JP2007042934A - Gang printed substrate and production history control method thereof - Google Patents

Gang printed substrate and production history control method thereof Download PDF

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JP2007042934A
JP2007042934A JP2005226711A JP2005226711A JP2007042934A JP 2007042934 A JP2007042934 A JP 2007042934A JP 2005226711 A JP2005226711 A JP 2005226711A JP 2005226711 A JP2005226711 A JP 2005226711A JP 2007042934 A JP2007042934 A JP 2007042934A
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identification code
board
substrate
circuit
history
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JP4860200B2 (en
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Michinobu Wakabayashi
宙伸 若林
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Juki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To shorten a production time without requiring the reading of a circuit identification code attached to each divided substrate, and to enable an original substrate configuration to be determined even after the substrate is divided into circuit units. <P>SOLUTION: When the production history of circuits on separate split substrates 11 to 14 obtained by dividing a gang printed substrate 10 is managed; a substrate identification code 20 is attached to the gang printed substrate, and a circuit identification code 22 containing the substrate identification code in its part is attached to the separate split substrate. When components are mounted, the separate circuit identification code is not read in, but only the substrate identification code is read in, and the substrate identification code, components, and mounting places are left as a history. History information when mounting components can be retrieved from the circuit identification code even after the gang printed substrate is divided into the respective separate split substrates. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、多面取り基板の生産履歴管理方法及び多面取り基板に係り、特に、電子部品実装装置に用いるのに好適な、多面取り基板を使った生産時に、個々の割基板上の回路単位の生産履歴を残すための多面取り基板の生産履歴管理方法、及び、これに用いるのに好適な多面取り基板に関する。   The present invention relates to a method for managing production history of a multi-sided board and a multi-sided board, and particularly suitable for use in an electronic component mounting apparatus, in the production using a multi-sided board, the circuit unit on each split board. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a production history management method for a multi-sided substrate for leaving a production history, and a multi-sided substrate suitable for use in this method.

部品供給装置から供給される電子部品を吸着ノズルで吸着して、搬送されてくる基板に搭載する電子部品実装装置が知られている。   2. Description of the Related Art There is known an electronic component mounting apparatus in which an electronic component supplied from a component supply device is sucked by a suction nozzle and mounted on a substrate that is conveyed.

最近では、実装基板は、基板の小型化により、大きな一枚の基板に複数回路を設けた多面取り基板となっており、この多面取り基板では、部品実装後、基板を分割して個々の基板（割基板）としている（特許文献１、２参照）。   Recently, due to the downsizing of the board, the mounting board has become a multi-sided board in which multiple circuits are provided on a large board. In this multi-sided board, after mounting components, the board is divided into individual boards. (Refer to Patent Documents 1 and 2).

このような多面取り基板の生産で、各割基板上の回路単位の生産履歴（どの部品を何処の回路の何処に搭載したか）を残すためには、それぞれの回路に識別コードを付け、これを生産前に回路毎に読み取り、部品搭載時に、読み取った識別コードと部品、搭載場所を履歴として残す必要があった（特許文献３参照）。   In order to keep the production history of each circuit on each split board (which part is mounted on which circuit where) in such multi-chip board production, an identification code is attached to each circuit. Must be read for each circuit before production, and at the time of component mounting, the read identification code, component, and mounting location must be left as a history (see Patent Document 3).

特開平１０−９８２９７号公報JP 10-98297 A 特開２００４−２１４２４７号公報JP 2004-214247 A 特開２００３−１１０２９７号公報JP 2003-110297 A

しかしながら従来の方法では、割基板毎に付いた識別コードを全て読み取る必要があるため、割基板数（回路数）が多い場合には、読み取りにかかる時間が増えてしまい、結果として生産時間が増えてしまうという問題点を有していた。   However, in the conventional method, since it is necessary to read all the identification codes attached to each divided board, when the number of divided boards (number of circuits) is large, the time required for reading increases, resulting in an increase in production time. It had the problem that it ended up.

本発明は、前記従来の問題点を解消するべくなされたもので、識別コードの読み取り時間を節約すると共に、回路単位に分離した状態でも、元の基板構成が判断できるようにすることを第１の課題とする。   The present invention has been made to solve the above-mentioned conventional problems, and it is a first object of the present invention to save the reading time of the identification code and to determine the original substrate configuration even in a state where it is separated into circuit units. It is an issue.

本発明は、又、前記の生産履歴管理に適した多面取り基板を提供することを第２の課題とする。   It is a second object of the present invention to provide a multi-sided substrate suitable for the production history management.

本発明は、多面取り基板を分割して得られる個々の割基板上の回路の生産履歴管理に際して、前記多面取り基板に基板識別コードを付すと共に、個々の割基板に該基板識別コードを一部に含む回路識別コードを付し、部品搭載時には、個々の回路識別コードを読み取ることなく、基板識別コードのみを読み取って、該基板識別コードと部品、搭載場所を履歴として残し、個々の割基板に分離した後でも、前記回路識別コードから、部品搭載時の履歴情報の検索を可能として、前記第１の課題を解決したものである。   The present invention attaches a board identification code to each multi-sided board and manages a part of the board identification code on each multi-sided board when managing the production history of a circuit on each board obtained by dividing the multi-sided board. The circuit identification code is included, and when mounting a component, only the board identification code is read without reading the individual circuit identification code, leaving the board identification code, the component, and the mounting location as a history. Even after the separation, the first problem can be solved by making it possible to retrieve history information at the time of component mounting from the circuit identification code.

本発明は、又、部品搭載後、個々の割基板に分割される多面取り基板であって、基板識別コードが付されると共に、個々の割基板に該基板識別コードを一部に含む回路識別コードが付されたことを特徴とする多面取り基板により、前記第２の課題を解決したものである。   The present invention is also a multi-sided board that is divided into individual divided boards after component mounting, and is provided with a board identification code and a circuit identification that includes the board identification code as a part of each divided board. The second problem is solved by a multi-sided substrate that is provided with a code.

本発明によれば、多面取り基板に基板識別コードを付すと共に、個々の割基板に該基板識別コードを一部に含む回路識別コードを付すようにしたので、部品搭載時に、多面取り基板の基板識別コードを読み取るのみで、個々の割基板上の回路の部品搭載履歴の把握が可能となり、生産時間を短縮できる。又、回路識別コードが基板識別コードを一部に含むようにしたので、個々の割基板に分離した後でも、回路識別コードから元の基板構成の把握が可能となり、部品搭載時の履歴情報の検索が可能となる。   According to the present invention, a board identification code is attached to a multi-sided board, and a circuit identification code including a part of the board identification code is attached to each split board. By simply reading the identification code, it is possible to grasp the component mounting history of the circuit on each split board, and the production time can be shortened. In addition, since the circuit identification code partially includes the board identification code, it is possible to grasp the original board configuration from the circuit identification code even after separation into individual split boards, and the history information at the time of component mounting Search is possible.

以下図面を参照して、本発明の実施形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

本実施形態の生産履歴管理に用いる多面取り基板の構成例を図１に示す。本実施形態の多面取り基板１０は、部品実装後に例えば４枚に分割される割基板１１〜１４がマトリックス状に配置されたマトリックス基板であり、その割基板以外の部分に基板識別コード（ＩＤ）２０が付されると共に、各割基板１１〜１４に回路識別コード（ＩＤ）２２が付されている。   An example of the configuration of a multi-sided board used for production history management of this embodiment is shown in FIG. The multi-sided substrate 10 of this embodiment is a matrix substrate in which, for example, divided substrates 11 to 14 divided into four pieces after component mounting are arranged in a matrix, and a substrate identification code (ID) is provided on a portion other than the divided substrate. 20 and a circuit identification code (ID) 22 are attached to each of the divided boards 11 to 14.

前記基板識別コード２０は、他の多面取り基板１０と重複しないユニークなものとされ、前記回路識別コード２２は、該基板識別コード２０を一部に含むものとされる。   The board identification code 20 is unique so as not to overlap with the other multi-sided board 10, and the circuit identification code 22 includes the board identification code 20 in part.

例えば、基板識別コード２０が［０００１０］とすると、各割基板１１〜１４の回路識別コード２２は、それぞれ［０００１０−００１］［０００１０−００２］［０００１０−００３］［０００１０−００４］とすることができる。   For example, if the board identification code 20 is [00010], the circuit identification codes 22 of the divided boards 11 to 14 are [00010-001] [00010-002] [00010-003] [00010-004], respectively. Can do.

以下、作用を説明する。   The operation will be described below.

まず、部品搭載時には、それぞれの回路識別コード２２の読み取りは実行せず、基板識別コード２０のみを読み取り、基板識別コード２０と部品、搭載場所を履歴として残す。この搭載場所には、電子部品実装装置で管理している回路位置も含む。   First, at the time of component mounting, reading of each circuit identification code 22 is not executed, only the board identification code 20 is read, and the board identification code 20, the component, and the mounting location are left as a history. This mounting location includes a circuit position managed by the electronic component mounting apparatus.

具体的には、図２に示す如く、部品実装のステップ１００において、ステップ１０２で基板搬入後、ステップ１０４で基板ＩＤを読み取って、図３に示す如くメモリの例えばＡ欄に記憶する。   Specifically, as shown in FIG. 2, in step 100 of component mounting, after board loading in step 102, the board ID is read in step 104 and stored in, for example, column A of the memory as shown in FIG.

次いでステップ１０６で、部品吸着で吸着した部品のシリアル番号を、メモリの例えばＢ欄に履歴として残す。   Next, at step 106, the serial number of the component sucked by the component pick-up is left as a history in, for example, column B of the memory.

次いでステップ１０８で、部品搭載で搭載回路（回路番号）、搭載位置（搭載位置ＩＤ）を図３に示す如く履歴として残す。   Next, in step 108, the mounting circuit (circuit number) and mounting position (mounting position ID) are left as a history as shown in FIG.

全ての搭載点に部品を搭載したとステップ１１０で判断されるまで、上記ステップ１０６及び１０８を繰り返す。ステップ１１０で全ての搭載点に搭載したと判断されたときに、ステップ１１２で基板を搬出する。   Steps 106 and 108 are repeated until it is determined in step 110 that components have been mounted on all mounting points. When it is determined in step 110 that all the mounting points have been mounted, the substrate is unloaded in step 112.

部品実装後、ステップ１２０に進み、基板１０を回路単位に分割し、基板組込機のシリアル又は出荷先を履歴に残す。   After mounting the components, the process proceeds to step 120, where the board 10 is divided into circuit units, and the serial or shipping destination of the board built-in machine is left in the history.

このようにすることで、回路単位に分離した状態でも、回路識別コード２２から部品搭載時の履歴情報の検索が可能となる。具体的には、図４に示す如く、例えば客先で不具合が発生し（ステップ２００）、不具合解析後、部品不良が判明（ステップ２０２）した後で、ステップ２０４に進み、図３に示した履歴情報を用いて、該当回路のＩＤから部品シリアル番号を特定し、ステップ２０６で、部品シリアル番号から搭載済み基板ＩＤを特定し、ステップ２０８で、該基板ＩＤと回路ＩＤから出荷先（基板組込機のシリアル）を特定することができる。このようにして、部品不良発生後、その部品使用基板をトレースすることができる。   By doing so, it is possible to retrieve history information at the time of component mounting from the circuit identification code 22 even in a state of being separated into circuit units. Specifically, as shown in FIG. 4, for example, a defect occurs at the customer (step 200), and after analyzing the defect, a component defect is determined (step 202), and then the process proceeds to step 204, as shown in FIG. 3. Using the history information, the component serial number is specified from the ID of the corresponding circuit, and in step 206, the mounted board ID is specified from the component serial number. In step 208, the shipping destination (board set) is determined from the board ID and circuit ID. Can be specified. In this manner, the component use board can be traced after the component failure occurs.

なお、前記実施形態においては、多面取り基板が４回路のマトリックス基板とされていたが、本発明の適用対象はこれに限定されず、４回路以外の割基板にも同様に適用できる。   In the above-described embodiment, the multi-sided substrate is a four-circuit matrix substrate. However, the application target of the present invention is not limited to this, and can be similarly applied to a split substrate other than four circuits.

本発明に係る多面取り基板の実施形態を示す平面図The top view which shows embodiment of the multi-sided board | substrate based on this invention 本発明による生産履歴管理に際して、基板の識別コードを読み取り、搭載履歴を残す手順を示す流れ図Flow chart showing a procedure for reading a substrate identification code and leaving a mounting history in production history management according to the present invention. 同じく履歴情報の一例を示す図The figure which similarly shows an example of history information 同じく部品不良発生後、その部品使用基板をトレースする手順を示す流れ図A flow chart showing the procedure for tracing a component-use board after a component failure occurs

符号の説明Explanation of symbols

１０…多面取り基板
１１〜１４…割基板
２０…基板識別コード（ＩＤ）
２２…回路識別コード（ＩＤ） DESCRIPTION OF SYMBOLS 10 ... Multi-sided board 11-14 ... Split board 20 ... Board identification code (ID)
22: Circuit identification code (ID)

Claims (2)

多面取り基板を分割して得られる個々の割基板上の回路の生産履歴管理に際して、
前記多面取り基板に基板識別コードを付すと共に、個々の割基板に該基板識別コードを一部に含む回路識別コードを付し、
部品搭載時には、個々の回路識別コードを読み取ることなく、基板識別コードのみを読み取って、該基板識別コードと部品、搭載場所を履歴として残し、
個々の割基板に分離した後でも、前記回路識別コードから、部品搭載時の履歴情報の検索を可能としたことを特徴とする多面取り基板の生産履歴管理方法。 When managing the production history of the circuit on each split board obtained by dividing a multi-sided board,
Attaching a board identification code to the multi-sided board, and attaching a circuit identification code including a part of the board identification code to each split board,
At the time of component mounting, without reading the individual circuit identification code, only the board identification code is read and the board identification code, the component, and the mounting location are left as a history,
A production history management method for a multi-chip board, characterized in that history information at the time of component mounting can be retrieved from the circuit identification code even after being separated into individual split boards. 部品搭載後、個々の割基板に分割される多面取り基板であって、
基板識別コードが付されると共に、個々の割基板に該基板識別コードを一部に含む回路識別コードが付されたことを特徴とする多面取り基板。 It is a multi-sided board that is divided into individual split boards after mounting components,
A multi-sided board characterized in that a substrate identification code is attached and a circuit identification code including a part of the board identification code is attached to each split board.
JP2005226711A 2005-08-04 2005-08-04 Production history management method for multi-sided board and multi-sided board Active JP4860200B2 (en)

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JP2013004702A (en) * 2011-06-16 2013-01-07 Fuji Mach Mfg Co Ltd Production management method for multi-piece substrate
JP2013235905A (en) * 2012-05-08 2013-11-21 Panasonic Corp Electronic component mounting system, and production history information generating method in electronic component mounting system
KR101387231B1 (en) * 2012-06-21 2014-04-21 삼성전기주식회사 Pcb array code traceability system and method for tracing and managing pcb array code
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WO2023008199A1 (en) * 2021-07-26 2023-02-02 デンカ株式会社 Bonded substrate, circuit board and method for producing same, and individual substrate and method for producing same
WO2023008200A1 (en) * 2021-07-26 2023-02-02 デンカ株式会社 Bonded substrate, circuit board and manufacturing method therefor, and individual substrate and manufacturing method therefor

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JP2006286949A (en) * 2005-03-31 2006-10-19 Fuji Photo Film Co Ltd Flexible printed board and its manufacturing method

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010070964A1 (en) * 2008-12-16 2010-06-24 株式会社村田製作所 Circuit module and method for managing same
CN102246605A (en) * 2008-12-16 2011-11-16 株式会社村田制作所 Circuit module and method for managing same
JP5126370B2 (en) * 2008-12-16 2013-01-23 株式会社村田製作所 Circuit module
US8431827B2 (en) 2008-12-16 2013-04-30 Murata Manufacturing Co., Ltd. Circuit modules and method of managing the same
CN102246605B (en) * 2008-12-16 2013-08-07 株式会社村田制作所 Circuit module
CN102259503A (en) * 2010-05-26 2011-11-30 宏恒胜电子科技（淮安）有限公司 Automatic code spraying system and application method thereof
JP2013004702A (en) * 2011-06-16 2013-01-07 Fuji Mach Mfg Co Ltd Production management method for multi-piece substrate
JP2013235905A (en) * 2012-05-08 2013-11-21 Panasonic Corp Electronic component mounting system, and production history information generating method in electronic component mounting system
KR101387231B1 (en) * 2012-06-21 2014-04-21 삼성전기주식회사 Pcb array code traceability system and method for tracing and managing pcb array code
JP2018056306A (en) * 2016-09-28 2018-04-05 富士機械製造株式会社 Information management device and information management method
WO2023008199A1 (en) * 2021-07-26 2023-02-02 デンカ株式会社 Bonded substrate, circuit board and method for producing same, and individual substrate and method for producing same
WO2023008200A1 (en) * 2021-07-26 2023-02-02 デンカ株式会社 Bonded substrate, circuit board and manufacturing method therefor, and individual substrate and manufacturing method therefor
JPWO2023008199A1 (en) * 2021-07-26 2023-02-02
JPWO2023008200A1 (en) * 2021-07-26 2023-02-02
JP7365529B2 (en) 2021-07-26 2023-10-19 デンカ株式会社 Bonded substrate, circuit board and method for manufacturing the same, individual board and method for manufacturing the same
JP7365528B2 (en) 2021-07-26 2023-10-19 デンカ株式会社 Bonded substrate, circuit board and method for manufacturing the same, individual board and method for manufacturing the same

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