CN109291603A - A kind of organosilicone film is the flexibility coat copper plate and preparation method thereof of matrix - Google Patents
A kind of organosilicone film is the flexibility coat copper plate and preparation method thereof of matrix Download PDFInfo
- Publication number
- CN109291603A CN109291603A CN201710606865.6A CN201710606865A CN109291603A CN 109291603 A CN109291603 A CN 109291603A CN 201710606865 A CN201710606865 A CN 201710606865A CN 109291603 A CN109291603 A CN 109291603A
- Authority
- CN
- China
- Prior art keywords
- copper plate
- organosilicone film
- flexibility coat
- matrix
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 239000010949 copper Substances 0.000 title claims abstract description 38
- 239000011159 matrix material Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 229920000642 polymer Polymers 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 12
- 229920000126 latex Polymers 0.000 claims abstract description 8
- 239000004816 latex Substances 0.000 claims abstract description 7
- 238000005098 hot rolling Methods 0.000 claims abstract description 6
- 239000011889 copper foil Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229920006305 unsaturated polyester Polymers 0.000 claims 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses the flexibility coat copper plates and preparation method thereof that a kind of novel organosilicone film is matrix.The flexibility coat copper plate is total to up of three-layer by organosilicone film, polymer latex adhesion coating and metal foil.Wherein, the dielectric constant of prepared flexibility coat copper plate is 2.5-3.1, dielectric loss 0.002-0.007, dielectric properties with higher.Preparation method is that polymer adhesive is coated uniformly on organosilicone film first, then continuously presses the organosilicone film for being coated with adhesive and metal foil with hot-rolling, and final high temperature solidifies to obtain dielectric properties good flexibility copper-clad plate.Prepared flexibility coat copper plate is not only flexible high, and has the characteristics that high-frequency high-speed, dielectric properties are good, dielectric constant and dielectric loss are lower, the electronic field for having particular/special requirement to high-frequency high-speed can be widely used in, such as 5G smart phone, radar, aerospace equipment, navigation equipment, aircraft instrument etc..
Description
Technical field
The present invention relates to the flexibility coat copper plates that the novel organosilicone film of one kind of flexibility coat copper plate technical field is matrix
And preparation method thereof, more specifically refer to that one kind has good flexibility, thickness is uniform, low-k and low-dielectric loss, Ke Yiying
Used in the flexibility coat copper plate of high-frequency high-speed electronic field.
Background technique
Flexibility coat copper plate refers to the single or double in flexible insulating materials such as thin polymer films, at certain technique
Reason, bonds together with copper foil and is formed by copper-clad plate.Flexibility coat copper plate is widely used in aerospace equipment, navigation equipment, flies
Machine instrument, military guidance system and mobile phone, digital camera, DV, vehicle satellite direction positioning device, LCD TV,
In the electronic products such as laptop.With the big great development of high-frequency communication so that mobile phone, automobile telephone, wirelessly communicate to
High frequency development, frequency of use are shifted from MHz to ghz band, and information is conveyed into high frequency field.Electronics and IT products high frequency
Change, more stringent requirements are proposed for high frequency characteristics of the high speed to flexibility coat copper plate.The fundamental characteristics of high frequency flexibility coat copper plate is necessary
Reach following two requirement: (1) dielectric constant (Dk) must be small and very stable.It is usually the smaller the better, the transmission speed of signal
The square root of rate and material dielectric constant is inversely proportional, and high dielectric constant be easy to cause signal transmission delay.(2) dielectric loss (Df)
It must be small.Dielectric loss (Df) mainly influences the quality of signal transmission, and dielectric loss is smaller so that loss of signal is also smaller.Mesh
The technology of preceding high-frequency high-speed flexibility coat copper plate is mainly monopolized by the company in the U.S. and Japan, such as Japanese Asahi Kasei Corporation's production
Flexibility coat copper plate kind it is more, performance is more excellent, have high Tg (255-330 DEG C), heat resistance (160-230 DEG C), moisture-resistant
The advantages that property, low Dk and low Df.ROGERS (Rogers) copper-clad plate of ROGERS CORPORATION of U.S. production, such as RO3200,
The series such as RO3210, RO4003, lowest dielectric constant even can achieve 2.2.Compared with foreign countries, the high-frequency high-speed in China is flexible
Copper-clad plate is still in infancy, and type is rare.The dielectric constant of the main product of existing market is 3.5 or so, is unable to satisfy
From now in the application in high-frequency high-speed field, it is especially unable to satisfy the application of the following 5G mobile phone market.And the present invention prepares
A kind of flexibility coat copper plate having the characteristics that with high-frequency high-speed can be applied in extensive electronic field, can especially be answered
Used in 5G mobile phone market from now on, for China, developing for the field has high strategic importance from now on.
Summary of the invention
In view of the above shortcomings of the prior art, the purpose of the present invention, being to provide the novel organosilicone film of one kind is matrix
Flexibility coat copper plate and preparation method thereof.The flexibility coat copper plate not only has many advantages, such as flexible height, and thickness is uniform, at the same there are also compared with
Low dielectric constant and dielectric loss, therefore have the characteristics that high-frequency high-speed, it can apply in extensive electronic field, especially
The 5G mobile phone market from now on can be applied.To achieve the goals above,
Technical scheme is as follows:
Coating machine is used to be coated uniformly on polymer adhesive with the coating speed of 1-10m/min thin with a thickness of organosilicon
On film.Then, the organosilicone film of adhesive is coated under the action of traction roller, it is continuous with the draft speed of 1-10m/min
The continuous drier for being 40-80 DEG C by temperature range removes organic solvent contained in polymer adhesive, then will be organic
Silicon thin film merges winding in 110-160 DEG C of temperatures with metal foil hot-rolling, is finally placed in 130-180 DEG C of baking oven and solidifies 1-
6h is to get the flexibility coat copper plate for the novel organosilicon film of high dielectric property being matrix.
For the organosilicone film layer with a thickness of 1-200 μm, preferred thickness is 20-100 μm.
The polymer adhesive is epoxyn, acrylate adhesive, organic silicon adhesive, unsaturation
Polyester adhesive, any one in polyurethane adhesive or its modified product.
The novel organosilicon film is the polymer latex adhesion coating of the flexibility coat copper plate of matrix with a thickness of 1-200 μm, excellent
Choosing is with a thickness of 20-100 μm.
The novel organosilicon film is the metal foil layer of the flexibility coat copper plate of matrix with a thickness of 1-200 μm, preferably thick
Degree is 20-100 μm, and metal foil is one of rolled copper foil or electrolytic copper foil.
Compared with the existing technology, the present invention has the following advantages: replacing current city using the lower organosilicone film of dielectric constant
The Kapton (PI) that the flexibility coat copper plate produced on field generally uses.As the basis material of flexibility coat copper plate, it is situated between
Electric constant is usually the smaller the better, because the transfer rate of signal and the square root of material dielectric constant are inversely proportional, high dielectric is normal
Number be easy to cause signal transmission delay.PI thin-film dielectric constant used is higher currently on the market, is 3.4-3.5 or so, only suitable
The particular/special requirement that high-frequency high-speed is unable to satisfy in common electronic products field is applied in conjunction, can not more be used as 5G mobile phone substrate material
Material uses.And the organosilicone film electrical insulation properties with higher that the present invention uses, good mechanical strength, use are organic
Silicon thin film is flexibility coat copper plate prepared by polymeric matrix, dielectric constant 2.5-3.1, dielectric loss 0.002-
0.007, transmission signal is fast when baseplate material as communications electronics product, and transmission quality is good.Therefore, what we were invented is organic
Silicon thin film is the novel flexibility coat copper plate of matrix, and flexible, thickness is uniform, before having excellent dielectric properties and good market
Scape is the development trend of future electronic communication product, and for China, developing for telecommunications field has high strategy from now on
Meaning.
Detailed description of the invention
Fig. 1 is the structure chart for the flexibility coat copper plate that organosilicone film is matrix, wherein 1. metal copper foils, 2. polymer latexs
Adhesion coating, 3. organosilicone films.
Fig. 2 is the preparation flow for the flexibility coat copper plate that organosilicone film is matrix.
Specific embodiment
Embodiment 1
Use coating machine that organic silicon adhesive is coated uniformly on a thickness of 25 μm of organosilicone films with the speed of 5m/min
On, applied thickness is 20 μm.Then, the organosilicone film of adhesive is coated under the action of traction roller, with leading for 5m/min
It stretches speed and continues through the continuous drier that temperature is 60 DEG C, remove organic solvent contained in organic silicon adhesive, then will
Organosilicone film merges winding in 130 DEG C of temperatures with the rolled copper foil hot-rolling with a thickness of 25 μm, is finally placed in 150 DEG C of bakings
Solidify 3h in case to get being the flexibility coat copper plate of matrix to the novel organosilicon film with a thickness of 70 μm.
Embodiment 2
Coating machine is used to be coated uniformly on acrylate adhesive with the speed of 8m/min thin with a thickness of 20 μm of organosilicons
On film, applied thickness is 18 μm.Then, the organosilicone film of adhesive is coated under the action of traction roller, with 8m/min's
Draft speed continues through the continuous drier that temperature is 70 DEG C, removes organic solvent contained in acrylate adhesive, connects
Organosilicone film is merged into winding in 150 DEG C of temperatures with the rolled copper foil hot-rolling with a thickness of 20 μm, be finally placed in 170
Solidify 1h in DEG C baking oven to get being the flexibility coat copper plate of matrix to the novel organosilicon film with a thickness of 58 μm.
Embodiment 3
Coating machine is used to be coated uniformly on epoxyn with the speed of 3m/min thin with a thickness of 35 μm of organosilicons
On film, applied thickness is 30 μm.Then, the organosilicone film of adhesive is coated under the action of traction roller, with 3m/min's
Draft speed continues through the continuous drier that temperature range is 50 DEG C, removes organic molten contained in epoxyn
Organosilicone film is then merged winding, most postposition in 120 DEG C of temperatures with the electrolytic copper foil hot-rolling with a thickness of 35 μm by agent
Solidify 5h in 140 DEG C of baking ovens to get the flexibility coat copper plate for a thickness of 100 μm of novel organosilicon films being matrix is arrived.
One organosilicone film of table is the electric property of the flexibility coat copper plate of matrix
Two organosilicone film of table is other performances of the flexibility coat copper plate of matrix
Claims (5)
1. the flexibility coat copper plate that a kind of organosilicone film is matrix, which is characterized in that the flexibility coat copper plate is by up of three-layer, respectively
For organosilicone film layer, polymer latex adhesion coating and metal foil layer, upper and lower level is respectively metal foil layer and organosilicone film layer, centre
One layer is polymer latex adhesion coating；Metal foil is by polymer latex adhesion coating together with organosilicone film secure adhesion；Wherein, organic
Silicon membrane layer is with a thickness of 1-200 μm；Polymer latex adhesion coating is with a thickness of 1-200 μm, and metal foil layer is with a thickness of 1-200 μm.
2. the flexibility coat copper plate that organosilicone film described in claim 1 is matrix, which is characterized in that the organosilicone film
Layer is with a thickness of 20-100 μm；Polymer latex adhesion coating is with a thickness of 20-100 μm, and metal foil layer is with a thickness of 20-100 μm.
3. the preparation method that organosilicone film described in claim 1 is the flexibility coat copper plate of matrix, which is characterized in that specific system
Preparation Method is as follows:
Polymer adhesive is coated uniformly on organosilicone film using coating machine, then, is coated with the organosilicon of adhesive
Film continues through temperature range under the action of traction roller, with the draft speed of 1-10m/min as 40-80 DEG C continuous drying
Machine removes organic solvent contained in polymer adhesive, then by organosilicone film and metal foil hot-rolling at 110-160 DEG C
Temperatures merge winding, are finally placed in 130-180 DEG C of baking oven and solidify 1-6h to get the flexibility for organosilicone film being matrix
Copper-clad plate.
4. the preparation method that organosilicone film described in claim 1 is the flexibility coat copper plate of matrix, which is characterized in that described
Polymer adhesive is epoxyn, acrylate adhesive, organic silicon adhesive, unsaturated polyester (UP) adhesive, gathers
Any one in urethane adhesive.
5. the preparation method that organosilicone film described in claim 1 is the flexibility coat copper plate of matrix, which is characterized in that described
Metal foil is rolled copper foil or electrolytic copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606865.6A CN109291603B (en) | 2017-07-24 | 2017-07-24 | Flexible copper-clad plate with organic silicon film as matrix and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710606865.6A CN109291603B (en) | 2017-07-24 | 2017-07-24 | Flexible copper-clad plate with organic silicon film as matrix and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109291603A true CN109291603A (en) | 2019-02-01 |
| CN109291603B CN109291603B (en) | 2020-10-02 |
Family
ID=65167073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710606865.6A Active CN109291603B (en) | 2017-07-24 | 2017-07-24 | Flexible copper-clad plate with organic silicon film as matrix and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109291603B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205491428U (en) * | 2016-01-14 | 2016-08-17 | 东莞晶达电子科技有限公司 | Hot pressing laminating flexible circuit board |
| CN106827719A (en) * | 2017-01-09 | 2017-06-13 | 三峡大学 | A kind of high-frequency high-speed flexibility coat copper plate and preparation method thereof |
-
2017
- 2017-07-24 CN CN201710606865.6A patent/CN109291603B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205491428U (en) * | 2016-01-14 | 2016-08-17 | 东莞晶达电子科技有限公司 | Hot pressing laminating flexible circuit board |
| CN106827719A (en) * | 2017-01-09 | 2017-06-13 | 三峡大学 | A kind of high-frequency high-speed flexibility coat copper plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109291603B (en) | 2020-10-02 |
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Effective date of registration: 20240410 Address after: 472500 Chengdong Industrial agglomeration zone, Lingbao City, Sanmenxia City, Henan Province Patentee after: LINGBAO HONGYU ELECTRONIC CO.,LTD. Country or region after: China Address before: 443002 No. 8, University Road, Yichang, Hubei Patentee before: CHINA THREE GORGES University Country or region before: China |
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