KR100402965B1 - Method for optimally arranging feeder in surface mounting equipment - Google Patents

Method for optimally arranging feeder in surface mounting equipment Download PDF

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KR100402965B1
KR100402965B1 KR1019970035201A KR19970035201A KR100402965B1 KR 100402965 B1 KR100402965 B1 KR 100402965B1 KR 1019970035201 A KR1019970035201 A KR 1019970035201A KR 19970035201 A KR19970035201 A KR 19970035201A KR 100402965 B1 KR100402965 B1 KR 100402965B1
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South Korea
Prior art keywords
feeder
nozzle
placement
surface mounter
anc
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KR1019970035201A
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Korean (ko)
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KR19990011942A (en
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박태형
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삼성테크윈 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Abstract

PURPOSE: A method for optimally arranging a feeder in a surface mounting equipment is provided to reduce time taken for program by setting optimal arrangement data of a feeder and a nozzle during execution of a feeder optimization program and referencing the optimal arrangement data. CONSTITUTION: A printed circuit board is selected(11). A feeder and a nozzle are firstly arranged(12). Quantities of an ANC(Auto Numerical Control), a nozzle, and a tape feeder are limited(13). A feeder optimization program is executed(14). An optimized arrangement result from the execution of the feeder optimization program is stored(15). In order to create a step program according the optimized arrangement, a subsequent feeder optimization program is executed(16).

Description

표면실장기에서의 피더배치 최적화방법Feeder Placement Optimization Method in Surface Mounter

본 발명은 표면실장기(surface mounting equipment)에서의 피더(feeder)배치 최적화방법에 관한 것으로서, 더 상세히는 표면실장기에 의한 PCB(printed circuit board)에의 부품실장에 있어서, 실장시간에 영향을 미치는 피더와 노즐(nozzle)의 배치를 자동으로 최적화시킬 수 있는 표면실장기에서의 피더배치 최적화방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of optimizing feeder placement in surface mounting equipment, and more particularly, to a feeder that affects mounting time in component mounting on a printed circuit board (PCB) by surface mounter. And a method of optimizing feeder placement in a surface mounter that can automatically optimize the placement of nozzles and nozzles.

일반적으로, 산업현장에서 PCB 상에 각종 전자부품 및 회로소자들을 조립하는 공정단계에는 특수한 용도 및 구조로 제작된 자동화설비가 사용된다. 이러한 자동화설비에는 표면실장기나 이형부품삽입기 등이 있으며, 표면실장기의 일 예로 칩마운터를 들 수 있다. 칩 마운터는 통상 X,Y축 방향으로 각각 직선 이동이 가능한 가동부를 구비하고 있으며, 각 가동부는 각각의 구동모터에 의해 구동되도록 되어 있다.In general, in the process of assembling various electronic components and circuit elements on the PCB in the industrial field, automated equipment manufactured for a special use and structure is used. Such automated equipment includes a surface mounter or a release part inserter, and an example of the surface mounter may be a chip mounter. The chip mounter is usually provided with movable parts which can be linearly moved in the X and Y axis directions, and the movable parts are driven by respective drive motors.

한편, 이와 같은 표면실장기를 이용한 PCB 조립작업에 있어서, 작업 소요 시간은 사용자가 부품 피더를 어떻게 배치하느냐에 따라 크게 달라질 수 있다. 특히, 부품을 실제로 PCB에 실장하는 헤드(노즐)의 개수 및 부품의 종류가 많은 경우, 사용자는 최적의 피더 배치를 위해 많은 시행착오와 노력을 투여하게 된다.On the other hand, in the PCB assembly work using such a surface mounter, the time required for operation may vary greatly depending on how the user places the part feeder. In particular, when there are a large number of heads (nozzles) and types of parts that actually mount the parts on the PCB, the user may put a lot of trial and error and effort for optimal feeder placement.

본 발명은 상기와 같은 문제점을 감안하여 창출된 것으로서, 피더 및 노즐의 배치를 자동으로 최적화시킬 수 있는 표면실장기에서의 피더배치 최적화방법을 제공함에 그 목적이 있다.The present invention has been made in view of the above problems, and an object thereof is to provide a method for optimizing feeder placement in a surface mounter that can automatically optimize the placement of feeders and nozzles.

도 1은 본 발명에 따른 표면실장기에서의 피더배치 최적화방법의 실행과정을 나타내 보인 플로우 챠트.1 is a flow chart showing the execution process of the feeder batch optimization method in the surface mounter according to the present invention.

상기의 목적을 달성하기 위하여 본 발명에 따른 표면실장기에서의 피더배치 최적화방법은, 표면실장기를 이용한 PCB 조립에 있어서의 피더의 배치를 최적화시키기 위한 방법에 있어서, PCB를 선택하는 단계; 피더 및 노즐을 우선 배치하는 단계; ANC, 노즐 및 테이프 피더의 수량을 제한하는 단계; 피더 최적화 프로그램을 실행하는 단계; 상기 피더 최적화 프로그램의 실행에 따른 최적화된 배치결과를 저장하는 단계; 및 상기 최적화된 배치결과에 의한 스탭 프로그램 생성을 위하여 후속 피더 최적화 프로그램을 실행하는 단계를 포함하는 점에 그 특징이 있다.In order to achieve the above object, the feeder arrangement optimization method in the surface mounter according to the present invention comprises the steps of: selecting a PCB in the method for optimizing the placement of the feeder in the PCB assembly using the surface mounter; First placing the feeder and the nozzle; Limiting the quantity of ANCs, nozzles and tape feeders; Executing a feeder optimizer; Storing the optimized placement result according to the execution of the feeder optimization program; And executing a subsequent feeder optimization program to generate a staff program based on the optimized placement result.

이와 같은 본 발명의 방법에 의하면, 표면실장기의 프로그래밍에 소요되는 시간 및 표면실장기의 장착시간을 단축시킬 수 있는 장점이 있다.According to the method of the present invention as described above, the time required for programming the surface mounter and the mounting time of the surface mounter can be shortened.

이하 첨부된 도면을 참조하면서 본 발명의 실시예를 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 따른 표면실장기에서의 피더배치 최적화방법의 실행과정을 나타내 보인 플로우 챠트이다.1 is a flow chart showing the execution process of the feeder batch optimization method in the surface mounter according to the present invention.

도 1을 참조하면, 본 발명에 따른 표면실장기에서의 피더배치 최적화방법은 먼저 PCB를 선택하게 된다(단계 11). 즉, 작업하려고 하는 PCB 파일 및 장착점 데이터를 선택하고 읽어 들인다. 그런 후, 피더 및 노즐을 우선적으로 배치한다(단계 12). 이때, 피더 배치에 의해 피더열의 선 배치상태를 점검 및 편집하고, 노즐 배치에 의해 피더열에 배치된 ANC 각 홀(hole)의 노즐 선 배치상태를 점검 및 편집하게 된다. 그런 다음, ANC, 노즐 및 테이프 피더의 수량을 제한한다(단계 13). 이때, ANC 제한에 의해 사용가능한 ANC(MMI의 시스템 세팅에서 설정된 ANC)의 상태를 점검 및 사용유무를 편집하고, 노즐 제한에 의해 사용가능한 노즐의 상태를 점검 및 사용유무를 편집하며, 테이프 피더 제한에 의해 부품별 테이프 피더의 최대 사용 수량이 제한된다. 이와 같이 하여 ANC, 노즐 및 테이프 피더의 제한이 완료되면, 피더 최적화 프로그램을 실행시킨다(단계 14). 이때, 실행시간은 부품의 종류나 수량에 따라 달라지며, 보통 20초~1분 정도가 소요된다. 이와 같은 피더 최적화 프로그램의 실행에 따른 최적화 결과(피더배치 및 노즐배치)는 컴퓨터 모니터(미도시)상에 표시되는데, 최적화 이전에 미리 배치된 피더와 노즐 및 최적화에 의해 배치된 피더와 노즐열의 상태가 표시된다. 이렇게 하여 피더 및 노즐배치의 최적화가 이루어지면, 최적화된 배치결과를 PCB 파일의 피더배치부와 노즐배치부에 각각 저장한다(단계 15). 그리고, 그 최적화된 배치결과에 의한 스텝 프로그램 생성을 위하여 후속 피더 최적화 프로그램을 실행한다(단계 16). 이로써 본 발명에 따른 표면실장기에서의 피더배치 최적화가 완료된다.Referring to FIG. 1, the method of optimizing feeder placement in the surface mounter according to the present invention first selects the PCB (step 11). That is, select and read the PCB file and the mounting point data you want to work with. Then, the feeder and the nozzle are placed first (step 12). At this time, the line arrangement of the feeder rows is checked and edited by the feeder arrangement, and the nozzle line arrangement state of each hole of the ANC holes arranged in the feeder rows is checked and edited by the nozzle arrangement. Then, the quantity of ANC, nozzle and tape feeder is limited (step 13). At this time, check and edit the status of ANC (ANC set in MMI system setting) available by ANC restriction, check and use status of nozzle available by nozzle restriction, and edit tape feeder. This limits the maximum number of parts used per part tape feeder. In this way, when the limitations of the ANC, the nozzle and the tape feeder are completed, the feeder optimization program is executed (step 14). At this time, the execution time depends on the type or quantity of parts, and usually takes about 20 seconds to 1 minute. The optimization results (feeder arrangement and nozzle arrangement) according to the execution of such a feeder optimizer are displayed on a computer monitor (not shown). Is displayed. When the feeder and nozzle arrangement are optimized in this way, the optimized placement results are stored in the feeder placement section and the nozzle placement section of the PCB file, respectively (step 15). Subsequently, a subsequent feeder optimization program is executed to generate a step program based on the optimized arrangement result (step 16). This completes the feeder placement optimization in the surface mounter according to the present invention.

이상의 설명에서와 같이 본 발명에 따른 표면실장기에서의 피더배치 최적화 방법은 피더 최적화 프로그램의 실행에 의해 피더와 노즐의 최적배치 데이터를 설정하고, 그 결과를 피더 및 노즐의 배치에 반영하므로, 표면실장기의 프로그래밍에 소요되는 시간 및 표면실장기에서의 부품의 장착시간을 단축시킬 수 있는 장점이 있다.As described above, the feeder placement optimization method in the surface mounter according to the present invention sets the optimum placement data of the feeder and the nozzle by executing the feeder optimization program, and reflects the result in the placement of the feeder and the nozzle. The time required for programming the mounter and the mounting time of components in the surface mounter can be shortened.

Claims (3)

표면실장기를 이용한 PCB 조립에 있어서의 피더의 배치를 최적화시키기 위환 방법에 있어서,In the replacement method for optimizing the placement of the feeder in PCB assembly using a surface mounter, a) PCB를 선택하는 단계;a) selecting a PCB; b) 피더 및 노즐을 우선 배치하는 단계;b) first placing a feeder and a nozzle; c) ANC, 노즐 및 테이프 피더의 수량을 제한하는 단계;c) limiting the quantity of ANCs, nozzles and tape feeders; d) 피더 최적화 프로그램을 실행하는 단계;d) running a feeder optimizer; e) 상기 피더 최적화 프로그램의 실행에 따른 최적화된 배치결과를 저장하는 단계; 및e) storing the optimized placement result according to the execution of the feeder optimization program; And f) 상기 최적화된 배치결과에 의한 스탭 프로그램 생성을 위하여 후속 피더 최적화 프로그램을 실행하는 단계를 포함하는 것을 특징으로 하는 표면실장기에서의 피더배치 최적화방법.and f) executing a subsequent feeder optimization program to generate a step program based on the optimized placement result. 제 1항에 있어서, 상기 단계 b)에서의 피더 배치에 의해 피더열의 선 배치상태를 점검 및 편집하고, 노즐 배치에 의해 피더열에 배치된 ANC 각 홀(hole)의 노즐 선 배치상태를 점검 및 편집하는 것을 특징으로 하는 표면실장기에서의 피더배치 최적화방법.The line arrangement of the feeder rows is checked and edited by the feeder arrangement in step b), and the nozzle line arrangement state of each hole of the ANC holes arranged in the feeder rows is arranged by the nozzle arrangement. Feeder placement optimization method in the surface mounter, characterized in that. 제 1항에 있어서, 상기 단계 c)에서의 ANC 제한에 의해 사용가능한 ANC의 상태를 점검 및 사용유무를 편집하고, 노즐 제한에 의해 사용가능한 노즐의 상태를 점검 및 사용유무를 편집하며, 테이프 피더 제한에 의해 부품별 테이프 피더의 최대 사용 수량이 제한되는 것을 특징으로 하는 표면실장기에서의 피더배치 최적화방법.The method according to claim 1, wherein the state of the available ANC is checked and edited by the ANC restriction in step c), the state of the nozzle available by the nozzle restriction is checked and edited, and the tape feeder is used. A method for optimizing feeder placement in a surface mounter, characterized in that the maximum number of parts of the tape feeder per part is limited by the restriction.
KR1019970035201A 1997-07-25 1997-07-25 Method for optimally arranging feeder in surface mounting equipment KR100402965B1 (en)

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Cited By (1)

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CN104427850A (en) * 2013-09-05 2015-03-18 三星泰科威株式会社 Method for operating part hook-up wires

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KR100365635B1 (en) * 2001-03-03 2002-12-26 (주)에스엠티코리아 The method for optimizing a time operated in electronic parts equipping system
KR100560728B1 (en) * 2004-03-12 2006-03-14 미래산업 주식회사 Method for configuring of line optimizing module
KR101339370B1 (en) * 2008-06-24 2013-12-09 삼성테크윈 주식회사 Multi-board grouping device and method for multi-board optimization

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104427850A (en) * 2013-09-05 2015-03-18 三星泰科威株式会社 Method for operating part hook-up wires

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