the corresponding substrate 71 cannot be used due to deformation or the like when a mark is formed (for example, when the mark is filled with a marker or the like). For example, a mark is formed on the mark forming unit 75 by a supplier of the panel 70 or a person in charge of the previous process. The mark is formed with a black color when the substrate is a white color, and with a white color when the substrate is a black color. Further, the substrate used by the mounting apparatus 11 may be a substrate 73 on which a mark forming portion 76 is formed, as shown in FIG. This mark formation part 76 represents the destination information regarding the area where the substrate is used. The mark forming unit 76 is an area indicating that when a mark is formed in a predetermined pattern, a part corresponding to an area (for example, the United States or Europe) corresponding to the predetermined pattern is arranged. In this board 73, it is assumed that a component P1 that is arranged regardless of the region and a component P2 that is changed according to the region, such as a change in resistance constant due to a difference in voltage or frequency, are arranged. The substrates 71 to 73 are simply referred to as “substrates”, the components P, P1, and P2 are simply referred to as “components”, and the mark forming portions 75 and 76 are simply referred to as “mark forming portions”.

  The management computer 80 is a PC having the function of a mounting setting device, and as shown in FIG. 2, is used as a microprocessor centered on a CPU 81, a ROM 82 for storing processing programs, an HDD 83 for storing various information, and a work area. A RAM 84, an input / output interface 85 for exchanging electrical signals with an external device, and the like are provided, and these are connected via a bus 86. Further, the management computer 80 can input signals from an input device 87 typified by a mouse and a keyboard via an input / output interface 85, and is connected to the display 88 so that various images can be output. As shown in FIG. 5, the HDD 83 stores mounting order information 91 and command information 92. The mounting order information 91 is information set by the management computer 80 based on mounting information input in advance, such as the type and arrangement position of components used for production and the nozzles used for mounting (see FIG. 6 described later). The mounting order information 91 includes information on the process of mounting the components on the board, the mounting order of the components, the type of the components to be mounted, the component size, the sampling member information such as the nozzle 40 and the nozzle holder 42 to be used, and the component arrangement position Information, pre-collection information indicating whether or not the part can be pre-collected, and the like are included. The component arrangement position includes information on whether or not a mark is formed on the board on which the component is arranged, coordinates of the component arrangement position, and the like. Further, the pre-collection means that a part is collected by the nozzle 40 before the mark forming part is read by the mark camera 34. The command information 92 includes either a preceding collection command or a preceding reading command. The pre-collection command is a command for executing a process of pre-collecting components based on the mounting order information 91 before reading the mark forming part on the board. Further, the preceding reading command is a command for executing processing for reading the mark forming portion on the substrate before collecting the parts.

  Next, the operation of the mounting system 10 according to the present embodiment configured as described above, first, processing in which the management computer 80 sets the mounting order of mounting components on the board in the mounting processing of the mounting apparatus 11 will be described. FIG. 6 is a flowchart showing an example of a mounting order setting process routine executed by the CPU 81 of the management computer 80. This routine is stored in the HDD 83 of the management computer 80, and is executed by a start instruction from the operator. Here, the case where components are arranged on each substrate of panel 70 will be mainly described.

  When this routine is started, the CPU 81 first reads mounting information and acquires information on components to be arranged on the board to be produced this time (step S100). This mounting information is, for example, basic information that does not include mounting order, pre-collection information, or the like in the mounting order information 91, and is read and input from the board design drawing at the production preparation stage, Input by the user. This mounting information includes information (arrangement position information) as to whether or not the component is to be arranged on the board based on the mark formed on the board. Further, the mounting information may include information as to whether or not a component type to be arranged is determined based on a mark formed on the board.

  Next, the CPU 81 determines whether there is a component that can be placed regardless of the mark on the board based on the mounting information (step S110). This determination can be made based on, for example, arrangement position information included in the mounting information. This determination can also be made based on whether or not the substrate to be mounted has a mark forming portion. When there is no component that can be placed regardless of the mark on the board, the CPU 81 can only collect the component after reading the mark forming portion, and therefore determines that the preceding sampling process cannot be performed, and issues a preceding reading command. The command information including it is set and stored in the HDD 83 (step S120). This is because, depending on whether or not a mark is formed on the mark forming part, there are cases where components cannot be arranged on the substrate, and it is necessary to read the mark forming part first. On the other hand, when there is a component that can be placed regardless of the mark on the board, the CPU 81 can place the component before reading the mark forming portion, and therefore determines that the preceding collection process can be performed, and a command including a preceding collection command. Information is set and stored in the HDD 83 (step S130).

  After step S130, the CPU 81 extracts components that can be placed regardless of the marks formed on the mark forming portion on the substrate from the components to be mounted by the mounting apparatus 11 (step S140). Next, in the extracted component group, an order in which the components that share the nozzle 40 and the nozzle holder 42 are prioritized is set (step S150). For example, here, the nozzle holder 42 (for example, the nozzle holder 42A) having a larger number of nozzles 40 is given higher priority so that the number of parts to be collected in advance is increased as much as possible, and the parts corresponding thereto are arranged in an earlier order. Shall be set to In addition, it is good also as what shall give priority to the nozzle holding body 42 from which the number of parts which can be preceded-collected increases. Next, the CPU 81 rearranges the order of the parts and sets the order so that the part whose height is lower than the predetermined value is placed higher than the other parts (step S160). The reason for this is that if a higher part is placed on the substrate first, it may interfere with a part to be placed later. In this process, it is good also as what extracts and rearranges the applicable thing from the thing selected higher in the rearrangement process of a previous step. For example, in this case, it is assumed that a part whose component height is lower than a predetermined value among the parts group that can be pre-collected by the nozzle holder 42A is higher. Note that the predetermined value of the component height may be determined empirically as a value that hardly interferes with subsequent component mounting, and may be set to that value.

  Next, the CPU 81 rearranges the order of components so as to prioritize components having a shorter distance between the mark forming portion position (mark position) and the component arrangement position (step S170). Here, for example, the order of parts may be rearranged so that a part having a movement distance shorter than a predetermined movement distance is placed higher than other parts. In this process, it is possible to extract and rearrange corresponding ones from those selected higher in the rearrangement process in the previous step (part height is lower than a predetermined value). The predetermined movement distance may be set to a value that empirically obtains a distance that can further reduce the mounting time. Here, the position of the mark forming unit in step S170 can be, for example, the position of the mark forming unit read last by the mark camera 34. In this way, the mounting head 24 can move at a shorter distance from the reading of the mark forming unit to the placement of the components, and the processing time can be further shortened and efficient mounting processing can be performed. In addition, the CPU 81 sets the parts closer to the mark position in the higher order, sets the part closer to the part as the next part, and further sets the part closer to the part as the next part. It is also possible to perform processing for changing the order of the components so that the mounting head 24 moves while suppressing reciprocation (see FIG. 8 described later).

  Subsequently, the CPU 81 determines the mounting order according to the number of nozzles 40 mounted on the nozzle holder 42 from the start of mounting (step S180). That is, here, in the nozzle holder 42 to be used, the mounting order corresponding to the number of parts that can be collected in one part is determined. Specifically, when the nozzle holder 42A that can collect 12 components at the start of mounting is used, the CPU 81 determines the mounting order of components from No. 1 to No. 12 at the maximum. When the number of components that can be collected in advance is smaller than the number of nozzles 40 mounted on the nozzle holder 42, the mounting order of the components corresponding to the number of components is determined. For example, when using the nozzle holder 42A, if there are only 10 pre-collected parts, the number up to 10 is determined. In this way, the number of samples collected in advance is increased, the moving time of the mounting head 24 is further shortened, and the interference between the arranged component and the moving component is further reduced, thereby making it more efficient. It is possible to set mounting conditions for performing various mounting processes.

  After step S180 or after step S120, the CPU 81 executes a mounting order setting process for unconfirmed components (step S190). In this process, for example, as with the setting of the mounting order described above, the nozzle holder 42 having a larger number of components is used, the component having a lower height, and the component that makes the moving distance of the mounting head 24 shorter. It is good also as what sets the mounting order which coordinates before. For example, in the mounting order setting process, the part closer to the part collection position is set in a higher order, the part closer to the part is set as the next part, and the part closer to the part is set as the next part. The mounting head 24 may be moved in a single stroke so that reciprocation is suppressed as much as possible. Further, in step S190, a plurality of mounting order candidates with different paths may be set, and a process of determining the most efficient one as the mounting order may be performed. Then, the CPU 81 stores the set mounting order in the HDD 83 as mounting order information 91 (step S200), creates a production program based on the command information 92 and the mounting order information 91, and mounts this production program via the network. The data is output to the apparatus 11 (step S210), and this routine is terminated. As described above, the CPU 81 determines, based on the mounting information, the components that place the component on the substrate without being based on the mark formed on the substrate, and the component types that are placed without being based on the mark formed on the substrate. The mounting order of the components is set so that at least one or more of the determined components is arranged on the board earlier (see FIG. 5).

  Next, the mounting process using the mounting order information 91 executed by the mounting apparatus 11 will be described. FIG. 7 is a flowchart illustrating an example of a mounting process routine executed by the CPU 61 of the mounting apparatus 11. This routine is stored in the HDD 63 of the control device 60, and is executed by a start instruction from the operator. When this routine is executed, the CPU 61 of the control device 60 acquires a production program based on the mounting order information 91 and the command information 92 (step S300). This production program may be acquired by reading the information previously received and stored in the HDD 63 from the HDD 63, or may be directly received from the management computer 80 and acquired. Next, the CPU 61 executes a substrate transfer process (step S310). In this processing, the substrate (panel 70) is transported by the conveyor belt 22 of the transport unit 18, and the substrate is fixed at a predetermined mounting position where the processing for placing the components is performed.

  While executing the substrate transfer process, the CPU 61 determines whether or not the command included in the acquired command information 92 is a preceding collection command (step S320). When the command included in the command information 92 is a pre-collection command, the CPU 61 executes a pre-collection process (steps S330 to S350) described below. This pre-collection process is a process in which components are sampled by the nozzle 40 based on the mounting order information 91 prior to reading of the mark forming part (mark) on the substrate. In the preceding collection process, it is assumed that the part camera 54 detects the state of the part collected by the nozzle 40 prior to the reading of the mark. When the preceding collection process is performed, the CPU 61 performs a process of reading each mark forming unit in a state where the parts are collected by the nozzle 40.

  In the preceding collection process, the CPU 61 first mounts the nozzle holding body 42 and the nozzle 40 that are specified to collect components on the mounting head 24 based on the information included in the mounting order information 91 (step S330). . Next, the CPU 61 performs sampling processing on the target component (step S340). In this process, the CPU 61 uses the nozzle 40 to collect components that are set to be pre-collectable (for example, components in order 1 to 12 in FIG. 5) based on the pre-collection information included in the mounting order information 91. Next, the CPU 61 performs a process of acquiring the collection state of the parts collected by the nozzle 40 (step S350). In this process, the CPU 61 moves the mounting head 24 to the upper part of the parts camera 54 and acquires an image captured by the parts camera 54. The CPU 61 analyzes this image and grasps a component abnormality, a sampling position shift, and the like. Further, the CPU 61 discards the part when the part shape is abnormal or when the sampling position is deviated from a predetermined value.

  Next, the CPU 61 determines whether or not the substrate (panel 70) is fixed at the mounting position (step S360). When the board is not fixed at the mounting position, the CPU 61 continues the board conveyance process, and when the board is fixed at the mounting position, the CPU 61 performs the mark forming unit reading process (step S370), and continues to process the components. Arrangement processing (mounting processing) is performed (step S380). In the reading process of the mark forming unit, the mark camera 34 is moved above each mark forming unit to perform processing for imaging the mark forming unit. The CPU 61 grasps whether or not a mark is formed by performing image processing on the obtained image. In the component placement process, the mounting head 24 is sequentially moved to the component placement position according to the mounting order, and the component is lowered to place the component at the placement position. As described above, the CPU 61 executes the preceding collection process by the collection unit 21 in parallel with the conveyance of the substrate by the conveyance unit 18 prior to the reading of the mark formation unit on the substrate. Then, the CPU 61 performs component placement processing so as to flow from the reading of the mark forming unit.

  FIG. 8 is an explanatory diagram showing an example of movement of the mounting head 24 on the panel 70. FIG. 8 is a specific example in which components are mounted in the mounting order corresponding to the mounting order information 91 of FIG. In the drawing, the movement of the mounting head 24 for reading by the mark forming unit 75 is indicated by a dotted line arrow, and the movement of the mounting head 24 for the component P placement processing is indicated by a solid line arrow. The CPU 61 causes the mark camera 34 to read the mark forming unit 75 in a state where the components arranged on the substrate 72 without the mark forming unit are collected, and the board 71 that cannot be used depending on the presence or absence of the mark. To grasp. Subsequently, the CPU 61 continues the arrangement processing of the collected components as it is.

  On the other hand, when the command included in the command information 92 is not a preceding collection command in step S320, that is, when it is a preceding reading command, the CPU 61 first performs a reading process of the mark forming unit (step S390). This reading process is the same as the process in step S370 described above. Next, the CPU 61 mounts the nozzle holder 42 and the nozzle 40 designated for component collection on the mounting head 24, and performs processing for collecting components with the nozzle 40 in accordance with the mounting order (step S400). . At this time, when a mark is formed on the mark forming portion 75 of the substrate 71, the CPU 61 does not place any component on the substrate 71. In addition, when a mark is formed on the mark forming portion 76 of the substrate 73, the CPU 61 determines a component type corresponding to the mark and collects the component. Subsequently, the CPU 61 performs a collection state acquisition process (step S410) and performs a component placement process (step S420). These processes are the same as steps S350 and S380.

  After step S420 or after step S380, the CPU 61 determines whether or not the current board mounting process has been completed (step S430), and if the current board mounting process has not been completed, the processes after step S400 are performed. Execute. That is, the CPU 61 collects parts by changing the nozzle holder 42 and the nozzle 40 as necessary, grasps the collection state, and performs component placement processing. On the other hand, when the mounting process of the current board is completed, the CPU 61 discharges the board that has been mounted (step S440), and determines whether or not the production is completed based on the number of boards that have been mounted (step S450). When the production is not completed, the CPU 61 repeatedly executes the processes after step S310. On the other hand, when the production is completed, the nozzle holder 42 and the nozzle 40 are returned (step S460), and this routine is finished as it is.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The CPU 81 of this embodiment corresponds to the information acquisition unit, setting unit, and information output unit of the present invention. In the present embodiment, an example of the mounting setting method of the present invention is also clarified by describing the operation of the mounting system 10.

  According to the mounting system 10 described above, the CPU 81 determines whether or not to place a component on the substrate based on the mark formed on the substrate, and the component type to be disposed based on the mark formed on the substrate. The mounting information including at least one or more information of whether to be determined is acquired. In addition, based on the acquired mounting information, the CPU 81 determines at least one or more of components that place the component on the board without being based on the mark and components that are determined based on the component type that is placed without being based on the mark. The mounting order information 91 including the mounting order of components is set so as to be placed on the board first. Subsequently, the CPU 81 outputs the set mounting order information 91 to the mounting apparatus 11. For this reason, the mounting apparatus 11 can use the mounting order information 91 in the mounting process. For example, the mounting apparatus 11 may perform a mounting process after acquiring information from a mark formed on the substrate. The management computer 80 sets a mounting order in which components to be mounted without being based on this mark or components whose component type is determined without being based on this mark are arranged with higher priority. For this reason, the mounting apparatus 11 can execute processing related to the mounting process (for example, sampling of components, grasping of the sampling status of components, etc.) before reading the marks formed on the substrate. Therefore, production efficiency can be further increased.

  In addition, since the CPU 81 sets command information including a pre-collection command and outputs the command information to the mounting device 11, the mounting device 11 can perform component sampling prior to reading the mark by the command information. By performing sampling, production time can be further shortened. Furthermore, since the CPU 81 sets command information in which advance sampling is executed by the sampling unit 21 in parallel with the transport of the substrate by the transport unit 18, the mounting apparatus 11 performs the transport of the substrate and the sampling of the components in parallel. Since it can be executed, the production time can be further shortened. Furthermore, in order to determine the mounting order of the number of parts at the time of starting the mounting process according to at least the number of parts that can be picked up by the picking unit 21, the mounting order of the minimum number of parts to be picked up in advance is set. Therefore, production efficiency can be increased more reliably. In addition, when setting the mounting order, the CPU 81 has a component that shares the nozzle holder 42 that collects components, a component that has a shorter distance between the position of the mark forming portion and the component arrangement position, and a low height. Since the mounting order is set so that the components are arranged on the board earlier, the time required for replacing the nozzle holder 42 is shortened, the movement time of the components in the mounting process is shortened, and the interference of the components is further reduced. Production efficiency can be increased. Further, since the mark forming unit includes one or more of availability information regarding whether or not each substrate 71 can be used in the panel 70 including a plurality of substrates, and destination information regarding the area where the substrate 73 is used, Production efficiency can be further improved in a substrate on which the availability information and destination information that must be acquired before mounting on the substrate are formed.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the CPU 81 sets command information including a preceding collection command or a preceding reading command and outputs the command information to the mounting apparatus 11, but this may be omitted. At this time, the CPU 61 of the mounting apparatus 11 may determine whether there is a component that can be placed regardless of the mark on the board based on the acquired mounting order information 91. For example, the CPU 61 can make this determination based on the preceding collection information included in the mounting order information 91. In this way, the CPU 61 can further shorten the production time by performing the pre-collection of parts by its own determination.

  In the above-described embodiment, the command information for performing the pre-collection by the sampling unit 21 is set in parallel with the transport of the substrate by the transport unit 18, but the substrate by the transport unit 18 is not particularly related to the command information. The preceding collection may be executed by the collection unit 21 in parallel with the above-described conveyance. Even in this case, the production time can be further shortened. Alternatively, the CPU 61 may not perform the transporting of the substrate by the transport unit 18 and the pre-sampling by the sampling unit 21 in parallel if the previous sampling is performed.

  In the embodiment described above, in step S180, the CPU 81 determines the mounting order of the components having the number of components at the start of the mounting process according to at least the number of components that can be collected by the collection unit (the number of nozzles 40 of the nozzle holder 42). However, the present invention is not limited to this. For example, the CPU 81 may determine the mounting order of a predetermined number of components (for example, 12, 4, etc.) from the start of the mounting process, and may be arranged regardless of the mark on the board. All possible components may be determined, or determination of the mounting order may be omitted. Even in this case, the CPU 61 can further increase the production efficiency.

  In the above-described embodiment, the CPU 81 gives priority to the parts that share the nozzle 40 and the nozzle holder 42 for collecting the parts, and then gives priority to the parts having a low height, and positions of the mark forming portion and the arrangement of the parts. Although the mounting order giving priority to the next component having a shorter distance from the position is set, it is not particularly limited to this. For example, the CPU 81 can select at least one of a component that shares the nozzle 40 and the nozzle holder 42, a component that has a shorter distance between the position of the mark forming unit and the component placement position, and a component that has a lower height. The priority mounting order may be set, one or more of these may be omitted, and one or more of these may be changed to other conditions. For example, when all the components are mounted with one type of nozzle holder 42 and nozzle 40, the CPU 81 can omit giving priority to the components that share the nozzle holder 42 and nozzle 40. Similarly, when all the parts are lower than the predetermined height, the CPU 81 can omit giving priority to a part having a low part height.

  In the above-described embodiment, the mark forming unit is one or more of the unusable mark indicating whether each substrate can be used and the destination mark where the substrate is used. Instead, it may be a mark representing other information.

  In the embodiment described above, the substrate is formed with a mark forming portion as an information portion on which a mark is written on the surface, but this information portion is for acquiring information before mounting. If there is a mark, it is not particularly limited to the mark, and a memory element that stores information and is arranged on the substrate may be used.

  In the above-described embodiment, the function of the mounting setting device of the present invention has been described as being provided in the management computer 80. However, the present invention is not particularly limited thereto, and for example, the mounting device 11 may have the function of the present invention. Even in this way, the mounting apparatus 11 can execute processing related to mounting processing (for example, sampling of components, grasping of sampling status of components, etc.) before acquiring information by reading marks formed on the board. Production efficiency can be further increased.

  The present invention can be used in the technical field of mounting components on a board.

DESCRIPTION OF SYMBOLS 10 mounting system, 11 mounting apparatus, 18 conveyance part, 21 sampling part, 20 support plate, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X axis slider, 28 guide rail, 30 Y axis slider, 32 guide rail, 34 Mark Camera, 40 Nozzle, 42, 42A to 42C Nozzle Holder, 45 Z-axis Motor, 54 Parts Camera, 55 Nozzle Stocker, 56 Reel Unit, 57 Reel, 58 Feeder Unit, 60 Controller, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 input / output interface, 66 bus, 70 panel, 71-73 substrate, 75, 76 mark forming unit, 80 management computer, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input / output interface 86 Bus, 87 Input device, 88 display, 91 mounting order information, 92 command information, P, P1, P2 parts.

Claims (6)

A mounting setting device that sets the mounting content of the component of the mounting device that performs the mounting process of collecting the component and placing it on the board,
Whether to place the component on the substrate based on the information portion formed on the substrate, and whether to determine the component type to be placed based on the information portion formed on the substrate Information acquisition means for acquiring mounting information including at least one of the information,
Based on the acquired mounting information, a component that places the component on the substrate without being based on the information portion formed on the substrate, and a placement that is not based on the information portion formed on the substrate Setting means for setting mounting order information including the mounting order of the components so that at least one or more of the components whose component types are determined are arranged on the board earlier;
And an information output means for outputting the mounting order information described above setting,
The setting means sets command information including a pre-collection command to sample the component prior to reading the information unit on the board based on the set mounting order information,
The information output means is a mounting setting device that also outputs the set command information . The mounting apparatus includes a conveyance unit that conveys a substrate, and a collection unit that obtains information from the information unit and collects components.
The mounting setting apparatus according to claim 1 , wherein the setting unit sets the command information for performing the preceding collection by the collection unit in parallel with the substrate conveyance by the conveyance unit. The mounting apparatus includes one or more sampling units that sample components,
The setting means sets the implementation order of the mounting processing start time of component count the parts of which corresponding to the number of components of at least the collecting unit, mounting setting device according to claim 1 or 2. The setting means, when setting the mounting order, a component having a common sampling member for sampling components, a component having a shorter distance between the position of the information unit and the arrangement position of the component, and a component having a low height The mounting setting device according to any one of claims 1 to 3 , wherein the mounting order is set so that at least one or more of them are arranged on the substrate earlier. It said information unit includes one or more of the destination information on local availability information and that the substrate is utilized to whether available for each substrate in a panel including a plurality of substrates, claim 1-4 The mounting setting device according to Item 1. A mounting setting method for setting the mounting content of the component of the mounting apparatus that performs the mounting process of collecting the component and placing it on the board,
(A) Whether to place the component on the substrate based on the information portion formed on the substrate and whether to determine the component type to be disposed based on the information portion formed on the substrate Obtaining mounting information including at least one or more pieces of information;
(B) Based on the acquired mounting information, based on the component that places the component on the substrate without being based on the information portion formed on the substrate, and on the information portion formed on the substrate Setting mounting order information including the mounting order of the components so that at least one or more of the components for which the component type to be arranged is determined is arranged on the board earlier;
(C) it viewed including the steps of: outputting a mounting order information described above setting,
In the step (b), setting command information including a pre-collection command for collecting the component prior to reading of the information unit on the board based on the set mounting order information,
In the step (c), the set command information is also output .

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