JP2002204100A - Component mounting machine and method for mount component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device and method of mounting components that can readily handle circuit boards for different destinations, readily edit and manage NC programs, and readily grasp production track records for each of the destinations. SOLUTION: On a multi-chamfering substrate 25 composed of two subordinate substrates 26 and 27 having component mounting surfaces 26a and 27a, which are commonly used regardless of different destinations, and mounting surfaces 26b, 26c, 26d, 27b, 27c, and 27d, which are different for each destination, NC programs are produced respectively for the mounting surfaces. A correspondence table is produced to match the NC programs with the destinations, and an execution table is produced to specify the executing order the NC programs for each of the destinations. When an operator specifies a destination, a specific NC program group is read from the correspondence table, and components are successively mounted on the mounting surfaces according to the execution table.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and a component mounting apparatus for mounting electronic components of different types and numbers depending on the destination and specifications of a product board on a circuit board having the same configuration or at least a part in common. About the method.

[0002]

2. Description of the Related Art Conventionally, electronic devices generally have different usage environments, such as warm, cold, wet, and dry lands, and different power supply voltages, such as 100 volts and 200 volts, depending on the destination. Alternatively, there are differences in use conditions due to differences in power supply cycles such as 50 cycles and 60 cycles.

[0003] In accordance with the difference in the use environment and use conditions, the appearance of the electronic device and the configuration of the control device disposed inside the electronic device, that is, the specifications of the electronic circuit, corresponding to the difference for each destination or specification. Are different. However, the differences in the specifications of these electronic circuits are also due to the recent improvement in electronic technology and the rationalization of the assembly process of final products (electronic devices).
In many cases, it is possible to deal with the above-mentioned difference in specifications only by changing the type and number of electronic components to be mounted on circuit boards having the same configuration.

FIG. 8 is a diagram showing an example of such a circuit board. The circuit board P shown in the figure is an example of a multi-panel board composed of two daughter boards P1 and P2. The sub-board P1 of the circuit board P shown in FIG. 1 has a mounting surface a on which common electronic components are mounted, and mounting surfaces b, c, or d on which electronic components are mounted or mounted depending on a destination or a difference in specifications. It is the part that does not exist.

The sub-board P2 has a mounting surface e on which common electronic components are mounted, and mounting surfaces f, g, and h are portions on which electronic components are mounted or not mounted depending on a destination or specifications. .

[0006]

As described above, on the one hand, there is a mounting surface on which electronic components are mounted or not depending on the destination or specifications, and on the other hand, the electronic components are always mounted in common. As a treatment for a circuit board having a mounting surface, processing to be skipped and processing not to be skipped for each destination or specification are described in one NC program, and up to nine option numbers (9 By setting the option number before the start of the production, the operator specifies the option number before the start of the production. is there.

This method can be similarly used in a dispenser device for applying solder to a mounting position of an electronic component or an apparatus for performing both solder application and electronic component mounting. However, in the method of specifying an option number consisting of numbers 1 to 9 when performing production according to destinations or specifications as described above, since the option number is merely a number, the operator can easily discriminate the option number. Often, the wrong option number is specified.

If the option number is specified incorrectly, the NC program will produce a large number of defective board products different from the desired specifications. The loss due to defective products is too large, and thus the above method is rarely adopted at present.

Further, when production is performed for each destination or each specification using an option number by one NC program, it is possible to grasp the production results of the board products for each destination or each specification due to the configuration of the program. There was also a problem that it could not be done. This was exactly the same as the fact that it was not possible to grasp the production results of the sub-boards of the multiple board.

Therefore, instead of the above method, one NC program is often created and operated for each destination or specification. In this case, since characters or symbols can be originally described in the header of the NC program,
By describing the name of the destination or the specification in this header portion, the NC program corresponding to the desired destination or the specification can be easily selected without error simply by the operator designating the name of the destination or the specification. be able to.

[0011]

However, when one NC program is created and operated for each destination or specification, some change occurs in the specification of the mounting surface a or e on which common electronic components are mounted. Then, it becomes necessary to modify all the NC programs created for each destination or specification, which is troublesome and has a problem of extremely poor maintainability. This applies not only to the case of changing the specification of the mounting surface common to all, but also to the case of changing the specification of the mounting surface common to some destinations or specifications. A plurality of NC programs for the circuit board corresponding to the specifications are extracted and corrected, and there is a problem that the trouble in program management is more troublesome than the correction in the case of all common NC programs.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances,
An object of the present invention is to provide a component mounting apparatus and a component mounting method that can easily cope with each circuit board having different destinations or specifications, can cope with common parts by one NC program, and can grasp the production results for each destination or specification. .

[0013]

First, a component mounting apparatus according to the first aspect of the present invention includes a plurality of NC programs corresponding to a plurality of component mounting surfaces partitioned on a circuit board, and the plurality of NC programs. Associating means for associating with each destination or specification of the circuit board, designating means for sequentially designating the NC programs associated by the associating means, and when the destination or specification is designated, Execution means for sequentially executing the NC program associated with the destination or specification according to the designation by the designation means.

The component mounting apparatus may include, for example, an execution number accumulating means for accumulating the number of executions for each NC program when the execution of the NC program is completed, and an accumulating means by the execution number accumulating means. And an execution number storage unit for storing a result for each of the NC programs. The execution of the NC program to all of the mounting positions of the circuit board is performed as described in claim 3, for example. When completed, an actual number accumulating means for accumulating the actual number for each destination or specification of the circuit board, and an actual number storing means for storing the cumulative result by the actual number accumulating means for each destination or specification, It is further provided.

Next, a component mounting method according to a fourth aspect of the present invention is a method for individually partitioning the entire component mounting surface of a circuit board for each component mounting surface that differs depending on the destination or specification of the electronic component mounting method. A procedure for individually creating an NC program corresponding to each of the plurality of component mounting surfaces individually partitioned, and a procedure for associating the plurality of individually created NC programs with the destination or specification,
A procedure for sequentially designating the associated NC programs, and a procedure for executing the NC programs associated with the designated destination or specification when the destination or specification is designated, in the designated order. And consisting of

[0016]

Embodiments of the present invention will be described below with reference to the drawings. In the following description, the associating means includes, for example, a correspondence table 35, the specifying means includes, for example, an execution table 40, the executing means includes, for example, the CPU 16, and the like. The means and the result number accumulating means include, for example, the CPU 16 and the RAM 19, and the execution number storing means and the result number storing means include, for example, the RAM 19 and an external storage device.

FIG. 1A is an external perspective view of a component mounting apparatus according to a first embodiment in which electronic components are automatically mounted on a circuit board, and FIG. It is the perspective view which removes and shows an internal structure typically. Same figure
A component mounting device (hereinafter, also referred to as a main device) 1 shown in (a) and (b) is composed of a liquid crystal display and a touch panel on the top of a ceiling cover, and is capable of inputting various instructions by an external operation. The apparatus includes a device 2, a monitor device 3 including a CRT display, and an alarm lamp 4 for notifying an operation state.

On the lower base 5, a pair of fixed and movable board guide rails 6 (6-1, 6-
2) extends horizontally in the transport direction of the circuit board (hereinafter simply referred to as the board) (X-axis direction, obliquely lower right to upper left in the figure). A loop-shaped conveyor belt (conveyor belt) is movably disposed in contact with the lower portions of these board guide rails 6. The conveyor belt is driven by a belt drive motor and travels in the substrate conveyance direction while supporting the side of the belt having a width of several millimeters from below the substrate guide rail 6 into the substrate conveyance path, and supports both sides of the back surface of the substrate from below. While loading the board before the components are loaded into the apparatus main body from the upstream side of the line, and the board on which the components are mounted is discharged to the downstream side of the line.

Although not shown, the base 2 includes a board positioning device, a board fixing mechanism for fixing the board between the two board guide rails 6, a control circuit for controlling each part, and the like. Have been. In addition, on the base 2,
A pair of left and right fixed rails (Y-axis rails) 7 (7-1, 7-2) extending in parallel to a direction perpendicular to the substrate transport direction (front-rear direction) across the pair of substrate guide rails 6 are provided. It is arranged. A moving rail (X-axis rail) 8 is slidably engaged with these Y-axis rails 7 along the Y-axis rail 7, and electronic components (hereinafter simply referred to as components) are mounted on the substrate on the X-axis rail 8. A work tower 9 for performing work is slidably suspended along the X-axis rail 8.

Although not clearly shown in the figure, the X-axis rail 8 is provided with an X-axis direction drive servomotor for freely moving the work tower 9 along its longitudinal direction (X-axis direction). On the base 5, the X-axis rail 8 is connected to the Y-axis rail 7.
A Y-axis direction drive servomotor for moving back and forth (Y-axis direction) along -1 and 7-2 is provided. The work tower 9 can be freely moved in the X-axis direction and the Y-axis direction by rotating the X-axis direction drive servomotor and the Y-axis direction drive servomotor in both the forward and reverse directions according to instructions from the control circuit.

At the front and rear of the base 5, component supply stages 11 (11-1, 11-2) are provided, respectively. Although not shown, a large number of cartridge-type component supply devices having reels wound with tapes containing the components are mounted on these component supply stages 11 in correspondence with a plurality of types of components. A tray-type component supply device having a plurality of pallets corresponding to the types of components is engaged.

The work tower 9 is vertically moved (Z-axis direction).
It can be moved up and down freely, and it is 360-degree direction (θ direction)
One or a plurality of work heads having a Zθ mechanism that can also be rotated, and a suction nozzle 12 or a chuck mechanism that is detachably attached to the tip of the work head, from a component supply device that engages on the component supply stage 11 A desired component is suctioned or gripped and mounted on a substrate.

The work tower 9 is protected by a belt-like chain body 13 (13-1, 13-2) which is bendable and has a hollow interior.
It is connected to a central control unit disposed on an electrical component motherboard inside the base 5 of the apparatus main body 1 by a plurality of accommodated signal codes (not shown). The work tower 9 is supplied with power and control signals from the central control unit via these signal codes, and transmits image data indicating information on the component mounting position on the board to the central control unit.

The work tower 9 is freely movable by engaging with the X-axis rail 8 and the Y-axis rail 7 described above, and a suction nozzle 12 or a chuck corresponding to a part to be suctioned or gripped at the tip of the work head. In order to mount the mechanism, a desired suction nozzle 12 or a chuck mechanism is mounted on the holder exchanger 14, and a desired component is suctioned or gripped from the component supply device on the component supply stage 11, and the suctioned or gripped component is mounted. To
It is automatically loaded into the main body device 1 and mounted on a substrate that is positioned and fixed at a predetermined position.

At this time, the work tower 9 is located between the board guide rail 6 and the component supply stage 11 and is arranged alongside the holder changer 14 prior to the mounting of the components. It moves over the attached component recognition camera 15, causes the component recognition camera 15 to capture an image of the held state of the component being held, and transmits the captured image data to the central control unit. Further, the work tower 9 is controlled by a board recognition camera (not shown in the figure) provided inside the apparatus.
An image of the component mounting position on the board is taken and the image data is transferred to the central control unit.

The central control unit calculates a correction amount with respect to the mounting position specified by the program based on the image recognition result of the holding state of the parts, moves the work tower 9 based on the correction amount, and performs the work. The component holding position is corrected by rotating the tip of the head, and control is performed so that the component is mounted at a position that takes into account the correction amount of the mounting position of the substrate specified by the program.

FIG. 2 is a block diagram showing a system configuration of a central control unit which controls the component mounting apparatus 1 having the above configuration and executes a process of efficiently mounting components on boards having different destinations and specifications. In FIG. 1, the central control unit has a CPU (Central Processing Unit) 16 for controlling the entire apparatus, and the CPU 16 has a ROM (R) via a bus 17.
ead-Only-Memory) 18, RAM (Random-Access-Memory)
19, an image processing unit 21, a key input unit 22, and an i / o control unit 23 are connected.

The ROM 18 stores a basic program for control and processing, various basic data, and the like. These basic programs and basic data are read out by the CPU 16 to correct the rotation of the head 15 and the The mounting process is executed. The RAM 19 includes an i / o control unit 23
A plurality of areas for storing an NC program read from an external storage device via an external storage device, reference position data of a component mounting position, corrected deviation value data, and the like, and an area for storing the number of program executions and board production results described later. , And a work area for temporarily storing intermediate data of arithmetic processing.
The NC program is read out and executed by the CPU 16 on the basis of batch data described later.
It is referenced or updated by the CPU 16.

The image processing unit 21 is connected to a component recognition camera 15 shown in FIG. 1 and a board position recognition camera not shown in FIG. 1 via a signal line (not shown). It drives, converts the analog signal of the imaging into a digital signal, develops it into a built-in memory as a dot image, and transfers it to the CPU 16.

The key input section 22 is connected to input keys of an input device provided on the upper protective cover 2 of the apparatus main body 1 and to a touch panel provided on the display screen so as to be operated from outside. The signal is output to the CPU 16.
The i / o control unit 23 includes a driver for a belt drive motor for driving a conveyor belt, a driver for a servo motor for driving an X-axis rail or a Y-axis rail, a driver for driving a substrate sensor (not shown), and a support plate and its positioning. Various drivers such as a driver for a cylinder that raises and lowers a pin, a driver that drives an abnormality display lamp (alarm lamp) of an input device, a driver that displays and drives a liquid crystal display of an input device, and the like are connected to an external storage device. .

In such a configuration, the work tower 9 shown in FIG.
Engages with the X-axis rail 8 and the Y-axis rail 7 to freely move the working area back and forth, left and right, sucks the component with the suction nozzle 12, and holds the component holding position deviation and the holding angle with the component recognition camera 15. Is detected, and the part is automatically carried in and mounted on a substrate positioned at a predetermined position.

By the way, when executing the work of mounting components as described above, the NC program is executed while the process of skipping the NC program is not performed and the process of not skipping is performed according to the option number previously input by the operator. As described above, it is easy for an operator to make an input error, and the risk of causing a large number of defective products is high. Also, as described above, creating an independent NC program for each destination and for each difference in specifications requires time and effort for maintenance when the program specifications are changed.

In the present embodiment, the component mounting apparatus 1 solves the problem in the NC program described above,
Parts having different types and numbers depending on the destination and specifications of the product substrate can be easily mounted on the substrates having the same configuration or at least partly having a common part without error. This will be described below.

FIG. 3 is a diagram showing an example of a substrate used in this embodiment. The substrate shown in the same figure is a multiple board similar to that shown in FIG. In FIG. 3, the multiple board 25 is composed of two child boards 26 and 27. The mounting surface of the daughter board 26 is divided into four mounting surfaces, that is, mounting surfaces 26a, 26b, 26c, and 26d. Of these four mounting surfaces, the mounting surface 26a is a common part on which the same components are mounted by the same number even if the product substrate is directed at different locations or different specifications, and the other mounting surfaces 26b, 26c and 2
Reference numeral 6d denotes a portion where components are mounted or not mounted depending on a destination or a difference in specifications.

Actually, there are cases where the specifications are different even when the destination is the same, and there are cases where the specifications are the same even when the destination is different. In the following description, a place that should be called "destination or specification" is simply called "destination". That is, for example, a place that should be called “difference in destination or specification” is simply called “difference in destination”, and a place that should be called “by destination or specification” is simply called “by destination”. The term “specification” is used as it stands for “design standard” or “designated standard”.

The sub board 27 of the multiple board 25 shown in FIG.
The mounting surface is divided into four mounting surfaces 27a, 27b, 27c and 27d. Of these four mounting surfaces, the mounting surface 27a is a common portion where the same components are mounted by the same number even when the product substrate is directed to different locations,
The other mounting surfaces 27b, 27c and 27d are portions where components are mounted or not mounted depending on the difference in destination.

Actually, the mounting surface 26b of the daughter board 26
26c or 26d (the mounting surfaces 27b, 27c
Or the same applies to 27d), not only is the component mounted or not mounted depending on the destination, but also when the component is mounted, the type and number of mounted components may be different. However, in order to avoid complicating the description, in the following description, the description of the case where the type and number of components to be mounted are different will be omitted, and whether the component is mounted or not mounted depending on the destination will be omitted. The case is explained.

FIGS. 4A to 4D are diagrams showing examples of NC programs for mounting components on the mounting surfaces 26a, 26b, 26c, 26d of the sub board 26, respectively. ) ~
(h) shows each mounting surface 27a, 27b, 27
It is a figure which shows the example of NC program for mounting components to c and 27d. For example, in the example of the NC program shown in FIG.
NC program "and this NC program
6, a program name indicating that it is a program of the mounting surface 26a is described, and the next line 31 indicates “type: common”.
And a type of program indicating that the NC program is a program for a common mounting surface of the multiple board 25.

In the parameter area 32, characters / symbols "X", "Y", "θ" and "parts" indicating data divisions are described in the division row 33, and the parts to be mounted are described below them. Are provided in each data row area 34. In each data row area 34, the X coordinate of the component mounting position is below the "X" of the section row 33, and the component is below the "Y" of the section row 33. , The angle at the component mounting position under “θ” in the section row 33, and the part number or name of the component under “parts” in the section row 33 are described for each row. . And
Similarly, NC programs are created for the other mounting surfaces 26b, 26c, and 26d of the daughter board 26 as shown in FIGS. These NC programs are created by an operator based on CAD data or based on board design data and a component master table.

The mounting surfaces 26b, 26 which are not common parts
Regarding c and 26d, in the second line of the header section, “type: individual” is set, and the NC program is
The type of the program indicating that the program is for a mounting surface that is not common is described. In addition, the child board 27
Similarly, the NC programs are created for the mounting surfaces 27a, 27b, 27c, and 27d as shown in FIGS. 7 (e), (f), (g) and (h).

The NC programs shown in FIGS. 3A to 3H show only a header section and a parameter section, and do not show an arithmetic section, a counting section, and the like. FIG. 5A is a diagram showing an example of a correspondence table for associating a plurality of NC programs individually created for each mounting surface with each destination of a completed product board, as shown in FIG. b)
FIG. 5 is a diagram showing an example of an execution table for specifying NC programs sorted in the correspondence table in the order of execution. These correspondence tables and execution tables are created by the operator.

In the example of the correspondence table 35 shown in FIG. 6A, the destinations in the destination column 36 are domestic, A, B
, For country C, for country D,..., And in the NC program column 37 are individual NC programs corresponding to the respective destinations described above (in this case, individual "Individual" including common programs in the sense of corresponding programs) is described. For example, if the destination is “domestic”, the NC program names “26a, 26b, 27a, 27b” (FIGS. 4 (a), (b) and (e), (f) ) Is described.

The execution table 40 shown in FIG. 5B is constituted by batch data for sequentially designating the individual NC programs associated with each other by the correspondence table 35 in the order of execution. The execution table 40 shown in FIG.
An example of an execution table when the destination of (a) is “domestic” is shown. In the execution table 40, the batch data is described as “26aNC program, 26bNC program, 27aNC program, 27bNC program”. ing. When the operation of mounting components on the board is started, if the operator inputs the above-mentioned "domestic" instruction, the execution table 40 shown in FIG. 5B is automatically called.

FIG. 6 shows the CPU of the central control unit based on the correspondence table 35 corresponding to the destination and the execution table 40 when the destination is specified in advance.
16 is a flowchart of a component mounting process performed by No. 16. Here, the description will be made assuming that "domestic destination" is designated as the destination. That is, the "domestic" NC programs in the correspondence table 35 of FIG. 5A are executed. For the execution, the batch data in the execution table 40 is referred to. In this process, the CPU 1
An execution counter, an actual number counter, and an execution number counter which are built in 6 or set in a predetermined area of the RAM 19 are used.

In FIG. 6, first, a substrate is loaded (step S1). In this process, the board guide rails 6 (6-6) shown in FIGS.
The substrate 25 shown in FIG.
, And is positioned and fixed at a predetermined position.

Next, each counter is cleared to "0" (step S2). Thereby, the execution counter, the actual number counter, and the execution number counter are initialized to “0”.
Subsequently, the NC program of the row specified by the execution counter (the first row specified by the initial value “0”) from the execution table 40 is read from the program area of the RAM 19 (step S3), and the read is performed. NC
The program is executed (Step S4).

FIGS. 7 (a), (b), (c), and (d) show steps S
6 is a flowchart showing the processing of the NC program in FIG. First, as shown in FIG. 7 (a), FIG.
"2" described in the first line of the execution table 40 shown in FIG.
6aNC program "is read and executed (step S4-1). As a result, the component mounting process is performed on the mounting surface 26a, which is the common mounting surface of the sub-board 26 of the multiple board 25 shown in FIG.

After the mounting on the mounting surface 26a is completed, the execution number counter is incremented by "1", and
The fact that the component mounting on the mounting surface 26a by the aNC program has been executed is recorded (step S4-2), and the process ends. Subsequently, returning to FIG. 6, the execution counter is set to “1”.
After incrementing (step S5), the contents of the execution counter are referred to, and it is determined whether or not the numerical value is larger than the number of rows of the batch data in the execution table 40 (step S6). If the value of the execution counter is not larger than the number of rows of the batch data of the execution table 40 (S
6 is N), but the batch data, that is, N to be processed
The C program remains, and in this case, the process returns to step S3 to repeat the processes of steps S3 to S6.

By this repetitive processing, the batch data of the execution table 40 shown in FIG.
C program, followed by 26b NC program,
"27aNC program", "27bNC program"
Are sequentially read and executed.

As a result, "26aN" shown in FIG.
Execution of "C program" and "1" to the execution number counter
Following the increment processing, “26b” shown in FIG.
The execution of the "NC program" and the "1" increment processing to the execution number counter, "27aN" shown in FIG.
Execution of "C program" and "1" to the execution counter
Increment processing, and “27bNC” shown in FIG.
The execution of the "program" and the "1" increment processing to the execution number counter are performed, and the mounting surfaces 26a and 26b of the child substrate 26 of the multiple board 25 and the child substrate 2 shown in FIG.
7 is mounted on the mounting surfaces 27a and 27b.

In the specification for "domestic use", the multi-panel board 25 shown in FIG. 3 has the mounting surfaces 26a, 26b, 27a, 27
b, the components are mounted, and the remaining mounting surfaces 26c, 26d,
The parts are not mounted on the parts 27c and 27d. Also, for the same type of multi-panel substrate 25,
For example, when the destination for country A is designated, the NC program corresponding to destination A in the destination / individual program correspondence table 35 in FIG. 5A is stored in the execution table 40 shown in FIG.
Batch data (for country A, "26aNC program", "27aNC program", "27bNC program", "27cNC program", and "27dN program"
Each of the NC programs is executed based on the “C program”.
Components are mounted on 6a, 27a, 27b, 27c, and 27d.

As shown in FIG. 5 (a), the components are mounted on the common mounting surface 26a for all the destination boards, and the components are mounted on the common mounting surface 26a. If the 26aNC program is modified, it is not necessary to modify all the NC programs for each destination as in the prior art, and only the 26aNC program needs to be modified. Can respond.

[0053]

As described above in detail, according to the present invention, NC programs are individually created for the mounting surfaces divided in position corresponding to the destination of the board, and the destination and the individual NC program are created. Since the NC program is executed by the table corresponding to the program and the table for specifying the execution order of the NC program, the designation of the destination by the operator can always be easily performed without error.

Also, since there is only one program containing the same processing content without distinction between the individual processing and the common processing, even if the common processing content is changed, only one common processing program is modified. This is convenient because the NC program can be easily managed.

[Brief description of the drawings]

FIG. 1 (a) is a first example of automatically mounting electronic components on a circuit board.
Appearance perspective view of the component mounting apparatus according to the embodiment,
(b) is a perspective view schematically showing an internal configuration by removing upper and lower protective covers.

FIG. 2 is a block diagram illustrating a system configuration of a central control unit that controls a component mounting apparatus and performs a process of efficiently mounting components on substrates having different destinations and specifications.

FIG. 3 is a diagram illustrating an example of a substrate on which components are efficiently mounted.

FIGS. 4A to 4H are diagrams showing examples of NC programs for mounting components on each mounting surface of a sub board of a multi-panel board.

FIG. 5A is a diagram showing an example of a destination / individual program correspondence table in which a plurality of NC programs for each mounting surface are associated with each destination of a product board, and FIG. 5B is a destination / individual program correspondence table. It is a figure which shows the example of the execution order designation | designated table which designates the sorted NC program in the execution order.

FIG. 6 is a flowchart of a component mounting process performed by a CPU of a central control unit based on a destination / individual program correspondence table and an execution order designation table.

FIGS. 7A, 7B, 7C, and 7D are flowcharts showing processing of each NC program.

FIG. 8 is a diagram showing an example of a conventional circuit board.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Component mounting device (main device) 2 Display input device 3 Monitor device 4 Alarm lamp 5 Base 6 (6-1, 6-2) Board guide rail 7 (7-1, 7-2) Fixed rail (Y-axis rail) 8) Moving rail (X-axis rail) 9 Work tower 11 (11-1, 11-2) Component supply stage 12 Suction nozzle 13 (13-1, 13-2) Chain body 14 Holder exchanger 15 Component recognition camera Reference Signs List 16 CPU (Central Processing Unit) 17 Bus 18 ROM (Read-Only-Memory) 19 RAM (Random-Access-Memory) 21 Image processing unit 22 Key input unit 23 I / O control unit 25 Multi-panel boards 26, 27 Substrates 26a, 26b, 26c, 26d Mounting surface 27a, 27b, 27c, 27d Mounting surface 28 Header part 29 First row 31 Next row 32 Parameter area 33 Division row 34 Data row area 35 Correspondence table 36 Destination column 37 NC program column 40 Execution table

Continued on the front page (72) Inventor Fumiaki Kimura 1400-5, Higashi-Kone, Higashi-Kone, Higashine-shi, Yamagata F-term in Yamagata Casio Co., Ltd. 5B076 AB17 AC06 5E313 AA02 AA11 AA15 AA23 DD03 DD13 EE02 EE03 EE24 EE34 EE35 EE37 EE50 FG01

Claims (4)

[Claims] 1. A plurality of NC programs corresponding to a plurality of component mounting surfaces partitioned on a circuit board, and associating means for associating the plurality of NC programs with each destination or specification of the circuit board, Designating means for sequentially designating the NC programs associated by the associating means; and when the destination or specification is designated, the NC program associated with the designated destination or specification is designated by the designation means Execution means for sequentially executing in accordance with the specification by: a component mounting apparatus. 2. An execution number accumulating means for accumulating the number of executions for each NC program when the execution of the NC program is completed, and an execution number storage means for storing the accumulation result by the execution number accumulating means for each NC program. The component mounting apparatus according to claim 1, further comprising: 3. An actual number accumulating means for accumulating an actual number for each destination or specification of the circuit board when the execution of the NC program to all the mounting positions of the circuit board is completed; 2. The component mounting apparatus according to claim 1, further comprising: an actual number storage unit that stores an accumulation result by the accumulation unit for each destination or specification. 4. A component mounting method for mounting electronic components of different types and numbers depending on the destination and specifications of a product board on a circuit board having a common part at least in part. A procedure for individually dividing each component mounting surface in which a component mounting method differs depending on a destination or a specification, a procedure for individually creating an NC program corresponding to each of the plurality of individually partitioned component mounting surfaces, A procedure for associating a plurality of individually created NC programs for each destination or specification; a procedure for sequentially specifying these associated NC programs; and when the destination or specification is designated, And a procedure for executing the NC program associated with the destination or specification in the specified order. Method.