CN210745653U - Metal substrate grounding structure of circuit board module - Google Patents
Metal substrate grounding structure of circuit board module Download PDFInfo
- Publication number
- CN210745653U CN210745653U CN201921934227.8U CN201921934227U CN210745653U CN 210745653 U CN210745653 U CN 210745653U CN 201921934227 U CN201921934227 U CN 201921934227U CN 210745653 U CN210745653 U CN 210745653U
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- CN
- China
- Prior art keywords
- metal substrate
- layer
- hole
- circuit board
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 59
- 239000002184 metal Substances 0.000 title claims abstract description 59
- 239000000758 substrate Substances 0.000 title claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 229910000679 solder Inorganic materials 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000741 silica gel Substances 0.000 claims abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 3
- 238000012856 packing Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 210000001503 joint Anatomy 0.000 abstract description 3
- 238000002788 crimping Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Abstract
The utility model discloses a metal substrate ground structure of circuit board module, including metal substrate and base member, metal substrate includes metal basic unit, insulating layer, circuit layer and solder mask, is equipped with a plurality of ground wire through-holes on the circuit layer, is equipped with the hole groove on the insulating layer, is equipped with the blind hole on the metal basic unit, and ground wire through-hole, hole groove and blind hole form the hole of irritating, through the copper facing technology formation packing copper body, ground wire on the circuit layer switches on through packing copper body ground connection with metal basic unit, and metal basic unit bonds with the base member mutually. The utility model discloses a hole design is irritated and copper facing technology shaping demand of satisfying the packing copper body for circuit board ground connection need not to adopt screw and pad cooperation ground connection, avoids the circuit board to produce the crimping damage. Realize the relatively fixed of metal substrate and base member through the mode of bonding, the butt joint face is level and smooth, can not cause metal substrate's distortion, reduces the equipment risk. The heat-conducting silica gel is used as the bonding layer, so that the bonding stability and the heat conductivity are better, and the actual application requirements are met.
Description
Technical Field
The utility model relates to a metal substrate ground structure of circuit board module belongs to the technical field of circuit board module.
Background
Involve the lamp plate module in the automobile production, the metal substrate who commonly uses on the existing market is copper base plate and aluminium base board, when lamp plate module calorific capacity is great and heat dissipation space is less, just need use copper base plate or aluminium base board. Part of the metal substrate needs to connect the metal base material and the ground line in the circuit together due to the performance requirements.
As shown in fig. 2, most of the prior art uses a pad structure that conducts around the screw hole, and fixes the circuit board module to the substrate by a plurality of screws, and simultaneously connects the metal substrate and the ground wire in the circuit.
In the process of matching and connecting, the circuit board is fixed by a plurality of screws, so that the circuit board is inevitably slightly bent, certain stress is generated inside the circuit board, and in the process of fixing by using the screws, the insulating layer of the metal substrate is possibly cracked due to the compression of the screws, so that the potential quality hazard exists.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the not enough of above-mentioned prior art, can lead to the problem that the quality risk appears in the product to traditional screw lock solid, provide the metal substrate ground structure of circuit board module.
In order to achieve the above purpose, the utility model discloses the technical scheme who adopts is:
the metal substrate grounding structure of the circuit board module comprises a metal substrate and a base body, wherein the metal substrate is sequentially provided with a metal base layer, an insulating layer, a circuit layer and a solder mask layer from bottom to top in a stacking sequence,
the circuit layer is provided with a plurality of ground wire through holes, the insulating layer is provided with hole grooves which are in one-to-one correspondence with the ground wire through holes, the metal base layer is provided with blind holes which are in one-to-one correspondence with the hole grooves,
the ground wire through hole, the hole groove and the blind hole form a filling hole, a filled copper body formed by a copper coating process is arranged in the filling hole, the ground wire on the circuit layer is connected and conducted with the metal base layer through the filled copper body, the solder mask is molded on the circuit layer,
the metal base layer is bonded with the substrate.
Preferably, the bonding layer between the metal base layer and the substrate is heat-conducting silica gel.
Preferably, the substrate is a metal substrate.
The beneficial effects of the utility model are mainly embodied in that:
1. the filling hole design meets the copper-clad process forming requirement of the copper filling body, so that the circuit board is grounded, screws and bonding pads are not needed to be matched for grounding, and the circuit board is prevented from being damaged by compression joint.
2. Realize the relatively fixed of metal substrate and base member through the mode of bonding, the butt joint face is level and smooth, can not cause metal substrate's distortion, reduces the equipment risk.
3. The heat-conducting silica gel is used as the bonding layer, so that the bonding stability and the heat conductivity are better, and the actual application requirements are met.
Drawings
Fig. 1 is a schematic structural diagram of the metal substrate grounding structure of the circuit board module of the present invention.
Fig. 2 is a schematic structural diagram of a circuit board module in the prior art.
Detailed Description
The utility model provides a metal substrate ground structure of circuit board module. The technical solution of the present invention will be described in detail below with reference to the accompanying drawings so as to be easier to understand and grasp.
As shown in fig. 1, the metal substrate grounding structure of the circuit board module comprises a metal substrate 1 and a base body 2, wherein the metal substrate 1 is sequentially provided with a metal base layer 3, an insulating layer 4, a circuit layer 5 and a solder mask layer 6 from bottom to top. A metal substrate 1 of a traditional ground circuit board module is provided with a through ground screw hole, a conducting pad structure is arranged on the periphery of the screw hole, and the ground conduction is realized after the screw is connected in a penetrating manner and pressed tightly. The circuit board module is easy to damage in the pressing operation, and the alignment matching holes need to be designed on the base body 2, so that the required precision is high.
In the scheme, as shown in fig. 1, a plurality of ground wire through holes 7 are formed in the circuit layer 5, hole grooves 8 corresponding to the ground wire through holes 7 one to one are formed in the insulating layer 4, and blind holes 9 corresponding to the hole grooves 8 one to one are formed in the metal base layer 3.
The ground wire through hole 7, the hole groove 8 and the blind hole 9 form a filling hole, a filling copper body 10 formed by a copper coating process is arranged in the filling hole, the ground wire on the circuit layer 5 is in grounding conduction with the metal base layer 3 through the filling copper body 10, the solder mask layer 6 is formed on the circuit layer, and the forming of the solder mask layer 6 belongs to the prior art and is not described herein again. The metal base layer 3 is bonded with the substrate 2.
The metal substrate 1 is directly bonded without being locked by screws, and the requirement on matching strength can be met by limiting the periphery of the metal substrate 1 and bonding the bottom surface of the metal substrate.
In one embodiment, the bonding layer between the metal base layer 3 and the substrate 2 is a heat conductive silicone 11. And the substrate 2 is a metal substrate.
Specifically, the loading space of the automobile lamp panel module is narrow, so that the automobile lamp panel module needs to have better heat dissipation performance, the heat conduction silica gel 11 is adopted in the scheme to realize better heat conduction, and the metal matrix has a better heat dissipation function.
Can discover through the above description, the utility model discloses the metal substrate ground structure of circuit board module satisfies the copper facing technology shaping demand of the packing copper body through the design of irritating the hole for circuit board ground connection need not to adopt screw and pad cooperation ground connection, avoids the circuit board to produce the crimping damage. Realize the relatively fixed of metal substrate and base member through the mode of bonding, the butt joint face is level and smooth, can not cause metal substrate's distortion, reduces the equipment risk. The heat-conducting silica gel is used as the bonding layer, so that the bonding stability and the heat conductivity are better, and the actual application requirements are met.
The above technical solutions of the present invention have been fully described, and it should be noted that the present invention is not limited by the above description, and all technical solutions formed by equivalent transformation or equivalent transformation adopted by the spirit of the present invention in the aspects of structure, method or function by those of ordinary skill in the art all fall within the protection scope of the present invention.
Claims (3)
1. The metal substrate grounding structure of the circuit board module comprises a metal substrate and a base body, wherein the metal substrate is sequentially provided with a metal base layer, an insulating layer, a circuit layer and a solder mask layer from bottom to top in a stacking sequence,
the method is characterized in that:
the circuit layer is provided with a plurality of ground wire through holes, the insulating layer is provided with hole grooves which are in one-to-one correspondence with the ground wire through holes, the metal base layer is provided with blind holes which are in one-to-one correspondence with the hole grooves,
the ground wire through hole, the hole groove and the blind hole form a filling hole, a filled copper body formed by a copper coating process is arranged in the filling hole, the ground wire on the circuit layer is connected and conducted with the metal base layer through the filled copper body, the solder mask is molded on the circuit layer,
the metal base layer is bonded with the substrate.
2. The metal substrate grounding structure of the circuit board module according to claim 1, wherein:
the metal base layer and the bonding layer between the substrates are heat-conducting silica gel.
3. The metal substrate grounding structure of the circuit board module according to claim 2, wherein:
the substrate is a metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921934227.8U CN210745653U (en) | 2019-11-11 | 2019-11-11 | Metal substrate grounding structure of circuit board module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921934227.8U CN210745653U (en) | 2019-11-11 | 2019-11-11 | Metal substrate grounding structure of circuit board module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210745653U true CN210745653U (en) | 2020-06-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921934227.8U Expired - Fee Related CN210745653U (en) | 2019-11-11 | 2019-11-11 | Metal substrate grounding structure of circuit board module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210745653U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
-
2019
- 2019-11-11 CN CN201921934227.8U patent/CN210745653U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200612 |
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| CF01 | Termination of patent right due to non-payment of annual fee |