JP4056121B2 - Component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting how to implement parts of the electronic components on the substrate.
[0002]
[Prior art]
The mounting data in the conventional electronic component mounting apparatus is shown in FIGS. 8A and 8B when mounting two types of substrates A and B as shown in FIGS. 7A and 7B, for example. Thus, the mounting data for the board A and the board B are used separately. In each mounting data, the mounting position / type / angle of the electronic component to be mounted is described.
[0003]
In this electronic component mounting apparatus, when the type of board to be produced is changed, it is necessary to switch the mounting data for each board to be mounted. An operation procedure when the substrate to be produced is switched from the substrate A to the substrate B will be described with reference to the flowchart of FIG.
[0004]
First, in step # 11, mounting data for production of board A and board B is created. In step # 12, the mounting data for producing the board A is transferred to the mounting apparatus. Until the production of the board A is completed, production is performed using the mounting data (steps # 13 and # 14). When the production of the substrate A is completed, the mounting apparatus is temporarily stopped in step # 15. In step # 16, mounting data for producing the substrate B is transferred to the mounting apparatus, and in step # 17, the substrate B is produced. Thus, when there are a plurality of types of boards to be produced, it is necessary to switch between a plurality of mounting data and the plurality of mounting data.
[0005]
As a method of using one mounting data for production of a plurality of substrates, a method using a parameter called a skip block is already known. FIG. 10 shows an example of mounting data when the types of boards to be mounted are switched using a skip block when the two types of boards A and B shown in FIG. 7 are mounted. “0” of the skip block is a block that is always mounted without skipping. When “2” is designated as the skip block, the block No. If blocks 1, 2, 3, and 5 are mounted and “1” is designated as the skip block, the block No. 1, 2, 4, 6 blocks are implemented. An operation procedure when the board to be produced using the mounting data is switched from the board A to the board B will be described with reference to the flowchart of FIG.
[0006]
First, in step # 21, mounting data (see FIG. 10) for producing the substrates A and B is created. In step # 22, it is specified to skip a mounting block that is unnecessary for the production of the board A. In this case, the skip block is “2”. In step # 23, the mounting data is transferred to the mounting apparatus. Production is performed until production of the substrate A is completed (steps # 24 and # 25). When the production of the board A is completed, the mounting apparatus is temporarily stopped in step # 26. After that, in step # 27, it is specified that a mounting block unnecessary for the production of the board B is skipped. In this case, the skip block is set to “1”. In step # 28, the mounting data is transferred to the mounting apparatus, and the substrate B is produced in step # 29. In this way, when a board to be produced covers a plurality of types, the method of switching the production board using the skip block requires only one mounting data, but when switching the board to be produced, the skip block is designated again. Switching work is required.
[0007]
[Problems to be solved by the invention]
As described above, conventionally, when there are a plurality of types of boards to be produced, it is necessary to switch the mounting data in accordance with the production boards. When switching the mounting data, it is necessary to temporarily stop the production after the production of the previous production board is finished, and then perform the steps of manually switching the mounting data and starting the production. Since these operations involve manual operation, there has been a problem that time loss occurs due to an operation error or stoppage of the mounting apparatus for switching.
[0008]
The present invention is the light of the conventional problems, and its object is to provide a component mounting how that can be switched production substrate not stop without intervening manually and the mounting device.
[0009]
[Means for Solving the Problems]
In the component mounting method of the present invention, in addition to the mounting position, angle, name, etc. of the component to be mounted for each mounting operation unit, which is an operation of mounting a component at a certain angle on a certain board. This is a component mounting method that uses mounting data that describes parameters to determine the board to be mounted, and sequentially executes the mounting operation units corresponding to the mounting target board, and is added when new board mounting data is added. For each mounting operation unit of mounting data, mounting data is created by placing the same mounting position or name of components in the existing mounting data as before and after it, and mounting on multiple types of boards is done manually This can be done without switching operation or stopping the mounting device.
[0010]
Also, it is possible to automatically switching is possible yet made less movement loss of movement loss or electronic component feeding position of the substrate, efficiently implement.
[0011]
Further, the step of recognizing any of the features on the substrate, the mounting data that is describing a parameter for determining a substrate for mounting in addition to the mounting position and angle, names of parts that implements, in the recognizing step From the recognition result, the mounting block is determined by recognizing the board when the mounting operation unit is determined to be executed and the mounting operation unit determined to be executed is executed. The production substrate can be switched without manual intervention and without stopping.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 4 and FIG. 7.
[0014]
The configuration of the electronic component mounting apparatus according to this embodiment will be described with reference to FIGS. FIG. 1 is an overall configuration diagram of an electronic component mounting apparatus, and FIG. 2 is a configuration diagram of its control unit. In FIG. 1, reference numeral 1 denotes a recognition means comprising a CCD camera or the like for recognizing an arbitrary feature on the substrate 2 in order to recognize the type of the substrate 2. The recognizing means 1 may be anything as long as it can discriminate a substrate to be produced by recognizing a mark on the substrate showing a feature for each substrate type, a bar code written on the substrate, or the like. 3 is a board carry-in section, 4 is a board carry-out section, 5 is a mounting head for mounting electronic components on the board 2, 6 is an XY table for positioning the board 2 at the mounting position, and 7 is a component supply section.
[0015]
The substrate 2 is carried in by the substrate carry-in unit 3, and after the features of the substrate 2 are recognized by the recognition means 1, the substrate 2 is fixed on the XY table 6, positioned at a predetermined position by the XY table 6, and mounted on the mounting head 5. The electronic component supplied from the component supply unit 7 is mounted on the substrate 2.
[0016]
A control unit 8 controls the operations of the recognition unit 1, the substrate carry-in unit 3, the XY table 6, the mounting head 5, and the substrate carry-out unit 4. The detailed configuration is shown in FIG.
[0017]
In FIG. 2, reference numeral 1 denotes a recognition unit for recognizing an arbitrary feature on the substrate 2, 8 denotes a control unit, and 14 denotes a mounting unit including a mounting head 5 and an XY table 6. In the control unit 8, reference numeral 9 denotes a production substrate determination unit that determines a substrate to be produced from the recognition result of the recognition unit 1, and the feature recognized by the recognition unit 1 and each substrate type stored in the production substrate feature storage unit 24. The board type to be produced is determined by comparing with the characteristics and stored in the board storage means 10. Reference numeral 11 denotes mounting data storage means for storing mounting data describing parameters for determining a board to be mounted in addition to mounting positions, angles, names, and the like of electronic components to be mounted at each mounting position on the board 2. FIG. 3 shows an example of mounting data when the substrates A and B shown in FIGS. 7A and 7B described in the conventional example are selectively mounted.
[0018]
In the mounting data of FIG. 3, necessary information is written for each row for each mounting operation unit (referred to as a mounting block) for mounting each electronic component, and the mounting operation is sequentially executed from the first row (first mounting block). The Therefore, a serial number (block No.) from the first mounting block is assigned. Information necessary for the mounting operation such as a mounting position, a mounting component name, a mounting angle, a mounting board, and a comment as necessary is described in the data of each mounting block. The mounting position is an XY coordinate value for mounting a component on the substrate, the mounting angle is the angle of the electronic component to be mounted, and the mounting substrate is a substrate for executing the mounting block.
[0019]
Reference numeral 12 denotes whether or not each mounting block in the mounting data is to be mounted based on the recognition result of the board type determined by the production board determining means 9 and stored in the production board storage means 10 and the mounting data in the mounting data storage means 11. This is a means for determining the mounting of each mounting block to be determined. Reference numeral 13 denotes mounting instruction means for instructing the mounting means 14 to execute the mounting block determined to be mounted by the mounting right determining means 12. The mounting means 14 positions by the XY table 6 so that the mounting head 5 mounts the electronic component at the mounting position on the substrate 2 indicated by the mounting block of the mounting data, and the mounting head 5 mounts the electronic component.
[0020]
A case where the electronic component mounting apparatus configured as described above is mounted by switching from the board A to the board B shown in FIGS. 7A and 7B will be described with reference to the flowchart of FIG.
[0021]
First, in step # 1, mounting data used for mounting the board A and the board B is created. The mounting data is as shown in FIG. 3, and only one mounting data is required for mounting the board A and the board B. In step # 2, this mounting data is transferred to the mounting apparatus, and production is started. In step # 3, the substrate is transferred to the mounting apparatus, and the recognition means 1 recognizes the characteristics of the substrate to determine the substrate to be produced. For example, the recognition unit 1 recognizes the substrate mark, barcode or substrate appearance on the substrate 2 and the production substrate determination unit 9 registers the substrate mark or bar registered in advance in the production substrate feature storage unit 24 for each type of production substrate. The matched production substrate is determined as a substrate to be produced by collating with the code and the substrate appearance pattern, and stored in the production substrate storage means 10.
[0022]
After that, the mounting operation is performed. In step # 4, the mounting block No. Is set to “1”. For each mounting block, the mounting right determination means 12 compares the mounting board described in the mounting data with the board determined by the production board determination means 9 and stored in the production board storage means 10. Decide whether to implement the mounting block. If it is to be mounted, a command is output from the mounting command means 13 in step # 6, and the mounting means 14 performs the mounting operation. Otherwise, the process proceeds to step # 7 without performing the mounting operation.
[0023]
In the mounting data of FIG. 3, when the board stored in the production board storage means 10 is A, the block No. In 1, 2, 3, and 5, mounting is performed because A is written on the mounting substrate. 4 and 6 are not mounted because A is not written on the mounting board. On the other hand, when the substrate stored in the production substrate storage means 10 is B, the block No. In 1, 2, 4, and 6, mounting is performed because B is written on the mounting board. 3 and 5 are not mounted because B is not written on the mounting substrate.
[0024]
Next, in step # 7, the mounting block No. Add "1" to In step # 8, it is determined whether the mounting block is finished. If the mounting block is not finished, the process returns to step # 5 and the above-described mounting operation is repeated until the mounting block is finished. When the mounting block is finished in step # 8 and mounting on the current board is finished, in step # 9, it is determined whether or not production is finished. If not finished, the process returns to step # 3 to return to the next board. And repeat the above mounting operation until the end of production. In this way, only one mounting data is required for the two boards A and B, and the trouble of switching the mounting data for switching the board type to be mounted can be eliminated.
[0025]
In the description of the above embodiment, the example in which the mounting data for selectively mounting the substrates A and B as shown in FIG. 3 is shown. Next, the substrate having the mounting data as shown in FIG. A case will be described in which the mounting data in FIG. 3 is corrected so that C (not shown) can be selectively mounted.
[0026]
In correcting the mounting data, for each mounting operation unit in the mounting data of the board C, any mounting block, mounting position, mounting component, and mounting angle in the mounting data in FIG. The substrate C may be added to the item. On the other hand, if at least one of the mounting position, the mounting component, and the mounting angle is different, a mounting block needs to be added. In that case, it may be possible to simply add it after the mounting block of FIG. 3, but if this is done, the movement of the board and the component supply position will vary and the movement loss will increase, so that it should be inserted between appropriate mounting blocks. It is desirable to make it.
[0027]
In the first example, as shown in FIG. 5B, for each mounting operation unit in the mounting data of the substrate C, at least one of the mounting position, the mounting component, and the mounting angle is the same mounting position. The mounting block having the same mounting position as the mounting block in the mounting data in FIG. 3 is inserted immediately after that. In FIG. 5B, block No. A block with a circle is the same block as in FIG. 3, and a block without a circle is a newly added mounting block. Block No. 3 is a block number. Since it is the same mounting position as (2), block No. 5 is a block number. Since it is the same mounting position as (4), it is inserted immediately after each. In addition, the mounting block No. whose mounting position was not included in the mounting data of FIG. 9 is inserted last.
[0028]
In this example, since the mounting order is set with priority on the mounting position, the loss of movement of the substrate can be reduced and the mounting efficiency can be improved.
[0029]
In the second example, as shown in FIG. 5 (c), for each mounting operation unit in the mounting data of the substrate C, the mounting component is the same for at least one of the mounting position, the mounting component, and the mounting angle. The mounting block having the same mounting component as the mounting block in the mounting data in FIG. 3 is inserted immediately after that. In FIG. 5C, block No. 2 is a block number. Since it is the same mounting component A as (1), the block No. 6 and 7 are block numbers. Since it is the same mounting component C as (5), it is inserted immediately after each.
[0030]
In this example, since the mounting order is set with priority on the mounting components, loss of movement of the electronic components to the supply position can be reduced and mounting efficiency can be improved.
[0031]
Further, although detailed explanation is omitted, it is preferable to set the mounting order so as to maximize the mounting efficiency comprehensively considering the mounting position and the degree of improvement of the mounting efficiency due to the priority of the electronic components. .
[0032]
FIG. 6 shows a configuration of the control unit 8 that can create mounting data in which a new production board is added in this way. Only the difference from FIG. 2 will be described. New board mounting data input means 15 for inputting mounting data of a new board to the control section 8 is provided. The control section 8 includes a mounting data comparison means 16 and a new block. Additional means 17 is provided. The mounting data comparison unit 16 compares the mounting data of the new board with the mounting data stored in the mounting data storage unit 11, and transfers the mismatched mounting data to the new block adding unit 17. Then, the new block adding unit 17 creates a new mounting block by the algorithm as described above and stores it in the mounting data storage unit 11.
[0033]
In the above embodiment, the example in which the recognition unit recognizes the type of the substrate at the time of carrying the substrate is shown. However, data related to the type of the substrate is input from the host control unit or various preceding devices to the control unit of the mounting device. You may be made to do.
[0034]
Moreover, although the example of the case where the production substrate is A and B types and the case where C is added thereto has been described, it goes without saying that any number of production substrates may exist.
[0035]
【The invention's effect】
According to the component mounting method of the present invention, as is apparent from the above description, each implementation operation unit, describes a parameter for determining the substrate for mounting in addition to the mounting position and angle, names and the like of the components to be mounted Since the mounting operation unit corresponding to the mounting target board is sequentially executed using the mounting data, mounting on a plurality of types of boards can be performed without manual switching operation or stopping of the mounting apparatus.
[0036]
In recent years, the circuit pattern of the production board in the mounting process has also been standardized, and there are cases in which mounting data does not change by only changing some mounted components, or mounting data can be shared almost only by the difference of not executing the mounting block. In many respects, the effect of the present invention is extremely high.
[0037]
Furthermore, there are many cases of sudden interruption production in the above-mentioned high-mix low-volume production sites. For example, there is a case where one board B is produced in the middle of production of the board A. In addition, since the production substrate can cope with a case such as A-B-A-C-B-D-A very easily, the effect of the present invention is great.
[0038]
Also, when mounting data for a new board is added, mounting data is created in which the same mounting position or name in the existing mounting data is placed before and after each mounting operation unit of the added mounting data. Therefore , automatic switching can be performed, and the movement loss of the substrate or the movement loss of the electronic component supply position can be reduced, so that the mounting can be efficiently performed.
[Brief description of the drawings]
FIG. 1 is an external perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a block diagram illustrating a configuration of a control unit of the electronic component mounting apparatus according to the embodiment;
FIG. 3 is an explanatory diagram of a configuration example of mounting data in the embodiment.
FIG. 4 is a flowchart of the mounting operation in the embodiment.
FIG. 5 is an explanatory diagram of a method for creating mounting data to which mounting data for a new board is added.
FIG. 6 is a block diagram illustrating a configuration of a control unit of an electronic component mounting apparatus to which new board mounting data can be added.
FIG. 7 is a plan view of two types of substrates as examples of production substrates.
FIG. 8 is an explanatory diagram of a configuration example of mounting data when the board of FIG. 5 is produced in the first conventional example.
FIG. 9 is a flowchart of the mounting operation in the first conventional example.
FIG. 10 is an explanatory diagram of a configuration example of mounting data when the board of FIG. 7 is produced in the second conventional example.
FIG. 11 is a flowchart of the mounting operation in the second conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Recognition means 9 Production board determination means 11 Mounting data storage means 12 Mounting right determination means 14 Mounting means

Claims (2)

In addition to the mounting position, angle, name, etc. of the component to be mounted, for each mounting operation unit , which is an operation of mounting a certain component at a certain angle on a certain board, a parameter that determines the board to be mounted using the mounting data that is written, the mounting operation unit corresponding to the mounting object board a part products implemented way to sequential execution,
When mounting data for a new board is added, for each mounting operation unit of the added mounting data, mounting data is created in which the same mounting position or name of the component in the existing mounting data is placed before and after that. A component mounting method characterized by the above. And optional recognize features step on the substrate, the mounting data that is describing a parameter for determining a substrate for mounting in addition to the mounting position and angle, names, etc. implementation parts, recognition in the recognizing step the results and the step of determining whether to perform the mounting operation unit, the component mounting method according to claim 1 Symbol mounting, characterized in that it comprises a step of performing the mounting operation unit which is determined to be executed.

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