CN104332676B - A kind of pasting method of soft-medium microwave circuit - Google Patents
A kind of pasting method of soft-medium microwave circuit Download PDFInfo
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- CN104332676B CN104332676B CN201410531692.2A CN201410531692A CN104332676B CN 104332676 B CN104332676 B CN 104332676B CN 201410531692 A CN201410531692 A CN 201410531692A CN 104332676 B CN104332676 B CN 104332676B
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Abstract
The invention discloses a kind of pasting method of soft-medium microwave circuit, comprise the following steps：According to design drawing requirement one microwave cavity of neat set and some soft-medium microwave circuits；One layer of conducting resinl is coated on the ground plane of each soft-medium microwave circuit, is adhered to successively on the corresponding position of microwave cavity inwall according to design drawing requirement；A layer capacitance paper is completely covered in bonding soft-medium microwave circuit upper surface；Use to be embedded in microwave cavity with a complete metal briquetting suitable with soft-medium microwave circuit upper surface area on electric capacity paper and apply pressure；By microwave cavity and metallic briquette keep relative position it is motionless together with heat, make conductive adhesive curing；Microwave cavity room temperature is cooled down, metallic briquette and electric capacity paper is removed, fifth wheel is cleared up.Present invention process is simple, reliability is high, solves existing soft-medium microwave circuit the problem of gap and cavity is produced with cavity inner wall adhesive linkage in being bonded solidification process.
Description
Technical field
The invention belongs to microwave and millimeter wave mounting technology field, more particularly to a kind of paster side of soft-medium microwave circuit
Method.
Background technology
In the material that microwave high-frequency circuit is applied, soft-medium polytetrafluoroethylene (PTFE) and its composite base material are due to extremely low
Dielectric constant, the dielectric loss of very little and very low hydroscopicity so that it is in hyperfrequency (frequency is up to 100GHz), ultra wide band (2
~10 octaves) microwave and millimetre-wave circuit in be used widely.Today enters with complete electronic set and systematic function
One step is improved, it is desirable to which microwave device and its circuit have higher reliability, therefore in microwave and millimeter wave module and multi-functional group
Through commonly used soft-medium polytetrafluoroethylene (PTFE) and its composite base material microwave circuit with finer lines and more small-bore in part
The manufacturability of (such as RT/duroid 5880 or 5870 of Rogers companies) be no longer it is final require, meet wire bonding,
Component welding, the requirement of die bonding simultaneously become most important with extremely low contact resistance and stable long-term reliability.
Therefore, the earthing method of the soft-medium polytetrafluoroethylene (PTFE) of high reliability and its composite base material microwave circuit is badly in need of exploitation and promoted to answer
With.
Conducting resinl can play a part of circuit connection and mechanically connect, while there are a variety of advantages, such as environment-friendly, work
Skill mild condition, better simply technique and high linear resolution, easily reprocess.Field is filled in micro-group at present, conductive adhesive is
Through obtaining relatively broad application, such as in terms of the bonding of microwave device and hard dielectric film circuit, therefore, such a soft-medium
Microwave circuit is also generally assembled in microwave cavity using the method for conductive adhesive.
Base material used in polytetrafluoroethylene (PTFE) and its composite base material microwave circuit is soft base material, the graphic structure of design and can be processed
Circuitry shapes it is very small by limit, along with the intrinsic characteristic of this kind of circuit substrate it is difficult to ensure that high flatness, therefore, soft
Some larger gaps or cavity often occur in the adhesive linkage of medium microwave circuit and microwave cavity inwall.Due to microwave electricity
Road acting frequency is higher, and the cavity and gap in such a soft-medium microwave circuit bonding process can cause the string between each functional module
The increase with insertion loss is disturbed, while also bringing the problems such as additional capacitor is with vibration.Make microwave circuit more than L-band can not
Obtain stable circuit parameter and reliable technical indicator, it is difficult to meet the performance need of microwave and millimeter wave part and multifunction module
Will.
Accordingly, it would be desirable to develop the pasting method for soft-medium microwave circuit that a kind of technique is simple, reliability is high.
The content of the invention
The purpose of the present invention be exactly in order to solve the above problems there is provided a kind of pasting method of soft-medium microwave circuit, it
With technique is simple, reliability is high, solve existing soft-medium microwave circuit in bonding solidification process with cavity inner wall adhesive linkage
The problem of producing gap and cavity.
To achieve these goals, the present invention is adopted the following technical scheme that：
A kind of pasting method of soft-medium microwave circuit, comprises the following steps：
Step 101：According to design drawing requirement one microwave cavity of neat set and some soft-medium microwave circuits；
Step 102：One layer of conducting resinl is coated on the ground plane of each soft-medium microwave circuit, is required according to design drawing
It is adhered to successively on the corresponding position of microwave cavity inwall；
Step 103：A layer capacitance is completely covered in the bonding soft-medium microwave circuit upper surface of step 102
Paper；
Step 104：Being used on electric capacity paper has one suitable with soft-medium microwave circuit upper surface area complete gold
Belong in briquetting insertion microwave cavity and apply pressure；
Step 105：By microwave cavity and metallic briquette keep relative position it is motionless together with heat, make conductive adhesive curing；
Step 106：Microwave cavity room temperature is cooled down, metallic briquette and electric capacity paper is removed, fifth wheel is cleared up.
In the step 101, soft-medium microwave circuit base material is the circuits of RT/duroid 5880 or 5870, and upper surface is electricity
Road figure, lower surface is ground plane, and thickness is 0.127mm or 0.254mm.
In the step 101, the matrix material of microwave cavity is copper or aluminium alloy, and plating is painted with Ni/Au or Ni/Ag.
In the step 102, the conducting resinl of coating is epoxy conducting H20E, and coating thickness is 20 μm~50 μm.
In the step 103, electric capacity paper is a kind of papery uniform close, air permeability is good, high mechanical strength, chemical purity
High insulating paper, thickness is 5 μm~25 μm, and the shapes and sizes of electric capacity paper are that the edge for pasting microwave circuit is completely covered and surpasses
Go out 50 μm~100 μm of edge.
In the step 104, metallic briquette matrix material be copper, aluminium or 304 stainless steels, altitude range be 10mm~
50mm。
In the step 105, by microwave cavity and metallic briquette keep relative position it is motionless together be heating and curing conducting resinl
Method be：Microwave cavity and metallic briquette are placed on warm table together or heated in baking oven, makes conductive adhesive curing, is solidified
Temperature is 120 DEG C~150 DEG C, and hardening time is 30min~60min.
The present invention solves the limitation and deficiency of current soft-medium microwave circuit pasting method, possesses advantages below：
(1) apply certain pressure to soft-medium microwave circuit using metallic briquette, solve soft-medium chip circuit in itself
The problems such as gap and cavity for being produced by the expansion or shrinkage deformation in out-of-flatness and solidification process, add the reliable of product
Property.
(2) pass through increases the use of electric capacity paper between metallic briquette and soft-medium microwave circuit, it is to avoid because applying pressure
Power is improper or glue-spread it is improper caused by circuit surrounding and non-metallic hole site conducting resinl of crossing overflow between briquetting
The generation of adhesion phenomenon, metallic briquette is removed after convenient conduction adhesive curing, improves the production efficiency of product.
Brief description of the drawings
A kind of method flow diagram for soft-medium microwave circuit paster that Fig. 1 provides for the present invention；
Fig. 2-1, Fig. 2-2, Fig. 2-3, Fig. 2-4, Fig. 2-5 and Fig. 2-6 are used for soft-medium microwave for one kind that the present invention is provided
The process chart of circuit pasting method；
Wherein, 501, microwave cavity, 502, soft-medium microwave circuit, 503, conducting resinl, 504, electric capacity paper, 505, overall gold
Belong to briquetting, 506, warm table, 507, grounding conductor layer.
Embodiment
The invention will be further described with embodiment below in conjunction with the accompanying drawings.
Embodiment 1
As shown in figure 1, in the aluminium alloy cavity that plating applies Ni/Au, pasting the microwave circuits of RT/duroid 5880, the circuit
Upper surface is circuitous pattern, and lower surface is ground plane, and circuit media thickness is 0.127mm, uses H20E conductive adhesives to chamber
In internal wall, technical process, pressure is applied to soft-medium microwave circuit using a complete Copper substrate metallic briquette.
1st, according to design drawing requirement one microwave cavity of neat set and some soft-medium microwave circuits；
As shown in Fig. 2-1, if being the soft of 0.127mm according to the neat microwave cavity 501 of set one of design drawing requirement and dry thickness
Medium microwave circuit 502, and cleaned totally with absolute ethyl alcohol cotton balls, and dry naturally.The plating of the inwall of microwave cavity 501 applies Ni/Au,
Soft-medium microwave circuit 502 is the high-frequency copper-clad plate microwave circuits of RT/duroid 5880, and upper surface is circuitous pattern, and lower surface is
Ground plane.
2nd, one layer of conducting resinl is coated on the ground plane of each soft-medium microwave circuit, is glued successively according to design drawing requirement
It is connected on the corresponding position of microwave cavity inwall；
As shown in Fig. 2-2, the H20E that a layer thickness is 20 μm~50 μm is coated on the ground plane of soft-medium microwave circuit 502
Type epoxy conducting, is adhered on the corresponding position of the inwall of microwave cavity 501 according to microwave circuits drawing requirement.
3rd, a layer capacitance paper is completely covered in bonding soft-medium microwave circuit upper surface；
As Figure 2-3, be completely covered in the upper surface of soft-medium microwave circuit 502 a layer thickness for 25 μm, papery it is uniform
Closely, the electric capacity paper 504 that air permeability is good, high mechanical strength, chemical purity are high, the shapes and sizes of electric capacity paper 504 are complete
The profile and edge that soft-medium microwave circuit 502 is pasted in covering exceed 50 μm~100 μm.
4th, being used on electric capacity paper has a complete metal pressure suitable with soft-medium microwave circuit profile upper surface product
Apply pressure in block insertion microwave cavity；
As in Figure 2-4, on electric capacity paper 504 with suitable with the profile upper surface product of soft-medium microwave circuit 502 and
The Copper substrate bulk metal briquetting 505 that can be embedded in microwave cavity applies certain pressure, and briquetting is highly 20mm.
5th, by microwave cavity and metallic briquette keep relative position it is motionless together with heat, make conductive adhesive curing；
As shown in Figure 2-5, by microwave cavity 501 be placed on together with applying stressed bulk metal briquetting 505 120 DEG C plus
In thermal station 506, solidify 30min.
6th, microwave cavity room temperature is cooled down, removes metallic briquette and electric capacity paper, clear up fifth wheel.
As shown in figures 2-6, after H20E types epoxy conducting 503 solidify to form good earth conductor layer 507, by microwave cavity
Body 501 is removed from warm table 506, carries out room temperature cooling, recovers to room temperature to remove Copper substrate bulk metal briquetting 505 and electric capacity
Paper 504, the fifth wheels such as conducting resinl are removed using scalpel, rubber pipette bulb etc..
Although above-mentioned the embodiment of the present invention is described with reference to accompanying drawing, not to present invention protection model
The limitation enclosed, one of ordinary skill in the art should be understood that on the basis of technical scheme those skilled in the art are not
Need to pay various modifications or deform still within protection scope of the present invention that creative work can make.
Claims (1)
1. a kind of pasting method of soft-medium microwave circuit, it is characterized in that, comprise the following steps：
Step 101：According to design drawing requirement one microwave cavity of neat set and some soft-medium microwave circuits；Soft-medium microwave circuit
Base material is RT/duroid 5880 or 5870, and upper surface is circuitous pattern, and lower surface is ground plane, thickness be 0.127mm or
0.254mm；The matrix material of microwave cavity is copper or aluminium alloy, and plating is painted with Ni/Au or Ni/Ag；
Step 102：One layer of conducting resinl is coated on the ground plane of each soft-medium microwave circuit, according to design drawing requirement successively
It is adhered on the corresponding position of microwave cavity inwall；The conducting resinl of coating be epoxy conducting H20E, coating thickness be 20 μm~
50μm；
Step 103：A layer capacitance paper is completely covered in the bonding soft-medium microwave circuit upper surface of step 102；Electricity
Hold paper thickness be 5 μm~25 μm, the shapes and sizes of electric capacity paper be completely covered paste soft-medium microwave circuit edge and
Beyond 50 μm~100 μm of edge；By increasing the use of electric capacity paper between metallic briquette and soft-medium microwave circuit, it is to avoid
Because apply that pressure is improper or glue-spread it is improper caused by circuit surrounding and it is non-metallic cross hole site conducting resinl overflow with
The generation of adhesion phenomenon between briquetting, metallic briquette is removed after convenient conduction adhesive curing, improves the production efficiency of product；
Step 104：Being used on electric capacity paper has a complete metal pressure suitable with soft-medium microwave circuit upper surface area
Apply pressure in block insertion microwave cavity；Metallic briquette matrix material is copper, aluminium or 304 stainless steels, is highly 10mm~50mm；
Apply certain pressure to soft-medium microwave circuit using metallic briquette, solution soft-medium chip circuit because of out-of-flatness and is consolidated in itself
Gap and empty problem that expansion or shrinkage during change is deformed and produced, add the reliability of product；
Step 105：By microwave cavity and metallic briquette keep relative position it is motionless together with heat, make conductive adhesive curing；By microwave
Cavity and metallic briquette keep relative position it is motionless together with the be heating and curing method of conducting resinl be：Microwave cavity and metallic briquette
It is placed on warm table or is heated in baking oven together, make conductive adhesive curing, solidification temperature is 120 DEG C~150 DEG C, hardening time is
30min~60min；
Step 106：After H20E type epoxy conductings solidify to form good earth conductor layer, microwave cavity is taken from warm table
Under, room temperature cooling is carried out, recovers to room temperature to remove Copper substrate bulk metal briquetting and electric capacity paper, uses scalpel, rubber pipette bulb
Remove conducting resinl fifth wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531692.2A CN104332676B (en) | 2014-10-10 | 2014-10-10 | A kind of pasting method of soft-medium microwave circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531692.2A CN104332676B (en) | 2014-10-10 | 2014-10-10 | A kind of pasting method of soft-medium microwave circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104332676A CN104332676A (en) | 2015-02-04 |
| CN104332676B true CN104332676B (en) | 2017-09-22 |
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| CN201410531692.2A Expired - Fee Related CN104332676B (en) | 2014-10-10 | 2014-10-10 | A kind of pasting method of soft-medium microwave circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108777933B (en) * | 2018-06-25 | 2020-08-11 | 中国电子科技集团公司第四十一研究所 | Method for pasting soft medium microstrip circuit by electromagnetic technology |
| CN109699169B (en) * | 2019-01-31 | 2020-12-22 | 深圳市益光实业有限公司 | Microwave multichannel T/R assembly surface mounting technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101723304B (en) * | 2008-10-16 | 2012-06-27 | 周正三 | Microstructure with flexible circuit board and manufacturing method thereof |
| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
| CN103447646B (en) * | 2013-09-05 | 2015-09-02 | 中国电子科技集团公司第十研究所 | The welding method of soft chip circuit plate and metallic matrix is realized without special tooling |
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