WO2023145070A1 - Substrate conveyance device, component mounting device, substrate conveyance method, program, and recording medium - Google Patents

Abstract

In the present invention, a region in which a head non-restricted range overlaps with a mounting stage in the conveyance direction is set as a non-restricted region, and it is determined whether or a substrate will protrude from the non-restricted region in the conveyance direction when the substrate is stopped at a reference stopping position set in the non-restricted region. When it is determined that protrusion will occur, the substrate is stopped at a position that is offset, from the reference stopping position and in the opposite direction from the direction of protrusion, by an offset amount which is greater than zero but not more than the amount of protrusion from the non-restricted region, and the substrate is positioned.

Description

Substrate transport device, component mounting device, substrate transport method, program and recording medium

The present invention relates to a board transfer technique suitable for a component mounting apparatus that mounts components on a board using a head unit having a so-called in-line structure in which a plurality of heads are arranged in a predetermined arrangement direction.

Conventionally, a component mounting apparatus using a head unit having an in-line structure (sometimes referred to as an in-line head unit) is known (Patent Document 1). In this component mounting apparatus, the board is transported in a direction parallel to the direction in which the heads are arranged, and positioned at a position where components are to be mounted. A substrate transfer section is provided for this positioning. The component transfer section has a conveyor section, which carries in the board from the outside of the component mounting apparatus and transfers the board in a transfer direction parallel to the arrangement direction. Further, in order to position the substrate conveyed by the conveyor section at the target position, a stopper is provided that mechanically contacts the substrate.

JP 2021-174895 A

A plurality of stoppers are provided in the substrate transfer section to accommodate various substrate sizes. Each stopper is configured to mechanically abut and position the conveyed substrate. In addition, the plurality of stoppers are arranged so as to be retractable with respect to the transport path of the substrate at different target positions in the transport direction. A stopper corresponding to the size of the substrate conveyed by the conveyor advances into the conveying path and abuts on the substrate to position it. For example, for substrates up to a specific size, the first stopper operates to position the substrate at the first target position. 2 Positioned by a second stopper arranged at the target position. For this reason, as will be described in detail later with reference to FIG. 4, it is not possible to mount components using the entire inline head unit. There is a restriction (hereinafter referred to as "head restriction") that it cannot be used. This head restriction is one of the main factors that increase the time required for component mounting (hereinafter referred to as "mounting cycle time"). Therefore, there has been a demand to reduce the number of heads subject to head restrictions. However, in the conventional component mounting apparatus, since the target position is fixed, the number of heads subject to head restrictions cannot be changed. Therefore, for example, when the substrate size in the transport direction is 1 mm longer than a specific size, it is necessary to position the substrate using the second stopper. As a result, the head is restricted in the same manner as when the substrate size is increased to the extent of the distance between the first stopper and the second stopper in the transport direction, and the same mounting cycle time is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a component mounting apparatus using an in-line head unit, which enables efficient component mounting by suppressing an increase in mounting cycle time due to an increase in substrate size in the transport direction. It is an object of the present invention to provide a substrate transport technique capable of transporting and positioning a substrate in such a manner as to

A first aspect of the present invention moves a plurality of heads collectively in a direction parallel to the arrangement direction within a first movable range while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. a component mounting apparatus having a first head unit capable of mounting a component on a first substrate positioned within a first mounting stage using the first head unit; a board transfer apparatus equipped in the component mounting apparatus; A substrate transport method for transporting a first substrate in the transport direction parallel to the arrangement direction in the component mounting apparatus, a program and a recording medium for transporting the first substrate in the transport direction parallel to the arrangement direction.

A substrate transfer apparatus according to a first aspect of the present invention transfers the first substrate to the first mounting stage without mechanical contact with the contact member after transferring the first substrate in the transfer direction parallel to the arrangement direction. and a controller for controlling the first stopperless transporting unit, wherein when the first head unit is positioned at the most upstream position of the first movable range in the transporting direction A first upstream end position where the most downstream head in the transport direction among the plurality of heads is positioned, and the most upstream in the transport direction among the plurality of heads when the first head unit is positioned at the most downstream position in the first movable range. When the first unconstrained area sandwiched between the first downstream end position where the head is located and the area where the first mounting stage overlaps is defined as the first unconstrained area, the control unit controls the first unconstrained area When it is determined that the first substrate protrudes from the first unrestricted area in the transport direction when the first substrate is stopped at the first reference stop position set within the The first stopperless conveying unit is controlled such that the first substrate is stopped at a position offset by an offset amount that is equal to or less than a first excess amount that protrudes from the first unrestricted area and is greater than zero. .

A component mounting apparatus according to a first aspect of the present invention is characterized by including the substrate transfer apparatus.

Further, in the substrate transport method according to the first aspect of the present invention, when the first head unit is positioned at the most upstream position in the first movable range in the transport direction, the most downstream head in the transport direction among the plurality of heads is and a first downstream end position where the most upstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range. a first step of obtaining, as a first unconstrained area, a region in which the first head unconstrained range overlaps with the first mounting stage; a second step of determining whether or not the first substrate protrudes from the first unrestricted area in the transport direction when stopped; and the second step determines that the first substrate protrudes from the first unrestricted area. Sometimes, the first substrate is transported and positioned at a position offset by an offset amount equal to or less than a first excess amount and larger than zero, in a direction opposite to the direction of protrusion from the first reference stop position, to protrude from within the first unrestricted area. and a third step.

Further, in the program according to the first aspect of the present invention, when the first head unit is positioned at the most upstream position in the first movable range in the transport direction, the most downstream head in the transport direction among the plurality of heads is positioned. Sandwiched between the first upstream end position and the first downstream end position where the most upstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range a first step of acquiring a region where the first head unconstrained area overlaps the first mounting stage as the first unconstrained area; and stopping the first substrate at a first reference stop position set within the first unconstrained area. a second step of determining whether or not the first substrate protrudes from the first non-constrained area in the transport direction when the first substrate protrudes from the first non-constrained area when the second step determines that the first substrate protrudes from the first non-constrained area; transporting and positioning the first substrate to a position offset by an offset amount equal to or less than a first excess amount protruding from the first unrestricted area in a direction opposite to the direction of protruding from the first reference stop position and an offset amount greater than zero; 3 steps are realized by a computer.

Furthermore, the recording medium of the first aspect of the present invention is a non-transitory recording medium recording the above program.

In the invention according to the first aspect configured in this way, the first head unit has a so-called in-line structure, so head restrictions occur. Therefore, a first non-constrained area that is not subject to the head constraint is acquired. When the first substrate protrudes from the first unrestricted area in the transport direction when the first substrate is stopped at the first reference stop position set within the first unrestricted area, the first reference stop position is set. offset. The direction of the offset is opposite to the direction of protruding from the first reference stop position, and the offset amount is less than or equal to the first excess amount protruding from the first unrestricted area and greater than zero. As a result, the excess amount of the first substrate from the first unrestricted area is reduced, and the number of heads subject to head restrictions during component mounting is also reduced. As a result, it is possible to efficiently mount components by suppressing an increase in mounting cycle time due to an increase in the size of the first substrate.

Here, if the first substrate does not protrude from the first unconstrained area in the transport direction when the first substrate is stopped at the first reference stop position, the first substrate is stopped at the first reference stop position, Alternatively, the first substrate may be stopped at a position offset from the first reference stop position within a range not protruding from the first non-restricted area. As a result, the first substrate fits within the first non-restricted area, and the head is not restricted when mounting the components, so that the components can be mounted in an excellent mounting cycle time.

In addition, the component mounting apparatus uses the first head unit to mount components on a second substrate positioned within a second mounting stage arranged downstream of the first mounting stage in the transport direction. While arranging a plurality of heads with nozzles attached to their tips along a predetermined arrangement direction, the plurality of heads can be collectively moved in a direction parallel to the arrangement direction within a second movable range that is the same as the first movable range. The second head unit is further provided, and components are mounted on the first board and the second board positioned on the first mounting stage and the second mounting stage, respectively, using the second head unit as follows. Additional configurations may be adopted. In other words, the second stopperless transfer section stops the second substrate transferred from the first mounting stage by the first stopperless transfer section in the second mounting stage without mechanical contact with the contact member. Further may be provided. Then, when the second substrate is stopped at a second reference stop position set within a second unconstrained area where the first head unconstrained range overlaps with the second mounting stage in the transport direction, the second substrate is placed in the second unconstrained area. If it protrudes from the area in the transport direction, the second reference stop position is offset. The direction of the offset is the direction opposite to the direction of protruding from the second reference stop position, and the offset amount is less than or equal to the second excess amount protruding from the second unrestricted area and greater than zero. As a result, the excess amount of the second substrate from the second unrestricted area is reduced, and the number of heads subject to head restrictions during component mounting is also reduced. As a result, it is possible to efficiently mount components by suppressing an increase in the mounting cycle time due to an increase in the size of the second substrate.

Also, the second movable range may differ from the first movable range. In this case, it is desirable to configure as follows, whereby an increase in mounting cycle time can be suppressed and efficient component mounting becomes possible. That is, it is desirable to control as follows according to the magnitude relationship between the first head-unrestricted range and the second head-unrestricted range. When the first head-unrestricted range is narrower than the second head-unrestricted range in the transport direction, the area where the first head-unrestricted range overlaps with the second mounting stage in the transport direction is defined as the second unrestricted area. When it is determined that the second board protrudes from the second unrestricted area in the transport direction when the second board is stopped at the second reference stop position set within the area, the direction opposite to the direction of protruding from the second reference stop position is determined. It is preferable to control the second stopperless transport section so that the second substrate is stopped at a position offset by an offset amount that is equal to or less than the second excess amount and larger than zero, and which protrudes from the second unrestricted area. be. On the other hand, when the second head-unrestricted range is narrower than the first head-unrestricted range in the transport direction, the area where the second head-unrestricted range overlaps with the first mounting stage in the transport direction is defined as the first unrestricted area. When it is determined that the second board protrudes from the second non-constrained area in the transport direction when the second board is stopped at the second reference stop position set within the non-constrained area, the direction opposite to the direction of protruding from the second reference stop position The second stopperless transport unit is controlled such that the second substrate stops at a position offset by an offset amount that is equal to or less than the second excess amount and larger than zero in the direction of the second non-restricted area. preferred.

Also, the second movable range may differ from the first movable range, and while the first head unit is responsible for mounting components on the first board, the second head unit may be responsible for mounting components on the second board. In such a case, it is desirable to configure as follows, whereby an increase in mounting cycle time can be suppressed and efficient component mounting becomes possible. That is, when the second substrate is stopped at the second reference stop position set within the second unconstrained area where the second head unconstrained range overlaps with the second mounting stage in the transport direction, the second substrate is placed in the second unconstrained area. When it is determined to protrude from the area in the conveying direction, it protrudes from the second non-restricted area in the direction opposite to the direction of protruding from the second reference stop position at a position offset by an offset amount that is less than or equal to the second excess amount and greater than zero. Preferably, the second stopperless transport is controlled such that the second substrate stops.

If the second substrate does not protrude from the second non-restricted area in the transport direction when the second substrate is stopped at the second reference stop position, the second substrate stops at the second reference stop position, or The second stopperless conveying unit may be controlled so that the second substrate stops at a position offset from the second reference stop position within the range where the second substrate does not protrude from the second non-restricted area. As a result, the second substrate fits within the second non-restricted area, so that the head is not restricted when mounting the component, and the component can be mounted in an excellent mounting cycle time.

Furthermore, while satisfying the condition that the first substrate and the second substrate are contained within the first unconstrained area and the second unconstrained area, respectively, the first reference stop position and the second reference stop position are offset as follows. may For example, the first substrate is stopped in a state where the upstream end of the first substrate in the transport direction coincides with the position of the upstream end of the first unrestricted area, and the downstream end of the second substrate in the transport direction is downstream of the second unrestricted area. By stopping the second substrate in a state aligned with the end position, the distance between the first substrate and the second substrate in the transport direction can be widened. Conversely, the first substrate is stopped in a state in which the downstream end of the first substrate in the transport direction coincides with the position of the downstream end of the first unrestricted area, and the upstream end of the second substrate in the transport direction is the second unrestricted area. By stopping the second substrate in a state aligned with the position of the upstream end of the , the above-described interval can be narrowed.

In a second aspect of the present invention, a plurality of heads having nozzles attached to their tips are arranged along a predetermined arrangement direction, and the plurality of heads are collectively arranged in a direction parallel to the arrangement direction within a first movable range. The first head unit is mounted on a long substrate positioned straddling a first mounting stage and a second mounting stage spaced apart from each other in a direction parallel to the arrangement direction. A component mounting device that mounts components using a component mounting device, a substrate transport device equipped in the component mounting device, a substrate transport method for transporting a first substrate in the component mounting device in a transport direction parallel to an arrangement direction, a first substrate A program and recording medium for conveying in a conveying direction parallel to an arrangement direction.

A substrate transport apparatus according to a second aspect of the present invention transports long substrates in a transport direction parallel to the arrangement direction, and thereafter, the first mounting stage and the second mounting stage are performed without mechanical contact with the contact member. A substrate transfer section for stopping the long substrate while straddling the stage and a control section for controlling the substrate transfer section are provided, and the first head unit is positioned at the most upstream position of the first movable range in the transfer direction. When the first upstream end position where the most downstream head in the transport direction among the plurality of heads is positioned, and when the first head unit is located at the most downstream position in the first movable range, the position of the plurality of heads in the transport direction A first head-unrestricted range sandwiched between a first downstream end position where the most upstream head is located is sandwiched between the most upstream position of an area overlapping with the first mounting stage and the most downstream position of an area overlapping with the second mounting stage. defined as a first non-constrained area, the controller controls the long substrate to stop in the first non-constrained area when the long substrate is stopped at the first reference stop position set within the first non-constrained area. When it is determined to protrude from the area in the conveying direction, at a position offset by an offset amount equal to or less than the first excess amount and larger than zero, which protrudes from the first non-restricted area in the direction opposite to the direction of protruding from the first reference stop position. It is characterized by controlling the board transfer part so that the long board stops.

A component mounting apparatus according to a second aspect of the present invention is characterized by including the board transfer apparatus.

Further, in the substrate transport method according to the second aspect of the present invention, when the first head unit is positioned at the most upstream position of the first movable range in the transport direction, the most downstream head in the transport direction among the plurality of heads is and a first downstream end position where the most upstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range. a first step of acquiring, as the first unconstrained area, an area sandwiched between the most upstream position of the area where the first head unconstrained area overlaps the first mounting stage and the most downstream position of the area where the second mounting stage overlaps and a second step of determining whether or not the long substrate protrudes from the first non-constrained area in the transport direction when the long substrate is stopped at the first reference stop position set within the first non-constrained area. , when it is determined in the second step that the long substrate protrudes from the first non-restricted area, the length of the substrate protruding from the first non-restricted area in the direction opposite to the direction of protruding from the first reference stop position is less than or equal to the first excess amount. and a third step of transporting and positioning the long substrate to a position offset by an offset amount larger than zero.

Further, in the program according to the second aspect of the present invention, when the first head unit is positioned at the most upstream position in the first movable range in the transport direction, the most downstream head in the transport direction among the plurality of heads is positioned. Sandwiched between the first upstream end position and the first downstream end position where the most upstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range a first step of acquiring, as the first unconstrained area, an area sandwiched between the most upstream position of the area where the first head unconstrained area overlaps with the first mounting stage and the most downstream position of the area where the first head unconstrained area overlaps with the second mounting stage; a second step of determining whether or not the long substrate protrudes from the first non-constrained area in the transport direction when the long substrate is stopped at a first reference stop position set within the first non-constrained area; When it is determined by the second step that the long substrate protrudes from the first non-constrained area, the amount of excess protruding from the first non-constrained area in the direction opposite to the direction of protruding from the first reference stop position is equal to or less than the first excess amount and is zero. and a third step of transporting and positioning the long substrate to a position offset by an offset amount larger than the offset amount.

Furthermore, the recording medium of the second aspect of the present invention is a non-transitory recording medium recording the above program.

In the invention according to the second aspect configured in this way, as in the invention according to the first aspect, since the first head unit has a so-called in-line structure, head restrictions occur. Therefore, a first non-constrained area that is not subject to the head constraint is acquired. Then, when the long substrate protrudes from the first non-constrained area in the transport direction when the long substrate is stopped at the first reference stop position set within the first non-constrained area, the first reference stop position is set. offset. The direction of the offset is opposite to the direction of protruding from the first reference stop position, and the offset amount is less than or equal to the first excess amount protruding from the first unrestricted area and greater than zero. As a result, the amount of the long substrate that exceeds the first unrestricted area is reduced, and the number of heads subject to head restrictions during component mounting is also reduced. As a result, it is possible to efficiently mount components by suppressing an increase in the mounting cycle time due to an increase in the size of the long substrate.

In the invention configured as described above, even if the substrate protrudes from the non-restricted area due to the increase in size of the substrate, the amount of the substrate exceeding the non-restricted area can be reduced by the offset process, thereby reducing the mounting cycle time. It is possible to suppress an increase in the component mounting efficiency.

1 is a plan view showing a component mounting apparatus equipped with a first embodiment of a substrate transfer apparatus according to the present invention; FIG. FIG. 2 is a plan view showing a board support portion in the component mounting apparatus shown in FIG. 1 with the head support member in FIG. 1 cut away; 2 is a block diagram showing an electrical configuration for controlling the component mounting apparatus shown in FIG. 1; FIG. 2 is a diagram showing the configuration of a head unit installed in the component mounting apparatus of FIG. 1; FIG. FIG. 4 is a schematic diagram for explaining the relationship between the stop position of the substrate and head restrictions; 2 is a flow chart showing an operation of setting a reference stop position in the component mounting apparatus shown in FIG. 1; It is a figure which shows typically the offset operation|movement in the 1st modification of 1st Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in the 2nd modification of 1st Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in the 3rd modification of 1st Embodiment of the board|substrate conveying apparatus which concerns on this invention. FIG. 10 is a plan view showing a component mounting apparatus equipped with a second embodiment of a board transfer apparatus according to the present invention; FIG. 11 is a plan view showing a board support portion in the component mounting apparatus shown in FIG. 10 by notching the head support member in FIG. 10; It is a figure which shows typically the operation|movement in 2nd Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in 2nd Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in the 1st modification of 2nd Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in the 2nd modification of 2nd Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in the 3rd modification of 2nd Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in 3rd Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in 4th Embodiment of the board|substrate conveying apparatus which concerns on this invention. It is a figure which shows typically the offset operation|movement in 5th Embodiment of the board|substrate conveying apparatus which concerns on this invention.

FIG. 1 is a plan view showing a component mounting apparatus equipped with the first embodiment of the board transfer apparatus according to the present invention. FIG. 2 is a plan view showing a board support portion in the component mounting apparatus shown in FIG. 1, with the head support member in FIG. 1 cut away. 3 is a block diagram showing an electrical configuration for controlling the component mounting apparatus shown in FIG. 1. FIG. In FIGS. 1, 2 and the following figures, XYZ Cartesian coordinates are shown where appropriate, with the Z direction parallel to the vertical direction and the X and Y directions respectively parallel to the horizontal direction.

A component mounting apparatus 100 includes a base 1 , a board transfer section 2 and a board support section 3 . This substrate transfer section 2 corresponds to the first embodiment of the substrate transfer apparatus according to the present invention, and has a pair of conveyors 21, 21 provided on the base 1. As shown in FIG. The conveyors 21, 21 operate according to a transport command from the drive control section 43 of the control unit 4 that controls the entire apparatus, and transport the substrate S along the substrate transport path extending in the X direction. More specifically, the conveyors 21, 21 carry in the substrate S from the outside of the apparatus and transport it in the X direction (transport direction). When the substrate S is transported to a target position (corresponding to a reference stop position to be described later) positioned above the substrate support portion 3, the conveyors 21 and 21 transport the substrate according to a stop command from the drive control portion 43. to stop. As a result, the board S is positioned in the transport direction X at a target position suitable for component mounting. As described above, the conveyors 21, 21 have the function of accurately stopping the substrate S on the substrate conveying path without mechanical contact with contact members such as stoppers. It corresponds to an example of a "stopperless transport section". The target position is appropriately changed according to the dimension of the substrate S in the transport direction X (hereinafter referred to as "substrate size"). As a result, the number of heads subject to head restrictions is minimized. The technical meaning of the target position and change of the target position will be detailed later.

As shown in FIG. 2, the substrate support part 3 is provided on the base 1 so as to be positioned below the substrate transfer path. The substrate support part 3 has a function of supporting the substrate S positioned at the target position from below. As shown in FIG. 2, the substrate support section 3 has a base member 31, a backup pin 32, and a pin elevating section (reference numeral 33 in FIG. 3).

The base member 31 is arranged to cover the target position of the board S from below, and has a planar size approximately equal to the maximum size of the board S handled by the component mounting apparatus 100 . The space directly above the upper surface of the base member 31 corresponds to a mounting stage ST for positioning the board S and mounting components. Reference numerals PP1 and PP2 in FIG. 2 indicate the upstream end position and downstream end position of the mounting stage ST, respectively. A target position is set between the upstream end position PP1 and the downstream end position PP2, and the substrate S is positioned by the conveyors 21,21.

A plurality of backup pins 32 are provided on the base member 31 to support the substrate S on the mounting stage ST from below. Each backup pin 32 is a stepped pin elongated in the vertical direction, and has a small diameter portion formed on the lower side and a support portion formed on the upper side (tip side). The support portion has a smaller diameter than the small diameter portion and extends straight upward. The support portion has a function of supporting the substrate S, and the upper end surface is a horizontal support surface.

The pin elevating section 33 is connected to the base member 31 . Upon receiving a lift command from the drive control section 43, the pin lifting section 33 lifts the base member 31 and the backup pin 32 integrally. As a result, the substrate S positioned on the mounting stage ST is supported from below by the backup pins 32 .

Above the substrate support section 3 configured as described above, as shown in FIG. A mechanism 6 is provided. The head drive mechanism 6 is provided with a pair of Y- axis rails 61, 61 extending in the Y-direction, a Y-axis ball screw 62 extending in the Y-direction, and a Y-axis motor My for rotationally driving the Y-axis ball screw 62. 63 is fixed to a nut of a Y-axis ball screw 62 while being supported by a pair of Y- axis rails 61, 61 so as to be movable in the Y direction. An X-axis ball screw 64 extending in the X direction and an X-axis motor Mx for rotating the X-axis ball screw 64 are attached to the head support member 63, so that the head unit 5 can move in the X direction on the head support member 63. is fixed to the nut of the X-axis ball screw 64 while being supported by the Therefore, the Y-axis motor My rotates the Y-axis ball screw 62 to move the head unit 5 in the Y direction, or the X-axis motor Mx rotates the X-axis ball screw 64 to move the head unit 5 in the X direction. can.

Two component supply units 7 are arranged in the X direction on each side of the pair of conveyors 21, 21 in the Y direction. A plurality of tape feeders 71 arranged in the X direction are detachably attached to each component supply section 7 . Each tape feeder 71 is provided with a reel wound with a tape containing chip-like components (chip electronic components) such as integrated circuits, transistors, and capacitors at predetermined intervals. The tape feeder 71 supplies the components in the tape to the component supply position 72 by intermittently feeding the tape to the head unit 5 side. The components supplied to the component supply position 72 are mounted on the board S by the head unit 5 .

FIG. 4 is a diagram showing the configuration of a head unit installed in the component mounting apparatus of FIG. The head unit 5 has a plurality of (10 in this embodiment) heads 51 arranged in the X direction. Each head 51 has an elongated shape extending in the Z direction (vertical direction), and is configured to be capable of sucking and holding a component by means of a nozzle detachably attached to its lower end. That is, the head 51 moves above the tape feeder 71 and picks up the component supplied by the tape feeder 71 . Subsequently, the head 51 moves above the substrate S positioned at the target position, and mounts the component on the substrate S by canceling the suction of the component.

The movable range MR in which the head unit 5 configured in this manner can move in the X direction is determined by the length of the X-axis ball screw 64, and cannot move beyond the movable range MR. For example, when the head unit 5 moves to the upstream side in the X direction (right hand side in the figure), its movement limit is as indicated by the one-dot chain line in the figure. Therefore, when the head unit 5 is positioned at the most upstream position of the movable range MR, the substrate S is present at a position directly below the upstream end position PH1 where the most downstream head 51a in the transport direction X among the plurality of heads 51 is positioned. , any head 51 can be positioned above the substrate S. FIG. That is, any head 51 can be used to execute a component on the substrate S. FIG. Here, if the upstream end of the substrate S is located on the upstream side (right hand side in the drawing) of the upstream end position PH1, the most downstream head 51a cannot be located above the upstream end of the substrate S. Therefore, the head 51a cannot be used to mount components on the upstream end of the board S, that is, the head is restricted. This head constraint increases as the upstream end of the substrate S approaches the upstream end position PP1 of the mounting stage ST, and the number of heads 51 subject to the head constraint increases.

Such head restrictions are the same on the downstream side (left hand side in the figure). That is, when the head unit 5 moves to the downstream side in the X direction, its movement limit is as indicated by the chain double-dashed line in FIG. Therefore, when the head unit 5 is positioned at the most downstream position of the movable range MR, the substrate S exists at a position directly below the downstream end position PH2 where the most upstream head 51j in the transport direction X among the plurality of heads 51 is positioned. , any head 51 can be positioned above the substrate S. FIG. That is, any head 51 can be used to execute a component on the substrate S. FIG. Here, if the downstream end of the substrate S is located downstream of the downstream end position PH2 (left hand side in the figure), the most upstream head 51j cannot be located above the downstream end of the substrate S. Therefore, the head 51j cannot be used to mount components on the downstream end of the substrate S, that is, the head is restricted. This head constraint increases as the downstream end of the substrate S approaches the downstream end position PP2 of the mounting stage ST, and the number of heads 51 subject to the head constraint increases.

On the other hand, as long as the substrate S is positioned between the upstream end position PH1 and the downstream end position PH2 in the transport direction X, basically all the heads 51 are used to carry out component processing without being subject to the above head restrictions. implementation can be done. Therefore, for convenience of explanation below, the range sandwiched between the upstream end position PH1 and the downstream end position PH2 in the transport direction X will be referred to as a "head unrestricted range AR".

To summarize the above description, in order for the component mounting apparatus 100 to mount a component on the substrate S satisfactorily, basically, in the transport direction X, an area in which the head unrestricted range AR and the mounting stage ST overlap (hereinafter referred to as “non-restrictive range AR”). It is necessary to position the substrate S so that it enters the NR (referred to as "restricted area"). In the first embodiment, as shown in FIG. 4, the entire head-unrestricted range AR is included in the mounting stage ST, and the non-restricted area NR matches the head-unrestricted range AR. Then, when the entire substrate S is positioned within the non-restricted area NR (=the range sandwiched between the upstream end position PH1 and the downstream end position PH2) in the transport direction X, components are mounted without being subject to head restrictions. It is possible to minimize the mounting cycle time. On the other hand, when the substrate S is positioned such that at least one of the upstream end portion and the downstream end portion of the substrate S protrudes from the non-restricted region NR, the amount protruding from the non-restricted region NR, the so-called excess amount, increases. Accordingly, the number of heads 51 subject to head restrictions increases. This has been a factor in increasing the mounting cycle time.

In order to make this point clearer, when positioning a relatively long substrate S, a conventional mechanical stopper that is brought into mechanical contact with a contact member to position the substrate S is used (comparative example 1). , a case where the substrate is stopped at a preset reference stop position (comparative example 2), and a case where the reference stop position is offset in the transport direction according to the excess amount as will be described in detail later (first embodiment). will be explained by comparing the

FIG. 5 is a schematic diagram for explaining the relationship between the stop position of the substrate and the head restrictions. Column (a) of FIG. 1 schematically shows the operation of the device (comparative example 1) for positioning the substrate S by the mechanical stoppers at different positions PS1 and PS2 in the transport direction X, like the conventional device. In this comparative example 1, the position PS1 at which the substrate S is stopped by the upstream mechanical stopper is set as the reference stop position, and when a substrate S having a relatively long substrate size is conveyed, the upstream mechanical stopper stops as shown in the same column. retreats downward from the substrate transport path, while the downstream mechanical stopper advances into the substrate transport path to position the substrate S. That is, the downstream mechanical stopper mechanically positions the substrate S so that the downstream end of the substrate S is positioned at the position PS2. Therefore, when the substrate size is relatively long, the downstream end portion of the substrate S exceeds the downstream end position PH2 of the non-restricted area NR by the excess area ER and protrudes from the non-restricted area NR. Further, as shown in column (b) of the figure, the conveyors 21, 21 convey the substrate S, and the substrate is moved so that the downstream end of the substrate S is positioned at the reference stop position PS1, as with the mechanical stopper on the upstream side. When positioning S (Comparative Example 2), the upstream end portion of the substrate S exceeds the upstream end position PH1 of the non-restricted area NR by the excess area ER and protrudes from the non-restricted area NR. Note that the reference stop position PS1 is basically set inside both end positions PH1 and PH2 of the non-restricted area NR in consideration of the stop error of the substrate S by the conveyors 21 and 21 . Here, the reference stop position PS1 is set at a position shifted toward the upstream end position PH1 from the downstream end position PH2 in the transport direction X by a distance DR.

On the other hand, in the first embodiment, as shown in column (c) of the figure, the direction (in the figure, −X direction) and the opposite direction (+X direction in the figure). Accordingly, if the substrate size is about the length of the non-restricted area NR in the transport direction X (hereinafter referred to as "non-restricted area length"), the entire substrate S fits within the non-restricted area NR. Further, even if the substrate size is longer than the length of the non-restricted range, although part of the substrate S protrudes from the non-restricted region NR in the transport direction X, the excess region ER is larger than that of Comparative Examples 1 and 2. less. Therefore, the number of heads 51 subject to head restrictions is smaller than in Comparative Examples 1 and 2, and an increase in mounting cycle time can be suppressed.

Therefore, in this embodiment, based on such technical matters, the control unit 4 controls the stop position of the substrate S on the mounting stage ST so as to reduce the amount of excess. Thereby, the control unit 4 attempts to minimize the number of heads 51 subject to head restrictions.

As shown in FIG. 3, the control unit 4 has an arithmetic processing unit 41, which is a processor configured by a CPU (Central Processing Unit) and memory, and a storage unit 42 configured by an HDD (Hard Disk Drive). are doing. Further, the control unit 4 includes a drive control unit 43 that controls the drive system of the component mounting apparatus 100 ( conveyors 21, 21, pin lifting unit 33, X-axis motor Mx, Y-axis motor My, etc.) It has an imaging control section 44 that controls an imaging system (component recognition camera, etc.) and a reading section 45 . In particular, the reading unit 45 reads from the recording medium RMa a control program for controlling each unit of the component mounting apparatus 100 and a stop setting program for reducing the excess amount by controlling the stop position of the board S. It has a function of writing to the storage unit 42 . This recording medium RMa is a computer-readable non-transitory recording medium such as a CD (Compact Disc), a DVD (Digital Versatile Disc), a USB (Universal Serial Bus) memory, or the like.

The control unit 4 is connected to the host computer 900 via a communication line (not shown), and receives from the host computer 900 the production program created by the arithmetic processing section 901 of the host computer 900 . In addition, the component mounting apparatus 100 performs component mounting by controlling each part of the component mounting apparatus 100 including the board transfer section 2 according to the program read from the recording medium RMa. In particular, in this embodiment, the control unit 4 performs the reference stop position setting process shown in FIG. to offset the reference stop position. The processing for setting the reference stop position will be described below with reference to FIGS. 5 and 6. FIG.

FIG. 6 is a flow chart showing the operation of setting the reference stop position in the component mounting apparatus shown in FIG. The arithmetic processing section 41 of the control unit 4 controls each section of the device as follows according to the stop setting program for the reference stop position. First, the arithmetic processing unit 41 acquires the substrate size Lx of the substrate S transported by the substrate transporting unit 2 and the preset reference stop position PS1 (step S1). Further, the arithmetic processing unit 41 acquires both end positions of the non-restricted area NR in the transport direction X, that is, the upstream end position PH1 and the downstream end position PH2 (step S2).

Based on these pieces of information, the arithmetic processing unit 41 calculates switching reference information Lf (step S3). This switching reference information Lf is whether or not the entire substrate S can be accommodated in the non-restricted area NR when the substrate S is stopped so that the leading edge of the substrate S, that is, the downstream end in the transport direction X is positioned at the reference stop position PS1. , that is, the distance of the range FR sandwiched between the preset reference stop position PS1 and the upstream end position PH1. More specifically, the arithmetic processing unit 41 uses the following formula Lf=PS1−PH1
The length information in the X direction calculated based on is stored as switching reference information Lf. Here, when the substrate size Lx exceeds the switching reference information Lf, as shown in column (b) of FIG. The upstream end of X is located upstream of the upstream end position PH1. That is, the rear end portion of the substrate S exceeds the non-restricted area NR by the excess area ER to the upstream side (right hand side in the figure). Conversely, when the substrate size Lx is equal to or smaller than the switching reference information Lf, the rear end (upstream end in the transport direction X) of the substrate S stopped at the reference stop position PS1 as described above is placed upstream. It is positioned downstream of the end position PH1 or the upstream end position PH1. That is, the substrate S is positioned on the mounting stage ST in a state in which the excess area ER does not occur and the entire substrate S is contained within the non-restricted area NR.

Therefore, the arithmetic processing unit 41 uses the following equation Le=Lx−Lf
The length of the excess area ER in the transport direction X, that is, the excess amount Le is calculated based on (step S4), and it is determined whether or not it is greater than zero (step S5). If it is determined "YES" in step S5, the arithmetic processing unit 41 sets the offset amount OF to the excess amount Le (step S6). On the other hand, if it is determined "NO" in step S5, the arithmetic processing unit 41 sets the offset amount OF to zero (step S7).

When the setting of the offset amount OF is completed in this way, the arithmetic processing unit 41 offsets the reference stop position PS1 to the downstream side in the transport direction X by the offset amount OF (step S8). That is, as shown in columns (b) and (c) of FIG. 5, when the substrate S protrudes upstream from the non-restricted region NR, the direction opposite to the protruding direction (downstream in this embodiment) The trailing edge of the substrate S coincides with the upstream edge position PH1 due to the offset of the reference stop position PS1. As a result, the length of the excess area ER in which the substrate S positioned at the reference stop position PS1 protrudes from the non-restricted area NR in the transport direction X becomes shorter than before the offset. That is, the number of heads 51 subject to head restrictions is reduced.

On the other hand, when the offset amount OF is set to zero, it is equivalent to not executing the offset operation, the preset reference stop position PS1 is maintained, and the substrate S is positioned at the reference stop position PS1. be. That is, the substrate S as a whole is positioned within the non-restricted area NR (=non-restricted area NR).

As described above, in the first embodiment, when the substrate S is positioned at the preset reference stop position PS1 and the substrate S protrudes from the non-restricted area NR, the reference stop position PS1 is offset as described above. are doing. Therefore, although the substrate S protrudes from the non-restricted area NR as the substrate S increases in size, the excess area ER is narrower than before the offset, and the number of heads 51 subject to head restriction is also reduced. As a result, it is possible to suppress an increase in the mounting cycle time due to an increase in the size of the substrate S, thereby enabling efficient component mounting.

Also, when the board size Lx of the board S is equal to or smaller than the switching reference information Lf and is relatively small, the component mounting is executed while being accommodated in the non-restricted area NR. In other words, components can be mounted without being subject to head restrictions, so excellent mounting cycle time can be obtained. Note that in the first embodiment, the arithmetic processing unit 41 sets the offset amount OF to the excess amount Le when it is determined "YES" in step S5, but the offset amount OF is not limited to this. . That is, the same effect can be obtained by setting the offset amount OF to a distance larger than zero and shorter than the excess amount Le, for example, a half value of the excess amount Le (=Le/2) as the offset amount OF. (See FIG. 7).

Further, in the above embodiment, as described with reference to FIG. 5, the substrate S is positioned such that the downstream end of the substrate S coincides with the reference stop position PS1. In other words, the above effects are achieved by offsetting the reference stop position PS1 set close to the downstream end position PH2 of the non-restricted area NR. For the convenience of the discussion below, this type of offset processing is referred to herein as "downstream offset processing." Here, it should be noted that since the substrate S is transported by the substrate transport section 2, the offset process may be performed in a manner different from the downstream offset process. That is, even when the reference stop position PS1 is set close to the upstream end position PH1 of the non-restricted area NR and the substrate S is positioned such that the upstream end of the substrate S coincides with the reference stop position PS1, this The invention can be applied. For example, as shown in FIG. 8, the above effects may be achieved by offsetting the reference stop position PS1 set near the upstream end position PH1 of the non-restricted area NR. This type of offsetting is referred to as "upstream offsetting" to distinguish it from downstream offsetting. The content of this upstream offset process is the same as the downstream offset process except that the reference stop position PS1 is set close to the upstream end position PH1 of the non-restricted area NR. are the same as those shown in FIG.

In short, when the substrate S is stopped at the reference stop position PS1 set within the non-restricted area NR, if the substrate S protrudes from the non-restricted area NR in the transport direction X by an excess amount Le, the direction opposite to the protruding direction control the substrate conveying part 2 so that the substrate S is stopped at a position offset from the reference stop position PS1 by an offset amount OF greater than zero and equal to or less than the excess amount Le (reference stop position PS1 after offset). , the above effects can be obtained.

Further, when the combination of nozzles attached to the heads 51 constituting the head unit 5, that is, the so-called head variation is changed, instead of the head non-restricted range AR, the length of the non-restricted area NR changes accordingly. Sometimes. Therefore, it is desirable to execute the processing shown in FIG. 6 each time the head variation is changed.

Further, in the first embodiment, when the substrate S does not protrude from the non-restricted area NR in the transport direction X when the substrate S is stopped at the preset reference stop position PS1 ("NO" in step S5). ), the conveyor 21 is stopped at the reference stop position PS1 without performing the offset, but is stopped at a position offset from the reference stop position PS1 within a range in which the substrate S does not protrude from the non-restricted area NR. , 21. This point also applies to modified examples and embodiments to be described later.

Thus, in the first embodiment, the combination of the substrate transport section 2 and the control unit 4 functions as the "substrate transport apparatus" of the present invention, and step S2 identifies the head unrestricted area AR and the head unrestricted area NR. This is a step of acquiring information (upstream end position PH1 and downstream end position PH2) for the above, and corresponds to an example of the "first step" of the present invention. Further, step S5 corresponds to an example of the "second step" of the present invention, and steps S6 and S7 and the transport and positioning of the substrate S to the reference stop position PS1 after the offset are an example of the "third step" of the present invention. is equivalent to Further, the head unit 5 corresponds to an example of the "first head unit" of the invention, and the movable range MR of the head unit 5 corresponds to an example of the "first movable range" of the invention. Also, the reference stop position PS1 corresponds to an example of the "first reference stop position" of the present invention. Further, the head-unrestricted range AR and the head-unrestricted area NR correspond to examples of the "first head-unrestricted area" and the "first unrestricted area" of the present invention, respectively, and the upstream end position PH1 of the unrestricted area NR and the downstream end position PH2 respectively correspond to examples of the "first upstream end position" and the "first downstream end position" of the present invention. Also, the length Le of the excess area ER corresponds to an example of the "first excess amount" of the present invention.

In the first embodiment, the stop setting program is recorded on the recording medium RMa and provided to the control unit 4 via the recording medium RMa. may provide. Further, in the first embodiment, prior to component mounting processing based on the production program, processing for setting the reference stop position is performed according to the stop setting program. can be configured to That is, the arithmetic processing unit 901 of the host computer 900 may perform processing for setting the reference stop position based on a stop setting program provided via the recording medium RMa or a communication line, and the processing result may be reflected in the production program. . By providing the production program from the host computer 900 to the component mounting apparatus 100, the same effects as in the first embodiment can be obtained. These points also apply to the following embodiments.

In addition, in the first embodiment, the present invention is applied to the component mounting apparatus 100 that mounts components on a single mounting stage ST. can be applied to a component mounting apparatus in which are arranged side by side in the transport direction X.

FIG. 9 is a diagram schematically showing a third modification of the first embodiment of the substrate transfer device according to the present invention. In this component mounting apparatus 100, mounting stages ST1 and ST2 are provided apart from each other in the transport direction X. As shown in FIG. Therefore, there are two non-restricted regions NR1 and NR2. That is, these non-constrained areas NR1 and NR2 correspond to examples of the "first non-constrained area" and the "second non-constrained area" of the present invention, respectively, and the head non-constrained area AR and the first mounting stage ST1 is a non-restricted area NR1, and the area where the head non-restricted range AR and the second mounting stage ST2 overlap is a non-restricted area NR2. Therefore, it is necessary to perform offset processing for each of the non-restricted areas NR1 and NR2. More specifically, in the first mounting stage ST1, the "upstream side offset processing" shown in FIG. 8 is executed to position the substrate S1, and in the second mounting stage ST2, the positions shown in columns (b) and (c) of FIG. Preferably, the substrate S2 is positioned by executing the "downstream offset process" shown. Such offset processing provides the same effects as those of the first embodiment.

In the component mounting apparatus 100 shown in FIG. 9, components are mounted on the substrates S1 and S2 positioned on the mounting stages ST1 and ST2 by the single head unit 5. The present invention can also be applied to additional devices (FIGS. 10 and 11).

FIG. 10 is a plan view showing a component mounting apparatus equipped with the second embodiment of the board transfer apparatus according to the present invention. FIG. 11 is a plan view showing a board support portion in the component mounting apparatus shown in FIG. 10, with the head support member in FIG. 10 cut away. The component mounting apparatus 200 shown in FIGS. 10 and 11 is greatly different from the component mounting apparatus 100 in that two mounting stages ST1 and ST2 are provided by providing two substrate support sections 3a and 3b. , the configuration of the substrate transfer section 2 is changed accordingly, and two head units 5a and 5b are provided. Since the rest of the configuration is basically the same as that of the component mounting apparatus 100 shown in FIGS. 1 and 2, the following description will focus on the points of difference. do.

In the component mounting apparatus 200, as shown in FIG. 11, the two board support sections 3a and 3b are arranged apart from each other in the transport direction X, and the spaces immediately above the board support sections 3a and 3b are located on the upstream side, respectively. It corresponds to one mounting stage ST1 and a downstream second mounting stage ST2. Reference numerals PP11 and PP12 in FIG. 11 indicate the upstream end position and downstream end position of the upstream mounting stage ST1, respectively. An upstream target position (corresponding to a reference stop position PS1, which will be described in detail later) is set between the upstream end position PP11 and the downstream end position PP12, and the substrate S is positioned by the substrate conveying section 2. FIG. Reference numerals PP21 and PP22 in FIG. 11 indicate the upstream end position and downstream end position of the downstream mounting stage ST2, respectively. A downstream target position (corresponding to a reference stop position PS2, which will be described in detail later) is set between the upstream end position PP21 and the downstream end position PP22, and the substrate S is positioned by the substrate conveying section 2. FIG.

The board transfer section 2 has a pair of conveyors 21, 21, a pair of conveyors 22, 22, a pair of conveyors 23, 23, and a pair of conveyors 24, 24. These conveyors 21 to 24 are arranged in the conveying direction X in this order. Then, the conveyors 21 to 24 are operated in response to a transport command from the drive control unit 43, and the substrate S is carried in from the outside of the apparatus and transported in the X direction (transport direction). Then, when the substrate S is transported to the target position (corresponding to the reference stop position PS1 described later) of the mounting stage ST1, the conveyors 22 and 22 stop transporting the substrate according to the stop command from the drive control section 43. As a result, the substrate S is positioned in the transport direction X at a target position suitable for component mounting on the mounting stage ST1. Further, when the substrate S conveyed from the conveyors 22, 22 is conveyed to the target position (corresponding to the reference stop position PS2 described later) of the mounting stage ST2, the conveyors 23, 23 are stopped by the drive control unit 43. Stop substrate transfer according to the command. As a result, the substrate S is positioned in the transport direction X at a target position suitable for component mounting on the mounting stage ST2. As described above, the conveyors 22, 22 have the function of accurately stopping the substrate S on the substrate conveying path without mechanical contact with contact members such as stoppers. It corresponds to an example of a "stopperless transport section". In addition, the conveyors 23, 23 have a function of accurately stopping the substrate S on the substrate conveying path without mechanical contact with an abutment member such as a stopper. It corresponds to an example of a “conveyance unit”. The positioning of the substrates on the mounting stages ST1 and ST2 is performed in the same manner as in the first embodiment, and the details will be described later. Further, in order to distinguish between the substrates S positioned by the mounting stages ST1 and ST2, the substrate S positioned by the mounting stage ST1 is appropriately referred to as "substrate S1", while the substrate S positioned by the mounting stage ST2 is referred to as "substrate S1". S2”.

In the second embodiment, the head unit 5a is provided corresponding to the component supply section 7 on the (-Y) direction side, and the head unit 5b is provided corresponding to the component supply section 7 on the (+Y) direction side. there is The component mounting apparatus 200 includes head support members 63a and 63b extending in the X direction to support the head units 5a and 5b, respectively. An X-axis ball screw 64 extending in the X direction and an X-axis motor Mxa for rotating the X-axis ball screw 64 are attached to the head support member 63a. The head unit 5a is fixed to the nut of the X-axis ball screw 64 while being supported by the head support member 63a so as to be movable in the X direction. Therefore, when the X-axis motor Mxa operates in response to a drive command from the drive control section 43 of the control unit 4, the head unit 5a moves parallel to the transport direction X. As shown in FIG. The head support member 63B is similarly configured, and when the X-axis motor Mxb operates in response to a drive command from the drive control section 43 of the control unit 4, the head unit 5b moves parallel to the transport direction X. In the component mounting apparatus 200, the moving ranges of the head units 5a and 5b are set to the same value, and similarly to the above-described first embodiment, from the upstream position P11 of the mounting stage ST1 to the upstream position of the mounting stage ST2. It is movable in a relatively wide range up to a position downstream of the downstream end position P22. However, as will be described in detail later, the head units 5a and 5b have an in-line structure and therefore have head unrestricted ranges AR1 and AR2, respectively. Moreover, like the apparatus shown in FIG. 9, it has two mounting stages ST1 and ST2 spaced apart from each other in the transport direction X. As shown in FIG. Therefore, there are two unconstrained regions NR1, NR2. That is, there are a non-constrained area NR1 where the head non-constrained range AR1 and the first mounting stage ST1 overlap, and a non-constrained area NR2 where the head non-constrained range AR2 and the second mounting stage ST2 overlap.

The head support members 63a and 63b configured in this way can be moved in the Y direction along the Y-axis rail 66 by a Y-axis motor (linear motor not shown). That is, field coils are attached to both ends of the head support members 63a and 63b as movers of linear motors. On the Y-axis rail 66, on the other hand, a plurality of permanent magnets are arranged along the Y direction and function as a stator of the linear motor. When current is supplied to the mover of the head support member 63a, the head support member 63a moves in the Y direction together with the head unit 5a. Further, when a current is supplied to the mover of the head support member 63b, the head support member 63b moves in the Y direction together with the head unit 5b. Thus, each of the head units 5a and 5b can move above the substrate transfer section 2 in the XY directions.

The head units 5a and 5b have the same configuration as the head unit 5 shown in FIG. That is, the head unit 5a has a plurality of (10 in this embodiment) heads 51 arranged in the X direction. As the head unit 5a moves toward the component supply section 7 in the (−Y) direction, the head 51 moves above the tape feeder 71 attached to the component supply section 7, and is supplied by the tape feeder 71. Adsorb parts. Subsequently, as the head unit 5a moves to the mounting stages ST1 and ST2, the head 51 moves above the board S positioned on the mounting stages ST1 and ST2 to release the suction of the component. Implement parts. On the other hand, as the head unit 5b moves toward the component supply section 7 in the (+Y) direction, the head 51 moves above the tape feeder 71 attached to the component supply section 7, and is supplied by the tape feeder 71. It picks up parts that have been Subsequently, as the head unit 5b moves to the mounting stages ST1 and ST2, the head 51 moves above the board S positioned on the mounting stages ST1 and ST2 to release the suction of the component. Implement parts. Here, the head units 5a and 5b have the same variation of the head 51, and the movable ranges of the head units 5a and 5b are the "first movable range" and the "second movable range" of the present invention, respectively. , but they are identical. Therefore, the head-unrestricted ranges AR1 and AR2 have the same value AR.

Components are mounted on the substrates S1 and S2 positioned on the mounting stages ST1 and ST2 in this way. In this component mounting apparatus 200 as well, if the target position for positioning the board S on the mounting stages ST1 and ST2 is fixed, as shown in the column (b) of FIG. An excess area ER occurs and the mounting cycle time increases.

Therefore, in the second embodiment, similarly to the first embodiment, the arithmetic processing unit 41 performs the following equation Le=Lx−Lf for the mounting stage ST1.
, the length of the excess area ER in the transport direction X, that is, the excess amount Le is calculated, and it is determined whether or not it is greater than zero. That is, the arithmetic processing unit 41 determines whether or not the substrate S1 protrudes in the transport direction X from the non-restricted area NR1 when the substrate S1 is stopped at the reference stop position PS1 set within the non-restricted area NR1. Then, for example, as shown in FIG. 12A, when the substrate S1 is within the non-restricted region NR1, the substrate S1 is stopped in a state where the downstream end of the substrate S1 coincides with the preset reference stop position PS1 ( offset amount OF=zero). This point also applies to the second mounting stage ST2. That is, when the substrate S2 is stopped at the reference stop position PS2 set within the non-restricted region NR2, the substrate S2 does not protrude from the non-restricted region NR2 in the transport direction X. Therefore, as shown in FIG. The substrate S2 is stopped in a state in which the edge coincides with a preset reference stop position PS2.

On the other hand, when the excess amount Le exceeds zero, that is, when the substrate S1 is stopped at the reference stop position PS1 set within the non-restricted area NR1, the substrate S1 protrudes from the non-restricted area NR1 in the transport direction X. , upstream offset processing is performed as shown in FIG. 12B. This point also applies to the second mounting stage ST2. That is, when the substrate S2 is stopped at the reference stop position PS2 set within the non-restricted area NR2, the substrate S2 protrudes from the non-restricted area NR2 in the transport direction X. Therefore, as shown in FIG. 12B, the downstream offset process is performed. executed. As a result, it is possible to suppress an increase in the mounting cycle time due to an increase in the size of the substrate S, thereby enabling efficient component mounting. Note that the length Le of the excess area ER on the second mounting stage ST2 side corresponds to an example of the "second excess amount" of the present invention.

Further, in the second embodiment, as shown in FIG. 12A, when the substrate size Lx of the substrate S is equal to or smaller than the switching reference information Lf and is relatively small, the substrates S1 and S2 are located within the non-restricted regions NR1 and NR2, respectively. The component mounting is performed in the state of being positioned at In other words, components can be mounted without being subject to head restrictions, so excellent mounting cycle time can be obtained.

In the second embodiment, when the substrate size Lx of the substrate S is equal to or smaller than the switching reference information Lf, the offset amount OF is set to zero, and the preset reference stop positions PS1 and PS2 are not offset. It may be offset accordingly, as shown in FIG. 12E.

FIG. 12C is a diagram schematically showing the offset operation in the first modified example of the second embodiment of the substrate transfer device according to the present invention. In this first modification, the substrate size Lx of the substrate S is equal to or smaller than the switching reference information Lf, and the substrate S1 is moved while the upstream end of the substrate S1 in the transport direction X coincides with the upstream end position PH1 of the non-restricted region NR1. Conveyor 22 is controlled to stop. Further, the conveyor 23 is controlled so that the substrate S2 stops in a state where the downstream end of the substrate S2 in the transport direction X coincides with the downstream end position PH2 of the non-restricted area NR2. Thus, the reference stop positions PS1 and PS2 are offset. As a result, the distance W between the substrates S1 and S2 in the transport direction X is widened. As a result, the waiting time for avoiding interference between the head units 5a and 5b in the direction parallel to the conveying direction X is reduced, and the mounting cycle time loss can be reduced.

FIG. 12D is a diagram schematically showing the offset operation in the second modification of the second embodiment of the substrate transfer device according to the present invention. In this second modification, the substrate size Lx of the substrate S is equal to or smaller than the switching reference information Lf, and the component recognition cameras Ca and Cb are arranged near the connection positions of the conveyors 22 and 23. . That is, the conveyor 22 is controlled such that the substrate S1 stops with the downstream end of the substrate S1 in the transport direction X aligned with the downstream end position PH12 of the non-restricted area NR1. Further, the conveyor 23 is controlled so that the substrate S2 stops in a state where the upstream end of the substrate S2 in the transport direction X coincides with the upstream end position PH21 of the non-restricted area NR2. Thus, the reference stop positions PS1 and PS2 are offset. As a result, the distance W between the substrates S1 and S2 in the transport direction X is narrowed. As a result, the distance that the head units 5a and 5b move to the board S via the component recognition cameras Ca and Cb is shortened, which works advantageously for improving the mounting cycle time.

FIG. 12E is a diagram schematically showing the offset operation in the third modification of the second embodiment of the substrate transfer device according to the present invention. This third modification corresponds to variations of the heads 51 attached to the head units 5a and 5b. For example, when the head unit 5a is in charge of mounting components on the board S1, as shown in FIG. It is desirable to Therefore, in the third modified example, the reference stop position PS1 is offset so that the substrate S1 is positioned at the preferred position described above, and the upstream end of the substrate S1 is positioned so as to coincide with the reference stop position PS1 after the offset. . This point is the same when the head unit 5b is in charge of mounting components on the board S2. By such offset processing, component mounting on the board S1 by the head unit 5a and component mounting on the board S2 by the head unit 5b are efficiently carried out, which is advantageous in improving the mounting cycle time.

In the above-described second embodiment and its modification, the substrates S1 and S2 respectively correspond to examples of the "first substrate" and the "second substrate" of the present invention, and the reference stop positions PS1 and PS2 respectively correspond to the " It corresponds to an example of "first reference stop position" and "second reference stop position".

In the second embodiment, the head-unrestricted ranges AR1 and AR2 have the same value AR. There may be cases where the ranges AR1 and AR2 are different. Alternatively, head units 5a and 5b may access both mounting stages ST1 and ST2 as in the modification shown in FIGS. 12C and 12D, or head units 5a and 5b may access both mounting stages ST1 and ST2 as shown in FIG. 12E. You may access only Therefore, when the head unrestricted ranges AR1 and AR2 are different from each other and the head units 5a and 5b access both the mounting stages ST1 and ST2 (third embodiment), the head unrestricted ranges AR1 and AR2 are different from each other. Also, a case (fourth embodiment) in which the head units 5a and 5b access only the mounting stages ST1 and ST2, respectively, will be sequentially described.

FIG. 13 is a diagram schematically showing the offset operation in the third embodiment of the substrate transfer device according to the present invention. In the figure, the head-unrestricted range AR2 is narrower than the head-unrestricted range AR1, and is included in the head-unrestricted range AR1 in the transport direction X. FIG. Moreover, as indicated by the thick arrows in the figure, the head units 5a and 5b access both the mounting stages ST1 and ST2 to mount the components. Therefore, in this embodiment, the head-unrestricted range AR2 serves as a reference for determining the unrestricted area. That is, the areas where the head unrestricted area AR2 and the mounting stages ST1 and ST2 overlap correspond to the unrestricted areas NR1 and NR2, respectively. Note that the offset processing of the reference stop positions PS1 and PS2 is the same as that of the second embodiment and the modified example, so description thereof will be omitted.

FIG. 14 is a diagram schematically showing the offset operation in the fourth embodiment of the substrate transfer device according to the present invention. The major difference between the fourth embodiment and the third embodiment is that the head units 5a and 5b access only the mounting stages ST1 and ST2, respectively, as indicated by the thick arrows in the figure. In this fourth embodiment, the criteria for determining the non-constrained area are different for each of the mounting stages ST1 and ST2. That is, since the head unit 5a is exclusively configured for component mounting on the mounting stage ST1, the overlapping area of the head non-restricted area AR1 of the head unit 5a and the mounting stage ST1 corresponds to the non-restricted area NR1. On the other hand, since the head unit 5b is exclusively configured for component mounting on the mounting stage ST2, the overlapping area of the head unrestricted area AR2 of the head unit 5b and the mounting stage ST2 corresponds to the unrestricted area NR2. Note that the offset processing of the reference stop positions PS1 and PS2 is the same as that of the second embodiment and the modified example, so description thereof will be omitted.

As described above, in the third embodiment and the fourth embodiment, although the head-unrestricted ranges AR1 and AR2 are different from each other, the size of the substrate in the transport direction X is increased in the same manner as in the second embodiment and the modified example. Efficient component mounting is possible by suppressing an increase in the mounting cycle time associated with the increase in the number of parts. Further, when the substrate size Lx of the substrate S is equal to or smaller than the switching reference information Lf and is relatively small, the component mounting is executed while being accommodated in the non-restricted areas NR1 and NR2. In other words, components can be mounted without being subject to head restrictions, so excellent mounting cycle time can be obtained. Furthermore, as shown in FIGS. 12C to 12E, by devising the arrangement of the relatively small substrates S1 and S2, the mounting cycle time can be reduced.

FIG. 15 is a diagram schematically showing the offset operation in the fifth embodiment of the substrate transfer device according to the present invention. The basic configuration of this component mounting apparatus 200 is the same as that of the second embodiment. However, since components are mounted on a so-called long board S that is longer than the dimensions of the mounting stages ST1 and ST2 in the transport direction X, the conveyors 21 to 23 of the board transport section 2 operate synchronously, and the long board S is mounted. It is positioned across the mounting stages ST1 and ST2. Therefore, in the fifth embodiment, in the transport direction X, the area sandwiched between the most upstream position PH1 of the area where the head unrestricted area AR overlaps the mounting stage ST1 and the most downstream position PH2 of the area overlapping the mounting stage ST2 is unconstrained. It is set as area NR.

When the long substrate S is positioned at the preset reference stop position PS1, for example, as shown in column (a) of FIG. Component mounting is performed in a state that the part is contained in the non-restricted area NR. In other words, components can be mounted without being subject to head restrictions, so excellent mounting cycle time can be obtained.

On the other hand, when the long substrate S protrudes from the non-restricted area NR, the reference stop position PS1 is offset as in the first embodiment, as shown in column (b) of FIG. Therefore, although the long substrate S protrudes from the non-restricted area NR as the long substrate S increases in size, the excess area ER becomes narrower than before the offset, and the number of heads 51 subject to head restriction is reduced. As a result, it is possible to suppress an increase in the mounting cycle time due to an increase in the size of the long substrate S, thereby enabling efficient component mounting.

It should be noted that the present invention is not limited to the above embodiments, and various modifications can be made to the above without departing from the spirit of the present invention. For example, in the above embodiments, the present invention is applied to component mounting apparatuses 100 and 200 having head units 5, 5a, and 5b having an in-line structure in which ten heads 51 are arranged in a line. is not limited to "10". The present invention is also applied to a component mounting apparatus using a head unit having an in-line structure in which a plurality of rows of heads arranged in a direction parallel to the conveying direction X are arranged in the Y direction perpendicular to the conveying direction X. can do.

INDUSTRIAL APPLICABILITY The present invention can be applied to general substrate transfer technology for transferring substrates in a component mounting apparatus that uses a head unit having a so-called in-line structure in which a plurality of heads are arranged in a predetermined arrangement direction to mount components on a substrate. can be done.

2... Substrate transfer unit (substrate transfer device)
4... Control unit (control section)
5, 5a... (first) head unit 5b... second head unit 21, 22... conveyor (first stopperless transport unit)
23... Conveyor (second stopperless conveying unit)
41 ... Arithmetic processing unit (control unit)
51... Head 51a... (most downstream) head 51j... (most upstream) head 100, 200... Component mounter 900... Host computer AR, AR1... First head unrestricted area AR2... Second head unrestricted area ER... Excess area MR... First movable range NR, NR1... First non-constrained area NR2... Second non-constrained area OF... Offset amount PH1, PH1a, PH1b... (Head unconstrained area, non-constrained area) upstream end position PH2, PH2a, PH2a... (head unrestricted range, unrestricted area) downstream end position PP11 (first mounting stage) upstream end position PP12 (first mounting stage) downstream end position PP21 (second mounting stage) ) Upstream end position PP22: Downstream end position (of second mounting stage) PS1: First reference stop position PS2: Second reference stop position RMa: Recording medium S, S1, S2: Substrate, long substrate ST1: First mounting Stage ST2...Second mounting stage X...Transport direction, arrangement direction

Claims (16)

1. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. and mounting a component on a first substrate positioned within a first mounting stage using the first head unit, the substrate conveying device being installed in a component mounting apparatus,
   A first stopperless transport for stopping the first substrate in the first mounting stage without mechanical contact with the contact member after transporting the first substrate in the transport direction parallel to the arrangement direction. Department and
   a control unit that controls the first stopperless transport unit,
   a first upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most upstream position of the first movable range in the transport direction; A first head unit sandwiched between a first downstream end position where the most upstream head of the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range, and When the constraint range defines the region overlapping the first mounting stage as the first unconstrained region,
   The control unit determines that the first substrate protrudes from the first unrestricted area in the transport direction when the first substrate is stopped at a first reference stop position set within the first unrestricted area. Then, the first substrate is stopped at a position offset by an offset amount equal to or less than a first excess amount and larger than zero in the direction opposite to the direction of protrusion from the first reference stop position. A substrate conveying apparatus, wherein the first stopperless conveying section is controlled so as to do so.
2. The substrate transfer apparatus according to claim 1,
   When the control unit determines that the first substrate does not protrude from the first non-restricted area in the transport direction when the first substrate is stopped at the first reference stop position, the first substrate stops at the first reference stop position. The first stopperless transport unit stops at a first reference stop position, or stops at a position offset from the first reference stop position within a range in which the first substrate does not protrude from the first non-restricted area. A substrate transport device that controls the
3. The substrate transfer apparatus according to claim 1 or 2,
   The component mounting device
   Mounting a component using the first head unit also on a second substrate positioned in a second mounting stage arranged downstream of the first mounting stage in the transport direction, and
   While arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction, the plurality of heads are collectively arranged in a direction parallel to the arrangement direction within a second movable range that is the same as the first movable range. further comprising a movable second head unit, and using the second head unit to mount components on the first substrate and the second substrate respectively positioned on the first mounting stage and the second mounting stage; When implementing
   A second stopperless transport for stopping the second substrate transported from the first mounting stage by the first stopperless transport unit within the second mounting stage without mechanical contact with a contact member. further comprising the
   When the area in which the first head unrestricted area overlaps with the second mounting stage in the transport direction is defined as a second unrestricted area,
   The control unit determines that the second substrate protrudes from the second unconstrained area in the transport direction when the second substrate is stopped at a second reference stop position set within the second unconstrained area. Then, the second substrate is stopped at a position offset by an offset amount equal to or less than a second excess amount and larger than zero in the direction opposite to the direction of protrusion from the second reference stop position. a substrate transport apparatus for controlling the second stopperless transport section so as to
4. The substrate transfer apparatus according to claim 1 or 2,
   The component mounting apparatus uses the first head unit to mount components also on a second substrate positioned within a second mounting stage arranged downstream of the first mounting stage in the transport direction. While a plurality of heads having nozzles attached to their tips are arranged along a predetermined arrangement direction, the plurality of heads are collectively moved in a direction parallel to the arrangement direction in a second movable range different from the first movable range. further comprising a second head unit movable within a range, wherein the second head unit is used for the first substrate and the second substrate respectively positioned on the first mounting stage and the second mounting stage; When mounting parts by
   A second stopperless transport for stopping the second substrate transported from the first mounting stage by the first stopperless transport unit within the second mounting stage without mechanical contact with a contact member. further comprising the
   an upstream end position where the most downstream head among the plurality of heads in the transport direction is positioned when the second head unit is positioned at the most upstream position of the second movable range in the transport direction; When the second head unit is positioned at the most downstream position of the movable range, the range sandwiched between the downstream end position where the most upstream head among the plurality of heads in the transport direction is positioned is defined as a second head unrestricted range. and
   The control unit
   When the first head-unrestricted range is narrower than the second head-unrestricted range in the transport direction, the area where the first head-unrestricted range overlaps with the second mounting stage in the transport direction is defined as a second unrestricted area. and when it is determined that the second substrate protrudes from the second non-constrained area in the transport direction when the second substrate is stopped at a second reference stop position set within the second non-constrained area, the The second substrate is stopped at a position offset by an offset amount equal to or less than a second excess amount protruding from the second unrestricted area in a direction opposite to the direction of protruding from the second reference stop position and larger than zero. , while controlling the second stopperless transport section;
   When the second head-unrestricted range is narrower than the first head-unrestricted range in the transport direction, a region in which the second head-unrestricted range overlaps with the first mounting stage in the transport direction is defined as the first unrestricted range. when it is determined that the second substrate protrudes from the second unrestricted area in the transport direction when the second substrate is stopped at a second reference stop position set within the second unrestricted area, The second substrate is stopped at a position offset by an offset amount equal to or less than a second excess amount protruding from the second unrestricted area in a direction opposite to the direction of protruding from the second reference stop position and larger than zero. and a substrate transfer device for controlling the second stopperless transfer section.
5. The substrate transfer apparatus according to claim 1 or 2,
   The component mounting apparatus arranges a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction, and collectively aligns the plurality of heads in a direction parallel to the arrangement direction so as to differ from the first movable range. a second head unit that is movable within a second movable range; When mounting components using the head unit,
   A second stopperless transport for stopping the second substrate transported from the first mounting stage by the first stopperless transport unit within the second mounting stage without mechanical contact with a contact member. further comprising the
   a second upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the second head unit is positioned at the most upstream position of the second movable range in the transport direction; When the second head unit is positioned at the most downstream position in the second movable range, the range sandwiched between the second downstream end position where the most upstream head among the plurality of heads in the transport direction is positioned is the second movable range. defined as a head unconstrained area, and defining an area where the second head unconstrained area overlaps the second mounting stage in the transport direction as a second unconstrained area,
   The control unit determines that the second substrate protrudes from the second unconstrained area in the transport direction when the second substrate is stopped at a second reference stop position set within the second unconstrained area. Then, the second substrate is stopped at a position offset by an offset amount equal to or less than a second excess amount and larger than zero in the direction opposite to the direction of protrusion from the second reference stop position. a substrate transport apparatus for controlling the second stopperless transport section so as to
6. The substrate transfer apparatus according to any one of claims 3 to 5,
   When the control unit determines that the second substrate does not protrude from the second non-restricted area in the transport direction when the second substrate is stopped at the second reference stop position, the second substrate stops at the second reference stop position. The second stopperless transport unit stops at a second reference stop position, or stops at a position offset from the second reference stop position within a range in which the second substrate does not protrude from the second non-restricted area. A substrate transport device that controls the
7. The substrate transfer apparatus according to claim 6,
   The control unit
   When determining that the first substrate and the second substrate do not protrude from the first unconstrained area and the second unconstrained area, respectively,
   controlling the first stopperless transport section so that the first substrate stops in a state where the upstream end of the first substrate in the transport direction is aligned with the position of the upstream end of the first unrestricted area;
   A substrate transport apparatus for controlling the second stopperless transport section so that the second substrate stops in a state where the downstream end of the second substrate in the transport direction coincides with the position of the downstream end of the second non-restricted area.
8. The substrate transfer apparatus according to claim 6,
   The control unit
   When determining that the first substrate and the second substrate do not protrude from the first unconstrained area and the second unconstrained area, respectively,
   controlling the first stopperless transport section so that the first substrate stops with a downstream end of the first substrate in the transport direction aligned with a position of a downstream end of the first unrestricted area;
   A substrate transport apparatus for controlling the second stopperless transport section so that the second substrate stops in a state where the upstream end of the second substrate in the transport direction coincides with the position of the upstream end of the second non-restricted area.
9. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. using the first head unit to mount components on a long substrate positioned across a first mounting stage and a second mounting stage spaced apart from each other in a direction parallel to the arrangement direction. , a board transfer device installed in a component mounting device,
   After transporting the long substrate in the transport direction parallel to the arrangement direction, the long substrate straddles the first mounting stage and the second mounting stage without mechanical contact with the contact member. A board transfer unit that stops the
   A control unit that controls the substrate transport unit,
   a first upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most upstream position of the first movable range in the transport direction; A first head unit sandwiched between a first downstream end position where the most upstream head of the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range, and When the region sandwiched between the most upstream position of the region where the constraint range overlaps with the first mounting stage and the most downstream position of the region where the constraint range overlaps with the second mounting stage is defined as a first unconstrained region,
   The control unit determines that the long substrate protrudes from the first unconstrained area in the transport direction when the long substrate is stopped at a first reference stop position set within the first unconstrained area. Then, the long substrate is stopped at a position offset by an offset amount equal to or smaller than a first excess amount and larger than zero, in a direction opposite to the direction of protruding from the first reference stop position. A substrate transfer apparatus, wherein the substrate transfer section is controlled so as to
10. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. and mounting a component on a first substrate positioned within a first mounting stage using the first head unit,
    A component mounting apparatus comprising the substrate transfer apparatus according to any one of claims 1 to 8.
11. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. using the first head unit to mount components on a long substrate positioned across a first mounting stage and a second mounting stage spaced apart from each other in a direction parallel to the arrangement direction. , a component mounting device,
    A component mounting apparatus comprising the board transfer apparatus according to claim 9 .
12. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. for mounting components on a first substrate positioned within a first mounting stage using the first head unit, wherein the first substrate is transported in a transport direction parallel to the arrangement direction. A substrate transfer method for
    a first upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most upstream position of the first movable range in the transport direction; A first head unit sandwiched between a first downstream end position where the most upstream head of the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range, and a first step of obtaining a region where a restricted range overlaps with the first mounting stage as a first non-restricted region;
    determining whether or not the first substrate protrudes from the first unrestricted area in the transport direction when the first substrate is stopped at a first reference stop position set within the first unrestricted area; 2 steps;
    When it is determined in the second step that the first substrate protrudes from the first non-restricted area, the first substrate protrudes from the first non-restricted area in a direction opposite to the direction of protruding from the first reference stop position. a third step of transporting and positioning the first substrate to a position offset by an offset amount equal to or less than the excess amount and greater than zero;
    A substrate transfer method, comprising:
13. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. using the first head unit to mount components on a long substrate positioned across a first mounting stage and a second mounting stage spaced apart from each other in a direction parallel to the arrangement direction. A substrate transport method for transporting the first substrate in a transport direction parallel to the arrangement direction in a component mounting apparatus,
    a first upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most upstream position of the first movable range in the transport direction; A first head unit sandwiched between a first downstream end position where the most upstream head of the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range, and a first step of acquiring, as a first non-constrained area, an area sandwiched between a most upstream position of an area where a restricted range overlaps with the first mounting stage and a most downstream position of an area where the restricted range overlaps with the second mounting stage;
    determining whether or not the long substrate protrudes from the first non-constrained area in the transport direction when the long substrate is stopped at a first reference stop position set within the first non-constrained area; 2 steps;
    When it is determined in the second step that the long substrate protrudes from the first non-restricted area, a first non-restricted area protrudes from the first non-restricted area in a direction opposite to the direction of protruding from the first reference stop position. a third step of transporting and positioning the long substrate to a position offset by an offset amount equal to or less than the excess amount and greater than zero;
    A substrate transfer method, comprising:
14. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. for mounting components on a first substrate positioned within a first mounting stage using the first head unit, wherein the first substrate is transported in a transport direction parallel to the arrangement direction. A program for
    a first upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most upstream position of the first movable range in the transport direction; A first head unit sandwiched between a first downstream end position where the most upstream head of the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range, and a first step of obtaining a region where a restricted range overlaps with the first mounting stage as a first non-restricted region;
    determining whether or not the first substrate protrudes from the first unrestricted area in the transport direction when the first substrate is stopped at a first reference stop position set within the first unrestricted area; 2 steps;
    When it is determined in the second step that the first substrate protrudes from the first non-restricted area, the first substrate protrudes from the first non-restricted area in a direction opposite to the direction of protruding from the first reference stop position. a third step of transporting and positioning the first substrate to a position offset by an offset amount equal to or less than the excess amount and greater than zero;
    A program characterized by realizing on a computer.
15. A first head unit capable of moving collectively within a first movable range in a direction parallel to the arrangement direction while arranging a plurality of heads having nozzles attached to their tips along a predetermined arrangement direction. using the first head unit to mount components on a long substrate positioned across a first mounting stage and a second mounting stage spaced apart from each other in a direction parallel to the arrangement direction. A program for transporting the board in a transport direction parallel to the arrangement direction in a component mounting apparatus,
    a first upstream end position at which the most downstream head among the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most upstream position of the first movable range in the transport direction; A first head unit sandwiched between a first downstream end position where the most upstream head of the plurality of heads in the transport direction is positioned when the first head unit is positioned at the most downstream position in the first movable range, and a first step of acquiring, as a first non-constrained area, an area sandwiched between a most upstream position of an area where a restricted range overlaps with the first mounting stage and a most downstream position of an area where the restricted range overlaps with the second mounting stage;
    determining whether or not the long substrate protrudes from the first non-constrained area in the transport direction when the long substrate is stopped at a first reference stop position set within the first non-constrained area; 2 steps;
    When it is determined in the second step that the long substrate protrudes from the first non-restricted area, a first non-restricted area protrudes from the first non-restricted area in a direction opposite to the direction of protruding from the first reference stop position. a third step of transporting and positioning the long substrate to a position offset by an offset amount equal to or less than the excess amount and greater than zero;
    A program characterized by realizing on a computer.
16. A non-transitory recording medium recording the program according to claim 14 or 15.
    

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