CN105269884B - Combined type high frequency Double-sided copper clad laminate and its manufacture method - Google Patents
Combined type high frequency Double-sided copper clad laminate and its manufacture method Download PDFInfo
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- CN105269884B CN105269884B CN201410348307.0A CN201410348307A CN105269884B CN 105269884 B CN105269884 B CN 105269884B CN 201410348307 A CN201410348307 A CN 201410348307A CN 105269884 B CN105269884 B CN 105269884B
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Abstract
The invention discloses a kind of combined type high frequency Double-sided copper clad laminate,It is obtained by simple processing procedure,It is by the first copper foil layer,Polyimide layer,Adhesion layer and the second copper foil layer overlap composition successively,Wherein,The thickness of both polyimide layer and adhesion layer and be 15 75 microns,The thickness of adhesion layer is 10 55 microns,The thickness of polyimide layer is 5 20 microns,Adhesion layer is mixed by fluorine resin and thermosetting resin and can be individual layer or three-decker,The content that the present invention passes through fluorine resin in the thickness and adhesion layer that adjust adhesion layer and polyimide layer,Make copper clad laminate that there is extremely low Dk,Df,The loss of signal transmission can significantly be reduced,And then efficient raising signal transmission quality,Double-sided copper clad laminate of the invention also has following characteristic compared to traditional Teflon system and LCP systems Double-sided copper clad laminate：Excellent dimensional stability, peel strength, bounce, resistance to chemical reagents and heat resistance and splendid operability, in leading ranks in the industry.
Description
Technical field
It is more particularly to a kind of that there is low Dk, Df characteristic the present invention relates to a kind of combined type high frequency Double-sided copper clad laminate, it is used for
The chi high peace of signal transmission plate, low bounce-back power, easy-operating combined type high frequency Double-sided copper clad laminate, can reduce the loss of signal, carry
High-transmission quality.
Background technology
Radio infrastructure needs to provide sufficiently low Insertion Loss, can just effectively improve energy utilization rate.As 4G business is come
Face, radio frequency products needs to provide broader bandwidth, and backward compatible 3G, 2G business.Meanwhile, base station becomes less and less, gets over
Come lighter, and be installed on tower top, this also just promotes circuit board toward miniaturization.
In terms of the handheld devices such as panel computer, the material of antenna miniaturization is being sought to allow by many manufacturers.It is hand-held
Many antennas (bluetooth, Wi-Fi, cellular communication and GPS etc.) are contained in equipment, these antenna is arranged in the space of very little,
And can not disturb from each other.Meanwhile, the Antenna Design per company is all different, it is necessary to possess flexibility.This is just to electricity
Sheet material path proposes requirement very high.
In order to tackle the demand, refined gloomy electronics develops combined type high frequency Double-sided copper clad laminate product, has applied for structure
Patent, application ground TaiWan, China, Certificate Number M377823, the present invention is the continuity of this structure patent.
The content of the invention
In order to solve the above problems, the invention provides a kind of combined type high frequency Double-sided copper clad laminate, the combined type high frequency
Double-sided copper clad laminate is obtained by easy processing procedure, with extremely low Dk, Df characteristic, can significantly reduce the damage of signal transmission
Lose, and then efficient raising signal transmission quality, also with excellent dimensional stability, peel strength, bounce, drug-resistant
Property and heat resistance.
The technical scheme that is used to solve its technical problem of the present invention is：
A kind of combined type high frequency Double-sided copper clad laminate, by the first copper foil layer, polyimide layer, adhesion layer and the second copper foil layer
Overlapping is constituted successively, wherein, the thickness sum of both the polyimide layer and the adhesion layer is 15-75 microns, described glutinous
It is 10-55 microns the thickness of layer, and the thickness of the polyimide layer is 5-20 microns；
Wherein, the material of the adhesion layer is to include fluorine resin and thermosetting resin, and the fluorine resin ratio
It is the 15-80% (percentage by weight) of total solids content.
Further, the adhesion layer is single layer structure or three-decker.When adhesion layer is single layer structure, the fluorine
The ratio for being resin is the 15-25% of total solids content.
It is preferred that when the adhesion layer is three-decker, it is by the first high frequency glue-line, the second high frequency glue-line and the
Three high frequency glue-lines are constituted, and the material of the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line is individually including fluorine
It is resin and thermosetting resin；Wherein, the ratio of the fluorine resin in the first high frequency glue-line is the 15- of total solids content
25% (percentage by weight), the thickness of the first high frequency glue-line is 2-10 microns；Wherein, the fluorine in the second high frequency glue-line
The ratio for being resin is the 60-80% (percentage by weight) of total solids content, and the thickness of the second high frequency glue-line is that 10-55 is micro-
Rice；Wherein, the ratio of the fluorine resin in the 3rd high frequency glue-line is the 15-25% (percentage by weight) of total solids content,
The thickness of the 3rd high frequency glue-line is 2-10 microns.
It is preferred that the thickness of the adhesion layer is 20-50 microns, the thickness of the polyimide layer is 8-14 microns.
It is preferred that the first high frequency glue-line is identical with the thickness of the 3rd high frequency glue-line and Df values are identical, it is described
The Df values of adhesion layer meet following relational expressions：Df=Df1×a/(a+2b)+Df2× 2b/ (a+2b),
Wherein, Df1It is the Df values of the second high frequency glue-line；
Df2It is the respective Df values of first and third high frequency glue-line；
A is the thickness value of the second high frequency glue-line；
B is the first and third respective thickness value of high frequency glue-line.
Preferably, the Df values of the first and third high frequency glue-line are respectively Df2=0.006, the second high frequency glue-line
Df values are Df1=0.002, the thickness of the first and third high frequency glue-line is respectively b=5 microns, the thickness of the second high frequency glue-line
It is a=30 microns to spend, and the Df values of the adhesion layer are 0.003.
It is preferred that the thermosetting resin is selected from epoxy resin, acrylic resin, amido formate system resin, silicon
Rubber series resin, poly- at least one in ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin or
Phosphorus system resin.
It is preferred that the thickness of first copper foil layer and the second copper foil layer is respectively 8-35 microns.
It is preferred that first copper foil layer and the second copper foil layer are respectively the one kind in rolled copper foil and electrolytic copper foil.
The manufacture method of above-mentioned combined type high frequency Double-sided copper clad laminate, it is characterised in that：Carry out in the steps below：
Step one：Polyimide polymer is coated with any surface of the first copper foil layer, and is subject to drying and form polyamides Asia
An one side copper clad laminate is obtained after amine layer；
Step 2：Adhesion layer is formed in the polyimides layer surface of one side copper clad laminate with transfer printing, and makes to stick together
Layer is in half polymerization semi-cured state；
Step 3：Taking the second copper foil layer, the second copper foil layer is covered on adhesion layer, and give pressing makes the second copper foil layer
Tight gluing, obtains Double-sided copper clad laminate；
Step 4：Baking Double-sided copper clad laminate, obtains combined type high frequency Double-sided copper clad laminate finished product of the present invention.
The beneficial effects of the invention are as follows：Combined type high frequency Double-sided copper clad laminate of the invention is obtained by simple processing procedure, be by
First copper foil layer, polyimide layer, adhesion layer and the second copper foil layer overlap composition successively, wherein, polyimide layer and adhesion layer
Both thickness sums are 15-75 microns, and the thickness of adhesion layer is 10-55 microns, and the thickness of polyimide layer is 5-20 microns,
The material of adhesion layer is mixed by fluorine resin and thermosetting resin, and the ratio of fluorine resin is total solids content
15-80% (percentage by weight), the present invention is by fluorine system tree in the thickness and adhesion layer that adjust adhesion layer and polyimide layer
The content of fat, makes copper clad laminate of the invention have extremely low Dk, Df, can significantly reduce the loss of signal transmission, enters
And efficient raising signal transmission quality.Combined type high frequency Double-sided copper clad laminate of the invention is compared to Teflon system and LCP
It is that Double-sided copper clad laminate has following characteristic：Low temp operation, beneficial to downstream process；It is good with splendid dimensional stability；Have
Splendid resistance to chemical reagents and heat resistance；With splendid heat-resisting quantity and adhesion, the splendid opering characteristic of electric apparatus, the present invention is produced
The combined type high frequency copper clad laminate Df values for going out can reach 0.003, with reference to excellent product performance, splendid operability, in industry
Interior leading ranks.
Brief description of the drawings
Fig. 1 is a kind of combined type high frequency Double-sided copper clad laminate (adhesion layer is single layer structure) structure chart of the invention；
Fig. 2 is another combined type high frequency Double-sided copper clad laminate (adhesion layer is three-decker) structure chart of the invention.
Specific embodiment
Specific embodiment of the invention is illustrated below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed in bright book understands advantages of the present invention and effect easily.The present invention can also other different modes give reality
Apply, i.e. do not depart from it is disclosed under the scope of, can give different modifications with change.
A kind of combined type high frequency Double-sided copper clad laminate, by the first copper foil layer, polyimide layer, adhesion layer and the second copper foil layer
Overlapping is constituted successively, wherein, the thickness sum of both the polyimide layer and the adhesion layer is 15-75 microns, described glutinous
It is 10-55 microns the thickness of layer, and the thickness of the polyimide layer is 5-20 microns；
Wherein, the material of the adhesion layer is to include fluorine resin and thermosetting resin, and the fluorine resin ratio
It is the 15-80% (percentage by weight) of total solids content.
The Copper Foil that first copper foil layer is used is rolled copper foil (RA Copper Foils) or electrolytic copper foil, the thickness of the first copper foil layer
Preferably 8-18 microns of degree；The Copper Foil that second copper foil layer is used has no specifically limited, and general electrolytic copper foil, second can be used
The thickness of copper foil layer is preferably 8-18 microns.
In order that the flexible electric circuit board manufactured by it has extremely low Dk, Df characteristic, copper clad laminate of the invention is root
The thickness of adhesion layer and the amount of institute's fluorine resin are adjusted the need for according to the copper clad laminate come obtain thickness of thin, bounce it is good and be situated between
The small copper clad laminate of electrical loss, the thickness of the adhesion layer of copper clad laminate of the present invention is 10-55 microns, preferably 20-50 microns,
When the thickness of polyimide layer is between 8-14 microns, the thickness of adhesion layer is selected between 20-50 microns.The adhesion layer
Thermosetting resin material be generally selected from epoxy resin, acrylic resin, amido formate system resin, silicon rubber system tree
Fat, poly- mixture to one or more in ring diformazan benzene series resin, bismaleimide amine system resin, polyimide resin or
Phosphorus system resin, and contain fluorine resin wherein, the adhesion layer can be individual layer (as shown in Figure 1) or three layers (as shown in Figure 2), list
Layer adhesion layer, the ratio of the fluorine resin is the 15-25% of total solids content, and Df values are up to 0.006；Three-decker is sticked together
Layer concrete structure is as follows：
It is made up of the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line, it is the first high frequency glue-line, second high
The material of frequency glue-line and the 3rd high frequency glue-line is individually to be mixed by fluorine resin and thermosetting resin；Wherein, described first
The ratio of the fluorine resin in high frequency glue-line is the 15-25% (percentage by weight) of total solids content, the first high frequency glue-line
Thickness be 2-10 microns；Wherein, the ratio of the fluorine resin in the second high frequency glue-line is the 60-80% of total solids content
(percentage by weight), the thickness of the second high frequency glue-line is 10-55 microns；Wherein, the fluorine system in the 3rd high frequency glue-line
The ratio of resin is the 15-25% (percentage by weight) of total solids content, and the thickness of the 3rd high frequency glue-line is 2-10 microns.
The thickness of the first high frequency glue-line and the 3rd high frequency glue-line is identical and Df values are identical, under the Df values of the adhesion layer meet
State relational expression：Df=Df1×a/(a+2b)+Df2× 2b/ (a+2b),
Wherein, Df1It is the Df values of the second high frequency glue-line；
Df2It is the respective Df values of first and third high frequency glue-line；
A is the thickness value of the second high frequency glue-line；
B is the first and third respective thickness value of high frequency glue-line.
The Df values of the first and third high frequency glue-line are each up to Df2=0.006, the Df values of the second high frequency glue-line can
Up to Df1=0.002, it is adjusted, when the thickness of first and third high frequency glue-line is respectively b=5 microns, the thickness of the second high frequency glue-line
Spend for a=30 microns when, the Df values of adhesion layer are up to 0.003.
The present invention is stressed that the polyimide layer and adhesion layer, and the carrier polyimide layer is beneficial to follow-up system
The attachment of product, insulation, size are stable etc. in journey, and the adhesion layer meets the transmission of product high-speed and high-efficiency in follow-up product
It is required that.
The manufacture method of combined type high frequency Double-sided copper clad laminate of the present invention, is carried out in the steps below：
Step one：Polyimide polymer is coated with any surface of the first copper foil layer, and is subject to drying and form polyamides Asia
An one side copper clad laminate is obtained after amine layer；
Step 2：Adhesion layer is formed in the polyimides layer surface of one side copper clad laminate with transfer printing, and makes to stick together
Layer is in half polymerization semi-cured state；
Step 3：Taking the second copper foil layer, the second copper foil layer is covered on adhesion layer, and give pressing makes the second copper foil layer
Tight gluing, obtains Double-sided copper clad laminate；
Step 4：Baking Double-sided copper clad laminate, obtains combined type high frequency Double-sided copper clad laminate finished product of the present invention.
Embodiment 1：As shown in figure 1, a kind of combined type high frequency Double-sided copper clad laminate, by the first copper foil layer 101, polyimides
The layer 102, copper foil layer 104 of adhesion layer 103 and second overlaps composition successively.Wherein, polyimide layer thickness 5um；Adhesion layer is single
Layer, in 15-25%, thickness is 45um to wherein fluororesin content；
Embodiment 2：As shown in Fig. 2 a kind of combined type high frequency Double-sided copper clad laminate, by the first copper foil layer 101, polyimides
Layer 102, adhesion layer and the second copper foil layer 104 overlap composition successively.Wherein, polyimide layer thickness 13um；Adhesion layer is three layers
And be respectively the first high frequency glue-line 1031, the second high frequency glue-line 1032 and the 3rd high frequency glue-line 1033, add in the second high frequency glue-line
Plus more fluorine resins, the 60-80% of total solids content is accounted for, thickness 30um, the fluorine resin of first and third high frequency glue-line is accounted for
The 15-25% of total solids content, thickness 5um, adhesion layer gross thickness are 40um.
Embodiment 3：As shown in figure 1, a kind of combined type high frequency Double-sided copper clad laminate, by the first copper foil layer 101, polyimides
The layer 102, copper foil layer 104 of adhesion layer 103 and second overlaps composition successively.Wherein, polyimide layer thickness 20um；Adhesion layer is single
Layer, in 15-25%, thickness is 55um to wherein fluorine resin content.
Comparative example 1：Teflon system Double-sided copper clad laminate
Comparative example 2：LCP systems Double-sided copper clad laminate
The combined type high frequency Double-sided copper clad laminate of embodiment of the present invention 1-3 and the Double-sided copper clad laminate of comparative example 1,2
Performance test is as shown in table 1：
Table 1
Note：1. dielectric constant method of testing is resonance cavity method (resonant Cavity)；
2. the test condition that bounce is tested：Piece will be tested and cuts into the test piece of 10mm × 30mm, set test R angles as
2.35mm, every group of test piece is measured 5 times, calculates average value.
Result as shown in Table 1 understand, Double-sided copper clad laminate of the present invention have excellent dimensional stability, peel strength,
Bounce and dielectric constant.Under the structure of optimization, Dk can reach 2.6, Df and can reach 0.003 under the frequency of 5GHz.In phase
Under conditions of, embodiments of the invention combination property is substantially better than comparative example.
The combined type high frequency copper clad laminate of this example has following spy compared to Teflon system and LCP systems Double-sided copper clad laminate
Property：Low temp operation, beneficial to downstream process；It is good with splendid dimensional stability；With splendid resistance to chemical reagents and heat resistance；Tool
There are splendid heat-resisting quantity and adhesion, the splendid opering characteristic of electric apparatus, the combined type high frequency copper clad laminate Df that the design is produced
Value can reach 0.003, with reference to excellent product performance, splendid operability, in leading ranks in the industry.
Claims (8)
1. a kind of combined type high frequency Double-sided copper clad laminate, it is characterised in that：By the first copper foil layer, polyimide layer, adhesion layer and
Second copper foil layer overlaps composition successively, wherein, the thickness sum of both the polyimide layer and the adhesion layer is that 15-75 is micro-
Rice, the thickness of the adhesion layer is 10-55 microns, and the thickness of the polyimide layer is 5-20 microns；
Wherein, the material of the adhesion layer is to include fluorine resin and thermosetting resin, and the ratio of the fluorine resin is total
The 15-80% (percentage by weight) of solids content；
The adhesion layer is three-decker, and is made up of the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line, institute
The material for stating the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line is individually including fluorine resin and thermosetting tree
Fat；
Wherein, the ratio of the fluorine resin in the first high frequency glue-line is the 15-25% (percentage by weight) of total solids content,
The thickness of the first high frequency glue-line is 2-10 microns；
Wherein, the ratio of the fluorine resin in the second high frequency glue-line is the 60-80% (percentage by weight) of total solids content,
The thickness of the second high frequency glue-line is 10-55 microns；
Wherein, the ratio of the fluorine resin in the 3rd high frequency glue-line is the 15-25% (percentage by weight) of total solids content,
The thickness of the 3rd high frequency glue-line is 2-10 microns.
2. combined type high frequency Double-sided copper clad laminate as claimed in claim 1, it is characterised in that：The thickness of the adhesion layer is
20-50 microns, the thickness of the polyimide layer is 8-14 microns.
3. combined type high frequency Double-sided copper clad laminate as claimed in claim 1, it is characterised in that：The first high frequency glue-line and institute
The thickness for stating the 3rd high frequency glue-line is identical and Df values are identical, and the Df values of the adhesion layer meet following relational expressions：Df=Df1×a/
(a+2b)+Df2× 2b/ (a+2b),
Wherein, Df1It is the Df values of the second high frequency glue-line；
Df2It is the respective Df values of first and third high frequency glue-line；
A is the thickness value of the second high frequency glue-line；
B is the first and third respective thickness value of high frequency glue-line.
4. combined type high frequency Double-sided copper clad laminate as claimed in claim 3, it is characterised in that：The first and third high frequency glue-line
Df values be respectively Df2=0.006, the Df values of the second high frequency glue-line are Df1=0.002, the first and third high frequency glue-line
Thickness be respectively b=5 microns, the thickness of the second high frequency glue-line is a=30 microns, and the Df values of the adhesion layer are
0.003。
5. combined type high frequency Double-sided copper clad laminate as claimed in claim 1, it is characterised in that：The thermosetting resin is selected from ring
Oxygen tree fat, acrylic resin, amido formate system resin, silicon rubber system resin, poly- acyl is come to ring diformazan benzene series resin, span
At least one or phosphorus system resin in imines system resin and polyimide resin.
6. combined type high frequency Double-sided copper clad laminate as claimed in claim 1, it is characterised in that：First copper foil layer and second
The thickness of copper foil layer is respectively 8-35 microns.
7. combined type high frequency Double-sided copper clad laminate as claimed in claim 1, it is characterised in that：First copper foil layer and second
Copper foil layer is respectively the one kind in rolled copper foil and electrolytic copper foil.
8. a kind of manufacture method of combined type high frequency Double-sided copper clad laminate as any one of claim 1 to 7, its feature
It is：Carry out in the steps below：
Step one：Polyimide polymer is coated with any surface of the first copper foil layer, and is subject to drying and form polyimide layer
After obtain an one side copper clad laminate；
Step 2：Adhesion layer is formed in the polyimides layer surface of one side copper clad laminate with transfer printing, and is made at adhesion layer
In half polymerization semi-cured state；
Step 3：The second copper foil layer is taken, the second copper foil layer is covered on adhesion layer, and giving pressing makes the second copper foil layer tight
Gluing, obtains Double-sided copper clad laminate；
Step 4：Baking Double-sided copper clad laminate, obtains combined type high frequency Double-sided copper clad laminate finished product of the present invention.
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| TWI664086B (en) * | 2018-01-18 | 2019-07-01 | 亞洲電材股份有限公司 | Double-sided copper foil substrate with fluorine polymer and high frequency and high transmission characteristics and the preparation method thereof and composite |
| CN112822835B (en) * | 2020-12-28 | 2023-02-07 | 杭州福斯特电子材料有限公司 | Polyimide copper-clad substrate |
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| JP5310820B2 (en) * | 2010-10-25 | 2013-10-09 | ダイキン工業株式会社 | Metal-clad laminate, method for manufacturing the same, and flexible printed circuit board |
| CN102595766A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof |
| JP5914169B2 (en) * | 2012-05-28 | 2016-05-11 | 株式会社有沢製作所 | Resin composition for flexible printed wiring board |
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