JPWO2023008200A1 - - Google Patents

Info

Publication number
JPWO2023008200A1
JPWO2023008200A1 JP2023506314A JP2023506314A JPWO2023008200A1 JP WO2023008200 A1 JPWO2023008200 A1 JP WO2023008200A1 JP 2023506314 A JP2023506314 A JP 2023506314A JP 2023506314 A JP2023506314 A JP 2023506314A JP WO2023008200 A1 JPWO2023008200 A1 JP WO2023008200A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023506314A
Other languages
Japanese (ja)
Other versions
JP7365528B2 (en
JPWO2023008200A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2023008200A1 publication Critical patent/JPWO2023008200A1/ja
Publication of JPWO2023008200A5 publication Critical patent/JPWO2023008200A5/ja
Application granted granted Critical
Publication of JP7365528B2 publication Critical patent/JP7365528B2/en
Active legal-status Critical Current
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Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
JP2023506314A 2021-07-26 2022-07-13 Bonded substrate, circuit board and method for manufacturing the same, individual board and method for manufacturing the same Active JP7365528B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021121333 2021-07-26
JP2021121333 2021-07-26
PCT/JP2022/027620 WO2023008200A1 (en) 2021-07-26 2022-07-13 Bonded substrate, circuit board and manufacturing method therefor, and individual substrate and manufacturing method therefor

Publications (3)

Publication Number Publication Date
JPWO2023008200A1 true JPWO2023008200A1 (en) 2023-02-02
JPWO2023008200A5 JPWO2023008200A5 (en) 2023-07-05
JP7365528B2 JP7365528B2 (en) 2023-10-19

Family

ID=85086705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506314A Active JP7365528B2 (en) 2021-07-26 2022-07-13 Bonded substrate, circuit board and method for manufacturing the same, individual board and method for manufacturing the same

Country Status (4)

Country Link
EP (1) EP4369874A1 (en)
JP (1) JP7365528B2 (en)
CN (1) CN117694024A (en)
WO (1) WO2023008200A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210028A (en) 2004-01-26 2005-08-04 Kyocera Corp Multi-molded wiring board
JP4860200B2 (en) 2005-08-04 2012-01-25 Ｊｕｋｉ株式会社 Production history management method for multi-sided board and multi-sided board
JP5299304B2 (en) 2010-02-05 2013-09-25 三菱マテリアル株式会社 Power module substrate manufacturing method and power module substrate manufacturing intermediate
JP2011233648A (en) * 2010-04-26 2011-11-17 Murata Mfg Co Ltd Circuit-board with mark
KR20210132066A (en) 2019-03-01 2021-11-03 덴카 주식회사 Ceramic green sheet, ceramic substrate, manufacturing method of ceramic green sheet, and manufacturing method of ceramic substrate
WO2021020471A1 (en) 2019-07-31 2021-02-04 デンカ株式会社 Ceramic substrate and method for manufacturing same, composite substrate and method for manufacturing same, and circuit substrate and method for manufacturing same

Also Published As

Publication number Publication date
EP4369874A1 (en) 2024-05-15
JP7365528B2 (en) 2023-10-19
WO2023008200A1 (en) 2023-02-02
CN117694024A (en) 2024-03-12

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