JP2013004702A - Production management method for multi-piece substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a production management method for a multi-piece substrate which improves a yield while suppressing the occurrence of products in process and stocks of substrate pieces, improves production efficiency without wasting components and makes it easy to search for traceability information.SOLUTION: The method is a production management method for a multi-piece substrate 1 in which substrate pieces for a plurality of groups, of a product component group composed of a plurality of kinds of substrate pieces, are originally integrally combined and separated into substrate pieces in a substrate separating step after a predetermined component is mounted in a component mounting step, and each substrate piece by the unit of product component group is embedded in manufactured products. Employed are substrate kind names CAD1 and CAD 2 expressing kinds of substrate pieces, board numbers B1 through B6 distinguishing among substrate pieces in the multi-piece substrate 1, and group numbers G1 through G3 distinguishing among product component groups in the multi-piece substrate 1.

Description

  The present invention relates to a production management method for a multi-piece board, in which a plurality of types of small-sized boards are joined together at first and separated after component mounting.

  There are solder printing machines, component mounting machines, reflow machines, board inspection machines, etc., as devices that produce boards with a large number of components mounted on them. . In recent years, a perforation that can be separated into a single panel is formed, and after the solder printing process, component mounting process, and reflow process for the panel are completed, the board is separated into multiple boards along the perforation in the production process. The method is increasing. Thereby, since the solder printing process, the component mounting process, the reflow process, and the inspection process of a plurality of boards can be performed together, the production efficiency of the board is remarkably improved. The original panel is called a multi-chip board, a multi-chip board, a split board, etc., and the separated board is called a small board.

  In a production method using a multi-piece substrate, a plurality of small-sized substrates in the multi-piece substrate may be of a single type, a plurality of types, or a plurality of types of groups. In a production method in which a small-sized substrate is a single type, the main purpose is to carry out the steps collectively. On the other hand, when there are a plurality of kinds of small-sized substrates, there is also an object of completing one product with one multi-chip substrate. That is, a product configuration group consisting of a plurality of types of small-piece substrates constituting a product is produced by one multi-piece substrate. As a result, there are merits such as the fact that each small piece substrate constituting the product can be produced in combination, and the number of produced pieces of each small piece substrate can be automatically aligned. For example, there is a great merit in the production of a set of two types of small boards to be incorporated into a foldable mobile phone.

  Also, in component mounting on a multi-chip board, mounting CAD data in which a plurality of component types and coordinate positions on the board are associated is prepared for each small board, and when mounting of the parts on one small board is completed. A component mounting sequence that moves to the next small board is used. Then, when a defect is found, the entire multi-chip substrate is not regarded as a defect, but only the defective piece substrate in which a defect is found is skipped as a defect, and thereafter the defective piece substrate is excluded. Production management using the component mounting sequence. As a result, the multi-chip substrate can be separated after mounting the components, and the remaining small board other than the defective small board can be produced as usual.

  In order to distinguish small boards and make their types easy to understand, board numbers and board type names that can be confirmed by visual inspection, sensors, cameras, etc. may be displayed on each small board with characters, barcodes, etc. Many. For multi-chip boards, production management is usually performed using board numbers, board type names, and the like. Patent Document 1 discloses a technical example related to production management of this type of multi-chip substrate.

  In the method of manufacturing a component-embedded substrate of Patent Document 1, the first and second substrates (multi-chip substrate) partitioned into a plurality of independent regions (small piece substrates), and the electrons mounted on each region of the second substrate are disclosed. An electronic component is mounted in consideration of not only the defective area of the second substrate but also the defective area of the first substrate. That is, the electronic component is not mounted when a certain area of the second substrate is defective, and in addition to this, even when another certain area of the first substrate is defective, the electronic component is not transferred to the corresponding area of the second substrate. Do not mount components. Thus, it is possible to prevent wasteful consumption of electronic components.

JP-A-2005-260112

  By the way, the conventional management method of normally producing the remaining small-sized substrates excluding the defective small-sized substrate of the multi-piece substrate at the time of defect detection is not always reasonable. That is, as exemplified in Patent Document 1, it is good when the small-sized substrate in the multi-piece substrate is of a single type, but there is a problem when there are multiple types of small-sized substrates to form a product configuration group. . For example, when a defect is likely to occur in a specific type of small-sized substrate in the product configuration group, another type of small-sized substrate is produced in excess. The extra small-sized substrate stays long as work-in-process / inventory products and requires troublesome storage, and is finally discarded to reduce the yield. In addition, parts are wasted to produce an extra small-sized substrate, and production time is also taken to reduce production efficiency.

  Furthermore, there are cases where it is necessary to fix and incorporate small board combinations constituting the product group into the product. For example, an oscillation element is mounted on a first small board that constitutes a product group, an associated circuit element of the oscillation element is mounted on a second small board, and the characteristic individual difference of the oscillation element is selected as the element constant of the related circuit element. A circuit configuration to be adjusted can be considered. In this circuit configuration, in order to use the oscillation element and the selected related circuit element in combination, it is necessary to fix the combination of small substrates. Therefore, when a defect is found in one of the first small piece substrate and the second small piece substrate, even if the other is a non-defective product, it cannot be used, resulting in a work-in-process / inventory product.

  In addition, a conventional component mounting sequence in which mounting is performed sequentially in units of small-sized boards is not necessarily optimal, and there is room for improving production efficiency. For example, in the circuit configuration including the oscillation element and the related circuit element described above, first, the characteristic individual difference of the oscillation element is measured and mounted on the first small board, and then the related circuit element is selected and mounted on the second small board. Then, after returning to the first small board and mounting other components, the production efficiency may be improved. As described above, there is room for improving the production efficiency by using the component mounting sequence to and from the small board.

  In addition, traceability information (history information) of a small piece board incorporated in a product is often required as part of a product quality assurance concept in recent years. The traceability information is necessary regardless of whether or not the combination of each small board constituting the product composition group is fixed, and it is preferable that the traceability information can be easily searched.

  The present invention has been made in view of the above-mentioned problems of the background art, and it is possible to improve the production efficiency without wasting parts and improve the production efficiency while suppressing the occurrence of work-in-process / inventories of small-sized substrates, and traceability. An object of the present invention is to provide a production management method for a multi-chip board that makes it easy to search for information.

  According to a first aspect of the present invention of the multi-chip board production management method for solving the above-mentioned problems, the small board for a plurality of groups in a product configuration group composed of a plurality of types of small board is initially combined and integrated. A method for producing a multi-piece substrate, wherein a predetermined component is mounted in a process and then separated into each small board in a board separation process, and each small board is incorporated in a product in units of the product configuration group, A board type name indicating the type of the small piece board, a board number for distinguishing the small piece board in the multi-piece board, and a group number for distinguishing the product configuration group in the multi-piece board are used.

  According to a second aspect of the present invention, in the first aspect, when a defect is detected in a small piece substrate of any one of the multi-piece boards before the component mounting process is completed, Subsequent component mounting steps are not performed with the defective small substrate and the small substrate having the same group number as the defective small substrate being skipped.

  The invention according to claim 3 is the invention according to claim 1 or 2, wherein when the quantity of the product group composed of small-sized substrates in which the component mounting process is satisfactorily completed without a defect being found reaches the planned production number of the product. The component mounting process is terminated.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, a component mounting sequence for determining a mounting order of a plurality of components to be mounted on the multi-piece board in the component mounting step is the product configuration. It is completed within the group.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the product ID is uniquely identified by further using a board ID number that uniquely identifies each of the small-sized substrates of a plurality of multi-chip substrates. The product ID number is associated with the board ID number of the small board incorporated in the product.

  In the invention of the production management method for a multi-piece substrate according to claim 1, production management is performed by attaching a board type name, a board number, and a group number to each small piece substrate in the multi-piece substrate. Thereby, since each small board | substrate can be managed for every board | substrate kind and product composition group and it can suppress producing a small piece board | substrate, a yield can be improved, suppressing generation | occurrence | production of a work-in-process product and a stock.

  In the invention according to claim 2, when a defect is found in a small piece substrate of any one of the multi-piece substrates, the subsequent component mounting process is performed with the defective piece substrate and the small piece substrate having the same group number as a skip target. Do not implement. As a result, when a combination of small substrates constituting a product group is used in a fixed manner, when a defect is found on a certain small substrate in the group, other small substrates in the group that are split into pieces are wasted. Production can be eliminated, and the yield can be improved by suppressing the generation of work-in-process and inventory. Further, there is no waste of parts due to wasteful production of a small piece substrate that breaks into pieces, and production efficiency is not reduced due to extra production time.

  In the invention according to claim 3, when the quantity of the product configuration group composed of small-sized substrates for which the component mounting process has been completed successfully reaches the planned production number of the product, the component mounting process is terminated. As a result, it is not necessary to produce small-sized substrates exceeding the planned production number of products, and the yield can be improved by suppressing the occurrence of work-in-process and inventory. In addition, there is no waste of parts due to the production of extra small-sized substrates, and production efficiency is not reduced due to extra production time.

  In the invention according to claim 4, the component mounting sequence for determining the mounting order of a plurality of components to be mounted on the multi-piece substrate is completed within the product configuration group. That is, the component mounting sequence is assumed to be able to come and go between small boards in a group within a multi-piece board, and not to go between groups. Thereby, the freedom degree of the mounting order of several components becomes larger than before, and the room which can improve production efficiency expands. In addition, since a skip target can be set in units of groups when a defect occurs, it is not necessary to finely change the mounting order and production efficiency does not decrease. If a component mounting sequence that goes back and forth between groups to further increase the degree of freedom is used, change control that skips mounting on a small board of the group when a defect is discovered becomes extremely complicated, Production efficiency also decreases.

  The invention according to claim 5 further uses a board ID number that uniquely identifies each small board of a plurality of multi-piece boards, and a product ID number that uniquely identifies the product and the board of the small board incorporated in the product. Corresponds to an ID number. As a result, it becomes easy to search for traceability information of a small substrate incorporated in a product.

It is a figure which illustrates and explains the multi-piece board | substrate used as the object of the production management method of 1st Embodiment. It is a figure explaining the board | substrate production line which produces a multi-piece board | substrate. It is a figure which illustrates typically the component mounting sequence of a chip shooter (component mounting machine), (1) is the sequence of 1st Embodiment, (2) has shown the sequence of a prior art. It is a figure explaining the production management method of 1st Embodiment, and is a figure explaining the case where a solder defect is discovered by the solder inspection machine. It is a figure explaining the production management method of 1st Embodiment, and is a figure explaining the case where a component mounting defect is discovered by the board | substrate external appearance inspection machine. It is a figure which illustrates by illustration the several multi-piece board | substrate used as the object of the production management method of 2nd Embodiment. It is a figure explaining the usage of board ID number in 2nd Embodiment.

  A production management method for a multi-piece substrate according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram illustrating an example of a multi-piece substrate 1 that is a target of the production management method of the first embodiment. The multi-piece substrate 1 is a rectangular thin plate (panel), and is formed by initially combining three pieces of two types, that is, a total of six pieces of small pieces substrates B1 to B6. After the predetermined components are mounted in the component mounting process, the multi-chip substrate 1 is separated into the small-sized boards B1 to B6 by removing the outer frame 12 along the perforations 11 in the board separating process.

  The three small-sized substrates B1 to B3 arranged on the upper side of the multi-piece substrate 1 in the drawing are the same type, the same shape and the same rectangular thin plate, and the circuit pattern and the mounted parts are also the same. . The three small piece substrates B4 to B6 arranged on the lower side are the same type and are rectangular thin plates of the same shape and the same size as the upper three small piece substrates B1 to B3. It is the same. Substrate type names indicating the types of the six small-sized substrates B1 to B6 are displayed on the lower left side of the respective surfaces. That is, the board type name CAD1 is displayed on the upper three small board substrates B1 to B3, and the board type name CAD2 is displayed on the lower three small board substrates B4 to B6. Moreover, in order to distinguish six small board | substrates B1-B6, board number B1-B6 is displayed near the lower right side of each surface. In FIG. 1, for convenience, the same reference numerals as those of the board numbers B1 to B6 are given to the small board B1 to B6.

  Here, the small board B1 to B3 of the board type name CAD1 and the small board B4 to B6 of the board type CAD2 constitute a product configuration group that is fixed in the combination and incorporated into the product. That is, the small piece substrate B1 and the small piece substrate B4 that are arranged adjacent to each other on the multi-piece substrate 1 constitute the first product configuration group G1, and the small piece substrate B2 and the small piece substrate B5 are the second product. The configuration group G2 is configured, and the small substrate B3 and the small substrate B6 configure the third product configuration group G3. Supplementally, the small substrate B1 is always used in combination with the small substrate B4 and is not combined with the small substrate B5. Therefore, if a defect is found in the small piece substrate B4, the small piece substrate B1 that breaks into pieces cannot be used. The group numbers G1 to G3 of the product configuration groups G1 to G3 of the six small-sized boards B1 to B6 are displayed below the board numbers B1 to B6 on the respective surfaces.

  The board type names CAD1, CAD2, board numbers B1 to B6, and group numbers G1 to G3 can be arbitrary names and numbers as long as they can be distinguished from each other, and the display method is free such as character display or bar code display. The display position is not limited to that shown in FIG. It is also possible to display using a composite number obtained by combining two or more of the board type name, board number, and group number into one.

  Next, the substrate production line 3 for producing the multi-piece substrate 1 will be described with reference to FIG. The board production line 3 includes a solder printing machine 4, a solder inspection machine 5 (SPI = Solder-Paste Inspector), a chip shooter 6 (Chip Shooter), a board appearance inspection machine 7 (AOI = Automatic Outlook Inspector), a chip placer 8 ( Chip Placer), a reflow machine (not shown), a substrate separator, and the like are arranged in series. In addition, a host computer (not shown) that controls each of the machines 4 to 8 is provided. The multi-piece substrate 1 is transported by the substrate transport devices 91 to 95 in the order described above (from left to right in FIG. 1), and a predetermined production process is performed.

  The solder printer 4 prints paste solder on the multi-chip substrate 1. As the solder printer 4, for example, a screen printer provided with a screen corresponding to a pattern paper having a circuit configuration, a nozzle printer provided with a nozzle for jetting solder, or the like can be used. The solder inspection machine 5 inspects the quality of the solder printing state on the multi-piece substrate 1. For example, the solder inspection machine 5 may be provided with a camera that images the surface state of the substrate, and a device that compares the imaging data with the reference data to determine pass / fail. The chip shooter 6 is a kind of component mounting machine, and mounts small electronic components such as a chip resistor and a chip capacitor on the multi-piece substrate 1. The chip shooter 6 may be a component mounting line in which a plurality of module type component mounting machines are connected and arranged in series.

  The board appearance inspection machine 7 inspects the quality of the mounted state of small electronic components on the multi-piece board 1. An apparatus equipped with an imaging camera can also be used for the board appearance inspection machine 7. The chip placer 8 is a kind of component mounting machine, and large components such as connectors are mounted on the multi-piece substrate 1 by soldering or fitting. A reflow machine (not shown) heats and melts the paste-like solder and cools it to solidify the solder and complete the soldering. A substrate separator (not shown) separates the multi-piece substrate 1 into six small-piece substrates B1 to B6. The inspection results of the solder inspection machine 5 and the board appearance inspection machine 7 are notified to each of the machines 4 to 8 via the host computer. The host computer performs setting of a skip target to be described later, notification to each of the machines 4 to 8, and management of the number of product configuration groups to be described later.

  Next, since the component mounting sequences of the chip shooter 6 and the chip placer 8 are similar, the component mounting sequence of the former 6 will be described as an example. FIG. 3 is a diagram for schematically explaining a component mounting sequence of the chip shooter 6, wherein (1) shows the sequence of the first embodiment and (2) shows the sequence of the prior art. The component mounting sequence determines the mounting order of a plurality of components to be mounted on the multi-piece board 1 and further associates the type of the component with the coordinate position on the multi-piece board 1 and is held as mounting CAD data. Yes.

  In the first embodiment shown in (1) of FIG. 3, the component mounting sequence is completed within the product configuration group, and the mounting CAD data is also set for each group. That is, as indicated by solid arrows in the figure, first, the small substrate B1 and the small substrate B4 with the group number G1, then the small substrate B2 and the small substrate B5 with the group number G2, and finally the small substrate B3 with the group number G3 and Component mounting is performed in the order of the small board B6. Then, as shown by the broken arrows in the figure, it is assumed that it can come and go between small substrates in the group and does not come and go between groups.

  For reference, in the prior art shown in (2) of FIG. 3, board numbers B1 to B6 are assigned from the small board B1 to the small board B6 so as to move to the next small board after completing the component mounting on one small board. The component mounting sequence according to this order is used, and the mounting CAD data is set for each small board.

  Next, a production management method for the multi-piece substrate 1 according to the first embodiment will be described. In the production management method of the first embodiment, the board type names CAD1 and CAD2 representing the types of the small board B1 to B6, the board numbers B1 to B6 for distinguishing the small board B1 to B6, and the product configuration groups G1 to G3 are distinguished. Group numbers G1 to G3 are used. 4 and 5 are diagrams illustrating the production management method according to the first embodiment. In the first embodiment, when a defect is found in a certain small piece board of any of the multi-piece boards before the component mounting process is finished, the defective piece board and the defective piece of the multi-piece board are concerned. The subsequent component mounting process is not performed with the small board having the same group number as the board being skipped.

  For example, as illustrated in FIG. 4, when a solder defect is found in the small board B1X of the board number B1 of the multi-piece board 1X by the solder inspection machine 5, the defective small board B1X is skipped (in the figure). (See solid line x). Further, all the small-piece substrates having the same group number G1 as the group number G1 of the defective small-piece substrate B1X are set as skip targets. In the example of the multi-chip substrate 1X, specifically, the small piece substrate B4 is set as a skip target (see the broken x mark in the figure). The component mounting process in the chip shooter 6 and the chip placer 8 is not performed on the small board B1X and B4 of the group number G1 to be skipped (skip process), and the small board B2 of the other group number G2 is not performed. And B5 and small substrates B3 and B6 of group number G3.

  Further, as illustrated in FIG. 5, for example, when a component mounting failure is found on the small board B5Y of the board number B5 of the multi-piece board 1Y by the board visual inspection machine 7, the defective small board B5Y is skipped. (See the solid line x in the figure). Furthermore, all the small substrate substrates having the same group number G2 as the group number G2 of the defective small substrate B5Y are set as skip targets. In the example of the multi-piece substrate 1Y, specifically, the small piece substrate B2 is set as the skip target (see the broken x mark in the figure). The component mounting process in the chip placer 8 is not performed on the small board B2 and B5Y of the group number G2 to be skipped (skipping process), and the small board B1 and B4 of the other group number G1 and the group. This is performed for the small-sized substrates B3 and B6 having the number G3.

  The skip processing described above can be easily performed because the component mounting sequence and mounting CAD data are set in units of groups. Similarly, when a defect is found in a device other than the solder inspection machine 5 and the board appearance inspection machine 7, the skip target is set in the same manner. For example, when it is clear that the chip shooter 6 has not successfully mounted components, the inspection result of the board appearance inspection machine 7 may be skipped without waiting. The cause of the defect is not limited to the solder defect and the component mounting defect, and includes, for example, a case where the multi-chip board 1 itself carried into the solder printer 4 has a defect. Note that the reflow machine and the substrate separating machine (not shown) perform the reflow process and the substrate separating process on the entire multi-piece substrate 1 regardless of whether or not the skip target is set.

  Furthermore, in the production management method for the multi-chip board 1 according to the first embodiment, when the quantity of the product group composed of small-sized boards for which the component mounting process has been satisfactorily completed without a defect being found reaches the planned production number of products. The component mounting process is finished. That is, the production number of the product configuration group composed of good small-sized substrates is sequentially counted up, and the component mounting process is terminated when the production planned number is reached. In the multi-piece substrate 1 illustrated in FIG. 1, the number of production increases by 3 if no defect is found. Further, in the multi-chip substrates 1X and 1Y illustrated in FIG. 4 and FIG.

  When the number of products in the product group reaches the planned number of products to be produced, the multi-fabricated substrate 1 that is still in the middle of the substrate production line 3 is terminated until the last substrate separation step. May be. Further, the number of production groups may be managed with a slight margin instead of just the planned production number of products. By these, it is possible to have a minimum necessary spare product configuration group.

  In the production management method for the multi-piece substrate 1 of the first embodiment, when a defect is found on a small piece substrate (for example, B1X, B5Y) in the group G1 to G3 of the multi-piece substrate 1, The subsequent component mounting process is not performed on the other small board (for example, B4, B2). Therefore, it is no longer necessary to produce a small-sized substrate that breaks the defective small-sized substrate. Further, when the number of product configuration groups composed of small-sized substrates for which the component mounting process has been completed successfully reaches the planned production number of the product, the component mounting process is terminated. Accordingly, it is not necessary to produce an extra small-sized substrate exceeding the planned production number of products. By these, generation | occurrence | production of work-in-process goods and stock goods can be suppressed, and a yield can be improved. Further, there is no waste of parts due to the production of an extra small piece substrate, and the production efficiency is not reduced due to extra production time.

  Furthermore, a component mounting sequence that determines the mounting order of a plurality of components mounted on the multi-piece substrate 1 is completed in the product configuration groups G1 to G3. That is, the component mounting sequence is assumed to be able to come and go between small boards in the groups G1 to G3 in the multi-piece board 1, and not to go between groups. Thereby, the freedom degree of the mounting order of several components becomes larger than before, and the room which can improve production efficiency expands. In addition, since a skip target can be set in units of groups when a defect occurs, it is not necessary to finely change the mounting order and production efficiency does not decrease. If a component mounting sequence that goes back and forth between groups to further increase the degree of freedom is used, change control that skips mounting on a small board of the group when a defect is discovered becomes extremely complicated, Production efficiency also decreases.

  Next, the multi-chip board production management method of the second embodiment will be described mainly with respect to differences from the first embodiment. FIG. 6 is a diagram illustrating a plurality of multi-chip substrates 101 to 103 that are targets of the production management method of the second embodiment. The shape of the multi-chip substrates 101 to 103 is the same as that of the multi-chip substrate 1 of the first embodiment, and the board type names CAD1, CAD2, board numbers B1-B6, and group numbers G1-G3 are displayed on each small-sized substrate. The same is true for the points. Moreover, the point produced by the board | substrate production line 3 shown by FIG. 2 is also the same.

  In the second embodiment, a board ID number that uniquely identifies each of the small piece boards B1 to B6 of the plurality of multi-piece boards 101 to 103 is further used. Specifically, as shown in FIG. 6, board ID numbers “ID1-1” to “ID1-1” are located on the upper left side of the respective surfaces of the six small-sized boards B1 to B6 of the first multi-chip board 101. ID1-6 "is displayed. Similarly, the board ID numbers “ID2-1” to “ID2-6” are displayed on the six small boards B1 to B6 of the second multi-chip board 102, and 6 of the third multi-chip board 103 is displayed. Board ID numbers “ID3-1” to “ID3-6” are displayed on the small piece substrates B1 to B6.

  As the board ID number, any number can be used as long as each small board can be uniquely identified. The display method is free such as character display or bar code display, and the display position is not limited to FIG. It is also possible to display using a composite number obtained by combining two or more of the board ID number, board type name, board number, and group number into one.

  Next, the usage of “ID3-6” of board ID numbers “ID1-1” to “ID1-1” in the second embodiment will be described. FIG. 7 is a diagram illustrating the usage of “ID3-6” of board ID numbers “ID1-1” to “ID1-1” in the second embodiment. In FIG. 7, for convenience, the same reference numerals as the board ID numbers “ID1-1” to “ID2-6” are attached to the small board. The production management database 200 in the figure is a production management apparatus that is installed separately from the board production line 3 and configured by linking a single computer or a plurality of computers. The production management database 200 manages traceability information (history information) of small boards “ID1-1” to “ID2-6” and other parts and members incorporated in the products P1 to P4.

  In the second embodiment, when the small board “ID1-1” to “ID2-6” is produced on the board production line 3, the board ID number and the traceability information at the time of production are associated with each other in the production management database 200. sign up. The traceability information naturally includes the fact that it is a skip target and that a predetermined part is not mounted. The produced small-sized substrates “ID1-1” to “ID2-6” are transported to the product assembly site and provided for the assembly of the products P1 to P4.

  At the product assembly site, the assembly operator accesses the production management database 200 and inquires traceability information based on the board ID numbers displayed on the small board “ID1-1” to “ID2-6”. Thereby, the assembling worker can determine whether or not the small-sized substrates “ID1-1” to “ID2-6” can be used. For example, it is determined that the small board “ID1-1”, “ID1-4”, “ID2-2”, and “ID2-5” in which the history to be skipped remains is unused, and others are usable. To do.

  As a result, the assembling worker fixes and combines the combination of two small board substrates composed of two kinds of board types CAD1 and CAD2 into the products P1 to P4. Furthermore, the assembly operator registers the incorporation result in the production management database 200 and associates the product ID number with the board ID number. In the example of FIG. 7, the product ID number P1 is associated with the board ID numbers “ID1-2” and “ID1-5”. Similarly, the product ID number P2 is associated with the board ID numbers “ID1-3” and “ID1-6”, and the product ID number P3 is associated with the board ID numbers “ID2-1” and “ID2-4”. The product ID number P4 is associated with the board ID numbers “ID2-3” and “ID2-6”.

  In the second embodiment, as described above, by using the board ID number and associating with the product ID number, it becomes easy to search for traceability information of the small board incorporated in the product.

  The present invention can also be applied to a case where a combination of a plurality of types of small piece substrates is not fixed but is freely combined. In addition to the first and second embodiments described above, various applications and modifications are possible.

1, 1X, 1Y, 101-103: Multi-chip substrate 11: Perforation 12: Outer frame 3: Substrate production line
4: Solder printer
5: Solder inspection machine (SPI = Solder-Paste Inspector)
6: Chip Shooter
7: Substrate visual inspection machine (AOI = Automatic Outlook Inspector)
8: Chip Placer
91-95: Substrate transport device 200: Production management database CAD1, CAD2: Substrate type name B1-B6: Board number (small piece substrate)
B1X, B5Y: defective small board G1-G3: group number (product configuration group)
“ID1-1” to “ID3-6”: Board ID numbers P1 to P4: Product ID numbers (products)

Claims (5)

The small board for a plurality of groups of product configuration groups consisting of multiple types of small board is initially combined integrally, and after a predetermined component is mounted in the component mounting process, it is separated into each small board in the board separation process, A production management method for a multi-piece substrate in which each of the small board is incorporated into a product in units of the product configuration group,
Multiple boards using a board type name representing the type of the small board, a board number for distinguishing the small board in the multi-piece board, and a group number for distinguishing the product configuration group in the multi-piece board. Production control method for substrate.   2. The defect small substrate of the multi-chip substrate and the defect when a defect is found in a small substrate of any multi-chip substrate before the component mounting process is completed in claim 1. A production management method for a multi-piece board, in which a small board having the same group number as the small board is skipped and no subsequent component mounting process is performed.   3. The component mounting process according to claim 1 or 2, wherein when the quantity of product configuration groups consisting of small-sized boards for which the component mounting process has been successfully completed without a defect being found reaches the planned production number of the product, the component mounting process is terminated. A production management method for single-chip substrates.   4. The component mounting sequence according to claim 1, wherein a component mounting sequence for determining a mounting order of a plurality of components to be mounted on the multi-chip substrate in the component mounting step is completed in each of the product configuration groups. Production control method for substrate.   5. The product ID number for uniquely identifying the product and the product ID number for uniquely identifying each of the small-sized substrates of a plurality of multi-piece substrates according to claim 1. Production control method of multi-chip board which associates board ID number of small board.

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