JP2005183939A - Producing method and system of circuit board - Google Patents

Producing method and system of circuit board Download PDF

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JP2005183939A
JP2005183939A JP2004331377A JP2004331377A JP2005183939A JP 2005183939 A JP2005183939 A JP 2005183939A JP 2004331377 A JP2004331377 A JP 2004331377A JP 2004331377 A JP2004331377 A JP 2004331377A JP 2005183939 A JP2005183939 A JP 2005183939A
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mounting
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JP3992108B2 (en
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Tokumi Kobayashi
徳實 小林
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a producing method and system of a circuit board capable of easily tracing the progressive conditions of divided productions of circuit boards and the histories of productions at the time of the occurrences of defects while increasing the production efficiency of the circuit boards using a multiple-boards forming board. <P>SOLUTION: In the producing method of the circuit board, the boards manufactured by a board maker 1 are distributed to a subsequent mounting maker 2, and electronic parts are mounted on the boards to produce the circuit boards at the mounting maker 2. Boards 5 that are divided into board pieces 7 through board sheets 6 are used at one or a plurality of dividing stages, and the discriminative information comprising the information on the entire boards and the information showing the correlations by division at each dividing stage is recorded in information recording sections 8, 9, 10 individually provided corresponding to each board before and after divided at each dividing stage, and the boards are distributed from the board maker 1 to the mounting maker 2, thereby enabling a user to trace the histories thereof by referring to the discriminative information. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、回路基板の生産方法とシステムに関し、特に基板メーカで1又は複数の分割段階でそれぞれ複数に分割される多数個取り基板を生産し、適宜分割して実装メーカに流通させて電子部品をはじめとする部品を実装し、回路基板を生産する回路基板の生産方法とシステム、並びにその多数個取り基板及び回路基板に関するものである。   The present invention relates to a circuit board production method and system, and in particular, a board maker produces a multi-piece board that is divided into a plurality of parts in one or a plurality of division stages, and divides them appropriately and distributes them to a mounting maker for electronic components. The present invention relates to a circuit board production method and system for mounting a circuit board and other components to produce a circuit board, and a multi-chip board and a circuit board.

従来、各種電子機器の回路基板の生産においては、回路基板の設計データに基づく基板の設計データが基板メーカに与えられる。基板メーカでは、基板設計データに基づいて基板を生産する。その際、生産管理や流通管理のために、基板メーカ独自にロット単位や個別の基板単位でその識別情報が書き込まれる。次に、実装メーカに基板が供給されるとともに、その実装メーカに回路基板の設計データに基づく部品実装データが与えられる。実装メーカでは、基板に必要な部品を実装するとともにその生産管理を行うために、実装メーカ独自に基板の適当な空き領域に基板の識別情報等の情報を書き込んでおり、さらにその際に実装ラインでの実装に必要とされる情報をも書き込んで、実装ラインに投入することで、高い生産性をもって実装を行うことも行われている。   Conventionally, in the production of circuit boards for various electronic devices, board design data based on circuit board design data is given to board manufacturers. Board manufacturers produce boards based on board design data. At that time, for production management and distribution management, the identification information is written in lot units or individual board units by the board manufacturer. Next, the board is supplied to the mounting manufacturer, and component mounting data based on the design data of the circuit board is given to the mounting manufacturer. In order to mount the necessary parts on the board and manage production, the mounting manufacturer writes information such as board identification information in an appropriate empty area on the board. It is also possible to perform mounting with high productivity by writing information necessary for mounting in the field and putting it in the mounting line.

また、複数の作業ステーションが配設された生産系において、ワークを個別に識別するIDタグをワーク毎に設け、各ワーク毎にその作業履歴をコンピュータを用いた作業履歴管理手段で管理するようにするとともに、その作業履歴管理手段の仕事量を低減するため、ワーク毎に作業履歴を記憶する作業履歴記憶手段と送信手段を備えたネットワークを構成したものが知られている(例えば、特許文献1参照。)。   Further, in a production system provided with a plurality of work stations, an ID tag for individually identifying a work is provided for each work, and the work history for each work is managed by work history management means using a computer. In addition, in order to reduce the amount of work of the work history management means, there is known a network comprising work history storage means for storing work history for each work and transmission means (for example, Patent Document 1). reference.).

また、セットシリアル番号や基板のシリアル番号を記述したセット・基板シリアル番号対応ファイルや、基板製造変更連絡書ファイルや、セット毎の不良履歴や基板不良履歴を記述した不良履歴ファイルなどの各種ファイルとデータ処理手段をオンラインで接続し、所定機種のセット単位及び基板単位で製造変更履歴、不良発生履歴を検索できるようにしたものが知られている(例えば、特許文献2参照。)。
特開平10−333740号公報 特開平8−222887号公報
Various files such as a set / board serial number correspondence file describing the set serial number and the board serial number, a board manufacturing change report file, a defect history file describing the defect history and board defect history for each set, etc. There is known a method in which data processing means is connected online so that a manufacturing change history and a defect occurrence history can be searched for a set unit and a substrate unit of a predetermined model (for example, see Patent Document 2).
JP 10-333740 A Japanese Patent Application Laid-Open No. 8-22287

ところで、近年は電子機器の小型化・高密度実装化に伴い、各回路基板は小サイズ化する傾向があるため、基板メーカでは複数の基板を配列した大判の多数個取り基板を生産し、それを分割して実装メーカに向けて流通させ、実装メーカでも同様に複数の基板に対し電子部品を一括して実装することで、生産効率の向上が図られている。また、その一方で、多品種少量生産、製品のライフサイクルの短命化、外部委託生産や海外工場での生産など、生産方法自体が大変複雑化している。そのため、上記従来の回路基板の生産方法では、任意の回路基板の現在の生産進捗状況などをリアルタイムで追跡・検索することは極めて困難であるという問題がある。また、製品に不良品が発生した時にも、その原因を見極めて対策を講じるのが極めて困難となっているという問題がある。   By the way, in recent years, with the trend toward smaller and higher-density mounting of electronic devices, each circuit board has a tendency to be reduced in size. Therefore, board manufacturers produce large-scale multi-chip boards with multiple boards arranged, Is divided and distributed to the mounting manufacturer, and the mounting manufacturer also mounts electronic components on a plurality of boards in a similar manner, thereby improving the production efficiency. On the other hand, the production method itself is very complicated, such as high-mix low-volume production, shortening of product life cycle, outsourced production and production at overseas factories. Therefore, the conventional circuit board production method has a problem that it is extremely difficult to track and search the current production progress of an arbitrary circuit board in real time. Also, when a defective product occurs in a product, it is extremely difficult to find out the cause and take measures.

また、各メーカ毎にそれぞれロット単位や基板単位で識別情報や製造に必要な情報を書き込んでいるため、各メーカ毎に情報を書き込むためのレーザマーカーなどの書き込み装置が設備されており、特に生産効率を高めるために多くの情報を書き込もうとすると、書き込み工数と設備コストがかかるという問題があった。   Also, because each manufacturer writes identification information and information necessary for manufacturing in units of lots and substrates, a writing device such as a laser marker for writing information is provided for each manufacturer. When trying to write a lot of information in order to increase the efficiency, there is a problem that it takes a writing man-hour and equipment cost.

このような問題を解決するには、製品の生産履歴を生産中を含めていつでも追跡できるようにする必要があるが、各メーカなど、各生産体で個別の製品に書き込まれた情報は、各生産体単位でしか解析できないため、実現不可能であるという問題があった。   In order to solve such problems, it is necessary to be able to track the production history of products at any time, including during production, but the information written on individual products by each producer, such as each manufacturer, There is a problem that it cannot be realized because it can only be analyzed in production units.

また、上記特許文献1や特許文献2に開示された手段は、各メーカなどの1つの生産体において生産される製品にのみ適用できるものであり、このような問題を解決することはできない。   In addition, the means disclosed in Patent Document 1 and Patent Document 2 can be applied only to products produced by one producer such as each manufacturer, and cannot solve such problems.

本発明は、上記従来の問題点に鑑み、多数個取り基板を用いて回路基板の生産能率を高めながら分割された回路基板の生産進捗状況の追跡や欠陥発生時の生産履歴の追跡を容易に行うことができ、また基板に対する情報の記録工数を低減できて生産コストの低下を図ることができる回路基板の生産方法とシステムを提供することを目的とする。   In view of the above-described conventional problems, the present invention facilitates the tracking of the production progress of a divided circuit board and the production history at the time of occurrence of a defect while improving the production efficiency of the circuit board using a multi-chip board. An object of the present invention is to provide a circuit board production method and system that can be performed and that can reduce the man-hours for recording information on the board and reduce the production cost.

本発明の回路基板の生産方法は、基板メーカで生産した基板を後続する実装メーカに流通させ、実装メーカでの部品実装に供することにより回路基板を生産する回路基板の生産方法であって、1又は複数の分割段階でそれぞれ複数に分割される多数個取りの基板を用い、かつ各分割段階の分割前と分割後の各基板にそれぞれ対応させて設けてなる各情報記録部に、基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報を記録して基板メーカが実装メーカに基板を流通させるものであり、大判の多数個取り基板を用い、それを分割して実装メーカに向けて流通させることで生産効率の向上を図りながら、また多品種少量生産、製品のライフサイクルの短命化、外部委託生産や海外工場での生産など、生産方法自体が大変複雑化しても、任意の回路基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また回路基板に不良品が発生した時にもその原因を見極めて容易に対策を講じることができる。なお、基板全体に係る情報には、その基板全体に対する識別情報が基板メーカと実装メーカで共通でなく、互いに異なる場合には、基板メーカでの識別情報と実装メーカでの識別情報の両方が含まれている。   The circuit board production method of the present invention is a circuit board production method for producing a circuit board by distributing a board produced by a board manufacturer to a subsequent mounting manufacturer and using it for component mounting at the mounting manufacturer. Alternatively, each information recording unit provided with a plurality of substrates each divided into a plurality of division stages and corresponding to each of the substrates before and after the division at each division stage is provided on the entire substrate. Identification information consisting of such information and information indicating the relative relationship by division at each division stage is recorded and the board manufacturer distributes the board to the mounting manufacturer. Production methods such as high-mix low-volume production, shortening of product life cycle, outsourced production and production in overseas factories, etc. Even if the body becomes very complex, the current production progress status of any circuit board can be easily tracked and searched in real time by referring to the identification information, and when a defective product occurs on the circuit board The cause can be identified and measures can be taken easily. Note that the information related to the entire board includes both the identification information of the board manufacturer and the identification information of the mounting manufacturer if the identification information for the entire board is not common between the board manufacturer and the mounting manufacturer, and is different from each other. It is.

また、情報記録部には、バーコードで情報を記録しても良いが、二次元コードにて情報を記録すると、レーザマーカー等を用いて簡単かつ低コストにて多くの情報を記録することができる。   In addition, the information recording unit may record information using a barcode, but if information is recorded using a two-dimensional code, a large amount of information can be recorded easily and at low cost using a laser marker or the like. it can.

また、基板メーカで、情報記録部に各基板自体の識別情報に加えて基板メーカでの生産工程に係る情報と実装メーカでの生産工程に係る情報を記録すると、基板メーカでその後の実装メーカでの実装工程に必要な情報を記録しているため、実装メーカでの基板に対する情報の記録工数を省略または低減できて生産コストの低下を図りながら効率的な生産を実現することができる。   In addition, when the board manufacturer records information related to the production process at the board manufacturer and information about the production process at the mounting manufacturer in addition to the identification information of each board itself in the information recording unit, Since the information necessary for the mounting process is recorded, it is possible to omit or reduce the man-hours for recording information on the board at the mounting manufacturer, thereby realizing efficient production while reducing the production cost.

また、実装メーカ側からの観点からは、基板メーカで生産され後続する実装メーカに流通された基板に対し、実装メーカにて部品を実装して回路基板を生産する回路基板の生産方法であって、1又は複数の分割段階でそれぞれ複数に分割される多数個取りの基板を用い、基板メーカで各分割段階の分割前と分割後の各基板にそれぞれ対応させて設けてなる各情報記録部に基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報を記録された基板に対し、実装メーカで各情報記録部に実装メーカで用いる識別情報を記録するものであり、上記のように多品種少量生産、製品のライフサイクルの短命化、外部委託生産や海外工場での生産など、生産方法自体が大変複雑化しても、任意の回路基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また回路基板に不良品が発生した時にもその原因を見極めて容易に対策を講じることができる。   Also, from the viewpoint of the mounting manufacturer, a circuit board production method is to produce a circuit board by mounting components at a mounting manufacturer against a board produced by a board manufacturer and distributed to subsequent mounting manufacturers. For each information recording unit provided in correspondence with each substrate before and after division in each division stage using a multi-piece substrate divided into a plurality of divisions in one or a plurality of division steps. For the board on which the identification information consisting of the information related to the whole board and the information indicating the relative relationship by the division at each division stage is recorded, the identification information used by the mounting manufacturer is recorded in each information recording unit by the mounting manufacturer. Yes, even if the production method itself becomes very complicated, such as high-mix low-volume production, short product life cycle, outsourced production, and production at overseas factories as described above, the current production progress of any circuit board Etc. can be easily tracked and search in real-time by referring to the identification information status, and may also easily take measures to identify the cause when the defective circuit board has occurred.

また、基板メーカで情報記録部に各基板自体の識別情報に加えて実装メーカでの生産工程に係る情報を記録された基板に対し、実装メーカで情報記録部から読み出した生産工程に係る情報に基づいて実装を行うと、実装メーカでの基板に対する情報の記録工数を省略または低減できて生産コストの低下を図りながら効率的な生産を実現できる。   In addition, the information related to the production process read out from the information recording unit by the mounting manufacturer to the board in which information related to the production process at the mounting manufacturer is recorded in addition to the identification information of each board itself in the information recording unit by the board manufacturer. When mounting is performed based on this, it is possible to omit or reduce the man-hours for recording information on the board at the mounting manufacturer, thereby realizing efficient production while reducing the production cost.

また、基板メーカ及び実装メーカで、各基板に関する生産工程情報と情報記録部から読み出した識別情報とを組み合わせて通信網を介して接続されたデータ処理センタに送信し、データ処理センタにてデータ処理を行って各種データベースを構築し、基板メーカ及び実装メーカは必要なデータを通信網を介してデータベースから取り込んで必要な処理を行うと、生産方法が複雑化しても任意の回路基板の必要な履歴情報などを通信網を介してデータベースから容易かつ的確に得ることができ、不良品が発生してその原因の追究と対策を講じる場合などの種々の事態の発生や、任意の回路基板の生産進捗状況の把握や、使用状況や、在庫状況などの把握などの種々の要望に適切に対処することができる。   In addition, the board manufacturer and the mounting maker combine the production process information on each board and the identification information read from the information recording unit, and transmit them to the data processing center connected via the communication network. To build various databases, board manufacturers and mounting manufacturers take necessary data from the database via the communication network and perform the necessary processing. Even if the production method becomes complicated, the necessary history of any circuit board Information can be easily and accurately obtained from a database via a communication network, and various situations such as when a defective product occurs and the cause is investigated and countermeasures are taken, and the production progress of any circuit board It is possible to appropriately cope with various requests such as grasping the situation, grasping the usage situation, inventory situation, and the like.

また、本発明の回路基板の生産システムは、基板メーカで、1又は複数の分割段階でそれぞれ複数に分割されかつ各分割段階の分割前と分割後の各基板にそれぞれ対応させて情報記録部を設けてなる多数個取りの基板を生産し、基板メーカで生産した基板を後続する実装メーカに流通させ、実装メーカにて基板に電子部品を実装して回路基板を生産する回路基板の生産システムであって、基板メーカに、基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報を基板の各情報記録部に記録する記録手段を設け、実装メーカに、情報記録部から情報を読み出す読み出し手段を設けたものであり、上記生産方法を実施でき、任意の回路基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また製品に不良品が発生した時にもその原因を見極めて容易に対策を講じることができる。   The circuit board production system according to the present invention is a circuit board manufacturer that divides the information recording unit into a plurality of divisions at one or a plurality of division stages and corresponds to each of the boards before and after the division at each division stage. This is a circuit board production system that produces a large number of printed boards, distributes the boards produced by the board manufacturer to the subsequent mounting manufacturers, and mounts electronic components on the boards at the mounting manufacturer to produce circuit boards. In addition, the board manufacturer is provided with a recording means for recording identification information consisting of information on the entire board and information indicating the relative relationship by the division at each division stage in each information recording section of the board. Readout means for reading information from the recording unit is provided, the above production method can be implemented, and the current production progress status of any circuit board can be referred to in real time by referring to the identification information. Tracking and search it is possible to, and may be readily take measures to identify the cause when the defective occurs in products.

また、基板メーカにおける記録手段を、各基板自体の識別情報に加えて基板メーカでの生産工程に係る情報と実装メーカでの生産工程に係る情報を情報記録部に記録するように構成すると、実装メーカでの基板に対する情報の記録工数を省略または低減できて生産コストの低下を図りながら効率的な生産を実現することができる。   In addition, if the recording means in the board manufacturer is configured to record information related to the production process in the board manufacturer and information related to the production process in the mounting manufacturer in addition to the identification information of each board itself, Efficient production can be realized while reducing the production cost by omitting or reducing the man-hours for recording information on the substrate at the manufacturer.

また、基板メーカ及び実装メーカと通信網にて接続され、基板メーカ及び実装メーカから送信されたデータを処理して各種データベースを構築するデータ処理センタを備え、基板メーカ及び実装メーカに、各基板の情報記録部に記録された識別情報を読み出す手段と、基板メーカ及び実装メーカでの各基板に関する生産工程情報と識別情報とを組み合わせてデータ処理センタに送信するとともに、必要なデータをデータ処理センタから受信するデータ処理・送受信手段とを設けると、生産方法が複雑化しても任意の回路基板の必要な履歴情報などを通信網を介してデータベースから容易かつ的確に得ることができ、不良品が発生してその原因の追究と対策を講じる場合などの種々の事態の発生や、任意の回路基板の生産進捗状況の把握や、使用状況や、在庫状況などの把握などの種々の要望に適切に対処することができる。   In addition, it has a data processing center that is connected to a board manufacturer and a mounting manufacturer via a communication network, and processes various data transmitted from the board manufacturer and the mounting manufacturer to construct various databases. The means for reading the identification information recorded in the information recording unit and the production process information and identification information relating to each board at the board manufacturer and the mounting manufacturer are combined and transmitted to the data processing center, and necessary data is sent from the data processing center. By providing data processing / transmission / reception means to receive, even if the production method is complicated, the necessary history information of any circuit board can be easily and accurately obtained from the database via the communication network, and defective products are generated As a result, various causes such as investigation of the cause and taking countermeasures, ascertaining the production progress of any circuit board, And circumstances, it is possible to properly deal with a variety of needs, such as understanding of and availability.

また、本発明の多数個取り基板は、1又は複数の分割段階を有し、各分割段階で複数に分割される多数個取り基板であって、各分割段階の分割前と分割後の各基板に対応させて情報記録部を設け、各情報記録部には基板全体に係る情報と各分割段階での分割による相対関係を示す情報とから成る識別情報を記録したものであり、この多数個取り基板を用いることで、任意の基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また生産後の回路基板に不良品が発生した時にもその原因を見極めて容易に対策を講じることができる。   Further, the multi-piece substrate of the present invention is a multi-piece substrate having one or a plurality of division stages and divided into a plurality of division stages, and each board before and after division in each division stage. An information recording unit is provided corresponding to each of the information recording units, and each information recording unit records identification information composed of information relating to the entire substrate and information indicating a relative relationship by division at each division stage. By using the board, it is possible to easily track and search the current production progress status of any board in real time by referring to the identification information, and when a defective product occurs on the circuit board after production The cause can be identified and measures can be taken easily.

また、情報記録部には、基板自体の個別情報に加えて、基板メーカでの生産工程に必要な情報と実装メーカでの生産工程に必要な情報が記録されていると、実装メーカでの基板に対する情報の記録工数を省略または低減できて生産コストの低下を図りながら効率的な生産を実現することができる。   In addition to the individual information on the board itself, the information recording unit records information necessary for the production process at the board manufacturer and information necessary for the production process at the mounting manufacturer. Therefore, efficient production can be achieved while reducing the production cost by omitting or reducing the man-hour for recording information.

また、本発明の回路基板は、多数個取り基板を1又は複数の分割段階でそれぞれ複数に分割された基板に部品が実装された回路基板であって、回路基板には情報記録部を有し、その情報記録部には、多数個取り基板における全基板に共通する情報と各分割段階の分割基板との関係を示す情報とから成る識別情報を記録したものであり、回路基板に不良品が発生した時にもその回路基板の生産履歴を識別情報に基づいて追跡・検索することができ、その原因を見極めて容易に対策を講じることができる。   The circuit board of the present invention is a circuit board in which components are mounted on a board obtained by dividing a multi-piece board into a plurality of division stages in one or a plurality of division stages, and the circuit board has an information recording unit. In the information recording section, identification information consisting of information common to all the substrates in the multi-chip substrate and information indicating the relationship between the divided substrates in each division stage is recorded. Even when it occurs, the production history of the circuit board can be tracked and searched based on the identification information, and the cause can be identified and measures can be taken easily.

また、情報記録部には、基板自体の識別情報に加えて、基板メーカでの生産工程に必要な情報と実装メーカでの生産工程に必要な情報が記録されていると、実装メーカでの基板に対する情報の記録工数を省略または低減できて生産コストの低下を図りながら効率的な生産を実現することができる。   In addition to the identification information of the board itself, the information recording unit records information necessary for the production process at the board manufacturer and information necessary for the production process at the mounting manufacturer. Therefore, efficient production can be achieved while reducing the production cost by omitting or reducing the man-hour for recording information.

さらに、本発明の回路基板の生産方法は、データ処理センタにおいて、基板メーカ及び実装メーカから通信網を介して送信された1又は複数の分割段階でそれぞれ複数に分割される多数個取り基板の各分割段階の分割前と分割後の各基板に関する生産工程情報と、各基板に設けられた情報記録部から読み出した基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報との組み合わせを、データ処理して各種データベースを構築するものであり、データベースには、基板メーカと実装メーカの両方における生産履歴に関する情報や、基板メーカ及び実装メーカが通信網を介し取り込んで必要な処理を行う際に必要となる情報が含まれることが望ましく、そのような構成とすることにより、生産方法が複雑化しても任意の回路基板の必要な履歴情報などを通信網を介してデータベースから容易かつ的確に得ることができ、不良品が発生してその原因の追究と対策を講じる場合などの種々の事態の発生や、任意の回路基板の生産進捗状況の把握や、使用状況や、在庫状況などの把握などの種々の要望に適切に対処することができる。   Further, the circuit board production method according to the present invention is a data processing center in which each of the multi-chip boards divided into a plurality of parts at one or a plurality of division stages transmitted from the board manufacturer and the mounting manufacturer via the communication network. Production process information on each substrate before and after the division in the division stage, information on the entire substrate read from the information recording unit provided on each substrate, and information indicating a relative relationship by the division in each division stage Various databases are constructed by processing the combination of identification information and various databases. Information on the production history of both the board manufacturer and the mounting manufacturer, and the board manufacturer and the mounting manufacturer import it via the communication network. It is desirable to include information necessary for performing the necessary processing, and such a configuration complicates the production method. Necessary history information of any circuit board can be easily and accurately obtained from the database via the communication network, and various situations such as occurrence of defective products and investigation of the cause and taking countermeasures It is possible to appropriately cope with various requests such as grasping the production progress status of any circuit board, grasping the usage status, inventory status, and the like.

本発明の回路基板の生産方法とシステムによれば、基板メーカで多数個取り基板を製造し、それを分割して実装メーカに向けて流通させることで生産効率の向上を図りながら、多品種少量生産や外部委託生産や海外会社での生産など生産方法自体が大変複雑化しても、任意の回路基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また回路基板に不良品が発生した時にもその原因を見極めて容易に対策を講じることができる。   According to the circuit board production method and system of the present invention, a board manufacturer manufactures a multi-piece substrate, divides it and distributes it to a mounting manufacturer, improving the production efficiency, and reducing the quantity of various products. Even if the production method itself, such as production, outsourced production or production at an overseas company, becomes very complicated, the current production progress status of any circuit board can be easily tracked and searched in real time by referring to the identification information. In addition, when a defective product occurs on the circuit board, it is possible to identify the cause and take measures easily.

以下、本発明の回路基板の生産方法とシステムの一実施形態について、図1〜図3を参照して説明する。   Hereinafter, an embodiment of a circuit board production method and system according to the present invention will be described with reference to FIGS.

本実施形態は、図1に示すように、基板メーカ1の基板製造ライン3において複数の基板を配列した大判の多数個取り基板(以下、基板ボードと称する。)5を製造し、それを各回路基板となる基板(以下、基板ピースと称する。)を複数配列した基板(以下、基板シートと称する。)6に分割して実装メーカ2に流通・供給し、実装メーカ2の実装ライン4にて基板シート6の各基板ピース7に対して所要の電子部品を実装し、さらに各基板ピース7に分割することで回路基板を生産するものである。   In the present embodiment, as shown in FIG. 1, a large-sized multi-piece substrate (hereinafter referred to as a “substrate board”) 5 in which a plurality of substrates are arranged in a substrate manufacturing line 3 of a substrate manufacturer 1 is manufactured. A circuit board (hereinafter referred to as a “substrate piece”) is divided into a plurality of substrates (hereinafter referred to as “substrate sheets”) 6 and distributed and supplied to the mounting manufacturer 2. Then, a required electronic component is mounted on each board piece 7 of the board sheet 6 and further divided into each board piece 7 to produce a circuit board.

基板ボード5は、図2に示すように、その外枠5a内に複数の基板シート6を配列して相互に連結して構成され、外枠5aの適所に基板ボード5全体に係る情報を記録する情報記録部8が設けられている。基板シート6は、その外枠6a内に複数の基板ピース7を配列して相互に連結して構成され、外枠6aの適所に基板ボード5全体に係る情報及びこの基板ボード5内のどの基板シート6であるかを示す情報を記録する情報記録部9が設けられている。基板ピース7は、その適所に基板ボード5全体に係る情報及びこの基板ボード5内のどの基板シート6におけるどの基板ピース7であるかを示す情報を記録する情報記録部10が設けられている。   As shown in FIG. 2, the substrate board 5 is configured by arranging a plurality of substrate sheets 6 in the outer frame 5a and connecting them to each other, and records information relating to the entire substrate board 5 at an appropriate position of the outer frame 5a. An information recording unit 8 is provided. The substrate sheet 6 is configured by arranging a plurality of substrate pieces 7 in the outer frame 6a and connecting them together. Information on the entire substrate board 5 and any substrate in the substrate board 5 are arranged at appropriate positions on the outer frame 6a. An information recording unit 9 for recording information indicating whether the sheet 6 is present or not is provided. The board piece 7 is provided with an information recording unit 10 that records information about the whole board board 5 and information indicating which board piece 7 in which board sheet 6 in the board board 5 is in place.

これら情報記録部8〜10に記録される情報には、例えば図3に示すように、生産しようとしている回路基板に関する実装メーカ管理品番と基板メーカ管理品番、その品番の回路基板の生産ロットにおけるロット番号とそのロットに含まれる基板ボード5の総数、ロットの何枚目の基板ボード5であるかを示す基板ボードコード(親コード)、基板ボード5のどの位置の基板シート6であるかを示す基板シートコード(子コード)、基板シート6のどの位置の基板ピース7であるかを示す基板ピースコード(孫コード)、並びに基板製造ライン3における製造開始時刻、製造終了時刻、作業者名、使用設備名等といった生産工程での情報、及び実装ライン4における各部品実装点における実装部品名称、基板上の実装位置座標、部品実装するための装着ヘッド移動速度、使用吸着ノズル等の動作情報を含む情報からなる部品実装機を動作させるための実装プログラムといった生産に必要な情報などが含まれ、例えば複数桁の一連の英数字列として設定されている。   The information recorded in these information recording units 8 to 10 includes, for example, as shown in FIG. 3, a mounting manufacturer control part number and a board manufacturer control part number related to the circuit board to be produced, and a lot in a production lot of the circuit board of that part number. The number, the total number of board boards 5 included in the lot, the board board code indicating the number of board boards 5 in the lot (parent code), and the position of the board sheet 6 on the board board 5 Substrate sheet code (child code), substrate piece code (grandchild code) indicating where the substrate piece 7 is located on the substrate sheet 6, and production start time, production end time, operator name, use in the substrate production line 3 Information in the production process such as equipment name, mounting component name at each component mounting point on the mounting line 4, mounting position coordinates on the board, and component mounting This includes information necessary for production, such as a mounting program for operating a component mounting machine, which consists of information including operation information such as the mounting head moving speed and the suction nozzle used, etc. Is set.

基板製造ライン3及び実装ライン4は回路基板の設計データ11に基づいて動作制御される。そのため、回路基板の設計データ11の内、基板ボード5の製造及び基板シート6への分割に関する設計データが、基板メーカ1に供給される。基板ボード5の設計データは制御データ作成部12に入力され、基板製造ライン3に関するデータが参照され、この基板製造ライン3で基板の成形機の動作プログラム、基板上の配線パターンの描画機の動作プログラム等といった基板ボード5を製造するための制御データが作成されて制御部13に格納され、その制御部13にて制御データに基づいて基板製造ライン3が作動制御され、基板ボード5が順次生産され、その後各基板シート6に分割された後検査装置14にて検査された後、実装メーカ2に供給・流通される。   The operation of the board production line 3 and the mounting line 4 is controlled based on circuit board design data 11. Therefore, of the circuit board design data 11, design data related to the manufacture of the board board 5 and the division into the board sheet 6 is supplied to the board manufacturer 1. The design data of the board board 5 is input to the control data creation unit 12, and the data related to the board production line 3 is referred to. The board production line 3 uses the operation program of the board molding machine and the operation of the wiring pattern drawing machine on the board. Control data for manufacturing the board board 5 such as a program is created and stored in the control unit 13, the operation of the board production line 3 is controlled based on the control data by the control unit 13, and the board boards 5 are sequentially produced. After being divided into each substrate sheet 6 and then inspected by the inspection device 14, the substrate sheet 6 is supplied and distributed to the mounting manufacturer 2.

回路基板の設計データ11の内、基板シート6の各基板ピース7に実装される電子部品に関する実装設計データは実装メーカ2に供給される。実装設計データは制御データ作成部15に入力され、実装ライン4に関するデータが参照され、この実装ライン4で基板シート6の各基板ピース7に各部品実装点における実装部品名称、基板上の実装位置座標、部品実装するための装着ヘッド移動速度、使用吸着ノズル等の動作情報を含む情報からなる部品実装機を動作させるための実装プログラムといった電子部品を実装するための制御データが作成され、その制御データは基板メーカ1に供給される。   Of the circuit board design data 11, mounting design data relating to electronic components mounted on each board piece 7 of the board sheet 6 is supplied to the mounting manufacturer 2. The mounting design data is input to the control data creation unit 15, and the data related to the mounting line 4 is referred to. The mounting line 4 is mounted on each board piece 7 of the board sheet 6. Control data for mounting electronic components such as mounting programs for operating a component mounting machine consisting of information including operation information such as coordinates, mounting head moving speed for mounting components, and suction nozzles used is created and controlled. Data is supplied to the board manufacturer 1.

なお、図1の例では、実装メーカ2の制御データ作成部15で作成された制御データを基板メーカ1に供給する場合の例を示したが、これに限らず、実装される電子部品に関する実装設計データについても基板メーカ1に供給するとともに実装メーカ2から実装ライン4に関する情報を基板メーカ1に供給して、基板メーカ1で実装ライン4の制御データを作成するようにしてもよい。   In the example of FIG. 1, an example in which the control data created by the control data creation unit 15 of the mounting manufacturer 2 is supplied to the board manufacturer 1 is shown. The design data may also be supplied to the board manufacturer 1 and information related to the mounting line 4 may be supplied from the mounting manufacturer 2 to the board manufacturer 1 so that the board manufacturer 1 generates control data for the mounting line 4.

また、基板メーカ1では、順次生産される基板ボード5、その基板シート6、及びその基板ピース7を個別に識別する情報や、基板を製造する際に用いた基板成形機や配線パターン描画機の名称、作業者名、製造開始時刻、製造終了時刻、基板を構成する素材の品番、ロット番号等といった基板ボード5、基板シート6、及び基板ピース7の製造情報などを当該基板ボード5の各情報記録部8、9、10に記録するため、制御部13から記録情報作成部16にデータが入力されると同時に、上記実装メーカ2から供給された電子部品を実装するための制御データの内の当該基板ボード5に関する制御データもこの記録情報作成部16に入力され、記録情報作成部16で当該基板ボード5に関するこれらの情報が記録情報に変換されてレーザマーカーなどの記録手段17に出力される。そして、記録手段17にて、当該基板ボード5に設けられた各情報記録部8、9、10に記録情報が記録される。これらの情報記録部8、9、10に二次元コードを書き込むことで、図3に示したような多量の情報を容易に低コストにて記録することができる。   The board manufacturer 1 also includes information for individually identifying the board board 5, the board sheet 6, and the board piece 7 that are sequentially produced, as well as the board molding machine and wiring pattern drawing machine used when manufacturing the board. Information on the board board 5, the board sheet 6, and the board piece 7, such as the name, operator name, manufacturing start time, manufacturing end time, product number of the material constituting the board, lot number, etc. In order to record in the recording units 8, 9, and 10, data is input from the control unit 13 to the recording information creation unit 16, and at the same time, among the control data for mounting the electronic components supplied from the mounting manufacturer 2 Control data related to the board 5 is also input to the recording information creation unit 16, and the information related to the board 5 is converted into recording information by the recording information creation unit 16. Is output to the recording unit 17 such as a car. Then, the recording means 17 records the record information in each of the information recording units 8, 9, 10 provided on the substrate board 5. By writing a two-dimensional code in these information recording units 8, 9, and 10, a large amount of information as shown in FIG. 3 can be easily recorded at a low cost.

基板ボード5の情報記録部8、9、10にそれぞれの記録情報が記録手段17にて書き込まれた後、基板ボード5は基板シート6に分割され、次いで各基板シート6の各種性能検査が検査装置14で行われる。その際、基板シート6とその検査結果を対応させるために、読み出し手段18にて基板シート6及びその基板ピース7の情報記録部9、10に記録された情報を読みだし、データ読取部19にて基板シート6及びその基板ピース7の個別情報を読み取り、パソコンから成るデータ処理・送受信手段20に基板シート6及びその基板ピース7の個別情報と検査データが入力される。その後、基板シート6は上記のように実装メーカ2に供給・流通される。   After each recording information is written in the information recording sections 8, 9, and 10 of the board board 5 by the recording means 17, the board board 5 is divided into board sheets 6, and then various performance inspections of each board sheet 6 are inspected. This is performed by the device 14. At this time, in order to associate the substrate sheet 6 with the inspection result, the information recorded in the information recording units 9 and 10 of the substrate sheet 6 and the substrate piece 7 is read by the reading means 18 and is read by the data reading unit 19. Then, the individual information of the substrate sheet 6 and the substrate piece 7 is read, and the individual information and the inspection data of the substrate sheet 6 and the substrate piece 7 are input to the data processing / transmission / reception means 20 comprising a personal computer. Thereafter, the substrate sheet 6 is supplied and distributed to the mounting manufacturer 2 as described above.

実装メーカ2では、基板シート6を実装ライン4に投入する前に、コードリーダなどの読み出し手段21にて情報記録部9、10に書き込まれた情報を読み出し、データ読取部22にて実装ライン4の制御データを読み取って制御部23に出力する。かくして、制御部23にて読み取った制御データに基づいて実装ライン4が作動制御され、実装ライン4に投入された基板シート6の各基板ピース7に対して所要の電子部品が実装されて回路基板が順次生産される。   In the mounting manufacturer 2, the information written in the information recording units 9 and 10 is read by the reading means 21 such as a code reader before the board sheet 6 is put into the mounting line 4, and the mounting line 4 is read by the data reading unit 22. The control data is read and output to the control unit 23. Thus, the operation of the mounting line 4 is controlled based on the control data read by the control unit 23, and the required electronic components are mounted on each board piece 7 of the board sheet 6 put into the mounting line 4. Will be produced sequentially.

なお、上記の方法に限らず、基板メーカ1において、制御データの識別名(例えば、部品実装機の実装プログラム名称)を各情報記録部8、9、10に記録する方法とすることもでき、制御データ(部品実装機の実装プログラム)の実体は、実装メーカ2の各部品実装機もしくは制御部23に記憶されているものであっても良い。その際、実装メーカ2においては、読み出し手段21で各情報記録部8、9、10から制御データを読み取り、制御データ名を認識し、予め各部品実装機もしくは制御部23に記憶されている制御データの中から該当するものを選択することとする。   In addition to the above method, the board manufacturer 1 can also use a method of recording the identification name of the control data (for example, the mounting program name of the component mounting machine) in each information recording unit 8, 9, 10. The entity of the control data (component mounting machine mounting program) may be stored in each component mounting machine or the control unit 23 of the mounting manufacturer 2. At that time, the mounting manufacturer 2 reads the control data from the information recording units 8, 9, and 10 by the reading unit 21, recognizes the name of the control data, and stores the control data stored in each component mounting machine or the control unit 23 in advance. The relevant data is selected from the data.

電子部品を実装されて実装ライン4から搬出された基板シート6は回路基板に対応する基板ピース7に分割され、次いで各基板ピース7の各種性能検査が検査装置24で行われる。その際、基板ピース7とその検査結果を対応させるために、読み出し手段25にて基板ピース7の情報記録部10に記録された情報を読みだし、データ読取部26にて基板ピース7の個別情報を読み取り、パソコンから成るデータ処理・送受信手段27に基板ピース7の個別情報と検査データが入力される。また、このデータ処理・送受信手段27には、データ読取部22にて検出した実装ライン4に搬入される基板シート6に関するデータも入力される。   The board sheet 6 mounted with electronic components and carried out of the mounting line 4 is divided into board pieces 7 corresponding to the circuit boards, and various performance inspections of the board pieces 7 are then performed by the inspection device 24. At that time, in order to associate the substrate piece 7 with the inspection result, the information recorded in the information recording unit 10 of the substrate piece 7 is read by the reading means 25 and the individual information of the substrate piece 7 is read by the data reading unit 26. The individual information and inspection data of the substrate piece 7 are input to the data processing / transmission / reception means 27 comprising a personal computer. The data processing / transmission / reception means 27 also receives data relating to the substrate sheet 6 carried into the mounting line 4 detected by the data reading unit 22.

基板メーカ1や実装メーカ2のデータ処理・送受信手段20、27はインターネット通信網28に接続されており、インターネット通信網28を介してデータ処理センタ29に接続されている。データ処理センタ29は、基板メーカ1や実装メーカ2などの生産体における製品とその生産に関する各種データベース30と、各生産体から送信されたデータを受信処理して各データベースにデータを格納するデータ受信処理手段と、各生産体からの要求に応じてデータベースから必要な情報を検索して各生産体に送信する検索送信手段を備えている。   The data processing / transmission / reception means 20 and 27 of the board manufacturer 1 and the mounting manufacturer 2 are connected to the Internet communication network 28 and connected to the data processing center 29 via the Internet communication network 28. The data processing center 29 receives the products in the production bodies such as the board manufacturer 1 and the mounting manufacturer 2 and various databases 30 related to the production, and data reception for storing the data transmitted from each production body and storing the data in each database. A processing means and search transmitting means for searching for necessary information from the database in response to a request from each producer and transmitting the information to each producer are provided.

かくして、データ処理センタ29にデータ処理・送受信手段20、27から基板ボード5、基板シート6、基板ピース7の識別情報や検査装置14、24による検査データなどが入力され、データ処理センタ29では、これら入力された情報を処理して各種データベース30が構築され、基板メーカ1や実装メーカ2等の各生産体のデータ処理・送受信手段20、27からこれらデータベース30に任意にアクセスして必要な情報が取り出される。   Thus, identification information of the board board 5, board sheet 6, and board piece 7 and inspection data by the inspection devices 14 and 24 are input from the data processing / transmission means 20 and 27 to the data processing center 29. Various types of databases 30 are constructed by processing these input information, and necessary information is obtained by arbitrarily accessing these databases 30 from the data processing / transmission / reception means 20, 27 of each producer such as the board manufacturer 1 and the mounting manufacturer 2. Is taken out.

データベース30としては、各生産体での在庫状況データベース(例えば、基板メーカ1における基板を構成する素材、配線材料の在庫数、納品日程等といった情報、及び実装メーカ2における基板メーカ1から納品された基板の在庫数、実装する部品の在庫数、これらの納品日程等といった情報)、各基板ボード5、基板シート6、基板ピース7の履歴管理データ(例えば、基板メーカ1における基板を製造する際に用いた基板成形機や配線パターン描画機の名称、作業者名、製造開始時刻、製造終了時刻、基板を構成する素材の品番、ロット番号等の情報、及び実装メーカ2における部品実装する際に用いた部品実装ラインや部品実装機の名称、作業者名、製造開始時刻、製造終了時刻、実装した部品の名称、メーカ名、ロット番号、実装に用いた吸着ノズル名、フィーダ識別番号等の情報)、各基板生産の進捗状況データベース、各基板ピース7の検査結果データベースや、その他オーダー管理データベース、使用エネルギーデータベース、各設備の作業実績データベースなどが構築されている。   As the database 30, an inventory status database for each production body (for example, information such as the material constituting the board in the board manufacturer 1, the number of wiring materials in stock, the delivery schedule, etc.) Information such as the number of boards in stock, the quantity of parts to be mounted, and the delivery schedule thereof), history management data of each board board 5, board sheet 6, and board piece 7 (for example, when a board manufacturer 1 manufactures a board Used when mounting components in the mounting manufacturer 2, such as the name of the used board molding machine or wiring pattern drawing machine, operator name, manufacturing start time, manufacturing end time, product number of the material constituting the board, lot number, etc. The name of the component mounting line or component mounting machine, operator name, manufacturing start time, manufacturing end time, mounted component name, manufacturer name, lot number, actual Information on the suction nozzle name, feeder identification number, etc. used), the progress database of each board production, the inspection result database of each board piece 7, the other order management database, the energy usage database, the work performance database of each equipment, etc. Has been built.

なお、データ処理センタ29にて、データベース30に履歴管理データが蓄積される方法に限らず、基板メーカ1での製造時における製造履歴及び実装メーカ2での製造時における製造履歴を、それぞれ該当基板5、6、7の情報記録部8、9、10に記録する方法とすることもできる。このような方法とすることにより、各基板5、6、7の情報記録部8、9、10を読み取るだけで、その実装基板の製造に関わった基板メーカ1、実装メーカ2等の複数の生産体での製造履歴を参照でき、データ処理センタ29のデータベース30を参照するのと同様に不良等の原因特定のトレースを容易に行うことができる。   Note that the data processing center 29 is not limited to the method of storing history management data in the database 30, but the manufacturing history at the time of manufacturing at the board manufacturer 1 and the manufacturing history at the time of manufacturing at the mounting manufacturer 2 are respectively shown in the corresponding board. It is also possible to use a method of recording in the information recording sections 8, 9, and 10 of 5, 6, and 7. By adopting such a method, only by reading the information recording sections 8, 9, and 10 of each of the substrates 5, 6, and 7, a plurality of productions such as the substrate manufacturer 1 and the mounting manufacturer 2 involved in the manufacture of the mounting substrate. The manufacturing history in the body can be referred to, and the cause specifying trace such as a defect can be easily traced in the same manner as referring to the database 30 of the data processing center 29.

本実施形態によれば、基板メーカ1では各々が回路基板となる多数の基板ピース7を有する大判の基板ボード5の形態で基板を製造し、それを分割して実装メーカ2に向けて流通させることで生産効率の向上を図りながら、また多品種少量生産、製品のライフサイクルの短命化、外部委託生産や海外工場での生産など、生産方法自体が大変複雑化しても、任意の回路基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また回路基板に不良品が発生した時にもその識別情報と生産工程に関する情報からその原因となった箇所を見極めて容易に対策を講じることができる。   According to this embodiment, the board manufacturer 1 manufactures a board in the form of a large-sized board board 5 having a large number of board pieces 7 each serving as a circuit board, and divides the board and distributes it to the mounting manufacturer 2. Even if the production method itself becomes very complicated, such as high-mix low-volume production, shortening of the product life cycle, outsourced production and production at overseas factories, The current production progress status etc. can be easily tracked and searched in real time by referring to the identification information, and when a defective product is generated on the circuit board, the cause is based on the identification information and information on the production process. It is very easy to take countermeasures by looking at the spot.

また、基板メーカ1と実装メーカ2でのデータをインターネット通信網28で接続されたデータ処理センタ29に集中し、任意に参照可能なデータベース30が構築されているので、基板メーカ1や実装メーカ2でのデータの管理費を削減できるとともに、製造データの危機管理を行え、また回路基板の品質のトレースや品質データのリアルタイムでの参照が可能となり、生産システムが複雑化していても、不良品発生時の原因追究をピンポイントで行うことができ、対策を速やかにかつ的確に行うことが可能となり、回路基板の品質向上を容易に図ることができる。また、任意の基板ボード5、基板シート6、基板ピース7の生産進捗状況の把握や、使用状況や、在庫状況などの把握などの種々の要望に適切に対処することができる。   Further, since the data of the board manufacturer 1 and the mounting manufacturer 2 is concentrated in the data processing center 29 connected by the Internet communication network 28 and the database 30 that can be arbitrarily referred to is constructed, the board manufacturer 1 and the mounting manufacturer 2 Data management costs can be reduced, manufacturing data can be managed in crisis, circuit board quality traces and quality data can be referenced in real time, and even if the production system is complicated, defective products are generated. The cause of the time can be investigated pinpointed, and measures can be taken quickly and accurately, and the quality of the circuit board can be easily improved. In addition, it is possible to appropriately cope with various requests such as grasping the production progress status of any board board 5, board sheet 6, and board piece 7, grasping the usage status, inventory status, and the like.

なお、以上の実施形態の説明では、基板メーカ1と実装メーカ2の2つのメーカ間で流通させて生産する例を示したが、任意数の生産体に適用できることは言うまでもない。   In the above description of the embodiment, an example is shown in which production is performed by distributing between two manufacturers, the board manufacturer 1 and the mounting manufacturer 2, but it goes without saying that it can be applied to an arbitrary number of producers.

本発明の回路基板の生産方法は、多数個取り基板を分割して実装メーカに向けて流通させることで生産効率の向上を図りながら、多品種少量生産や外部委託生産や海外会社での生産など生産方法自体が大変複雑化しても、各基板に記録された識別情報に基づいて任意の回路基板の現在の生産進捗状況などを識別情報を参照することでリアルタイムで容易に追跡・検索することができ、また製品に不良品が発生した時にもその原因を見極めて容易に対策を講じることができるので、各種回路基板の生産に有用である。   The circuit board production method of the present invention divides a multi-chip board and distributes it to mounting manufacturers to improve production efficiency, while producing a variety of products in small quantities, outsourced production, production at overseas companies, etc. Even if the production method itself becomes very complicated, it is possible to easily track and search in real time by referring to the identification information on the current production progress of any circuit board based on the identification information recorded on each board. In addition, when a defective product occurs, it is possible to find out the cause and take measures very easily, which is useful for the production of various circuit boards.

本発明の一実施形態の回路基板の生産システムの概略構成図である。1 is a schematic configuration diagram of a circuit board production system according to an embodiment of the present invention. 同実施形態の生産システムで用いる基板ボードの模式的説明図である。It is a typical explanatory view of a substrate board used in the production system of the embodiment. 同実施形態における基板の情報記録部に記録する情報の説明図である。It is explanatory drawing of the information recorded on the information recording part of the board | substrate in the embodiment.

符号の説明Explanation of symbols

1 基板メーカ
2 実装メーカ
3 基板製造ライン
4 実装ライン
5 基板ボード(多数個取り基板)
6 基板シート
7 基板ピース
8、9、10 情報記録部
20、27 データ処理・送受信手段
28 インターネット通信網
29 データ処理センタ
30 データベース
1 Board manufacturer 2 Mounting manufacturer 3 Board manufacturing line 4 Mounting line 5 Board board (Multi-chip board)
6 Substrate sheet 7 Substrate piece 8, 9, 10 Information recording unit 20, 27 Data processing / transmission / reception means 28 Internet communication network 29 Data processing center 30 Database

Claims (18)

基板メーカで生産した基板を後続する実装メーカに流通させ、実装メーカでの部品実装に供することにより回路基板を生産する回路基板の生産方法であって、1又は複数の分割段階でそれぞれ複数に分割される多数個取りの基板を用い、かつ各分割段階の分割前と分割後の各基板にそれぞれ対応させて設けてなる各情報記録部に、基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報を記録して基板メーカが実装メーカに基板を流通させることを特徴とする回路基板の生産方法。   A circuit board production method for producing a circuit board by distributing a board produced by a board manufacturer to a subsequent mounting manufacturer and using it for component mounting at the mounting manufacturer, each divided into a plurality of division stages in one or more division stages. In each information recording unit, which is provided corresponding to each substrate before and after the division in each division stage, and information on the whole substrate and the division at each division stage. A method for producing a circuit board, wherein identification information comprising information indicating a relative relationship is recorded and the board manufacturer distributes the board to the mounting manufacturer. 情報記録部には、二次元コードにて情報を記録することを特徴とする請求項1記載の回路基板の生産方法。   2. The circuit board production method according to claim 1, wherein information is recorded in a two-dimensional code in the information recording unit. 基板メーカで、情報記録部に各基板自体の識別情報に加えて基板メーカでの生産工程に係る情報と実装メーカでの生産工程に係る情報を記録することを特徴とする請求項1又は2記載の回路基板の生産方法。   3. The board maker records information on a production process at the board maker and information on a production process at the mounting maker in addition to the identification information of each board itself in the information recording unit. Circuit board production method. 基板メーカで生産され後続する実装メーカに流通された基板に対し、実装メーカにて部品を実装して回路基板を生産する回路基板の生産方法であって、1又は複数の分割段階でそれぞれ複数に分割される多数個取りの基板を用い、基板メーカで各分割段階の分割前と分割後の各基板にそれぞれ対応させて設けてなる各情報記録部に基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報を記録された基板に対し、実装メーカで各情報記録部に実装メーカで用いる識別情報を記録することを特徴とする回路基板の生産方法。   A circuit board production method for producing a circuit board by mounting components at a mounting manufacturer on a board produced by a board manufacturer and distributed to subsequent mounting manufacturers. Information on the entire board and information at each division stage are provided in each information recording unit provided by the board manufacturer corresponding to each division board before and after division at each division stage using a multi-piece substrate to be divided. A method for producing a circuit board, wherein identification information used by a mounting maker is recorded in each information recording unit by a mounting maker on a board on which the identification information including information indicating a relative relationship by division is recorded. 基板メーカで情報記録部に各基板自体の識別情報に加えて実装メーカでの生産工程に係る情報を記録された基板に対し、実装メーカで情報記録部から読み出した生産工程に係る情報に基づいて実装を行うことを特徴とする請求項4記載の回路基板の生産方法。   Based on the information related to the production process read from the information recording unit by the mounting manufacturer for the board in which information related to the production process at the mounting manufacturer is recorded in the information recording unit in the information recording unit by the board manufacturer 5. The circuit board production method according to claim 4, wherein mounting is performed. 基板メーカ及び実装メーカで、各基板に関する生産工程情報と情報記録部から読み出した識別情報とを組み合わせて通信網を介して接続されたデータ処理センタに送信し、データ処理センタにてデータ処理を行って各種データベースを構築し、基板メーカ及び実装メーカは必要なデータを通信網を介してデータベースから取り込んで必要な処理を行うことを特徴とする請求項1〜5の何れかに記載の回路基板の生産方法。   The board manufacturer and the mounting maker combine the production process information about each board and the identification information read from the information recording unit and send it to the data processing center connected via the communication network, and the data processing center performs the data processing. 6. The circuit board according to claim 1, wherein various databases are constructed, and the board manufacturer and the mounting manufacturer take in necessary data from the database via a communication network and perform necessary processing. Production method. データベースには、基板メーカと実装メーカの両方における生産履歴に関する情報が含まれることを特徴とする請求項6に記載の回路基板の生産方法。   7. The circuit board production method according to claim 6, wherein the database includes information relating to production histories of both the board manufacturer and the mounting manufacturer. 基板メーカで、1又は複数の分割段階でそれぞれ複数に分割されかつ各分割段階の分割前と分割後の各基板にそれぞれ対応させて情報記録部を設けてなる多数個取りの基板を生産し、基板メーカで生産した基板を後続する実装メーカに流通させ、実装メーカにて基板に電子部品を実装して回路基板を生産する回路基板の生産システムであって、基板メーカに、基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報を基板の各情報記録部に記録する記録手段を設け、実装メーカに、情報記録部から情報を読み出す読み出し手段を設けたことを特徴とする回路基板の生産システム。   A board maker produces a multi-piece board that is divided into a plurality of division stages in one or a plurality of division stages and is provided with an information recording unit corresponding to each of the boards before and after the division of each division stage, A circuit board production system that distributes a board produced by a board manufacturer to a subsequent mounting manufacturer and mounts electronic components on the board at the mounting manufacturer to produce a circuit board. And recording means for recording identification information consisting of information indicating the relative relationship by division at each division stage in each information recording section of the board, and a mounting means for reading information from the information recording section in the mounting manufacturer A circuit board production system characterized by 基板メーカにおける記録手段は、各基板自体の識別情報に加えて基板メーカでの生産工程に係る情報と実装メーカでの生産工程に係る情報を情報記録部に記録するように構成したことを特徴とする請求項8記載の回路基板の生産システム。   The recording means in the board manufacturer is configured to record the information related to the production process in the board manufacturer and the information related to the production process in the mounting manufacturer in addition to the identification information of each board itself in the information recording unit. The circuit board production system according to claim 8. 基板メーカ及び実装メーカと通信網にて接続され、基板メーカ及び実装メーカから送信されたデータを処理して各種データベースを構築するデータ処理センタを備え、基板メーカ及び実装メーカに、各基板の情報記録部に記録された識別情報を読み出す手段と、基板メーカ及び実装メーカでの各基板に関する生産工程情報と識別情報とを組み合わせてデータ処理センタに送信するとともに、必要なデータをデータ処理センタから受信するデータ処理・送受信手段とを設けたことを特徴とする請求項8又は9記載の回路基板の生産システム。   A data processing center that connects to the board manufacturer and the mounting manufacturer via a communication network, processes data transmitted from the board manufacturer and the mounting manufacturer, and builds various databases, and records information on each board to the board manufacturer and the mounting manufacturer. The means for reading the identification information recorded in the section and the production process information and identification information relating to each board at the board manufacturer and mounting manufacturer are combined and transmitted to the data processing center, and the necessary data is received from the data processing center. 10. The circuit board production system according to claim 8, further comprising data processing / transmission / reception means. 1又は複数の分割段階を有し、各分割段階で複数に分割される多数個取り基板であって、各分割段階の分割前と分割後の各基板に対応させて情報記録部を設け、各情報記録部には基板全体に係る情報と各分割段階での分割による相対関係を示す情報とから成る識別情報を記録したことを特徴とする多数個取り基板。   A multi-piece substrate that has one or a plurality of division stages and is divided into a plurality of divisions at each division stage, provided with an information recording unit corresponding to each substrate before and after the division of each division stage; A multi-piece substrate characterized in that identification information comprising information relating to the entire substrate and information indicating a relative relationship by division at each division stage is recorded in the information recording unit. 情報記録部には、基板メーカと実装メーカの両方の生産履歴が記録されることを特徴とする請求項11に記載の多数固取り基板。   12. The multi-chip substrate according to claim 11, wherein production history of both the board manufacturer and the mounting manufacturer is recorded in the information recording unit. 情報記録部には、基板自体の個別情報に加えて、基板メーカでの生産工程に必要な情報と実装メーカでの生産工程に必要な情報が記録されていることを特徴とする請求項11記載の多数個取り基板。   12. The information recording unit records information necessary for a production process at a board manufacturer and information necessary for a production process at a mounting manufacturer in addition to individual information on the board itself. Multi-cavity board. 多数個取り基板を1又は複数の分割段階でそれぞれ複数に分割された基板に部品が実装された回路基板であって、回路基板には情報記録部を有し、その情報記録部には、多数個取り基板における全基板に共通する情報と各分割段階の分割基板との関係を示す情報とから成る識別情報を記録したことを特徴とする回路基板。   A circuit board in which components are mounted on a board obtained by dividing a multi-piece board into a plurality of division stages in one or a plurality of division stages, the circuit board having an information recording section, and the information recording section includes A circuit board having recorded thereon identification information composed of information common to all the boards in the individual substrate and information indicating a relationship between the divided boards at each division stage. 情報記録部には、基板自体の識別情報に加えて、基板メーカでの生産工程に必要な情報と実装メーカでの生産工程に必要な情報が記録されていることを特徴とする請求項14記載の回路基板。   15. The information recording unit records information necessary for a production process at a board manufacturer and information necessary for a production process at a mounting manufacturer in addition to identification information of the board itself. Circuit board. データ処理センタにおいて、基板メーカ及び実装メーカから通信網を介して送信された1又は複数の分割段階でそれぞれ複数に分割される多数個取り基板の各分割段階の分割前と分割後の各基板に関する生産工程情報と、各基板に設けられた情報記録部から読み出した基板全体に係る情報と各分割段階での分割による相対関係を示す情報とからなる識別情報との組み合わせを、データ処理して各種データベースを構築することを特徴とする回路基板の生産方法。   In a data processing center, each board before and after division in each division stage of a multi-piece board divided into a plurality of division stages in one or a plurality of division stages transmitted from a board manufacturer and a mounting manufacturer via a communication network Various combinations of production process information, identification information consisting of information related to the entire substrate read from the information recording unit provided on each substrate and information indicating the relative relationship by division at each division stage are processed and processed. A circuit board production method characterized by constructing a database. データベースには、基板メーカと実装メーカの両方における生産履歴に関する情報が含まれることを特徴とする請求項16記載の回路基板の生産方法。   17. The circuit board production method according to claim 16, wherein the database includes information relating to production histories of both the board manufacturer and the mounting manufacturer. データベースには、基板メーカ及び実装メーカが通信網を介し取り込んで必要な処理を行う際に必要となる情報が含まれることを特徴とする請求項16記載の回路基板の生産方法。   17. The method for producing a circuit board according to claim 16, wherein the database includes information necessary for the board manufacturer and the mounting manufacturer to take in via the communication network and perform necessary processing.
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JP2008258332A (en) * 2007-04-03 2008-10-23 Dainippon Printing Co Ltd Printed circuit board, electronic device, manufacturing method of printed circuit board
JP2009524256A (en) * 2006-01-20 2009-06-25 サンミナ−エスシーアイ コーポレーション In-line system for collecting production metrics at each stage
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115038A (en) * 2005-10-20 2007-05-10 Sharp Corp Printed board quality information management system
JP2009524256A (en) * 2006-01-20 2009-06-25 サンミナ−エスシーアイ コーポレーション In-line system for collecting production metrics at each stage
KR101294532B1 (en) * 2006-01-20 2013-08-07 산미나-에스씨아이 코포레이션 Inline system for collecting stage-by-stage manufacturing metrics
JP2008258332A (en) * 2007-04-03 2008-10-23 Dainippon Printing Co Ltd Printed circuit board, electronic device, manufacturing method of printed circuit board
WO2010070964A1 (en) * 2008-12-16 2010-06-24 株式会社村田製作所 Circuit module and method for managing same
JP5126370B2 (en) * 2008-12-16 2013-01-23 株式会社村田製作所 Circuit module
US8431827B2 (en) 2008-12-16 2013-04-30 Murata Manufacturing Co., Ltd. Circuit modules and method of managing the same
JP2016122440A (en) * 2014-12-25 2016-07-07 昭和電工株式会社 Division component defective cause determination method and division component traceability system
JP2017188015A (en) * 2016-04-08 2017-10-12 昭和電工株式会社 Quality determination method for workpiece and traceability system

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