JP5647937B2 - PCB production management system - Google Patents

Description

  The present invention relates to a substrate production management system that manages the production of a plurality of substrates belonging to the same family substrate group.

  In electronic devices such as mobile phones, personal computers, and televisions, the specifications and standards of the power supply may differ from destination to destination. The same electronic device may be developed in series depending on, for example, the presence / absence of optional functions and the size of the screen. In addition, when developing a series, there is a case where a prototype of a substrate is made. In such a case, the manufacturer of the electronic device incorporates the substrate belonging to the same family substrate group into the electronic device so as to correspond to the destination for reducing the cost.

  2A to 2D are conceptual diagrams of substrates belonging to the same family substrate group. As shown in FIGS. 2A to 2D, when the substrates 100a to 100d are compared, the same electronic component is mounted on most mounting coordinates. For example, the same electronic component 101 is mounted on the mounting coordinates (X103, Y104) of the substrates 100a to 100d. The same electronic component 102 is mounted on the mounting coordinates (X105, Y101) of the boards 100a to 100d.

  However, different electronic components are mounted on some mounting coordinates. For example, different electronic components 103a to 103d are mounted on the mounting coordinates (X103, Y101) of the substrates 100a to 100d, respectively. Note that the mounting coordinates (X103, Y101) on which the different electronic components 103a to 103d are mounted are not limited to one. Further, depending on the boards 100a to 100d, the electronic components 103a to 103d may not be mounted (skipped) at the mounting coordinates (X103, Y101).

  For example, when there are four destinations of the electronic device, only the electronic components 103a to 103d mounted on the mounting coordinates (X103, Y101) among all the mounting coordinates are changed according to the destination. In this way, the substrates 100a to 100d are made to correspond to the specifications and standards of each destination.

  As described above, in the plurality of boards belonging to the family board group, the same electronic component is mounted in most mounting coordinates. However, job data (a data group for operating a plurality of electronic component mounting machines arranged on a board production line) used for board production is created for each board type. Therefore, at the time of data creation, it is necessary to create a plurality of similar job data according to the number of board types. In data management, it is necessary to manage job data for each board type. Thus, data production and data management are complicated in the production of a board belonging to a family board group. Further, the degree of complexity increases as the number of substrate types (for example, the number of destinations) increases.

  In view of this point, Patent Document 1 discloses a component mounting method for generating destination integration data shared by all boards for all destinations. According to the component mounting method of the same document, first, a mounting component skip correspondence table for each destination is created from a mounting component instruction table for each destination (indicating whether or not an electronic component is mounted for each destination). Next, with reference to the skip command determined in the mounting component skip correspondence table for each destination, the destination integrated operation data, which is the operation data to which the skip command necessary for the electronic component mounter to operate, is given. Created. According to the component mounting method described in this document, data creation and data management can be easily performed even when the number of destinations is large.

JP-A-8-236996

  However, in the case of the component mounting method of Patent Document 1, the content of the destination integration operation data is electronic component skip information (mounting prohibition information). That is, the destination integration operation data has redundant mounting data with skip information for the same mounting coordinates for each board type corresponding to each destination. For this reason, a substrate production management system that can further easily create and manage data is desired.

  The substrate production management system of the present invention has been completed in view of the above problems. It is an object of the present invention to provide a board production management system in which data creation and data management are simple.

  (1) In order to solve the above-described problem, a board production management system according to the present invention distributes an electronic component mounting machine for mounting an electronic component on a board mounting coordinate, and the electronic component to be mounted on the electronic component mounting machine. A board production management system comprising a management device, wherein the board belongs to a family board group consisting of a plurality of the boards, and the management apparatus is shared by all the boards belonging to the family board group. , The coordinate data in which the mounting coordinates and the coordinate identifier are associated with each other, and individually used for all the boards belonging to the family board group, and the type of the coordinate identifier and the electronic component And BOM data having the same number of BOMs as the number of the boards belonging to the family board group and all the boards belonging to the family board group, OM and board type correspondence data in which the board type, which is the type of the board on which the electronic component related to the part type of the BOM is mounted, are associated with each other. The BOM selection step of selecting the BOM corresponding to the board type from the BOM data based on the board type correspondence data, and the coordinates based on the coordinate identifier of the BOM. A mounting coordinate recognition step for recognizing the mounting coordinates from data and a notification step for notifying the electronic component mounter of the electronic component to be mounted are executed.

  Here, in the plurality of substrates belonging to the “family substrate group”, different electronic components may be mounted at the same mounting coordinates in some mounting coordinates among all mounting coordinates. Further, in some mounting coordinates among all the mounting coordinates, an electronic component may be mounted or not mounted (that is, skipped) at the same mounting coordinates.

  The board production management system of the present invention includes an electronic component mounting machine and a management device. The management device has coordinate data, BOM (Bills of Materials) data, and board type correspondence data. Among these, the coordinate data and the board type correspondence data are shared by all the boards belonging to the family board group. Further, each BOM of the BOM data individually corresponds to all the boards belonging to the family board group.

  When the board type is input, the management apparatus executes a BOM selection step, a mounting coordinate recognition step, and a notification step. In the BOM selection step, a BOM is selected from the input substrate type. In the mounting coordinate recognition step, the mounting coordinates of the electronic component belonging to the BOM are recognized. In the notifying step, the electronic component mounting machine is notified of the electronic component in charge of the electronic component mounting machine.

  According to the substrate production management system of the present invention, coordinate data and substrate type correspondence data are shared by all the substrates belonging to the family substrate group. For this reason, at the time of data creation, it is not necessary to create a plurality of coordinate data and board type corresponding data according to the number of board types. This makes it easy to create and modify data. Further, at the time of data management, it is not necessary to manage coordinate data and board type corresponding data for each board type. For this reason, data management is easy.

  In addition, according to the substrate production management system of the present invention, coordinate data and substrate type correspondence data are shared by all the substrates belonging to the family substrate group, and the substrate type can be changed only by BOM. Easy to trace the production status of the board. That is, it is easy to acquire traceability information.

  In addition, according to the substrate production management system of the present invention, it is possible to easily switch substrates to be produced simply by inputting a substrate type automatically or manually. Moreover, an electronic component is automatically notified to an electronic component mounting machine only by inputting a board type. For this reason, transmission errors from the management apparatus to the electronic component mounting machine are reduced. Further, in the case of trial production, electronic components and the like are frequently changed. However, according to the board production management system of the present invention, it can be dealt with only by adding BOM. In addition, since the board type is managed by BOM including trial manufacture, when obtaining traceability information after board production, it is possible to easily reach the desired traceability information based on the inputted board type information. it can.

  (2) Preferably, in the configuration of (1), the management device is shared by all the boards belonging to the family board group, and the component type and the specifications of the electronic component are The management apparatus has the associated part data, and the management apparatus, after the BOM selection step and before the notification step, determines the spec of the electronic component from the part data based on the part type of the BOM. The component specification recognition step for recognizing

  According to this configuration, it is possible to automatically recognize the specifications of the electronic component belonging to the BOM simply by inputting the board type. For this reason, the specification can be reflected in the mounting order and mounting coordinates of the electronic components in the electronic component mounting machine.

  According to the present invention, it is possible to provide a board production management system in which data creation and data management are simple.

It is a block diagram of the board | substrate production management system used as one Embodiment of this invention. It is a conceptual diagram of the board | substrate which belongs to the same family board | substrate group.

  Hereinafter, an embodiment of a substrate production management system of the present invention will be described.

<Board production management system>
First, the substrate production management system of this embodiment will be described. FIG. 1 shows a block diagram of the substrate production management system of this embodiment. As shown in FIG. 1, the board production management system 1 of the present embodiment includes a management device 2 and a plurality of electronic component mounting machines 3.

  The plurality of electronic component mounting machines 3 are arranged in series along the production line. In the production line, a plurality of substrates belonging to the same family substrate group (for example, a plurality of substrates having different destinations) are produced. The plurality of electronic component mounting machines 3 mount the plurality of electronic components in stages using suction nozzles (not shown) on the substrate conveyed on the production line.

  The management device 2 is electrically connected to a plurality of electronic component mounting machines 3. The management device 2 distributes the electronic component mounting staff to each of the plurality of electronic component mounting machines 3. That is, the management device 2 assigns to each of the plurality of electronic component mounting machines 3 distribution data such as “which electronic component is to be mounted at which mounting coordinate of the substrate to be transported” before each board production. Supply. The management device 2 is electrically connected to a CAD (Computer-Aided Design) system 9 when generating sequence data 21 described later.

  Job data 20 is stored in the memory of the management apparatus 2. The job data 20 includes sequence data 21, BOM data 22, part data 23, board type corresponding data 24, mounting order information (not shown), and apparatus configuration information (not shown). The sequence data 21 is included in the concept of “coordinate data” of the present invention.

  The sequence data 21 is data relating to the substrate production process. Sequence data 21 includes electronic component mounting coordinates (X-axis (for example, left-right direction) coordinates (X1, X2, X3...), Y-axis (for example, front-rear direction) coordinates (Y1, Y2, Y3...), Θ Axis (rotation direction in the horizontal plane) coordinates (θ1, θ2, θ3...)) And circuit symbols (Ref1, Ref2, Ref3...). The circuit symbol is included in the concept of “coordinate identifier” of the present invention. The mounting coordinates and the circuit symbols are associated with each other, for example, X1-Y1-θ1-Ref1. The sequence data 21 is common to all substrate types.

  The part data 23 is data relating to the specifications of the electronic component. The part data 23 includes electronic component types (a, b, c, d...), Electronic component dimensions (X-axis length (x1, x2, x3, x4...), Y-axis length (y1). , Y2, y3, y4...), Lead type (r1, r2, r3, r4...)) And the like. The component types and dimensions are associated with each other, for example, a-x1-y1-r1. The part data 23 is common to all board types.

  The BOM data 22 is data related to the BOM set for each board type. The BOM data 22 includes a plurality of BOM1, BOM2,. BOM1 includes circuit symbols (Ref1, Ref2, Ref3...) And electronic component types (a, b, c...). The circuit symbol and the component type are associated with each other, for example, Ref1-a. Similarly, BOM2... Other than BOM1 are associated with circuit symbols and component types.

  Here, the correspondence between circuit symbols and component types may differ between different BOMs. For example, in BOM1, the circuit symbol Ref3 corresponds to the component type c. On the other hand, in BOM2, the circuit symbol Ref3 corresponds to the component type d. This means that an electronic component named component type c is mounted when BOM1 is used, and an electronic component named component type d is mounted when BOM2 is used, with respect to the mounting coordinates X3-Y3-θ3 corresponding to the circuit symbol Ref3. Means that.

  The board type correspondence data 24 is data relating to the association between the board type and the BOM. The board type correspondence data 24 includes board types (Key1, Key2,...) And BOMs (BOM1, BOM2,...). The substrate type and the BOM are associated with each other, for example, Key1-BOM1.

  The mounting order information is data relating to the operation order of the electronic component mounting machine. The device configuration information is data relating to the configuration of the electronic component mounting machine (for example, a suction nozzle to be used). The mounting order information and the device configuration information are common to all board types.

<Board production management method>
Next, a substrate production management method using the substrate production management system of this embodiment will be described. The board production management method is executed before board production. The board production management method includes a sequence data generation step, a board type input step, a BOM selection step, a mounting coordinate recognition step, a component spec recognition step, and a notification step.

[Sequence data generation step]
In this step, the management apparatus 2 generates the sequence data 21 based on the CAD data 90 of the CAD system 9. That is, the CAD system 9 stores CAD data 90 regarding the component type and mounting coordinates of the electronic component. Based on the CAD data 90, the management apparatus 2 automatically generates sequence data 21 relating to all electronic components used in the family board group.

[Substrate type input step]
In this step, the substrate type (for example, Key1) of the substrate to be produced is input to the management apparatus 2. Specifically, first, an image pickup device (not shown) of the electronic component mounting machine 3 arranged at the upstream end of the production line reads an ID (identification) mark displayed on a board to be produced, thereby obtaining a board type. Key 1 is input to the electronic component mounting machine 3. Next, the electronic component mounting machine 3 transmits the board type Key1 to the management device 2. In this way, the substrate type Key1 is automatically input to the management device 2.

[BOM selection step]
In this step, the management apparatus 2 selects BOM 1 using the board type correspondence data 24 of the job data 20. That is, in the board type correspondence data 24, the board type (Key1, Key2...) And the BOM (BOM1, BOM2...) Are associated with each other. The management device 2 uses the board type correspondence data 24 to select the BOM 1 corresponding to the board type Key1 input in the board type input step.

[Mounting coordinate recognition step]
In this step, the management device 2 recognizes the mounting coordinates using the sequence data 21 generated in the sequence data generation step. That is, in the sequence data 21, the mounting coordinates (X-axis coordinates (X1, X2, X3...), Y-axis coordinates (Y1, Y2, Y3...), Θ-axis coordinates (θ1, θ2,. θ3...)) and circuit symbols (Ref1, Ref2, Ref3...) are associated with each other. The management device 2 recognizes the mounting coordinates of the electronic component corresponding to the BOM 1 selected in the BOM selection step, that is, the board type Key1, using the sequence data 21.

[Parts specification recognition step]
In this step, using the part data 23 of the job data 20, the management device 2 recognizes the specifications (shape, size, lead format (number of leads, lead arrangement, etc.), etc.) of the electronic component. That is, in the part data 23, the component type (a, b, c, d...) Of the electronic component, the dimensions of the electronic component (X axis length (x1, x2, x3, x4...), Y axis. The length (y1, y2, y3, y4...), The lead type (r1, r2, r3, r4...), Etc. are associated with each other. Using the part data 23, the management device 2 recognizes the component specifications of the electronic component corresponding to the BOM 1 selected in the BOM selection step, that is, the board type Key1.

[Notification step]
Through the steps so far, the management device 2 has acquired data relating to the mounting coordinates and component specifications of all the electronic components mounted on the substrate of the substrate type Key1. In this step, first, the management device 2 determines the mounting order of all electronic components. That is, “which electronic component is to be mounted on the substrate using which electronic component mounting machine 3” is determined. Next, the management device 2 transmits distribution data to each electronic component mounting machine 3 based on the determination. When the production of the substrate of the substrate type Key1 is started, each electronic component mounting machine 3 mounts electronic components on the substrate in stages according to the distribution data.

  Thereafter, when the substrate to be produced is switched from the substrate type Key1 to the substrate type Key2 by the setup change, the above steps are executed again. However, the sequence data generation step is not executed. The sequence data 21 generated in the first sequence data generation step is used as it is. In this way, the BOM is automatically switched according to the switching of the substrate.

  Here, when the board type Key1 and the board type Key2 are compared, that is, when BOM1 and BOM2 are compared, the component type (for example, the component type a, Ref2) other than the circuit symbol Ref3 (for example, the circuit type Ref1, Ref2). All of b) are common. On the other hand, the component types corresponding to the circuit symbol Ref3 are different. This means that the same electronic component is mounted on the mounting coordinates other than the mounting coordinates corresponding to the circuit symbol Ref3 even if the board to be produced is switched. Further, it means that different electronic components are mounted on the mounting coordinates corresponding to the circuit symbol Ref3.

  That is, since BOM1 is used in the case of the substrate type Key1, the mounting coordinates corresponding to the circuit symbol Ref3 (X-axis coordinates, Y-axis coordinates, θ-axis coordinates) = (X3, Y3, Z3) Electronic component of component type c (X-axis length, Y-axis length, lead type) = (x3, y3, r3). On the other hand, since BOM2 is used in the case of the substrate type Key2, the mounting coordinates (X-axis coordinates, Y-axis coordinates, θ-axis coordinates) corresponding to the circuit symbol Ref3 = (X3, Y3, Z3) Electronic component of component type d (X-axis length, Y-axis length, lead type) = (x4, y4, r4).

  As described above, even when the same electronic component is mounted at most mounting coordinates and different electronic components are mounted at some mounting coordinates in accordance with the switching of the substrates, the board types Key1, Key2,. By simply entering, substrate production can be managed easily and accurately.

<Effect>
Next, the effect of the substrate production management system of this embodiment will be described. According to the substrate production management system 1 of the present embodiment, the sequence data 21 and the substrate type correspondence data 24 are shared by all the substrates belonging to the family substrate group. Therefore, at the time of data creation, it is not necessary to create a plurality of sequence data 21 and board type correspondence data 24 according to the number of board types Key1, Key2,. This makes it easy to create and modify data. Further, at the time of data management, it is not necessary to manage the sequence data 21 and the board type corresponding data 24 for each board type Key1, Key2,. For this reason, data management is easy.

  Further, according to the substrate production management system 1 of the present embodiment, the sequence data 21 and the substrate type correspondence data 24 are shared by all the substrates belonging to the family substrate group, and the substrate type can be changed only by the BOM. It is easy to trace the production status of any board after production. That is, it is easy to acquire traceability information.

  Further, according to the board production management system 1 of the present embodiment, it is possible to simply produce by simply reading the board ID mark with the imaging device of the electronic component mounting machine 3, that is, inputting the board types Key1, Key2,. The target substrate can be switched. In addition, electronic components are automatically notified to a plurality of electronic component mounting machines 3 only by inputting the board types Key1, Key2,. In addition, the electronic components are automatically distributed to the plurality of electronic component mounting machines 3 only by inputting the board types Key1, Key2,. For this reason, transmission errors from the management apparatus 2 to the plurality of electronic component mounting machines 3 are reduced. Further, when obtaining traceability information after the production of a substrate, it is possible to easily reach desired traceability information based on the inputted information of the substrate types Key1, Key2,.

  Further, according to the board production management system 1 of the present embodiment, it is possible to automatically recognize the specs of the electronic parts belonging to BOM1, BOM2,... Simply by inputting the board types Key1, Key2,. . For this reason, the specification can be reflected in the mounting order and mounting coordinates of the electronic components in the electronic component mounting machine 3. Further, according to the substrate production management system 1 of the present embodiment, the sequence data 21 can be automatically generated from the CAD data 90.

<Others>
The embodiment of the substrate production management system of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  In the board type input step of the board production management method using the board production management system 1 of the above embodiment, the board type Key1, Key2,... Was entered. However, the operator may manually input the substrate types Key1, Key2,. Further, the input destination of the board types Key1, Key2,... May be the electronic component mounting machine 3 or the management apparatus 2. As the ID mark for input, for example, a character, a figure, a symbol, a special pattern shape, a bar code, a two-dimensional code such as a QR code (registered trademark), or the like may be used. Good.

  Further, as an imaging device for inputting the substrate types Key1, Key2,..., A CCD (Charge-Coupled Device) camera, a CMOS (Complementary Metal-Oxide Semiconductor) camera, an infrared camera, or the like may be used.

  Further, the sequence data 21 may not be automatically generated from the CAD data 90. An operator may input manually. Further, the part data 23, the mounting order information, and the apparatus configuration information may not exist independently in the job data 20. The part data 23, the mounting order information, and the device configuration information may be combined with other data (for example, sequence data 21). Further, the part data 23, the mounting order information, and the device configuration information may exist outside the job data 20.

  Further, in the case of the board production management method using the board production management system 1 of the above embodiment, when using BOM1 with respect to the mounting coordinates X3-Y3-θ3 corresponding to the circuit symbol Ref3, there is an electronic component of the part type c. When BOM2 is used, electronic components of the component type d are respectively mounted. However, depending on the BOM, there may be no electronic component mounted on the mounting coordinates X3-Y3-θ3.

  In the notification step of the substrate production management method using the substrate production management system 1 of the above embodiment, the distribution data may be optimized as appropriate in consideration of the specifications of the electronic components. In this way, for example, the production speed of the substrate can be improved. Alternatively, power consumption required for production can be reduced.

  In addition, the electronic component distribution in the notification step (which electronic component is mounted on the substrate using which electronic component mounting machine 3) may be executed before the substrate type input step. That is, the distribution may be determined in advance, and after the board type is input, the electronic component mounting machines 3 may be notified according to the already determined distribution.

  The use of the family substrate group produced using the substrate production management system 1 of the above embodiment is not particularly limited. For example, it can be used for destinations, prototypes, and small quantities of many products. When the substrate production management system 1 is used for prototypes, it is easy to acquire traceability information after trial production, and therefore data collection is easy. Further, the job data 20 (partially or entirely) used at the time of prototyping may be introduced into an actual production line via a recording medium.

  1: Board production management system, 2: Management device, 3: Electronic component mounting machine, 9: CAD system, 20: Job data, 21: Sequence data, 22: BOM data, 23: Part data, 24: Board type data , 90: CAD data.

Claims (2)

A board production management system comprising: an electronic component mounting machine that mounts electronic components at mounting coordinates of a board; and a management device that distributes the electronic components to be mounted on the electronic component mounting machine,
The substrate belongs to a family substrate group consisting of a plurality of the substrates,
The management device
Coordinate data that is shared by all the boards belonging to the family board group, and that the mounting coordinates and the coordinate identifier are associated with,
A BOM that is individually used for all the boards belonging to the family board group and is associated with the coordinate identifier and the component type that is the type of the electronic part is assigned to the BOM of the board belonging to the family board group. BOM data that has the number,
A board that is shared by all the boards that belong to the family board group and that is associated with the BOM and the board type that is the type of the board on which the electronic component related to the part type of the BOM is mounted Species correspondence data,
Have
The management apparatus inputs a board type to be produced, and selects a BOM corresponding to the board type from the BOM data based on the board type correspondence data; and A mounting coordinate recognition step for recognizing the mounting coordinates from the coordinate data based on the coordinate identifier, and a notification step for notifying the electronic component mounting machine of the electronic component to be mounted are performed. Board production management system. Furthermore, the management device is shared by all the boards belonging to the family board group, and has part data in which the component type and the specifications of the electronic component are associated with each other.
The management apparatus executes a component specification recognition step of recognizing the specification of the electronic component from the part data based on the component type of the BOM after the BOM selection step and before the notification step. The substrate production management system according to claim 1.

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