JP6628593B2 - Mounting setting device and mounting setting method - Google Patents

Description

The present invention relates to a mounting setting device and a mounting setting method.

2. Description of the Related Art Conventionally, as a mounting setting device for setting mounting contents for arranging components on a board, each step data of mounting data is classified into a plurality of groups, group identification data is added to each step data, and execution is performed. There has been proposed a method in which identification data of a group to be registered is registered in advance in a mounting apparatus, and step data having identification data of an arbitrary group registered in advance is sequentially executed at the time of component mounting operation (for example, Patent Document 1). In this apparatus, when a plurality of types of mounting boards having the same mounting position and different mounting components are produced, the identification data is registered according to the type of the mounting board to be produced, so that one type of mounting program is used. It is said that the mounting board can be produced without switching time.

JP 2000-196296 A

By the way, in the mounting process of arranging components on a substrate, for example, a mark that prohibits the use of any substrate is formed on a panel including a plurality of the substrates, and the mounting process may be performed after reading the mark. . Alternatively, in the mounting process, a mark related to a component to be mounted on the board is formed, and after reading the mark, a component to be mounted is determined, and the mounting process may be performed. In the mounting process, the mounting process may be performed without these marks. For this reason, in the mounting apparatus, there is a case where a waiting time for mounting processing occurs until reading of the mark is completed, and in this case, there is a problem that the production time becomes longer.

The present invention has been made in view of such a problem, and has as its main object to provide a mounting setting device and a mounting setting method that can further increase production efficiency.

The present invention employs the following means to achieve the above-mentioned main object.

A mounting setting device of the present invention is a mounting setting device that sets mounting contents of the component of a mounting device that performs a mounting process of collecting a component and arranging the component on a substrate, and a mark forming unit formed on the substrate. Mounting based on at least one of information as to whether or not the component is arranged on the substrate based on the information and whether a component type to be arranged is determined based on a mark forming portion formed on the substrate. Information acquiring means for acquiring information, a component for arranging the component on the substrate without being based on the mark forming portion formed on the substrate, based on the acquired mounting information, and a component formed on the substrate Setting means for setting mounting order information including the mounting order of the components so that at least one or more of the components for which the component types to be arranged are determined based on the mark forming unit are arranged on the board earlier. , Comprising an information output means for outputting the mounting order information serial set, wherein the setting means, for collecting the parts before the reading of the mark forming portion on the substrate based on the set mounted order information prior Command information including a collection command is set, and the information output means also outputs the set command information .

Whether in this apparatus, whether based on the mark forming part formed on the substrate to place the component on a substrate, and component types to place on the basis of the mark forming portion formed on the substrate is determined And mounting information including at least one or more pieces of information. The device also based on the obtained mounting information, the part not based on the mark forming portion formed on the substrate part arranged on a substrate, and not based on the mark forming portion formed on a substrate The mounting order information including the mounting order of the components is set so that at least one or more of the components for which the component types to be arranged are determined are arranged earlier on the board. Subsequently, this device outputs the set mounting order information. Therefore, this mounting order information can be used in the mounting process. For example, a mounting apparatus may perform a mounting process after obtaining information from a mark forming unit formed on a substrate. In this implementation setting apparatus, parts and to be mounted on not based on the mark formation unit sets the implementation order to more preferentially mounting components that component type is determined not based on the mark forming portion. For this reason, the mounting apparatus can execute processing related to the mounting processing (for example, component collection, grasping of component collection status, etc.) before acquiring information from the mark forming unit formed on the substrate. Therefore, production efficiency can be further improved. Here, the “mark forming section” may be a mark formed on the substrate.

In the mounting setting device of the present invention, the setting unit sets command information including a preceding sampling command for sampling the component prior to reading the information unit on the board based on the set mounting order information, The information output means may also output the set command information. With this configuration, the mounting apparatus can execute the sampling of the component before the reading of the information unit based on the command information. Therefore, by performing the preliminary sampling of the component, the production time can be further reduced. At this time, the mounting apparatus includes a transport unit that transports the board, and a sampling unit that obtains information from the information unit and samples components, and wherein the setting unit performs the transport in parallel with the transport of the board by the transport unit. The command information for executing the preceding sampling by the sampling unit may be set. In the mounting apparatus, when the component is collected after reading the information section, it is necessary to wait during the transfer of the board. Here, since the transfer of the substrate and the collection of the components can be performed in parallel, the production time can be further reduced.

In the mounting setting device according to the present invention, the mounting device includes one or more collecting units for collecting components, and the setting unit determines the number of components at the start of the mounting process according to at least the number of components in the collecting unit. The mounting order of the components may be set. In this way, for example, since the mounting order of the number of components to be pre-sampled is set, the production efficiency can be more reliably improved.

In the mounting setting device of the present invention, the setting unit sets the mounting order, a component having a common sampling member for sampling the component, a distance between the position of the information unit and the arrangement position of the component is shorter. The mounting order may be set so that at least one or more of a component and a component having a low height is arranged on the substrate earlier. By doing so, it is possible to reduce the time required to replace the sampling unit, to reduce the moving time of the components in the mounting process, to reduce the interference of components, and to further increase the production efficiency. Here, the sampling member includes, for example, a nozzle, a chuck, and a holder for holding these.

In the mounting setting apparatus according to the present invention, the information section includes at least one of availability information regarding whether each substrate can be used in a panel including a plurality of substrates, and destination information regarding an area where the substrate is used. It may be. In this case, the production efficiency can be further improved in the substrate on which the usability information and the destination information which must be obtained before mounting on the substrate are formed.

The mounting setting method according to the present invention is a mounting setting method for setting mounting contents of a component in a mounting apparatus that performs a mounting process of collecting a component and arranging the component on a board, and (a) information formed on the substrate. Information on at least one of whether or not the component is arranged on the board based on the part and whether or not the kind of the part to be arranged is determined based on the information part formed on the board. Acquiring mounting information; and (b) arranging the component on the substrate based on the acquired mounting information without being based on the information section formed on the substrate, and Setting the mounting order information including the mounting order of the components so that at least one or more of the components to be arranged without being determined based on the information portion to be formed are arranged on the board earlier than at least one of the components, (C) The setting And outputting the mounting order information, it is intended to include.

In this mounting setting method, similarly to the mounting setting device described above, the mounting order in which components to be mounted without being based on the information portion and components whose component types are determined without being based on this information portion are mounted with higher priority is determined. Set. For this reason, the mounting apparatus can execute processing related to the mounting processing (for example, collection of a component, grasping of the collection state of a component, and the like) before acquiring information from the information unit formed on the board. Therefore, production efficiency can be further improved. Note that, in this mounting setting method, various aspects of the above-described mounting setting device may be adopted, or a configuration that realizes each function of the above-described mounting setting device may be added.

FIG. 1 is a schematic explanatory diagram of a mounting system 10. FIG. 2 is a block diagram illustrating an electrical connection relationship of the mounting system 10. FIG. 4 is an explanatory diagram illustrating an example of a panel 70 including a plurality of substrates 71 and 72. FIG. 4 is an explanatory diagram illustrating an example of a substrate 73. FIG. 4 is an explanatory diagram of information stored in an HDD 83. 9 is a flowchart illustrating an example of a mounting order setting processing routine. 9 is a flowchart illustrating an example of a mounting processing routine. FIG. 4 is an explanatory diagram illustrating an example of movement of a mounting head 24 on a panel 70.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. FIG. 2 is a block diagram illustrating an electrical connection relationship of the mounting system 10. FIG. 3 is an explanatory diagram illustrating an example of a panel 70 including a plurality of substrates 71 and 72 on which components P are mounted. FIG. 4 is an explanatory diagram illustrating an example of the substrate 73 on which the components P1 and P2 are mounted. FIG. 5 is an explanatory diagram of the mounting order information 91 and the command information 92 stored in the HDD 83. The mounting system 10 of the present embodiment includes a mounting apparatus 11 that mounts components on a board and a mounting management computer 80 that manages and sets information related to mounting processing. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. The mounting process includes a process of arranging, mounting, inserting, joining, and bonding components on a substrate.

As shown in FIG. 1, the mounting apparatus 11 includes a transport unit 18 that transports a substrate, a sampling unit 21 that samples components, a reel unit 56 that supplies components, and a control device 60 (FIG. 2) that controls the entire device. See). The transport unit 18 includes support plates 20, 20 that are provided at an interval in front and rear of FIG. 1 and extend in the left-right direction, and conveyor belts 22, 22 that are provided on surfaces of the support plates 20, 20 that face each other. ing. The conveyor belts 22, 22 are endlessly wound around driving wheels and driven wheels provided on the left and right sides of the support plates 20, 20. The panel 70 including a plurality of substrates is placed on the upper surfaces of the pair of conveyor belts 22, and is transported from left to right. The panel 70 is supported from the back side by a plurality of support pins 23 that are erected.

The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is mounted on the front surface of the X-axis slider 26. The X-axis slider 26 is mounted on the front surface of a Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32 extending in the front-rear direction. The guide rails 32 are fixed inside the mounting device 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each of the sliders 26 and 30 is driven by a drive motor (not shown).

The mounting head 24 includes a nozzle 40 for sucking and collecting a component, and a nozzle holder 42 to which one or more nozzles 40 can be attached and detached. For example, three types of nozzle holders 42A to 42C can be attached to and detached from the mounting head 24. The nozzle holders 42A to 42C are collectively referred to as a nozzle holder 42. The nozzle holder 42A includes twelve nozzle holders, and can hold twelve nozzles 40. The nozzle holder 42B includes four nozzle holders, and can mount four nozzles 40. The nozzle holder 42C can mount one nozzle 40. The nozzle holding body 42A is held by the mounting head 24 in a state where it can be rotated intermittently. The nozzle 40 uses pressure to adsorb components to the nozzle tip or release components adsorbed to the nozzle tip. The nozzle 40 is moved up and down in a Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder elevating device using a Z-axis motor 45 as a driving source. In addition, the sampling member for sampling the component will be described here as the nozzle 40, but is not particularly limited as long as the component can be sampled, and may be a mechanical chuck for sandwiching and sampling the component.

The mounting head 24 is provided with a mark camera 34 for photographing the substrate from above. The mark camera 34 is a camera that reads a mark as an information portion attached to the panel 70 (substrate), which is a photographing area below. The mark camera 34 moves in the X and Y directions as the mounting head 24 moves. This mark indicates whether or not the component can be arranged on the board and whether or not the type of the component to be arranged is determined. In addition, the mark camera 34 may read a reference mark indicating the reference position of the panel 70.

The reel unit 56 includes a plurality of reels 57 around which a tape storing components is wound, and is detachably attached to the front side of the mounting apparatus 11. This tape is unwound from the reel 57 and is sent out by the feeder unit 58 to a collecting position where the mounting head 24 collects the tape. The parts camera 54 is disposed in front of the support plate 20 on the front side of the transport unit 18. The imaging range of the part camera 54 is above the part camera 54. The part camera 54 captures the state of the component sucked by the nozzle 40 when the nozzle 40 that has sucked the component passes above the part camera 54, and outputs the image to the control device 60. The nozzle stocker 55 is a box for stocking a plurality of types of nozzles 40 suitable for the type of component. The nozzle 40 is detachably mounted on a nozzle holder 42 of the mounting head 24.

As shown in FIG. 2, the control device 60 is configured as a microprocessor with a CPU 61 at the center, and a ROM 62 for storing a processing program, an HDD 63 for storing various data, a RAM 64 used as a work area, an external device and an electric device. An input / output interface 65 for exchanging signals is provided, and these are connected via a bus 66. The control device 60 is connected to the transport unit 18, the collection unit 21, the mark camera 34, the parts camera 54, the reel unit 56, and the like so as to be capable of bidirectional communication, and receives an image signal from the mark camera 34 or the parts camera 54. I do. The sliders 26 and 30 are provided with position sensors (not shown), and the control device 60 controls the drive motors of the sliders 26 and 30 while inputting the position information from the position sensors.

Here, the panel 70 (substrate) on which the component P is mounted by the mounting apparatus 11 will be described. As shown in FIG. 3, the panel 70 includes a plurality of substrates 71 and 72. On the substrate 71, a mark forming part 75 as an information part is formed. The mark forming section 75 indicates usability information regarding whether each board can be used in a panel including a plurality of boards. The mark forming section 75 is an area indicating that, when a mark is formed (for example, when the mark is filled with a marker or the like), the corresponding substrate 71 cannot be used due to deformation or the like. For example, a mark is formed on the mark forming unit 75 by a supplier of the panel 70 or a person in charge of a previous process. The mark is formed in a black color when the substrate is a white color, and is formed in a white color when the substrate is a black color. Further, as shown in FIG. 4, the substrate used by the mounting apparatus 11 may be a substrate 73 on which a mark forming section 76 is formed. The mark forming section 76 indicates destination information on an area where the substrate is used. The mark forming section 76 is an area indicating that when a mark is formed in a predetermined pattern, components corresponding to an area (for example, the United States or Europe) corresponding to the predetermined pattern are arranged. On the substrate 73, a component P1 arranged regardless of the area and a part P2 changed according to the area such as a change in resistance constant due to a difference in voltage or frequency are arranged. The substrates 71 to 73 are simply referred to as “substrate”, the components P, P1 and P2 are simply referred to as “components”, and the mark forming units 75 and 76 are simply referred to as “mark forming unit”.

As shown in FIG. 2, the management computer 80 is a PC having the function of an implementation setting device. As shown in FIG. 2, the management computer 80 is used as a microprocessor, a ROM 82 for storing processing programs, an HDD 83 for storing various information, and a work area. And an input / output interface 85 for exchanging electric signals with an external device. These are connected via a bus 86. The management computer 80 is capable of inputting a signal from an input device 87 typified by a mouse or a keyboard via an input / output interface 85, and is connected to a display 88 so that various images can be output. The HDD 83 stores mounting order information 91 and command information 92, as shown in FIG. The mounting order information 91 is information set by the management computer 80 based on mounting information input in advance, such as the type and arrangement position of components used for production and the nozzles used for mounting (see FIG. 6 described later). The mounting order information 91 includes, as information relating to the process of mounting the components on the board, the mounting order of the components, the type of the components to be mounted, the component size, the sampling member information such as the nozzle 40 and the nozzle holder 42 to be used, and the arrangement position of the components Information includes advance collection information indicating whether or not the component can be collected in advance. The component placement position includes information as to whether or not the substrate on which the component is placed has a mark forming portion, coordinates of the component placement position, and the like. In addition, pre-sampling refers to sampling components with the nozzle 40 before the mark camera 34 reads the mark forming unit. The command information 92 includes one of a preceding collection command and a preceding reading command. The pre-sampling command is a command for executing a process of pre-sampling components based on the mounting order information 91 before reading the mark forming unit on the board. Further, the preceding reading command is a command for executing a process of reading a mark forming portion on the board before collecting a component.

Next, the operation of the mounting system 10 according to the present embodiment configured as described above, and first, a process in which the management computer 80 sets the mounting order of mounting components on the board in the mounting process of the mounting apparatus 11 will be described. FIG. 6 is a flowchart showing an example of a mounting order setting processing routine executed by the CPU 81 of the management computer 80. This routine is stored in the HDD 83 of the management computer 80, and is executed in response to a start instruction from an operator. Here, a case where components are arranged on each substrate of panel 70 will be mainly described.

When this routine is started, the CPU 81 first reads out mounting information and acquires information on components to be arranged on a board to be produced this time (step S100). The mounting information is, for example, basic information that does not include the mounting order and the preceding sampling information in the mounting order information 91. Entered by the person. This mounting information includes information (arrangement position information) as to whether or not to arrange components on the board based on the marks formed on the board. Further, the mounting information may include information as to whether or not a component type to be arranged is determined based on a mark formed on the board.

Next, the CPU 81 determines whether there is a component that can be arranged regardless of the mark on the board based on the mounting information (step S110). This determination can be made, for example, based on the arrangement position information included in the mounting information. This determination can also be made based on whether or not the substrate to be mounted has a mark forming portion. When there is no component that can be arranged irrespective of the mark on the substrate, the CPU 81 determines that the pre-sampling process cannot be performed because the component can be collected only after reading the mark forming unit, and issues a pre-read command. The command information including the command information is set and stored in the HDD 83 (step S120). This is because, depending on whether or not a mark is formed in the mark forming unit, components may not be arranged on the substrate in some cases, and it is necessary to read the mark forming unit first. On the other hand, when there is a component that can be arranged irrespective of the mark on the board, the CPU 81 determines that the pre-sampling process can be performed because the component can be arranged before reading the mark forming unit, and issues a command including the pre-sampling command. The information is set and stored in the HDD 83 (step S130).

After step S130, the CPU 81 extracts, from the components to be mounted by the mounting apparatus 11, components that can be arranged irrespective of the marks formed on the mark forming unit on the substrate (step S140). Next, an order is set to give priority to components in the extracted component group that are common to the nozzle 40 and the nozzle holder 42 (step S150). For example, here, the nozzle holder 42 (for example, the nozzle holder 42A) having a larger number of nozzles 40 mounted thereon is prioritized so that the number of components to be collected earlier is increased as much as possible, and the components corresponding to the nozzle holders 42 are arranged in earlier order. Shall be set to In addition, the nozzle holding body 42 in which the number of components that can be obtained in advance can be increased may be given priority. Next, the CPU 81 rearranges the component order such that the component whose height is lower than the predetermined value is higher than the other components, and sets the order (step S160). The reason for this is that if higher components are placed on the board first, they may interfere with components placed later. In this processing, in the rearrangement processing of the previous step, a pertinent one may be extracted and rearranged from those selected in a higher order. For example, here, it is assumed that a component having a component height lower than a predetermined value is higher in a component group that can be pre-collected by the nozzle holder 42A. The predetermined value of the component height may be set empirically to a value that does not easily interfere with subsequent component mounting and set to that value.

Next, the CPU 81 rearranges the component order so as to give priority to a component having a shorter distance between the position of the mark forming unit (mark position) and the component arrangement position (step S170). Here, for example, the order of the components may be rearranged so that a component having a shorter moving distance than a predetermined moving distance is ranked higher than the other components. In this processing, in the rearrangement processing of the previous step, a pertinent one may be extracted and rearranged from those selected higher (the part height is lower than a predetermined value). Note that the predetermined moving distance may be set empirically to a distance that can further reduce the mounting time, and set to that value. Here, the position of the mark forming unit in step S170 may be, for example, the position of the mark forming unit that is read last by the mark camera 34. In this way, the mounting head 24 can move from the reading of the mark forming section to the arrangement of the components at a shorter distance, and can further shorten the processing time and perform the efficient mounting processing. In addition, the CPU 81 sets a component closer to the mark position in a higher order, sets a component closer to the component as a next component, and sets a component closer to the component as a next component, and draws as much as possible with one stroke. A process of changing the order of the components so that the mounting head 24 moves with suppressed reciprocal movement may be performed (see FIG. 8 described later).

Subsequently, the CPU 81 determines the mounting order according to the number of nozzles 40 mounted on the nozzle holder 42 from the start of mounting (step S180). That is, here, in the nozzle holder 42 used, the mounting order according to the number of components that can be collected by one component collection is determined. Specifically, when using the nozzle holder 42A that can collect 12 components at the start of mounting, the CPU 81 determines the mounting order of the components from No. 1 to No. 12 at the maximum. When the number of components that can be pre-collected is smaller than the number of nozzles 40 mounted on the nozzle holder 42, the mounting order of the components with that number of components is determined. For example, when using only the nozzle holder 42A and there are only 10 preceding parts to be collected, the number is determined up to the tenth. In this way, the number of pre-samples is increased, the moving time of the mounting head 24 is further shortened, and the interference between the arranged parts and the moving parts is further reduced, so that more efficient operation is achieved. It is possible to set a mounting condition for performing a simple mounting process.

After step S180 or after step S120, the CPU 81 executes a mounting order setting process for the undetermined components (step S190). In this process, for example, similarly to the setting of the mounting order described above, the use of the nozzle holder 42 having a larger number of components, the component having a lower height, and the component having a shorter moving distance of the mounting head 24 are used. May be set in a mounting order in which is arranged earlier. For example, in the mounting order setting process, a component closer to the component sampling position is set in a higher order, a component closer to the component is set as the next component, and a component closer to the component is set as the next component. Alternatively, the movement of the mounting head 24 may be performed in one stroke with the reciprocal movement suppressed as much as possible. In step S190, a plurality of mounting order candidates having different routes may be set, and a process of determining the most efficient one as the mounting order may be performed. Then, the CPU 81 stores the set mounting order as mounting order information 91 in the HDD 83 (step S200), creates a production program based on the command information 92 and the mounting order information 91, and mounts the production program via a network. Output to the device 11 (step S210), and this routine ends. As described above, the CPU 81 determines, based on the mounting information, a component for arranging the component on the substrate without being based on the mark formed on the substrate and a component type for arranging the component without being based on the mark formed on the substrate. The mounting order of the components is set so that at least one or more of the determined components is arranged on the board earlier (see FIG. 5).

Next, a mounting process performed by the mounting apparatus 11 using the mounting order information 91 will be described. FIG. 7 is a flowchart illustrating an example of a mounting processing routine executed by the CPU 61 of the mounting apparatus 11. This routine is stored in the HDD 63 of the control device 60 and is executed according to a start instruction from the operator. When this routine is executed, the CPU 61 of the control device 60 acquires a production program based on the mounting order information 91 and the command information 92 (Step S300). This production program may be obtained by reading out the information previously received and stored in the HDD 63 from the HDD 63 or by directly receiving it from the management computer 80 and acquiring it. Next, the CPU 61 executes a substrate transfer process (Step S310). In this process, the board (panel 70) is transported by the conveyor belt 22 of the transport unit 18 and the board is fixed at a predetermined mounting position where the processing for arranging the components is performed.

While executing the substrate transfer process, the CPU 61 determines whether or not the command included in the obtained command information 92 is a preceding collection command (step S320). When the command included in the command information 92 is a preceding collection command, the CPU 61 executes a preceding collection process (steps S330 to S350) described below. This pre-sampling process is a process in which components are sampled by the nozzle 40 based on the mounting order information 91 prior to reading of the mark forming portion (mark) on the board. In addition, in the preceding sampling process, a process of detecting the state of the component sampled by the nozzle 40 by the part camera 54 before the mark is read is also performed. When the pre-sampling process is performed, the CPU 61 performs a process of reading each mark forming unit in a state where components are collected by the nozzle 40.

In the preceding collection process, the CPU 61 first mounts the nozzle holder 42 and the nozzle 40 designated to collect components on the mounting head 24 based on the information included in the mounting order information 91 (step S330). . Next, the CPU 61 performs a sampling process on the target component (step S340). In this process, the CPU 61 uses the nozzle 40 to collect components (for example, components in the order 1 to 12 in FIG. 5) that are set to be precedent-collectable based on the pre-collection information included in the mounting order information 91. Next, the CPU 61 performs a process of acquiring the collection state of the component collected by the nozzle 40 (step S350). In this process, the CPU 61 moves the mounting head 24 to an upper part of the parts camera 54 and acquires an image captured by the parts camera 54. The CPU 61 analyzes this image to grasp a component abnormality, a shift in the sampling position, and the like. Further, the CPU 61 discards the part when the part shape is abnormal or when the sampling position is shifted from a predetermined value.

Next, the CPU 61 determines whether or not the board (panel 70) is fixed at the mounting position (Step S360). When the board is not fixed at the mounting position, the CPU 61 continues the board transfer processing. When the board is fixed at the mounting position, the CPU 61 performs a reading process of the mark forming section (step S370), and continues with the component. An arrangement process (mounting process) is performed (step S380). In the reading process of the mark forming unit, a process of moving the mark camera 34 above each mark forming unit and capturing an image of the mark forming unit is performed. The CPU 61 determines whether or not a mark is formed by performing image processing on the obtained image. In the component arranging process, the mounting head 24 is sequentially moved to the component arranging position according to the mounting order, the component is lowered, and the component is arranged at the arranging position. As described above, the CPU 61 executes the preceding collecting process by the collecting unit 21 in parallel with the transfer of the substrate by the transfer unit 18 before the reading of the mark forming unit on the substrate. Then, the CPU 61 performs the component arranging process so as to flow from the reading of the mark forming unit.

FIG. 8 is an explanatory diagram illustrating an example of movement of the mounting head 24 on the panel 70. FIG. 8 is a specific example of mounting components in the mounting order corresponding to the mounting order information 91 in FIG. In the drawing, the movement of the mounting head 24 for reading of the mark forming unit 75 is indicated by a dotted arrow, and the movement of the mounting head 24 for the placement processing of the component P is indicated by a solid arrow. The CPU 61 causes the mark camera 34 to read the mark forming unit 75 in a state where the components arranged on the substrate 72 having no mark forming unit are collected, and removes the unusable substrate 71 according to the presence or absence of the mark. Figure out. Subsequently, the CPU 61 continues the placement processing of the collected components.

On the other hand, when the command included in the command information 92 is not the preceding collection command in step S320, that is, when the command is the preceding reading command, the CPU 61 first performs a reading process of the mark forming unit (step S390). This reading process is the same as the process of step S370 described above. Next, the CPU 61 mounts the nozzle holder 42 and the nozzle 40 designated for collecting components on the mounting head 24, and performs a process of collecting components with the nozzles 40 in accordance with the mounting order (step S400). . At this time, when a mark is formed on the mark forming portion 75 of the substrate 71, the CPU 61 does not arrange any components on the substrate 71. When a mark is formed on the mark forming section 76 of the substrate 73, the CPU 61 determines a component type corresponding to the mark and collects the component. Subsequently, the CPU 61 performs a process of acquiring a collection state (step S410), and performs a component placement process (step S420). In these processes, the same processes as those in steps S350 and S380 are performed.

After step S420 or after step S380, the CPU 61 determines whether or not the mounting process of the current board is completed (step S430). If the mounting process of the current board is not completed, the processes after step S400 are performed. Execute That is, the CPU 61 changes the nozzle holder 42 and the nozzle 40 as necessary, collects components, grasps the collection state, and performs component arrangement processing. On the other hand, when the mounting processing of the current board is completed, the CPU 61 discharges the board on which mounting is completed (step S440), and determines whether or not the production is completed based on the number of boards on which mounting is completed (step S450). When the production is not completed, the CPU 61 repeatedly executes the processing after step S310, and when the production is completed, the CPU 61 returns the nozzle holder 42 and the nozzle 40 (step S460), and ends this routine as it is.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The CPU 81 of the present embodiment corresponds to the information acquisition unit, the setting unit, and the information output unit of the present invention. In the present embodiment, an example of the mounting setting method of the present invention is also clarified by describing the operation of the mounting system 10.

According to the mounting system 10 described above, the CPU 81 determines whether or not to place components on the board based on the marks formed on the board, and determines the type of the components to be placed based on the marks formed on the board. Acquire mounting information including at least one piece of information on whether or not to be determined. Further, based on the acquired mounting information, the CPU 81 determines at least one or more of a component for arranging a component on a substrate without using a mark and a component for which a component type to be laid out without using a mark is determined. First, the mounting order information 91 including the mounting order of the components is set so as to be arranged on the board. Subsequently, the CPU 81 outputs the set mounting order information 91 to the mounting apparatus 11. Therefore, the mounting apparatus 11 can use the mounting order information 91 in the mounting process. For example, the mounting apparatus 11 may perform mounting processing after acquiring information from a mark formed on a substrate. The management computer 80 sets a mounting order in which components to be mounted based on the mark and components whose component type is determined based on the mark are arranged with higher priority. For this reason, the mounting apparatus 11 can execute processing related to mounting processing (for example, collection of components, grasping of the collection state of components, etc.) before reading the mark formed on the substrate. Therefore, production efficiency can be further improved.

Further, since the CPU 81 sets command information including the preceding collection command and outputs the command information to the mounting apparatus 11, the mounting apparatus 11 can execute the sampling of the component before the reading of the mark by the command information. By performing the sampling, the production time can be further reduced. Further, the CPU 81 sets the command information for executing the preceding sampling by the sampling unit 21 in parallel with the transfer of the board by the transfer unit 18, so that the mounting apparatus 11 performs the transfer of the board and the sampling of the parts in parallel. Since it can be performed, the production time can be further reduced. Furthermore, in order to determine the mounting order of the number of components at the start of the mounting process in accordance with at least the number of components that can be collected by the collecting unit 21, the mounting order of the minimum number of components to be pre-sampled is set. Thereby, the production efficiency can be more reliably increased. In addition, when setting the mounting order, the CPU 81 sets a component having a common nozzle holder 42 for sampling the component, a component having a shorter distance between the position of the mark forming portion and the arrangement position of the component, and a lower height. Since the mounting order is set so that the components are arranged on the board earlier, the time required for replacing the nozzle holder 42 and the like, the moving time of the components in the mounting process, the interference of the components, and the like are further reduced. And increase the production efficiency. Further, the mark forming unit includes at least one of availability information regarding whether each substrate 71 can be used in the panel 70 including a plurality of substrates and destination information regarding an area where the substrate 73 is used. The production efficiency can be further improved for a substrate on which usability information and destination information that must be obtained before mounting on the substrate are formed.

It should be noted that the present invention is not limited to the above-described embodiment at all, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the CPU 81 sets command information including a preceding collection command or a preceding reading command and outputs the command information to the mounting apparatus 11, but this may be omitted. At this time, the CPU 61 of the mounting apparatus 11 may determine, based on the acquired mounting order information 91, whether or not there is a component that can be arranged regardless of the mark on the board. The CPU 61 can make this determination based on the preceding collection information included in the mounting order information 91, for example. In this case, the CPU 61 can further reduce the production time by performing the preliminary sampling of the component based on its own determination.

In the above-described embodiment, the command information for performing the preceding sampling by the sampling unit 21 is set in parallel with the transport of the substrate by the transport unit 18. However, the command information is not particularly related to the instruction information. The preceding collection may be performed by the collection unit 21 in parallel with the transport of the data. Even in this case, the production time can be further reduced. Alternatively, the CPU 61 does not have to perform the transport of the substrate by the transport unit 18 and the advance sampling by the sampling unit 21 in parallel if the preliminary sampling is performed.

In the above-described embodiment, in step S180, the CPU 81 determines the mounting order of the number of components at the start of the mounting process according to at least the number of components that can be collected by the collection unit (the number of nozzles 40 of the nozzle holder 42). However, the present invention is not limited to this. For example, the CPU 81 may determine the mounting order of a predetermined number of components (for example, 12, 4, etc.) from the start of the mounting process, or may arrange the components irrespective of the mark on the board. All possible components may be determined, or the determination of the mounting order may be omitted. Even in this case, the CPU 61 can further increase the production efficiency.

In the above-described embodiment, the CPU 81 gives priority to the component that shares the nozzle 40 or the nozzle holder 42 that collects the component first, gives priority to the component with the lower height next, and arranges the position of the mark forming unit and the component arrangement. Although a component having a shorter distance from the position is set with the next highest priority in the mounting order, the present invention is not particularly limited to this. For example, the CPU 81 may select at least one of a component that shares the nozzle 40 and the nozzle holder 42, a component that has a shorter distance between the position of the mark forming unit and the component placement position, and a component that has a lower height. A priority mounting order may be set, one or more of these may be omitted, or one or more of these may be changed to another condition. For example, when all components are mounted with one type of nozzle holder 42 and nozzle 40, the CPU 81 can omit giving priority to components that share the nozzle holder 42 and nozzle 40. Similarly, when all the components are lower than the predetermined height, the CPU 81 can omit giving priority to a component having a lower component height.

In the above-described embodiment, the mark forming unit is one or more of the unusable mark indicating whether each substrate can be used or not and the destination mark in which the substrate is used. Instead, it may be a mark representing other information.

In the above-described embodiment, the substrate is provided with a mark forming part as an information part on which a mark is written, but the information part is for acquiring information before mounting. There is no particular limitation on the mark as long as the information is stored, and a storage element that stores information and is provided on a substrate may be used.

In the embodiment described above, the management computer 80 has the function of the mounting setting device of the present invention. However, the present invention is not limited to this. For example, the mounting device 11 may have the function of the present invention. Even in this manner, the mounting apparatus 11 can execute processing related to the mounting processing (for example, component collection, grasping of the component collection state, etc.) before information acquisition by reading the mark formed on the substrate. Production efficiency can be further improved.

INDUSTRIAL APPLICATION This invention is applicable to the technical field which mounts components on a board | substrate.

Reference Signs List 10 mounting system, 11 mounting device, 18 transport unit, 21 sampling unit, 20 support plate, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X-axis slider, 28 guide rail, 30 Y-axis slider, 32 guide rail, 34 mark camera, 40 nozzles, 42, 42A to 42C nozzle holder, 45 Z-axis motor, 54 parts camera, 55 nozzle stocker, 56 reel unit, 57 reel, 58 feeder unit, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 input / output interface, 66 bus, 70 panel, 71 to 73 substrate, 75, 76 mark forming unit, 80 management computer, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input / output interface, 86 bus, 87 input device, 88 disk Play, 91 mounting order information, 92 command information, P, P1, P2 parts.

Claims (6)

A mounting setting device that sets mounting contents of the component of a mounting device that performs a mounting process of collecting a component and placing the component on a board,
Whether a component type is determined to place the whether based on the mark forming part formed on the substrate to place the component to the substrate, and on the basis of the mark forming portion formed on the substrate An information obtaining means for obtaining mounting information including at least one or more information among
Based on the obtained mounting information, not based the components not based on the mark forming portion formed on the substrate in the mark forming portion formed on the part, and the substrate is placed onto said substrate Setting means for setting mounting order information including the mounting order of the components so that at least one or more of the components whose component types are to be determined are arranged earlier on the board;
And an information output means for outputting the mounting order information described above setting,
The setting unit sets command information including a pre-sampling command to sample the component prior to reading the mark forming unit on the board based on the set mounting order information,
The mounting setting device , wherein the information output unit also outputs the set command information . The mounting apparatus includes a transport unit that transports a substrate, and a sampling unit that obtains information from the mark forming unit and samples components.
The mounting setting device according to claim 1 , wherein the setting unit sets the command information for executing the preceding sampling by the sampling unit in parallel with the transfer of the substrate by the transfer unit. The mounting apparatus includes one or more collecting units for collecting components.
The setting means sets the implementation order of the mounting processing start time of component count the parts of which corresponding to the number of components of at least the collecting unit, mounting setting device according to claim 1 or 2. The setting means, when setting the mounting order, a component having a common sampling member for sampling the component, a component having a shorter distance between the position of the mark forming portion and the arrangement position of the component, and a lower height. The mounting setting device according to any one of claims 1 to 3 , wherein the mounting order is set so that at least one or more of the components is arranged on the board earlier. The mark formation unit, usability information about whether it is possible to use each board in a panel including a plurality of substrates, and one or more of the destination information about the area where the substrate is utilized, any one of claim 1-4 2. The mounting setting device according to claim 1. A mounting setting method of setting mounting contents of the component of a mounting apparatus that performs a mounting process of collecting a component and placing the component on a board,
(A) whether or not to place the component on the basis of the mark forming portion formed on the substrate to the substrate, and component types are determined to place on the basis of the mark forming portion formed on the substrate Acquiring implementation information including at least one of information on whether or not
(B) based on the obtained mounting information, the mark forming part of the component not based on the mark forming portion formed on the substrate is formed on the component placing on the substrate, and the substrate Setting mounting order information including the mounting order of the components so that at least one or more of the components for which the component type to be arranged is determined based on
(C) viewed including the steps of: outputting a mounting order information described above setting,
In the step (b), based on the set mounting order information, command information including a pre-sampling command for sampling the component prior to reading the mark forming unit on the board is set,
In the step (c), an implementation setting method for outputting the set command information .

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