CN111508709A - Planar capacitor and manufacturing method thereof - Google Patents
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- CN111508709A CN111508709A CN202010355670.0A CN202010355670A CN111508709A CN 111508709 A CN111508709 A CN 111508709A CN 202010355670 A CN202010355670 A CN 202010355670A CN 111508709 A CN111508709 A CN 111508709A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000004020 conductor Substances 0.000 claims description 38
- 238000003825 pressing Methods 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 7
- 239000011147 inorganic material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 239000011368 organic material Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000002861 polymer material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A planar capacitor includes a first electrode, a second electrode, and a dielectric layer, the dielectric layer being disposed between the first electrode and the second electrode, the dielectric layer having a dielectric constant greater than 100, the first electrode including a first conductive layer and a second conductive layer having adhesiveness, the first conductive layer being adhered to the second conductive layer, the second conductive layer being adhered to the dielectric layer, the second electrode including a third conductive layer and a fourth conductive layer having adhesiveness, the third conductive layer being adhered to the fourth conductive layer, the fourth conductive layer being adhered to the dielectric layer. The dielectric layer of the planar capacitor has higher dielectric constant, and can greatly reduce the difficulty of the production process and reduce the production cost. The invention also relates to a manufacturing method of the planar capacitor.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a planar capacitor and a manufacturing method thereof.
Background
The current planar capacitor is a planar capacitor prepared by a polymer material system based on barium titanate particles and epoxy resin mixed and dispersed, and a copper foil (serving as two-end electrodes of the planar capacitor) and other auxiliary materials (such as a dispersing agent and a curing agent), wherein the polymer material is required to ensure high dielectric constant and ensure viscosity between the polymer material and between the polymer material and the copper foil so as to prevent the planar capacitor from falling off and poor layering during application; wherein barium titanate is a strong dielectric compound material, and the epoxy resin is a generic name of a polymer containing more than two epoxy groups in a molecule, and is a polycondensation product of epichlorohydrin and bisphenol A or polyhydric alcohol. Therefore, the dielectric constant of the dielectric material between the two electrodes of the planar capacitor is generally not high, and is about 5 to 40.
Fig. 1 is a schematic partial sectional structure view of a conventional planar capacitor, and as shown in fig. 1, the planar capacitor includes a first electrode 21, a second electrode 22, and a dielectric layer 23 disposed between the first electrode 21 and the second electrode 22. The capacitance density (capacitance value per unit area) of the existing planar capacitor is generally not high, about 130pF/cm2～10nF/cm2And the production process is complex and difficult, and the thickness of the dielectric layer 23 is generally between 3 and 25um, so the requirements on factory equipment and technical personnel are very strict, and the production cost of an enterprise is high.
Disclosure of Invention
In view of this, the present invention provides a planar capacitor, in which the dielectric layer has a higher dielectric constant, so that the difficulty of the production process can be greatly reduced, and the production cost can be reduced.
A planar capacitor includes a first electrode, a second electrode, and a dielectric layer, the dielectric layer being disposed between the first electrode and the second electrode, the dielectric layer having a dielectric constant greater than 100, the first electrode including a first conductive layer and a second conductive layer having adhesiveness, the first conductive layer being adhered to the second conductive layer, the second conductive layer being adhered to the dielectric layer, the second electrode including a third conductive layer and a fourth conductive layer having adhesiveness, the third conductive layer being adhered to the fourth conductive layer, the fourth conductive layer being adhered to the dielectric layer.
In an embodiment of the invention, the dielectric layer includes a first surface and a second surface parallel and opposite to each other, the first conductive layer and the second conductive layer are parallel to the first surface, the second conductive layer is adhered to the first surface, the third conductive layer and the fourth conductive layer are parallel to the second surface, and the fourth conductive layer is adhered to the second surface.
In an embodiment of the present invention, the first conductive layer and the third conductive layer are made of a metal material; the second conductive layer and the fourth conductive layer are made of metal, metal oxide or conductive paste.
In an embodiment of the present invention, the dielectric layer is made of an inorganic material.
In the embodiment of the invention, the thickness of the dielectric layer is 3 um-100 um.
In an embodiment of the present invention, the capacitance density of the planar capacitor is 130pF/cm2～100uF/cm2The area of the planar capacitor is greater than or equal to 500mm × 400 mm.
The invention also provides a manufacturing method of the planar capacitor, which comprises the following steps:
manufacturing a first electrode, a second electrode and a dielectric layer, wherein the dielectric constant of the dielectric layer is more than 100;
wherein the dielectric layer is located between the first electrode and the second electrode, the first electrode comprises a first conductive layer and a second conductive layer having adhesiveness, the first conductive layer is adhered to the second conductive layer, the second conductive layer is adhered to the dielectric layer, the second electrode comprises a third conductive layer and a fourth conductive layer having adhesiveness, the third conductive layer is adhered to the fourth conductive layer, and the fourth conductive layer is adhered to the dielectric layer.
In an embodiment of the present invention, the steps of manufacturing the first electrode, the second electrode and the dielectric layer include:
adhering a conductive material with viscosity to the first conductive layer, and enabling the conductive material to be tightly combined with the first conductive layer to form the first electrode, wherein the combined conductive material is the second conductive layer;
adhering a conductive material with viscosity to the fourth conductive layer, and enabling the conductive material to be tightly combined with the fourth conductive layer to form the second electrode, wherein the combined conductive material is the third conductive layer;
coating inorganic material on the second conductive layer to form the dielectric layer, combining the third conductive layer of the second electrode with the dielectric layer, and pressing the second electrode and the first electrode to form the planar capacitor.
In an embodiment of the present invention, the steps of manufacturing the first electrode, the second electrode and the dielectric layer include:
adhering a conductive material with viscosity to the first conductive layer, and enabling the conductive material to be tightly combined with the first conductive layer to form the first electrode, wherein the combined conductive material is the second conductive layer;
adhering a conductive material with viscosity to the fourth conductive layer, and enabling the conductive material to be tightly combined with the fourth conductive layer to form the second electrode, wherein the combined conductive material is the third conductive layer;
pressing the organic material into the dielectric layer by using a die;
and pressing the first electrode, the dielectric layer and the second electrode to form the planar capacitor.
In the embodiment of the invention, the area of the planar capacitor is greater than or equal to 500mm × 400 mm.
The dielectric layer of the planar capacitor has higher dielectric constant, corresponds to the current equipment production process level, and can make the distance (the thickness of the dielectric layer) t between the first electrode and the second electrode larger on the premise of ensuring the same capacitance density as the existing planar capacitor, thereby greatly reducing the production process difficulty and the production cost, and the preparation method is diversified and flexible; in addition, the second conducting layer and the third conducting layer have viscosity, so that the problems of falling, layering and the like between the first conducting layer and the dielectric layer can be effectively avoided.
Drawings
Fig. 1 is a partial sectional structural schematic diagram of a conventional planar capacitor.
Fig. 2 is a partial sectional structural schematic diagram of the planar capacitor of the present invention.
Detailed Description
First embodiment
Fig. 2 is a partial sectional structural diagram of a planar capacitor according to the present invention, as shown in fig. 2, the planar capacitor includes a first electrode 11, a second electrode 12, and a dielectric layer 13, the dielectric layer 13 is located between the first electrode 11 and the second electrode 12, the dielectric layer has a dielectric constant greater than 100, the first electrode 11 includes a first conductive layer 111 and a second conductive layer 112 having adhesion, the first conductive layer 111 is adhered to the second conductive layer 112, the second conductive layer 112 is adhered to the dielectric layer 13, the second electrode 12 includes a third conductive layer 121 and a fourth conductive layer 122 having adhesion, the third conductive layer 121 is adhered to the fourth conductive layer 122, and the fourth conductive layer 122 is adhered to the dielectric layer 13. Preferably, the dielectric layer 13 is made of a mixed dielectric material with high dielectric constant such as an inorganic material and the like, and replaces an original polymer material, so that the dielectric layer 13 has a high dielectric constant, namely the dielectric constant of the dielectric layer is greater than 100, and corresponding to the current equipment production process level, on the premise of ensuring that the dielectric layer has the same capacitance density as the existing planar capacitor, the distance (thickness of the dielectric layer 13) t between the first electrode 11 and the second electrode 12 can be larger, so that the production process difficulty can be greatly reduced, the production cost is reduced, and the preparation method is diversified and flexible; in addition, the second conductive layer 112 and the third conductive layer 121 have viscosity, so that the problems of falling off, layering and the like between the first conductive layer 111 and the dielectric layer 13 can be effectively avoided.
In another preferred embodiment, the dielectric layer 13 is made of a polymer material with a dielectric constant greater than 100, which can be freely selected according to actual needs.
Further, the capacitance theoretical characteristic formula of the planar capacitor is as follows:
wherein C is the capacitance of the planar capacitor, A is the facing area of the first electrode 11 and the second electrode 12 of the planar capacitor, and DkIs the dielectric constant of the dielectric layer 13, K is a constant, and t is the first of the planar capacitorsThe distance between the electrode 11 and the second electrode 12. From the calculation formula, it can be known that the capacitance value C of the planar capacitor is proportional to the facing area a of the planar capacitor, inversely proportional to the distance t between the first electrode 11 and the second electrode 12, and proportional to the dielectric constant of the dielectric layer 13. At the same time, the capacitance value per unit area (i.e. the capacitance density C of the planar capacitor) is obtainedd) The dielectric constant of the dielectric layer 13 is proportional to the distance t between the first electrode 11 and the second electrode 12, which is expressed by the following formula:
further, the dielectric layer 13 includes a first surface 101 and a second surface 102 which are parallel and opposite to each other, a first conductive layer 111 and a second conductive layer 112 which are parallel to the first surface 101, the second conductive layer 112 adhered to the first surface 101, a third conductive layer 121 and a fourth conductive layer 122 which are parallel to the second surface 102, and the fourth conductive layer 122 adhered to the second surface 102.
Further, the first conductive layer 111 and the third conductive layer 121 are made of a metal material, such as metallic copper, aluminum; the second conductive layer 112 and the fourth conductive layer 122 are made of metal, metal oxide, or conductive paste, and preferably, the second conductive layer 112 and the fourth conductive layer 122 are made of anisotropic conductive paste (ACF).
Further, the dielectric constant of the dielectric layer 13 is greater than 100 and less than or equal to 1000.
Further, the thickness of the dielectric layer 13 is 3um to 100um, i.e. the distance t between the first electrode 11 and the second electrode 12.
Further, the capacitance density C of the planar capacitordIs 130pF/cm2～100uF/cm2。
Further, the area of the planar capacitor is greater than or equal to 500mm × 400mm
Second embodiment
The invention also relates to a manufacturing method of the planar capacitor, which comprises the following steps:
manufacturing a first electrode 11, a second electrode 12 and a dielectric layer 13, wherein the dielectric constant of the dielectric layer 13 is larger than 100;
wherein a dielectric layer 13 is located between the first electrode 11 and the second electrode 12, the first electrode 11 comprises a first conductive layer 111 and a second conductive layer 112 having adhesion, the first conductive layer 111 is adhered to the second conductive layer 112, the second conductive layer 112 is adhered to the dielectric layer 13, the second electrode 12 comprises a third conductive layer 121 and a fourth conductive layer 122 having adhesion, the third conductive layer 121 is adhered to the fourth conductive layer 122, and the fourth conductive layer 122 is adhered to the dielectric layer 13. Preferably, the dielectric layer 13 is made of a mixed dielectric material with high dielectric constant such as an inorganic material and the like, and replaces an original polymer material, so that the dielectric layer 13 has a high dielectric constant, namely the dielectric constant of the dielectric layer is greater than 100, and corresponding to the current equipment production process level, on the premise of ensuring that the dielectric layer has the same capacitance density as the existing planar capacitor, the distance (thickness of the dielectric layer 13) t between the first electrode 11 and the second electrode 12 can be larger, so that the production process difficulty can be greatly reduced, the production cost is reduced, and the preparation method is diversified and flexible; in addition, the second conductive layer 112 and the third conductive layer 121 have viscosity, so that the problems of falling off, layering and the like between the first conductive layer 111 and the dielectric layer 13 can be effectively avoided.
In another preferred embodiment, the dielectric layer 13 is made of a polymer material with a dielectric constant greater than 100, which can be freely selected according to actual needs.
Further, the capacitance theoretical characteristic formula of the planar capacitor is as follows:
wherein C is the capacitance of the planar capacitor, A is the facing area of the first electrode 11 and the second electrode 12 of the planar capacitor, and DkIs the dielectric constant of the dielectric layer 13, K is a constant, and t is the distance between the first electrode 11 and the second electrode 12 of the planar capacitor. From the calculation formula, it can be known that the capacitance value C of the planar capacitor is proportional to the facing area a of the planar capacitor, inversely proportional to the distance t between the first electrode 11 and the second electrode 12, and proportional to the dielectric constant of the dielectric layer 13. At the same time, the capacitance per unit area (i.e. planar electricity) is obtainedCapacitance density C of capacitord) The dielectric constant of the dielectric layer 13 is proportional to the distance t between the first electrode 11 and the second electrode 12, which is expressed by the following formula:
further, the steps of manufacturing the first electrode 11, the second electrode 12 and the dielectric layer 13 include:
adhering (e.g., coating) a conductive material having adhesiveness to the first conductive layer 111, and tightly bonding the conductive material to the first conductive layer 111 to form the first electrode 11, where the bonded conductive material is the second conductive layer 112;
adhering (e.g., coating) a conductive material having adhesiveness to the fourth conductive layer 122, and tightly bonding the conductive material to the fourth conductive layer 122 to form the second electrode 12, where the bonded conductive material is the third conductive layer 121;
inorganic materials are coated on the second conductive layer 112 to form a dielectric layer 13, the third conductive layer 121 of the second electrode 13 is combined with the dielectric layer 13, and then the second electrode 12 and the first electrode 11 are pressed to form the planar capacitor.
Further, the steps of manufacturing the first electrode 11, the second electrode 12 and the dielectric layer 13 include:
adhering (e.g., coating) a conductive material having adhesiveness to the first conductive layer 111, and tightly bonding the conductive material to the first conductive layer 111 to form the first electrode 11, where the bonded conductive material is the second conductive layer 112;
adhering (e.g., coating) a conductive material having adhesiveness to the fourth conductive layer 122, and tightly bonding the conductive material to the fourth conductive layer 122 to form the second electrode 12, where the bonded conductive material is the third conductive layer 121;
pressing the organic material into the dielectric layer 13 by using a die;
and pressing the first electrode 11, the dielectric layer 13 and the second electrode 12 to form the planar capacitor. In the present embodiment, different shapes of the dielectric layer 13 can be obtained according to different shapes of the mold.
Further, a conductive material is tightly combined with the first conductive layer 111 by using a process flow such as high temperature to form a first electrode 11; the second electrode 12 is formed by tightly bonding the conductive material and the fourth conductive layer 122 through a process flow such as high temperature, but not limited thereto.
Further, the dielectric layer 13 includes a first surface 101 and a second surface 102 which are parallel and opposite to each other, a first conductive layer 111 and a second conductive layer 112 which are parallel to the first surface 101, the second conductive layer 112 adhered to the first surface 101, a third conductive layer 121 and a fourth conductive layer 122 which are parallel to the second surface 102, and the fourth conductive layer 122 adhered to the second surface 102.
Further, the first conductive layer 111 and the third conductive layer 121 are made of a metal material, such as metallic copper, aluminum; the second conductive layer 112 and the fourth conductive layer 122 are made of metal, metal oxide, or conductive paste, and preferably, the second conductive layer 112 and the fourth conductive layer 122 are made of anisotropic conductive paste (ACF).
Further, the dielectric constant of the dielectric layer 13 is greater than 100 and less than or equal to 1000.
Further, the thickness of the dielectric layer 13 is 3um to 100um, i.e. the distance t between the first electrode 11 and the second electrode 12.
Further, the capacitance density C of the planar capacitordIs 130pF/cm2～100uF/cm2。
Further, the area of the planar capacitor is greater than or equal to 500mm × 400 mm.
The present invention is not limited to the specific details of the above-described embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention. The various features described in the foregoing detailed description may be combined in any suitable manner without departing from the scope of the invention. The invention is not described in detail in order to avoid unnecessary repetition.
Claims (10)
1. A planar capacitor comprising a first electrode, a second electrode and a dielectric layer, the dielectric layer being disposed between the first electrode and the second electrode, the dielectric layer having a dielectric constant greater than 100, the first electrode comprising a first conductive layer and an adhesive second conductive layer, the first conductive layer being adhered to the second conductive layer, the second conductive layer being adhered to the dielectric layer, the second electrode comprising a third conductive layer and an adhesive fourth conductive layer, the third conductive layer being adhered to the fourth conductive layer, the fourth conductive layer being adhered to the dielectric layer.
2. The planar capacitor as claimed in claim 1, wherein the dielectric layer comprises a first surface and a second surface parallel and opposite to each other, the first conductive layer and the second conductive layer are parallel to the first surface, the second conductive layer is adhered to the first surface, the third conductive layer and the fourth conductive layer are parallel to the second surface, and the fourth conductive layer is adhered to the second surface.
3. The planar capacitor as claimed in claim 1, wherein the first conductive layer and the third conductive layer are made of a metal material; the second conductive layer and the fourth conductive layer are made of metal, metal oxide or conductive paste.
4. The planar capacitor of claim 1 wherein the dielectric layer is made of an inorganic material.
5. The planar capacitor as claimed in claim 1, wherein the dielectric layer has a thickness of 3um to 100 um.
6. The planar capacitor of claim 1, wherein the planar capacitor has a capacitance density of 130pF/cm2～100uF/cm2The area of the planar capacitor is greater than or equal to 500mm × 400 mm.
7. A method for manufacturing a planar capacitor is characterized by comprising the following steps:
manufacturing a first electrode, a second electrode and a dielectric layer, wherein the dielectric constant of the dielectric layer is more than 100;
wherein the dielectric layer is located between the first electrode and the second electrode, the first electrode comprises a first conductive layer and a second conductive layer having adhesiveness, the first conductive layer is adhered to the second conductive layer, the second conductive layer is adhered to the dielectric layer, the second electrode comprises a third conductive layer and a fourth conductive layer having adhesiveness, the third conductive layer is adhered to the fourth conductive layer, and the fourth conductive layer is adhered to the dielectric layer.
8. The method of claim 7, wherein the steps of forming the first electrode, the second electrode and the dielectric layer comprise:
adhering a conductive material with viscosity to the first conductive layer, and enabling the conductive material to be tightly combined with the first conductive layer to form the first electrode, wherein the combined conductive material is the second conductive layer;
adhering a conductive material with viscosity to the fourth conductive layer, and enabling the conductive material to be tightly combined with the fourth conductive layer to form the second electrode, wherein the combined conductive material is the third conductive layer;
coating inorganic material on the second conductive layer to form the dielectric layer, combining the third conductive layer of the second electrode with the dielectric layer, and pressing the second electrode and the first electrode to form the planar capacitor.
9. The method of claim 7, wherein the steps of forming the first electrode, the second electrode and the dielectric layer comprise:
adhering a conductive material with viscosity to the first conductive layer, and enabling the conductive material to be tightly combined with the first conductive layer to form the first electrode, wherein the combined conductive material is the second conductive layer;
adhering a conductive material with viscosity to the fourth conductive layer, and enabling the conductive material to be tightly combined with the fourth conductive layer to form the second electrode, wherein the combined conductive material is the third conductive layer;
pressing the organic material into the dielectric layer by using a die;
and pressing the first electrode, the dielectric layer and the second electrode to form the planar capacitor.
10. The method as claimed in claim 7, wherein the area of the planar capacitor is greater than or equal to 500mm × 400 mm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713013A (en) * | 2020-12-28 | 2021-04-27 | 金照辉 | Preparation process of extra-high voltage capacitor |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112713013A (en) * | 2020-12-28 | 2021-04-27 | 金照辉 | Preparation process of extra-high voltage capacitor |
| CN112713013B (en) * | 2020-12-28 | 2022-11-22 | 深圳锐取电子有限公司 | Extra-high voltage capacitor manufacturing process |
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