CN108352308A - Die pick-up equipment - Google Patents
Die pick-up equipment Download PDFInfo
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- CN108352308A CN108352308A CN201680062745.8A CN201680062745A CN108352308A CN 108352308 A CN108352308 A CN 108352308A CN 201680062745 A CN201680062745 A CN 201680062745A CN 108352308 A CN108352308 A CN 108352308A
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- wafer
- bare chip
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- chip
- label
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
A kind of die pick-up equipment comprising：Photographic device (8), the image of shooting wafer (W), the wafer are cut into multiple chips (C) and pay the wafer for having the label (Rm) for indicating reference position in arbitrary chip (Cs) subscript；Storage part (17), prestores setting position relationship, which is the position relationship of the known reference position (P) and the label (Rm) of the wafer on wafer；Processing unit (183) is extracted, image procossing is carried out to the image of captured wafer, the characteristic of the shape of label (Rm) and wafer is extracted, reference position (P) is exported according to the characteristic of the shape；Abnormity detection portion (184), to the image according to the wafer, the reference position (P) of determination and the setting position relationship for marking the absolute fix relationship of (Rm) and storage part (17) to be stored are compared to the malposition of detection label (Rm).
Description
Technical field
The present invention relates to the die pick-up equipments of pickup chip (die) in the wafer (wafer) after being cut.
Background technology
It has been known that there is in the wafer after being cut pick up bare chip (chip (die)) and be installed to substrate element install dress
It sets.The element fixing apparatus has the head that can individually adsorb bare chip and controls the control unit of the action on the head.Institute
State control unit according to for the wafer as absorption object and the qualified or not wafer figure of each bare chip of expression of pre-production come
So that the head is moved, successively bare chip of the absorption as target (referring for example to patent document 1).
When carrying out absorption action, in order to make the wafer figure and the bare chip of actual wafer align, reference sometimes
Set on the reference marker of wafer.The reference marker is, for example, to mark to be attached to beating on the bare chip of specific coordinate in wafer
Marking is remembered.Alternatively, in the making of wafer, also the bare chip formed without pattern (minute surface chip) can be formed in spy sometimes
Fixed coordinate and using the minute surface chip as utilizing with reference to label.On the control unit is identified according to the shooting image of wafer
The position of the reference marker is carried out the wafer figure and wafer suitable for wafer figure by the position for stating such reference marker
The contraposition of bare chip.Moreover, the control unit identifies the position of the bare chip of first absorption point using reference marker as benchmark,
The head is allowed to execute attraction action.
However, it some times happens that so-called printing deviates that is, the reference marker is not printed to desirable bare chip
On situation.Or it some times happens that because after correctly being printed bare chip or minute surface chip stuck up relative to the bonding plane of wafer
Act the position offset of reference marker caused by waiting.If these offsets are big, the wafer figure and crystalline substance just cannot be correctly carried out
The contraposition of round bare chip causes the control unit mistakenly to identify the position of the bare chip of absorption initial point.In this case, just not
The picking task for the bare chip implemented by the wafer figure can be carried out, representative picking task is the qualified bare chip of pickup
Operation.
Following technology is disclosed in the device of patent document 1：It not only identifies reference marker but also identifies wafer ID marks
Note, and seek the position offset between wafer ID labels and wafer figure.However, the technology of patent document 1 may not apply to not
There are the wafers of wafer ID labels.In addition, the technology of patent document 1 does not consider the problem of position offset of reference marker, and
And due to wafer ID label be also marked bys laser printing etc. it is attached, it is thus also possible to the problem of printing offset occurs.
Existing technical literature
Patent document
Patent document 1：Japanese Laid-Open Patent Publication 2013-197225
Invention content
The present invention makees in view of the above circumstances, and its purpose is to provide a kind of following die pick-up equipments：Even if ginseng
The position for examining label is deviated the position that also can correctly determine chip.
One aspect of the present invention is related to die pick-up equipment comprising：Photographic device shoots the image of wafer, described
Wafer is cut into multiple chips and pays the wafer for having the label for indicating reference position in arbitrary chip subscript；Storage part,
Prestore setting position relationship, the setting position relationship for known reference position and the wafer on the wafer institute
State the position relationship of label；Processing unit is extracted, image procossing is carried out to the image of the captured wafer, extracts the label
With the characteristic of the shape of the wafer, and the reference position is exported according to the characteristic of the shape；And
Abnormity detection portion, to the image according to the wafer absolute fix relationship of the reference position of determination and the label with
The setting position relationship that the storage part is stored is compared to detect the malposition of the label.
The purpose of the present invention, feature and advantage become to become apparent by detailed description below and attached drawing diagram.
Description of the drawings
Fig. 1 is to indicate that the integrally-built of element fixing apparatus for applying die pick-up equipment according to the present invention bows
Plan view depending under.
Fig. 2 is the exploded perspective view for indicating the mechanical structure portion of die pick-up equipment in the element fixing apparatus.
Fig. 3 is the block diagram for the control system for indicating the element fixing apparatus.
(A) of Fig. 4 is the vertical view of wafer, and (B) of Fig. 4 is the figure for an example for indicating wafer figure.
Fig. 5 is the figure for an example for indicating reference marker.
(A) and (B) of Fig. 6 is the figure for indicating the undesirable example of reference marker.
(A) of Fig. 7 is the vertical view of notched wafer, and (B) of Fig. 7 is the vertical view of the wafer with directional plane.
Fig. 8 is the functional block diagram of main operational part.
Fig. 9 is the figure of the first embodiment for the malposition for indicating detection reference marker.
Figure 10 is the figure for indicating to adsorb the ad hoc approach of bare chip for the first time in first embodiment.
Figure 11 is the figure of the variation for illustrating first embodiment.
Figure 12 is the figure of the second embodiment for the malposition for indicating detection reference marker.
Figure 13 is the figure of the variation for illustrating second embodiment.
Figure 14 is the flow chart for the action for indicating the element fixing apparatus.
Figure 15 is the figure for illustrating corner correction processing.
Specific implementation mode
[explanation of element fixing apparatus]
Hereinafter, the embodiment that the present invention will be described in detail with reference to the accompanying drawings.Die pick-up equipment according to the present invention can
It is installed suitable for such as chip soldering apparatus, by the wafer storage after being cut in the apparatus for loading of material strip or by the chip
In the various devices such as the element fixing apparatus of substrate.Herein, which is applied to the example of element fixing apparatus
It illustrates.
Fig. 1 is the element fixing apparatus 100 for indicating to apply the die pick-up equipment D involved by embodiments of the present invention
Integrally-built vertical view under plan view.Fig. 2 is the main machinery for indicating die pick-up equipment D in element fixing apparatus 100
The exploded perspective view of structure division.Element fixing apparatus 100 is a kind of wafer W taking-up chips (die that can be after being cut
(hereinafter referred to as bare chip C)) and it is installed to the chip component that on printed base plate 20 and tape feeder 31 can be supplied
The compound element fixing apparatus being installed on printed base plate 20.
Element fixing apparatus 100 includes：Base station 1；Conveyer belt 2；Liang Ge chip components supply department 3；Mounting portion 4；Wafer is protected
Hold platform 5；Upper pushed section 6 (is only shown in Fig. 2)；Taking-up portion 7；Element identifies video camera 8 (photographic device)；Fixed video camera 9；Wafer
Incorporating section 10；And control unit 12.
Printed base plate 20 is moved to specified installation exercise position by conveyer belt 2, by printed base plate after installation exercise
20 move out from the job position.Conveyer belt 2 includes：The conveyer belt main body extended along the X-direction of conveyance printed base plate 20；
The detent mechanism (not shown) that printed base plate 20 is promoted and positioned in the conveyer belt main body.Conveyer belt 2 is by printed base plate
20 are transported with approximate horizontal posture from X2 direction sides towards X1 direction sides in X direction, and the positioning of printed base plate 20 is fixed on finger
Fixed installation exercise position (two printed base plates shown in FIG. 1,20 position).
Liang Ge chip components supply department 3 is separately positioned on the both ends of the front side (Y1 direction sides) of element fixing apparatus 100.
The chip components such as 3 supply transistor of chip component supply department, resistance, capacitor.Equipped with load in chip component supply department 3
Multiple tape feeders 31 of band, the carrier band remain the chip component with appointed interval.31 interval of each tape feeder
The carrier band is sent out on ground, and the chip component, which is passed out to specified element, supplies position.
Bare chip C or chip component are installed on printed base plate 20 by mounting portion 4.Mounting portion 4 includes two head units (the
One head unit 41 and the second head unit 42) and their support element (the first support element 43 and the second support element 44).First, second
Head unit 41,42 respectively can be on top (directions Z2) position edge of conveyer belt 2 by the XY mobile mechanisms that the illustration is omitted
Horizontal direction (directions XY) is mobile.First head unit 41 using on base station 1 mainly upstream side (X2 direction sides) region as
Movable area, the second head unit 42 is to be mainly the region in downstream side (X1 direction sides) as movable area.
The first head unit 41 is illustrated in Fig. 2.There is first head unit 41 the two elements installation being arranged along the X direction to use
The substrate of first 411,412 and one identifies video camera 45.Second head unit 42 is also the same.Element installation with first 411,412 based on by
Negative pressure occur machine generations (not shown) negative pressure and can be adsorbed using its distal portion and keep from tape feeder 31 supply come
Chip component or from aftermentioned taking-up portion 7 supply come bare chip C.Mounting portion 4 makes the chip component or bare chip C absorption
In first 411,412 distal portion of element installation, and install them on printed base plate 20.
Substrate identification video camera 45 is the video camera for shooting printed base plate 20.Element is installed to by the first head unit 41
Before printed base plate 20, this is attached to identify according to the shooting image of the printed base plate 20 shot by substrate identification video camera 45
Reference mark (fiducial mark) on printed base plate 20.Thus the position offset of printed base plate 20 is identified, make corrections element
Position offset when installation.
Wafer incorporating section 10 accommodates the polylith wafer W after being cut, and is arranged on the front of element fixing apparatus 100
The central portion of side (Y1 direction sides).Wafer W is held in substantially circular retainer 11.Wafer incorporating section 10 includes that will keep
The host rack accommodated to about 11 multilayer of retainer of wafer W and the driving unit for driving the host rack to lift.It is contained in
Each wafer W of wafer incorporating section 10 in the state that bare chip C is attached in the wafer board (wafer sheet) of film-form,
Device 11 is kept by the wafer board to keep.Lifting of the wafer incorporating section 10 based on the host rack and make desirable wafer
The specified disengaging height and position that can be passed in and out relative to wafer holding station 5 is arrived in W settings.
Wafer holding station 5 supports the wafer W being drawn out from wafer incorporating section 10.Element fixing apparatus 100 has disengaging machine
Structure (not shown), the inlet/outlet mechanism are pulled out from wafer incorporating section 10 and are carried in wafer holding station 5 or opposite into being about to wafer W
Wafer W is sent back to the action in wafer incorporating section 10 by ground from wafer holding station 5.Wafer holding station 5 has circle in central portion
The opening portion of shape, and in such a way that the opening portion of the opening portion, the opening portion of retainer 11b, wafer holding station 5 coincides with one another
To keep retainer 11.
Wafer holding station 5 takes out job position in element and wafer receives to move in 1 upper edge Y-direction of base station between position
It is dynamic.Specifically, a pair that wafer holding station 51 is movably arranged on base station 1 in a manner of extending along Y-direction is fixed
Track 5 supports, and is moved along trapped orbit 51 based on specified driving unit.Driving unit includes：With trapped orbit 51
It extends parallel to and is threaded into the ball screw axis 52 in the nut portion of wafer holding station 5；For driving ball screw axis
The drive motor 53 of 52 rotations.Wafer holding station 5 takes out job position by the lower position of conveyer belt 2 in specified element
Receive to move between position with the wafer of 10 vicinity of wafer incorporating section.
The bare chip group of the wafer W in the wafer holding station 5 on job position is taken out in element by that will be arranged in upper pushed section 6
In become take out object bare chip C from its downside up push away, to make bare chip C be gone up while removing from wafer board
It rises.Upper pushed section 6 includes above cut somebody's hair 61 and trapped orbit 62.On cut somebody's hair 61 have be built-in with distribution the first upper push-rod 611 and
Second upper push-rod 612.First, second upper push-rod 611,612 is based on occurring what machine (not shown) was generated in its distal portion by negative pressure
Negative pressure and adsorb bare chip C.The position offset of bare chip C when thereby, it is possible to inhibit above to push away.
Trapped orbit 62 is fixed on base station 1, and cut somebody's hair by 61 can movably be supported in X direction.Upper pushed section 6
Have 61 driving mechanisms moved along trapped orbit 62 that make to cut somebody's hair.The driving mechanism includes as drive of cutting somebody's hair in driving source
Dynamic motor 63 (with reference to Fig. 3).It is configured based on above cutting somebody's hair 61 in a manner of it can move in X direction, cuts somebody's hair on this and 61 just can
It enough is directed to be supported on and only can above push away arbitrary bare chip C along the wafer W in the wafer holding station 5 that Y-direction moves.
Taking-up portion 7 (head) is by the bare chip C absorption (pickup chip) postponed in the portion that is pushed 6 and is delivered to first list
Member 41 or the second head unit 42.Taking-up portion 7 top (the side Z2 of job position is taken out in element based on specified driving unit
To) (directions XY) is mobile in the horizontal direction for position.Taking-up portion 7 includes：Four head wafer 7a to 7d；Beam 7e；Two holders
Component 7f；Two head wafer rotation motor 7h；Head wafer lift motor 7i (with reference to Fig. 3).
Head wafer 7a to 7d can be turned about the X axis, and can be moved in (Z-direction) in above-below direction.Head wafer 7a is extremely
7d adsorbs bare chip C based on the negative pressure generation machine by illustration omitted in the negative pressure that its distal portion generates.Head wafer 7a to 7d exists
Bare chip C is delivered to element installation head 411,412 by specified delivery position.The branch of head wafer 7a, 7b based on X2 direction sides
Frame component 7f and be supported with capable of turning about the X axis, head wafer 7c, 7d can be around X based on the bracket component 7f of X1 direction sides
Axis is rotationally supported.
Head wafer rotation motor 7h is can with the position of (Z-direction) up and down of head wafer 7a, 7c and head wafer 7b, 7d
The mode replaced mutually drive they rotate motor.This be in order to make the bare chip C adsorbed by head wafer 7a to 7d into
Row reversion (overturning).Two bracket component 7f are able to be supported up and down by beam 7e.Head wafer lift motor
7i is the driving source for making bracket component 7f be lifted relative to beam 7e, and head wafer 7a to 7d is lifted as a result,.
As shown in Figure 1, the driving unit in taking-up portion 7 includes：A pair of of trapped orbit 71；Beam 72；A pair of of ball screw
Axis 73；A pair of of beam drive motor 74.A pair of of trapped orbit 71 is fixed on base station 1, separate appointed interval in the X direction and that
This parallelly extends along Y-direction.Beam 72 extends in X direction, and both ends are movably supported on trapped orbit 71 respectively
On.A pair of of ball screw axis 73 is disposed proximate to the position of trapped orbit 71 in a manner of extending along Y-direction, is threaded into respectively
In the nut part (not shown) at 72 both ends of beam.A pair of of beam drive motor 74 drives ball screw axis 73 to rotate.
Taking-up portion 7 and element identification video camera 8 are carried on beam 72.Based on the work of a pair of of beam drive motor 74,
Beam 72 is moved along trapped orbit 71, with the movement of the beam 72,8 one of taking-up portion 7 and element identification video camera
It is moved along Y-direction on ground.Be provided on the end of the sides X1 of beam 72 for make taking-up portion 7 along beam 72 in the X direction
Mobile drive motor 75 and the drive motor 76 for making element identification video camera 8 be moved in the X direction along beam 72.
Element identification video camera 8, which is shot in bare chip C before being picked in wafer W, to be positioned in wafer holding station 5
The image of wafer W (bare chip C).Captured image data is output to control unit 12.In present embodiment, according to by element
The image of the wafer W captured by video camera 8 is identified to extract the characteristic of the shape of wafer W.
Fixed video camera 9 is in the respective movable area for the first, second head unit 41,42 being arranged on base station 1
Element identification video camera.Fixed video camera 9 is shot from downside (Z1 direction sides) by the member of the first, second head unit 41,42
The element that part installation head 411,412 adsorbs, and its picture signal is output to control unit 12.
Control unit 12 plans as a whole the action in each portion of ground control element mounting device 100.Fig. 3 is to indicate element fixing apparatus
The block diagram of 100 control system.Control unit 12 and drive motor 53, on cut somebody's hair drive motor 63, beam drive motor 74, driving
Motor 75, drive motor 76, head wafer rotation motor 7h, head wafer lift motor 7i, element identification video camera 8, fixed camera shooting
Machine 9 and substrate identification video camera 45 are electrically connected.In addition, control unit 12 is also electrically connected with the input equipment of illustration omitted, base
It is entered the various information based on user in the operation of the input equipment.It is built in moreover, also inputting to come to control unit 12
The output signal of the position detection units such as the encoder (not shown) in each drive motor.
Control unit 12 has axis control unit 13, image processing part 14, I/O processing units 15, communication control unit 16, storage part 17
And main operational part 18.Axis control unit 13 is the driver for driving each drive motor, is made according to the instruction for carrying out autonomous operational part 18
Each drive motor work.Image processing part 14 is to from each video camera, (element identifies that video camera 8, fixed video camera 9 and substrate identify
Video camera 45) image data of input carries out various image procossings.The control of I/O processing units 15 comes from 100 institute of element fixing apparatus
The input of the signal for the various sensors (not shown) having and the output of various control signals.Communication control unit 16 control with
Communication between external device (ED).Storage part 17 stores the various programs and various data etc. such as installation procedure.Main operational part 18 is planned as a whole
Ground controls control unit 12 and executes various calculation process.About the functional structure of main operational part 18, carried out according to Fig. 8 below
Narration.
Control unit 12 controls each drive motor etc. according to preset program, and to control conveyer belt 2, wafer is kept
The action of platform 5, upper pushed section 6, taking-up portion 7 and the first, second head unit 41,42.Adjust 7 (head wafer of taking-up portion as a result,
7a to 7d) absorption bare chip C absorption position.In addition, by control unit 12 come carry out wafer W relative to wafer incorporating section
10 disengaging, the pickup of bare chip C and the element based on the progress of the first, second head unit 41,42 are installed from wafer W
Etc. the control of a series of action.
[about wafer figure (wafer map) and its bad]
As one of the various data being stored in storage part 17, there is wafer figure.(A) of Fig. 4 is representative wafer W
Plan view under overlooking, (B) of Fig. 4 is the figure for an example for indicating the wafer figure WM in relation to wafer W.Such as (A) institute of Fig. 4
Show, there is multiple formed by cutting to be independent bare chip C in wafer W.Bare chip C is in wafer board along the side XY
To state arranged in arrays.The position of each of these bare chips C is managed by the address based on XY coordinate systems.
Wafer figure WM is that record it based on specified benchmark about each bare chip C having in wafer W be certified products
The either file of the evaluation of defective work.Evaluation of estimate with the address of bare chip C is corresponding respectively is associatedly described.Fig. 4's
(B) in, " 1 " indicates the bare chip C of certified products, " 2 " indicate not to be defective work but the low bare chip C of grade, and " 3 " indicate not
The bare chip C of certified products.In addition, " n " indicates that bare chip C is not present on the address.Control unit 12 by taking-up portion 7 from wafer
When picking up bare chip C in W, the sequence of pickup is set with reference to wafer figure WM, in turn only picks up the bare chip C of certified products.
Herein importantly, the position for the wafer W (bare chip C) being positioned in now in wafer holding station 5 and wafer figure WM
Contraposition.Contraposition described herein refers to the XY coordinates of the address and the address on wafer figure WM on the wafer W of each bare chip C
Contraposition.If two coordinates are inconsistent, the bare chip C that such as defective work of " 3 " evaluation can occur is picked, or is thought only originally
The problems such as picking up the bare chip C of " 1 " evaluation, but having picked up the bare chip C of " 2 " evaluation.In order to carry out above-mentioned contraposition, sometimes
It can use and mark the reference marker (label for indicating reference position) for investing wafer W in advance.
Fig. 5 is the figure for an example for indicating reference marker Rm.In Figure 5, the figure of upside is the overall diagram of wafer W, mark
Show that the enlarged drawing of the frame portion A on wafer W is the figure of downside.It is located at specific coordinate in the bare chip C that wafer W has
On bare chip (arbitrary chip) be preset as benchmark bare chip Cs.Reference marker Rm is by laser mark etc.
Means and mark the franking being attached on benchmark bare chip Cs.When benchmark bare chip Cs is arranged on the manufacture of wafer W sometimes
On the minute surface chip formed without pattern.In minute surface chip, minute surface itself becomes reference marker Rm.In either case
Under, benchmark bare chip Cs is in the shooting image of wafer W and can recognize that in the state of other bare chip C.
As described above, element identification video camera 8 shoots the image of wafer W (bare chip C) before bare chip C is picked.
The image data obtained based on the shooting is in image processing part 14 by image procossing, and reference marker Rm is wafer W's as a result,
It shoots and is identified on image.The address of benchmark bare chip Cs is it is known that therefore, by will it is suitable for wafer figure WM, Neng Goujin
Row is positioned in the contraposition of the address and wafer figure WM of the bare chip C on the wafer W in wafer holding station 5 now.Moreover, control unit
12 identify the position of the bare chip C of the absorption initial point in pickup sequence on the basis of reference marker Rm, and taking-up portion 7 is allowed to hold successively
Row attraction acts.
However, reference marker Rm is it some times happens that exception.(A) of Fig. 6 and (B) of Fig. 6 are to indicate that reference marker Rm is bad
Example figure.(A) of Fig. 6 illustrates the bad of " tilting " of benchmark bare chip Cs.Include the bare chip C of benchmark bare chip Cs
It is adhered to wafer board, but causes benchmark bare chip Cs to be tilted from wafer board for some reason sometimes.In this case, i.e.
Reference marker Rm is set normally to be printed upon on benchmark bare chip Cs, institute is identified with reference to mark on the shooting image of wafer W
The position of note Rm can also be offset between the identification position of the real position of benchmark bare chip Cs.
(B) of Fig. 6 illustrates the bad of " the printing offset " of reference marker Rm.This situation is that reference marker Rm is not printed
Situation at the center of benchmark bare chip Cs.This bad situation for not occurring at minute surface chip, but in reference marker Rm quilts
It prints in the case of wafer W, is likely to occur because of reasons such as the target offsets of laser mark afterwards.In the case,
On the shooting image of wafer W the position of identified reference marker Rm be offset between the real position of benchmark bare chip Cs
Identification position.
When the degree of above-mentioned " tilting " or " printing offset " is big, that is, the real position of benchmark bare chip Cs and image
On reference marker Rm position offset it is big when, cannot correctly carry out the contraposition of the bare chip C of wafer figure WM and wafer W,
The case where being likely to occur the position of the bare chip C of 12 wrong identification of control unit absorption initial point.Such as the offset is bare chip C
Arrangement spacing 1/2 or more when, it is possible to generation the adjacent bare chip C of benchmark bare chip Cs is identified on wafer figure WM
On the basis of bare chip Cs the case where.The situation is referred to as map migration, if map migration occurs, can not carry out implementing by wafer figure WM
Bare chip C picking task.
[first embodiment]
It is above-mentioned bad in order to clear up, in present embodiment, before the picking task of bare chip C, extracts wafer W and had
The characteristic of standby intrinsic shape.Moreover, according to the reference position derived from the characteristic of the shape and reference marker
Position relationship between Rm detects the malposition of reference marker Rm.When having detected malposition, depositing in order to prevent
Pickup in the state of map migration, such as give a warning.
As the characteristic of the shape, as long as the intrinsic shape from the wafer W shapes having, then do not have
There is special limitation.In first embodiment, as the characteristic of the shape, illustrates and utilize the knot for indicating wafer W
Crystallographic axis to expression shape example.For example have as such expression shape：Notch or directional plane.These are all as table
The part for showing specific shape for showing the axial expression shape of crystallization of wafer W and being attached on any wafer W.
(A) of Fig. 7 is the vertical view for the wafer WL for setting up jagged N.Notch N is that have opening on the periphery of wafer WL
Cut-out, which has the shape of V-shape or U-shaped made of the radial center towards wafer WL is cut into.
Notch N is the expression for the expression crystallization axial direction for being mainly used in the bigbore wafer WL that wafer size is 8 to 12 inch
Shape.(B) of Fig. 7 is the vertical view for the wafer WS for being attached to directional plane OF.Directional plane OF is the circular arc periphery of wafer WS
A part be removed and be formed with the part of straight line portion Wa.Directional plane OF is be mainly used in 2 to 6 inches small-bore
The expression shape of the expression crystallization axial direction of wafer WS.
Fig. 8 is the Function Block Diagram of the main operational part 18 of the processing for realizing first embodiment.Main operational part 18 is based on
It executes specified program and picks up control unit 181, rotation correcting section 182 (correcting section), extraction control unit functionally to have
183, the mode of abnormity detection portion 184 and abnormal notification unit 185 works.
It picks up control unit 181 and controls taking-up portion 7, to execute the action of pickup bare chip C.Specifically, pickup control unit
181 read the wafer for being stored in storage part 17 in association with the identification number for the wafer W being positioned in now in wafer holding station 5
Scheme WM, the pickup sequence of setting bare chip C allows taking-up portion 7 to execute picking action.Control unit 181 is picked up to have been marked attached and referred to
It marks the benchmark bare chip Cs of Rm to be used as benchmark, determines to allow the bare chip C that taking-up portion 7 is initially picked up.
Rotation correcting section 182 carries out the registration process of the rotation direction for the wafer W being mounted in wafer holding station 5.Rotation
Correcting section 182 identifies the shooting image of the wafer W in the wafer holding station 5 captured by video camera 8 according to element, such as extracts brilliant
Justify the cutting line of W to seek indicating the corner of the offset of the cutting line relative to specified datum line.Rotate correcting section 182
When there is the offset, the processing for generating corner correction data corresponding with the offset is carried out.
Extract the shooting image that control unit 183 obtains image processing part 14 to the wafer W captured by element identification video camera 8
The image data after image procossing is carried out.Control unit 183 is extracted according to acquired image data, extract reference marker Rm and
The characteristic of the shape of wafer W.In first embodiment, the characteristic of shape is notch N or directional plane OF, these portions
Position is for example determined by edge is extracted and handled on the image.In addition, extract control unit 183 according to the characteristic of shape and
Export reference position P.
Abnormity detection portion 184 is obtained according to the image of wafer W and the coordinate of the reference position P of determination and reference marker Rm
Coordinate seeks the absolute fix relationship of the two.In addition, abnormity detection portion 184 reads 17 pre-stored reference position P of storage part
Coordinate and reference marker Rm coordinate, obtain as the two position relationship setting position relationship.Due to reference position P and
Reference marker Rm is set on the known position of wafer W, therefore, can be pre-stored within using these coordinates as setting value
Storage part 17.Moreover, abnormity detection portion 184 carries out following processing：The absolute fix relationship and the setting position are closed
System is compared, to detect whether reference marker Rm is printed on specified position that is, with the presence or absence of the position of reference marker Rm
It is abnormal.
Abnormal notification unit 185 is installed in element and is filled when abnormity detection portion 184 detects the malposition of reference marker Rm
Set the alert message that the meaning of malposition has occurred in display on the display (illustration omitted) that 100 have.Alert message can
Use the degree in for example described malposition for the arrangement spacing of bare chip C 1/2 or more when the setting transmitted messages.By
This, can urge user to be modified processing, so that the element fixing apparatus 100 in the state of being likely to occur map migration
Operation will not continue to down.It recognizes the user of alert message, such as is instructed the naked core adsorbed for the first time using input equipment
The input of the address of piece C, and make since the pickup of the bare chip C of wafer W.
Fig. 9 illustrates the wafer WL with notch N, is that first of the malposition for illustrating to detect reference marker Rm is real
Apply the figure of mode.In Fig. 9, the enlarged drawing of the frame portion A1 comprising reference marker Rm is illustrated on the downside of the overall diagram of wafer WL,
It illustrates to form the enlarged drawing of the frame portion A2 of jagged N on right side.As described according to Fig. 5, in the naked core that wafer W has
The benchmark bare chip Cs subscripts positioned at preferred coordinates in piece C have reference marker Rm.Notch N is to cut the periphery of wafer WL
Part mode and the notch of U-shaped that is formed.
After such wafer WL is moved to wafer holding station 5 from wafer incorporating section 10, control unit 12 makes element identification camera shooting
Machine 8 shoots the flat image of wafer WL.Image data acquired by the shooting is input into the image processing part of control unit 12
14.Image processing part 14 carries out described image data the processing of the edge in such as detection image, extracts the shape of wafer WL
Shape and the pattern being shown on wafer WL.
Then, the outer shape data for extracting wafer WL of the control unit 183 to being extracted are applied and such as notch N phases
When template processing, extract as wafer WL shape characteristic notch N.Moreover, according to the shape of notch N, lead
Go out reference position P.Specifically, extract control unit 183 substitutes into XY coordinate systems by the outer shape data of wafer WL, seek providing
The coordinate of toward each other two opening edges N1, N2 of the notch of notch N.Moreover, export opening edge N1, N2 intermediate point using as
Reference position P.The coordinate of reference position P is set as (X0, Y0).
The pattern data of the wafer WL extracted is applied and such as reference marker Rm in addition, extracting control unit 183
The comparable template of the shape ellipse of lengthwise (in Fig. 9 be) processing, extract reference marker Rm.Moreover, extract control unit 183 into
Row seeks the processing at the center of elliptical reference marker Rm.The centre coordinate of reference marker Rm is set as (X1, Y1).
The position relationship of reference position P and reference marker Rm are illustrated in Figure 10.In addition, being also illustrated in Figure 10 from benchmark
Direction vector V11 of the coordinate (X0, Y0) of position P toward the centre coordinate (X1, Y1) of reference marker Rm.Moreover, going back table in Figure 10
First absorption bare chip C1 is shown.First absorption bare chip C1 is the bare chip for being designated to be adsorbed for the first time in wafer figure WM.
The centre coordinate of first absorption bare chip C1 is (X2, Y2).The position of first absorption bare chip C1 is on the basis of reference marker Rm
And it is identified.It is also illustrated in Figure 10 from the center of the past first absorption bare chip C1 of centre coordinate (X1, Y1) of reference marker Rm
The direction vector V2 of coordinate (X2, Y2).If the coordinate of first absorption bare chip C1 can be identified, due to the first absorption bare chip
The opposite position relationship of C1 and other bare chip C are it is known that therefore, pickup control unit 181 can be such that taking-up portion 7 correctly holds
The action of the later pickup bare chip C of row.
Hereafter, abnormity detection portion 184 obtains the coordinate (X0, Y0) for extracting 183 obtained reference position P of control unit and ginseng
The centre coordinate (X1, Y1) for examining label Rm, seeks the direction vector V11 of the absolute fix relationship as the two.Moreover, abnormal inspection
Survey portion 184 is obtained to direction vector V11 and according to the position relationship of the reference position P and reference marker Rm that are stored in storage part 17
To direction vector (setting position relationship) be compared.Compare processing by this to judge whether reference marker Rm is printed on
Specified position.If two direction vectors are consistent or substantially consistent, there is no the positions of reference marker Rm for the judgement of abnormity detection portion 184
Set exception.In this case, being used as starting point with the centre coordinate (X1, Y1) of reference marker Rm, there will be signified in direction vector V2
Position on bare chip C be identified as adsorbing bare chip C1 for the first time, begin to pick up operation.
On the other hand, there is 1/2 or more of the spacing if two direction vectors are scaled the arrangement spacing of bare chip C
Offset, then there are the malpositions of reference marker Rm for the judgement of abnormity detection portion 184.At this point, with identified ginseng on the image
Examine label Rm as on the position of direction vector V2 meaning of starting point there is no for the first time adsorb bare chip C1 and there is its peripheries
The possibility of bare chip C increase.Therefore, abnormity detection portion 184 does not allow picking task to start and abnormal notification unit 185 is allowed to inform
The malposition of reference marker Rm.
Figure 11 is the figure of the variation for illustrating first embodiment.Wafer shown in Figure 11 is with directional plane OF
Wafer WS.Wafer WS has straight line portion Wa made of the partial cut-out of its circular arc periphery.In wafer WS, it is easy to hold
Shape characteristic be straight line portion Wa the both ends corner P11 and P12 that intersect with the circular arc periphery of wafer WS.
In the case of such wafer WS, extracts control unit 183 and determined first according to the image data of wafer WS
The position of corner P11 and P12, seek its coordinate.Then, the angle that control unit 183 exports the corner P11 and another party of a side is extracted
The intermediate point of portion P12 that is, the intermediate point of straight line portion Wa, using as reference position P.Moreover, extracting control unit 183 extracts reference
Label Rm and the coordinate for seeking its center.
Later processing is as described above.That is, abnormity detection portion 184 seeks the center of reference position P and reference marker Rm
The absolute fix relationship that is, direction vector V12 of coordinate.Its direction vector V12 is illustrated in Figure 11.Moreover, abnormity detection portion
184 couples of direction vector V12 and compare from the direction vector of the reference position P toward the reference marker Rm that are stored in storage part 17
Compared with whether judgement reference marker Rm is printed on specified position.There is no when the malposition of reference marker Rm, marked with reference
The centre coordinate of Rm is remembered as starting point, and there will be the bare chip C on the position of direction vector V2 meanings to be identified as adsorbing for the first time
Bare chip C1, begins to pick up operation.In addition, in this variation, if having carried out the rotation correction of wafer WS (later according to Figure 15
Narration), then it can also be using the position itself of corner P11 or P12 as reference position P.
[second embodiment]
The example that reference position P is set not against notch N or directional plane OF is illustrated in second embodiment.Figure 12
It is the figure of the second embodiment of the malposition for illustrating to detect reference marker Rm.As shown in figure 12, usual wafer W has
Circular shape.In second embodiment, the circular shape of the periphery of wafer itself is treated as the characteristic of shape.
Therefore, wafer W can be the arbitrary of the other display units for having notch N, directional plane OF or indicating other crystallization axial direction
Wafer.
After element identification video camera 8 obtain the planar image data of wafer W, image processing part 14 carries out edge inspection
Survey pattern of the processing to extract the outer shape of wafer W and be shown on wafer WL.Then, control unit 183 is extracted according to being taken out
The outer shape data of the wafer W taken seek the circular arc vertex of the outer peripheral edge of wafer W.X-direction and y-direction is illustrated in Figure 12
Four circular arc vertex P21, P22, P23, P24.
In second embodiment, reference position P is the center of the wafer derived from the circular shape of wafer W.That is, taking out
Control unit 183 is taken to seek the seat of the center of circular wafer W from the coordinate of four circular arc vertex P21, P22, P23, P24
Mark.Position P on the basis of the center.The circular arc vertex sought may be three.In addition, extracting control unit 183 extracts ginseng
It examines label Rm and seeks the coordinate at its center.
Later processing is same as first embodiment.That is, abnormity detection portion 184 is sought as reference position P and reference
Mark the direction vector V13 of the absolute fix relationship of the centre coordinate of Rm.Direction vector V13 is illustrated in Figure 11.Moreover, different
Normal test section 184 is to direction vector V13 and from the reference position P of storage part 17 is stored in toward the direction vector of reference marker Rm
It is compared, whether judgement reference marker Rm is printed on specified position.There is no when the malposition of reference marker Rm, with
For the centre coordinate of reference marker Rm as starting point, there will be the bare chip C on the position of direction vector V2 meanings to be identified as just
Secondary absorption bare chip C1, begins to pick up operation.There are when the malposition of reference marker Rm, abnormal notification unit 185 informs reference
Mark the malposition of Rm.
Figure 13 is the figure of the variation for illustrating second embodiment.In this second embodiment, if having carried out wafer
The rotation of WS makes corrections, then can save the processing for the center for seeking wafer W.Illustrated in Figure 13 three circular arc vertex P31,
P32、P33.After the rotation correction for carrying out wafer WS, the position of circular arc vertex P31, P32, P33 can be arranged in XY coordinate systems
Designated position.Therefore, it is sought toward the side of reference marker Rm according to circular arc vertex P31, P32, P33 coordinate of any one
To vector using as absolute fix relationship.
It is illustrated in Figure 13 and treats and seek using circular arc vertex P33 as reference position P as reference position P and ginseng
Examine the example of the direction vector V14 of the absolute fix relationship of the centre coordinate of label Rm.Abnormity detection portion 184 is to direction vector
V14 is compared with from the direction vector for circular arc vertex P33 toward the reference marker Rm for being stored in storage part 17, judges reference marker
Whether Rm is printed on specified position.According to above second embodiment, just can not against notch N or directional plane OF etc.
Enough set reference position.
[flow of element installation]
Then, the action of element fixing apparatus 100 is illustrated according to the flow chart of Figure 14.It is set when from the input of illustration omitted
When the standby instruction for giving the beginning installation elements of control unit 12, control unit 12 makes the operation of moving in of wafer W be performed (step S1).Tool
For body, 12 control shaft control unit 13 of control unit and make drive motor 53 work, so that wafer holding station 5 is moved to wafer incorporating section
The wafer of 10 vicinities receives position.After the specified wafer W of wafer incorporating section 10 is placed on wafer holding station 5, control unit 12 makes
The wafer holding station 5 takes out job position movement toward element.
When wafer W takes out job position toward element or after reaching the position, control unit 12 allows element identification video camera 8 to clap
Take the photograph the image (step S2) of the wafer W in wafer holding station 5.The image data input picture processing unit 14 of wafer W, is carried out finger
Fixed image procossing.In general, in the state that wafer W is positioned in wafer holding station 5, the XY coordinates of element fixing apparatus 100
It is inconsistent with the directions XY (cutting line) of wafer W.That is, the X-axis relative to element fixing apparatus 100, the X-direction of wafer W is in
Have rotated the state of rotational angle theta.Therefore, control unit 12 executes according to the shooting image of wafer W and turns to clear up the pivot offset
The correction processing (step S3) of angle θ.
Figure 15 is the figure for illustrating corner correction processing.The rotation correcting section 182 of control unit 12 is according to image processing part
The image data of 14 treated wafer W detects the multiple checking chip CA being preset.Multiple checking chip CA are edges
The bare chip that a cutting line separates specified spacing L1 and arranged in the range of specified inspection distance L2.Therefore,
By identifying multiple checking chip CA on the image, the direction of cutting line can be identified.
Rotation correcting section 182 seek the X-axis relative to element fixing apparatus 100 of identified cutting line inclination
Degree obtains rotational angle theta.The rotational angle theta is replaced into corner correction data by rotation correcting section 182, is allowed to be stored in storage part 17.Pass through
The processing of such rotation correcting section 182, makes reference position P be corrected as being present in designated position.In addition it is also possible to make wafer
Holding station 5 actually rotates rotational angle theta and realistically releases pivot offset.In addition it is also possible to not extracted from the image data of wafer W
Checking chip CA, and cutting line is directly detected to detect the rotational angle theta.Or it can also be by identifying be defined in advance two
A unique bare chip C detects the rotational angle theta.
Then, the extraction control unit 183 of control unit 12 carries out in above-mentioned first embodiment or second embodiment
The processing (step S4) of the feature of the illustrated shape for extracting wafer W.Moreover, extracting control unit 183 according to obtained shape
The feature of shape seeks reference position P, exports the coordinate (step S5) of reference position P.Also know in addition, extracting control unit 183
Position on the image of other reference marker Rm, determines the coordinate (step S6) of reference marker Rm.It is taken in step S5 and S6
The coordinate of reference position P and the coordinate of reference marker Rm obtained gives abnormality detection as the position data of absolute fix relationship
Portion 184.
Hereafter, abnormity detection portion 184 reads the seat of the coordinate and reference marker Rm for the reference position P for being stored in storage part 17
Mark obtains the setting position relationship of the position relationship as the two.Moreover, abnormity detection portion 184 closed to the setting position
It is the processing (step S7) being compared with the absolute fix relationship being previously given.
According to the comparison result of step S7, abnormity detection portion 184 judges whether reference marker Rm is printed on specified position
It sets that is, with the presence or absence of the malposition (step S8) of reference marker Rm.When detecting the malposition of reference marker Rm, such as
The coordinate of the coordinate of the reference marker Rm of the absolute fix relationship and the reference marker Rm of the setting position relationship are carried out
Compare, there are (being "Yes" in step S8) when 1/2 or more offset of the arrangement spacing of bare chip C, and abnormal notification unit 185 is informed
Malposition (step S9) has occurred.
On the other hand, when the malposition of reference marker Rm is not detected (being "No" in step S8), continue to execute naked
The installation action to printed base plate 20 of chip C.It is picked up that is, pickup control unit 181 reads wafer figure WM from storage part 17 to set
Sequence (step S10) is taken, taking-up portion 7 is allowed to execute the action (step S11) of pickup bare chip C.Specifically, pickup control unit
181 control shaft control units 13 so that on cut somebody's hair the work of drive motor 63, allow 61 execution of cutting somebody's hair above to push away the dynamic of specified bare chip C
Make.Moreover, allow the work such as head wafer lift motor 7i, allows taking-up portion 7 (head wafer 7a to 7d) to execute absorption and be pushed portion 6 and above push away
The action of bare chip C afterwards, and executing makes head wafer rotation motor 7h work make to be attracted on head wafer 7a to 7d
The action of bare chip C overturnings.
Hereafter, bare chip C from head wafer 7a to 7d specified delivery position be adsorbed to element installation head 411,
412.Moreover, in the state of being adsorbed with first 411,412 by element installation, mounting portion 4 is moved to the flux supply of illustration omitted
The top of device, what flux was applied to bare chip C convexes to form face (step S12).Then, mounting portion 4 by fixation to be taken the photograph
The mode of the superjacent air space of camera 9 moves, and the face that convexes to form of bare chip C is taken, and carries out this and convex to form the bad of face sentencing
The identification (step S13) of fixed and absorption position offset.After the shooting, mounting portion 4 is moved to the printing for being held in conveyer belt 2
The superjacent air space of substrate 20 allows the bare chip C adsorbed to be installed to the designated position (step S14) of printed base plate 20.
Element fixing apparatus 100 (die pick-up equipment D) involved by present embodiment discussed above, even if
The position offset of reference marker Rm has occurred, also can correctly determine the position of first absorption bare chip C1 (chip).Therefore,
It is capable of providing a kind of following element fixing apparatus 100：No matter whether there is or not the position offsets that reference marker Rm occurs, using along crystalline substance
The pickup sequence of circle diagram WM, can correctly take out bare chip C from wafer W.
Above-mentioned specific implementation mode includes mainly the invention with the following contents.
One aspect of the present invention is related to die pick-up equipment comprising：Photographic device shoots the image of wafer, described
Wafer is cut into multiple chips and pays the wafer for having the label for indicating reference position in arbitrary chip subscript；Storage part,
Prestore setting position relationship, the setting position relationship for known reference position and the wafer on the wafer institute
State the position relationship of label；Processing unit is extracted, image procossing is carried out to the image of the captured wafer, extracts the label
With the characteristic of the shape of the wafer, and the reference position is exported according to the characteristic of the shape；And
Abnormity detection portion, to the image according to the wafer absolute fix relationship of the reference position of determination and the label with
The setting position relationship that the storage part is stored is compared to detect the malposition of the label.
According to the die pick-up equipment, the characteristic of the shape of wafer is extracted by extracting processing unit.The spy of shape
Sign part is the intrinsic shape for the shape having from wafer, and any wafer is provided with.Of course, from the feature of the shape
Reference position derived from part can be held and be constant in advance.Therefore, by that should show reference position by mark subordinate list
The position of label and the setting position relationship of the reference position be pre-stored within storage part, can determine described on wafer
Label should existing setting position.Therefore, the absolute fix of the label of determination is closed by the image according to wafer
System is compared with the setting position relationship, is able to detect that the malposition of the label.
It is preferable that, the characteristic of the shape is the knot for indicating the wafer in above-mentioned die pick-up equipment
Crystallographic axis to notch.Or the characteristic of the shape is the directional plane for indicating that the crystallization of the wafer is axial.
The notch or the directional plane are as the part for crystallizing axial direction for indicating wafer and on any wafer
The part that the shape being attached to clearly is shown.Therefore, it may be desirable to using them as the characteristic of the shape
To treat.Reference position for example can be the center of the notch or the straight line from directional plane derived from the shape of notch
The center of the straight line portion derived from the end positions in portion.
It is preferable that, the wafer has circular shape, the spy of the shape in above-mentioned die pick-up equipment
Sign part is the circular shape of the periphery of the wafer.At this point, the reference position can be led according to the circular shape
The center of the wafer gone out.
The circular shape of the periphery of wafer for example can obtain the characteristic of shape by determining the vertex of circular arc.This
Outside, by identifying circular arc and determining multiple points on the circular arc, it can determine the center of circular wafer.Therefore, according to above-mentioned
Die pick-up equipment just can set the reference position not against notch or directional plane etc..
It is preferable that, further include in above-mentioned die pick-up equipment：Holding station carries the wafer；And correction
Portion seeks the corner of the offset of the expression of the wafer for being equipped on the holding station relative to specified datum line, exists
Carry out generating the processing of corner correction data when the offset；Wherein, the benchmark is corrected by the processing of the correcting section
Position.
In general, when wafer is equipped on the holding station, the progress of the carrying is simultaneously not accompanied by stringent positioning.Therefore, exist
It is mounted on the shooting image of the wafer of holding station, the coordinate of the characteristic of shape is nearly all in defined coordinate each other
Different states.Therefore, the correction of the reference position is carried out by using corner correction data to make the feature of shape
Part is integrated with defined coordinate position, can effectively be detected the processing of the malposition of label hereafter.
It is preferable that, further include in above-mentioned die pick-up equipment：The chip is picked up on head；And pickup control
Portion processed controls the action on the head；Wherein, the respective of the chip for indicating that the wafer has also is stored in the storage part
Evaluation wafer figure, the pickup control unit by mark pay have the chip of the label on the basis of determine to allow the head initial
The chip of pickup.
According to the die pick-up equipment, head can be allowed to execute the correct die pick according to wafer figure.
As described above, according to the present invention, even if can correctly determine chip if the position offset of reference marker has occurred
Position.Therefore, it is possible to provide a kind of die pick-up equipment that can correctly take out the chip as target.
Claims (7)
1. a kind of die pick-up equipment, it is characterised in that including：
Photographic device shoots the image of wafer, and the wafer, which is cut into multiple chips and is paid in arbitrary chip subscript, to be had
Indicate the wafer of the label of reference position；
Storage part prestores setting position relationship, the setting position relationship be the wafer on known reference position with
The position relationship of the label of the wafer；
Processing unit is extracted, image procossing is carried out to the image of the captured wafer, extracts the label and the wafer
The characteristic of shape, and the reference position is exported according to the characteristic of the shape；And
Abnormity detection portion, to the image according to the wafer, the absolute fix of the reference position of determination and the label is closed
System is compared to detect the malposition of the label with the setting position relationship that the storage part is stored.
2. die pick-up equipment according to claim 1, it is characterised in that：
The characteristic of the shape is the notch for indicating that the crystallization of the wafer is axial.
3. die pick-up equipment according to claim 1, it is characterised in that：
The characteristic of the shape is the directional plane for indicating that the crystallization of the wafer is axial.
4. die pick-up equipment according to claim 1, it is characterised in that：
The wafer has circular shape,
The characteristic of the shape is the circular shape of the periphery of the wafer.
5. die pick-up equipment according to claim 4, it is characterised in that：
The reference position is according to the circular shape and the center of the derived wafer.
6. die pick-up equipment according to any one of claim 1 to 5, it is characterised in that further include：
Holding station carries the wafer；And
Correcting section seeks turning for the offset of the expression of the wafer for being equipped on the holding station relative to specified datum line
Angle carries out the processing for generating corner correction data when there are the offset；Wherein,
The reference position is corrected by the processing of the correcting section.
7. die pick-up equipment according to any one of claim 1 to 5, it is characterised in that further include：
The chip is picked up on head；And
Control unit is picked up, the action on the head is controlled；Wherein,
The wafer figure of the respective evaluation for the chip for indicating that the wafer has also is stored in the storage part,
The pickup control unit determines the chip for allowing the head initially to pick up on the basis of marking and pay the chip for having the label.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2016/052549 WO2017130361A1 (en) | 2016-01-28 | 2016-01-28 | Die pickup device |
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| Publication Number | Publication Date |
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| CN108352308A true CN108352308A (en) | 2018-07-31 |
| CN108352308B CN108352308B (en) | 2022-05-10 |
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| JP (1) | JP6522797B2 (en) |
| KR (1) | KR102056656B1 (en) |
| CN (1) | CN108352308B (en) |
| WO (1) | WO2017130361A1 (en) |
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| CN109449096A (en) * | 2018-11-08 | 2019-03-08 | 科为升视觉技术（苏州）有限公司 | The method of recognition detection wafer chip |
| CN110390325A (en) * | 2019-07-30 | 2019-10-29 | 深圳市技美智能自动化有限公司 | A kind of network centralization OCR identifying system and method |
| CN111326455A (en) * | 2018-12-13 | 2020-06-23 | 三星显示有限公司 | Method for manufacturing display device |
| CN112530832A (en) * | 2019-09-19 | 2021-03-19 | 铠侠股份有限公司 | Processing information management system and method for managing processing information |
| CN114359240A (en) * | 2022-01-07 | 2022-04-15 | 河北博威集成电路有限公司 | Chip sorting anti-dislocation method, device, terminal and storage medium |
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| JP7195051B2 (en) * | 2018-02-20 | 2022-12-23 | ワイエイシイガーター株式会社 | Peeling device |
| JP7022097B2 (en) * | 2019-03-29 | 2022-02-17 | ファナック株式会社 | Transport equipment and delivery system |
| JP7285162B2 (en) * | 2019-08-05 | 2023-06-01 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
| WO2023228322A1 (en) * | 2022-05-25 | 2023-11-30 | ヤマハ発動機株式会社 | Die pickup method and device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2017130361A1 (en) | 2018-07-19 |
| KR20180071320A (en) | 2018-06-27 |
| KR102056656B1 (en) | 2019-12-17 |
| WO2017130361A1 (en) | 2017-08-03 |
| JP6522797B2 (en) | 2019-05-29 |
| CN108352308B (en) | 2022-05-10 |
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