CN105295753B - High frequency sticks together glue layer stack structure and preparation method thereof - Google Patents
High frequency sticks together glue layer stack structure and preparation method thereof Download PDFInfo
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- CN105295753B CN105295753B CN201410348306.6A CN201410348306A CN105295753B CN 105295753 B CN105295753 B CN 105295753B CN 201410348306 A CN201410348306 A CN 201410348306A CN 105295753 B CN105295753 B CN 105295753B
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Abstract
The invention discloses a kind of high frequency to stick together glue layer stack structure,By first,Two,Three high frequency glue-lines are formed,First,Two,The material of three high frequency glue-lines is individually to be mixed by fluorine resin and thermosetting resin,The gross thickness that the high frequency sticks together glue layer stack structure is 15 75 microns,Wherein,The ratio of fluorine resin in first high frequency glue-line is the 15 25% of total solids content and thickness is 2 10 microns,The ratio of fluorine resin in second high frequency glue-line is the 60 80% of total solids content and thickness is 10 55 microns,The ratio of fluorine resin in 3rd high frequency glue-line is the 15 25% of total solids content and thickness is 2 10 microns,The high frequency, which sticks together glue layer stack structure, has extremely low Dk,Df characteristics,Df values are up to 0.003,Signal transmission loss can be greatly reduced,And then efficient raising signal transmission quality,The judgement for reducing error messages occurs,And the high frequency sticks together glue layer stack structure and is made by straightforward procedure.
Description
Technical field
The present invention relates to a kind of high frequency to stick together glue, more particularly to a kind of high frequency adhesion glue with low Dk with Df characteristics
Water, the interlayer available for signal circuit plate then, can significantly reduce the loss of signal transmission, and then efficient carry
High signal transmission quality, the judgement for reducing error messages occur.
Background technology
The information communication requirement of the high speeds such as the satellite communications such as early stage military affairs, it is necessary to seek the superior part of high frequency characteristics and carry
Plate, the dielectric property of especially GHz bands is particularly significant, therefore the dielectric constant of product is low, when dielectric constant change is small, transmission delay
Time just shortens, and transmission speed is accelerated, as bandwidth opens existing the becoming toward high frequency of radio communication of the people's livelihood and business
Gesture, include direct broadcast satellite system (DBS), GPS (GPS), anti-collision system for automobile (CA), wireless network card (WLAN
Card), the application demand such as cellular tower and digital microwave gradually increases, it follows that high frequency communications substrate market will be gradual
It is extended to general people's livelihood purposes.
As 3G wireless intelligence types mobile phone market flourishes in recent years, to meet frequency, the high pixel phase of more high workload
Under machine camera lens and high-resolution screen demand, obtain and further lift digit signal transmission speed between each processor, usually chase after
More high transmission speed is sought, can typically take reduces the time that operating voltage rises with reducing pulse, may achieve raising even so
Signal transmission speed, but also result in simultaneously and reduce operating voltage and cause the significantly decay of anti-electromagnetic interference capability, arteries and veins is reduced in addition
Rushing to the time risen causes (di/dt) in V=L (di/dt) relational expression will greatly improve, and causes in high gigahertz frequency range
Electromagnetic Interference produces probability, causes signal distortion in transmission.
In order to tackle the demand, high frequency adhesion glue aquatic products are also constantly developing therewith.In low-k, low dielectric
It is lost among the resin used in baseplate material, twentieth century early stage application more is polytetrafluoroethylene (PTFE)
(Polytetrafluoroethene, PTFE) or other fluorine-containing property resins, the baseplate material of this low polar resin, are being measured
During measured frequency 10GHz, Dk values (Dielectric Constant, dielectric constant) be 2.1, Df values (DissipationFactor,
Dielectric loss factor) it is 0.0004；It is used between 1975 in U.S.A. military affairs equipment, from there in space flight, aviation, military project
In core realm centered on industry, application all the year round is obtained.But the glass transition temperature of fluorine resin is close to room temperature so that it
The such dimensionally stable of the thermoplastic resin as is low, and in mechanical strength and heat conductivity etc. not as thermosetting resin
Material, so had in the making of printed circuit board by many special pre-electroplating treatments, and it processing and forming,
It is more difficult in machining.This causes fluorine resin base material can not manufacture densification PCB (Printedcircuit
Board, printed circuit board (PCB)) and high multiple stratification PCB product.
The content of the invention
In order to solve the above problems, the invention provides a kind of high frequency to stick together glue layer stack structure, has extremely low Dk, Df
Characteristic, the loss of signal transmission, and then efficient raising signal transmission quality can be significantly reduced, reduces error messages
Judgement occur, on Practical Operation better than traditional Teflon (Teflon) and LCP (Liquid CrystalPolymer,
Liquid crystal polymer) material, especially suitable for the circuit board material of high-quality transmission demand, and the high frequency sticks together the folded knot of glue layer
Structure is made by straightforward procedure.
The present invention in order to solve its technical problem used by technical scheme be：A kind of high frequency sticks together glue layer stack structure,
The high frequency sticks together glue layer stack structure and is made up of the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line, and described
The material of one high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line is individually to include fluorine resin and thermosetting resin, institute
Stating high frequency and sticking together the gross thickness of glue layer stack structure is 15-75 microns；
Wherein, the ratio of the fluorine resin in the first high frequency glue-line is the 15-25% (weight percents of total solids content
Than), the thickness of the first high frequency glue-line is 2-10 microns；
Wherein, the ratio of the fluorine resin in the second high frequency glue-line is the 60-80% (weight percents of total solids content
Than), the thickness of the second high frequency glue-line is 10-55 microns；
Wherein, the ratio of the fluorine resin in the 3rd high frequency glue-line is the 15-25% (weight percents of total solids content
Than), the thickness of the 3rd high frequency glue-line is 2-10 microns.
It is preferred that the first high frequency glue-line is identical with the thickness of the 3rd high frequency glue-line and Df values are identical.
It is preferred that the thickness of the first high frequency glue-line is 5-8 microns, the thickness of the second high frequency glue-line is 15-
50 microns, the thickness of the 3rd high frequency glue-line is 5-8 microns.
It is preferred that the gross thickness that the high frequency sticks together glue layer stack structure is 20-58 microns.
Further, the high frequency sticks together the Df values of glue layer stack structure and meets following relational expressions：Df=Df1 × a/ (a+2b)
+ Df2 × 2b/ (a+2b),
Wherein, Df1 is the Df values of the second high frequency glue-line；
Df2 is the respective Df values of first and third high frequency glue-line；
A is the thickness value of the second high frequency glue-line；
B is the first and third respective thickness value of high frequency glue-line.
It is preferred that the Df values of the first and third high frequency glue-line are respectively Df2=0.006, the second high frequency glue-line
Df values are Df1=0.002, and the Df values that the high frequency sticks together glue layer stack structure are 0.003.It is preferred that described first and third is high
The thickness of frequency glue-line is respectively b=5 microns, and the thickness of the second high frequency glue-line is a=30 microns.
It is preferred that the thermosetting resin is selected from epoxy resin, acrylic resin, carbamate system resin, silicon
At least one of rubber series resin, bismaleimide amine system resin and polyimide resin.
It is preferred that the thermosetting resin is selected from phosphorus system resin.
Above-mentioned high frequency sticks together the preparation method of glue layer stack structure, carries out in the steps below：
Step 1: the first high frequency glue-line is coated on mould release membrance, be coated after the baking oven of end wind it is stand-by；
Step 2: the 3rd high frequency glue-line is coated on other mould release membrance, be coated after the baking oven of end wind it is stand-by；
Step 3: the second high frequency glue-line is coated on the finished product of step 2, after carrying out baking oven baking, the system with step 1
Product carry out pressing and form last high frequency and stick together glue layer stack structure finished product.
The beneficial effects of the invention are as follows：The high frequency of the present invention sticks together glue layer stack structure by the first high frequency glue-line, second high
Frequency glue-line and the 3rd high frequency glue-line are formed, and the material of the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue-line is each
Mixed naturally by fluorine resin and thermosetting resin, by adjust the fluorine resin in each floor height frequency glue-line content and
The thickness of each floor height frequency glue-line, the high frequency is sticked together glue layer stack structure has extremely low Dk, Df characteristic, Df values up to 0.003,
The loss of signal transmission, and then efficient raising signal transmission quality can be significantly reduced, reduces sentencing for error messages
It is disconnected to occur, it is better than traditional Teflon (Teflon) and LCP (Liquid CrystalPolymer, liquid crystal on Practical Operation
Macromolecule) material, especially suitable for the circuit board material of high-quality transmission demand, and the high frequency stick together glue layer stack structure by
Straightforward procedure is made.
Brief description of the drawings
The high frequency that Fig. 1 is the present invention sticks together glue layer stack structure schematic diagram.
Embodiment
Illustrate the embodiment of the present invention below by way of specific instantiation, those skilled in the art can be by this theory
Content disclosed in bright book understands advantages of the present invention and effect easily.The present invention can also other different modes give reality
Apply, i.e. do not depart from it is disclosed under the scope of, different modification and change can be given.
Embodiment：A kind of high frequency sticks together glue layer stack structure, and the high frequency sticks together glue layer stack structure by the first high frequency glue
The 1, second high frequency glue-line 2 of layer and the 3rd high frequency glue-line 3 are formed, the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency
The material of glue-line is individually to include fluorine resin and thermosetting resin；
Wherein, the ratio of the fluorine resin in the first high frequency glue-line is the 15-25% (weight percents of total solids content
Than), the thickness of the first high frequency glue-line is 2-10 microns；
Wherein, the ratio of the fluorine resin in the second high frequency glue-line is the 60-80% (weight percents of total solids content
Than), the thickness of the second high frequency glue-line is 10-55 microns；
Wherein, the ratio of the fluorine resin in the 3rd high frequency glue-line is the 15-25% (weight percents of total solids content
Than), the thickness of the 3rd high frequency glue-line is 2-10 microns.
It is preferred that the first high frequency glue-line is identical with the thickness of the 3rd high frequency glue-line and Df values are identical.
It is preferred that the thickness of the first high frequency glue-line is 5-8 microns, the thickness of the second high frequency glue-line is 15-
50 microns, the thickness of the 3rd high frequency glue-line is 5-8 microns.
In order that the high frequency sticks together the flexible electric circuit board that glue layer stack structure is sticked together and has extremely low Dk and Df characteristics, this
The high frequency of invention, which sticks together glue layer stack structure, to stick together glue according to the needs of the flexible circuit copper clad laminate to adjust high frequency
The thickness of stepped construction and fluorine-containing property resin amount, thereby reach the flexible electrical that thickness of thin, bounce are good and dielectric loss is small
Road plate, the thickness that high frequency of the present invention sticks together glue layer stack structure are 15~75 microns, preferably 20~58 microns.Heat therein
Thermosetting resin is selected from epoxy resin, acrylic resin, carbamate system resin, silicon rubber system resin, BMI
It is at least one of resin and polyimide resin or phosphorus system resin.
Moreover, further, the Df values that the high frequency sticks together glue layer stack structure meet following relational expressions：Df=Df1
× a/ (a+2b)+Df2 × 2b/ (a+2b),
Wherein, Df1 is the Df values of the second high frequency glue-line；
Df2 is the respective Df values of first and third high frequency glue-line；
A is the thickness value of the second high frequency glue-line；
B is the first and third respective thickness value of high frequency glue-line.
For example, when the Df values of the first and third high frequency glue-line are respectively Df2=0.006, the Df of the second high frequency glue-line
It is worth and is respectively b=5 microns, the thickness of the second high frequency glue-line for Df1=0.002, the thickness of the first and third high frequency glue-line
For a=30 microns when, the high frequency sticks together the Df values of glue layer stack structure up to 0.003.
The present invention is stressed that the high frequency sticks together glue layer stack structure and meets product at a high speed in follow-up product
The requirement of high efficiency of transmission, to reach the generation for reducing erroneous signals and judging.
Above-mentioned high frequency sticks together the preparation method of glue layer stack structure, carries out in the steps below：
Step 1: the first high frequency glue-line is coated on mould release membrance, be coated after the baking oven of end wind it is stand-by；
Step 2: the 3rd high frequency glue-line is coated on other mould release membrance, be coated after the baking oven of end wind it is stand-by；
Step 3: the second high frequency glue-line is coated on the finished product of step 2, after carrying out baking oven baking, the system with step 1
Product carry out pressing and form last high frequency and stick together glue layer stack structure finished product.
The high frequency of this example sticks together glue layer stack structure compared to Teflon system and LCP systems, during applied to Double-sided copper clad laminate,
The Double-sided copper clad laminate for pressing to obtain has following characteristic：It can be grasped in the operating condition operation compared with low temperature beneficial to downstream client
Make, with splendid dimensional stability, with splendid resistance to chemical reagents and heat resistance, with splendid heat-resisting quantity and combination
Power, the splendid opering characteristic of electric apparatus, the high frequency that the design is produced sticks together glue layer Df values and can reach 0.003, with reference to excellent production
Product characteristic, splendid operability, it is the product of a great competitiveness in domestic and international leading ranks.
Claims (10)
1. a kind of high frequency sticks together glue layer stack structure, it is characterised in that：The high frequency sticks together glue layer stack structure by the first high frequency
Glue-line, the second high frequency glue-line and the 3rd high frequency glue-line are formed, the first high frequency glue-line, the second high frequency glue-line and the 3rd high frequency glue
The material of layer is individually to include fluorine resin and thermosetting resin, and the gross thickness that the high frequency sticks together glue layer stack structure is 15-
75 microns；Wherein, by weight percentage, the ratio of the fluorine resin in the first high frequency glue-line is total solids content
15-25%, the thickness of the first high frequency glue-line is 2-10 microns；Wherein, by weight percentage, the second high frequency glue-line
In fluorine resin ratio be total solids content 60-80%, the thickness of the second high frequency glue-line is 10-55 microns；Its
In, by weight percentage, the ratio of the fluorine resin in the 3rd high frequency glue-line is the 15-25% of total solids content, institute
The thickness for stating the 3rd high frequency glue-line is 2-10 microns.
2. high frequency as claimed in claim 1 sticks together glue layer stack structure, it is characterised in that：The first high frequency glue-line and described
The thickness of 3rd high frequency glue-line is identical and Df values are identical.
3. high frequency as claimed in claim 1 sticks together glue layer stack structure, it is characterised in that：The thickness of the first high frequency glue-line
For 5-8 microns, the thickness of the second high frequency glue-line is 15-50 microns, and the thickness of the 3rd high frequency glue-line is 5-8 microns.
4. high frequency as claimed in claim 1 sticks together glue layer stack structure, it is characterised in that：The high frequency sticks together the folded knot of glue layer
The gross thickness of structure is 20-58 microns.
5. high frequency as claimed in claim 2 sticks together glue layer stack structure, it is characterised in that：The high frequency sticks together the folded knot of glue layer
The Df values of structure meet following relational expressions：Df=Df1 × a/ (a+2b)+Df2 × 2b/ (a+2b),
Wherein, Df1 is the Df values of the second high frequency glue-line；Df2 is the respective Df values of first and third high frequency glue-line；
A is the thickness value of the second high frequency glue-line；
B is the first and third respective thickness value of high frequency glue-line.
6. high frequency as claimed in claim 5 sticks together glue layer stack structure, it is characterised in that：The first and third high frequency glue-line
Df values are respectively Df2=0.006, and the Df values of the second high frequency glue-line are Df1=0.002, and the high frequency, which sticks together glue layer, to be folded
The Df values of structure are 0.003.
7. high frequency as claimed in claim 6 sticks together glue layer stack structure, it is characterised in that：The first and third high frequency glue-line
Thickness is respectively b=5 microns, and the thickness of the second high frequency glue-line is a=30 microns.
8. high frequency as claimed in claim 1 sticks together glue layer stack structure, it is characterised in that：The thermosetting resin is selected from epoxy
Resin, acrylic resin, carbamate system resin, silicon rubber system resin, bismaleimide amine system resin and polyimides
At least one of resin.
9. high frequency as claimed in claim 1 sticks together glue layer stack structure, it is characterised in that：The thermosetting resin is selected from phosphorus system
Resin.
10. a kind of high frequency as claimed in any one of claims 1-9 wherein sticks together the preparation method of glue layer stack structure, its feature
It is：Carry out in the steps below：
Step 1: the first high frequency glue-line is coated on mould release membrance, be coated after the baking oven of end wind it is stand-by；
Step 2: the 3rd high frequency glue-line is coated on other mould release membrance, be coated after the baking oven of end wind it is stand-by；
Step 3: the second high frequency glue-line is coated on the finished product of step 2, after carrying out baking oven baking, enter with the product of step 1
Row pressing forms last high frequency and sticks together glue layer stack structure finished product.
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| CN106221619A (en) * | 2016-07-29 | 2016-12-14 | 无锡市华泰医药包装有限公司 | Medicinal Composite Double aluminum packaging film |
| CN108504294A (en) * | 2017-02-24 | 2018-09-07 | 昆山雅森电子材料科技有限公司 | A kind of coloured ultra-thin cover film of high frequency and preparation method |
| CN110467890B (en) * | 2019-07-16 | 2021-09-17 | 广州慧谷工程材料有限公司 | Pressure-sensitive adhesive tape, method for producing same, and resin composition for producing pressure-sensitive adhesive tape |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176789A1 (en) * | 2011-06-20 | 2012-12-27 | 日東電工株式会社 | Capacitive touch panel |
| CN103096612A (en) * | 2011-11-01 | 2013-05-08 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure |
| CN103635015A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176789A1 (en) * | 2011-06-20 | 2012-12-27 | 日東電工株式会社 | Capacitive touch panel |
| CN103096612A (en) * | 2011-11-01 | 2013-05-08 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure |
| CN103635015A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure and manufacturing method thereof |
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