CN210986560U - High heat conduction graphite alkene base plate - Google Patents
High heat conduction graphite alkene base plate Download PDFInfo
- Publication number
- CN210986560U CN210986560U CN201921478563.6U CN201921478563U CN210986560U CN 210986560 U CN210986560 U CN 210986560U CN 201921478563 U CN201921478563 U CN 201921478563U CN 210986560 U CN210986560 U CN 210986560U
- Authority
- CN
- China
- Prior art keywords
- graphite alkene
- copper foil
- base plate
- graphene
- conductive copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The utility model provides a high heat conduction graphite alkene base plate, including graphite alkene body, graphite alkene base plate body top is equipped with heat conduction insulating glue layer, electrically conductive copper foil layer, white oil insulating paint layer, chip from bottom to top in proper order, electrically conductive copper foil layer top is equipped with the positive negative pole pin of a plurality of from a left side to the right side, electrically conductive copper foil layer top is equipped with white oil insulating paint layer, chip fixed mounting is on the positive negative pole pin of electrically conductive copper foil layer. The existing aluminum substrate has poor heat dissipation performance, if active heat dissipation devices such as fans and the like are not adopted, the temperature of core electronic elements such as chips and the like can be rapidly increased, the performance and the service efficiency of electronic products are seriously limited, and the service life is shortened. The utility model discloses a graphite alkene base plate utilizes the advantage that graphite alkene is light, corrosion-resistant, strong acid and alkali resistant, resistant high radiation, high heat conduction, has effectively improved the heat conductivity and the durability of base plate, makes the base plate have safe in utilization, durable characteristics.
Description
Technical Field
The utility model relates to a technical field is made to graphite alkene, specifically is a high heat conduction graphite alkene base plate.
Background
With the development and progress of electronic technology, electronic products are gradually developed in the light, thin and small directions, so that it has become a necessary trend to produce electronic products with individuation, high reliability, low cost and multiple functions, but the existing aluminum substrate has poor heat dissipation performance, if active heat dissipation devices such as fans are not adopted, the temperature of core electronic components such as chips and the like can be rapidly increased, the performance and the service efficiency of the electronic products are severely limited, and the service life is shortened accordingly. Graphene has the characteristic of being light as a high-thermal-conductivity material, but the existing electronic products do not utilize graphene to produce substrates.
Disclosure of Invention
The utility model provides a high heat conduction graphite alkene base plate to it is poor to solve metal substrate heat dispersion among the prior art at least, leads to the problem that electronic component life descends.
The utility model provides a high heat conduction graphite alkene base plate, high heat conduction graphite alkene base plate includes the graphite alkene body, graphite alkene body top is equipped with heat conduction insulating glue layer, conductive copper foil layer, white oil insulating paint layer, chip from bottom to top in proper order, conductive copper foil layer top is equipped with the positive negative pole pin of a plurality of from a left side to the right side, conductive copper foil layer top is equipped with white oil insulating paint layer, chip fixed mounting is on the positive negative pole pin of conductive copper foil layer.
Further, the graphene body is a graphene plate filled with a ceramic medium.
Further, the thickness of the graphene body is 0.3-20mm, the graphene body is a plate or a special-shaped structure, the thickness of the conductive copper foil layer is 0.1-0.35mm, and the white oil is silicone oil.
Further, the upper surface and the lower surface of the graphene body are respectively provided with a first protective film and a second protective film.
Furthermore, a soldering tin layer is arranged between the positive pin and the negative pin and the conductive copper foil layer.
Compared with the prior art, the utility model, adopt the graphite alkene body to carry out the production of electronic substrate, utilize the high heat conductivity of graphite alkene, effectively improve the heat dispersion of base plate. And simultaneously, the utility model discloses a graphite alkene body utensil is corrosion-resistant, resistant strong acid and alkali, resistant high radiation's advantage, can use under multiple harsh condition, has safe in utilization, durable characteristics.
Drawings
The embodiment of the present invention provides a schematic diagram of a structure of a high thermal conductivity graphene substrate in fig. 1.
In the figure: A. the heat dissipation structure comprises a graphene heat dissipation body or a special-shaped graphene sheet, a B heat conduction insulating adhesive layer, a C electric and heat conduction copper foil layer, a D white oil layer, an E solder, F positive and negative pins and a G chip.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
The embodiment of the utility model discloses high heat conduction graphite alkene base plate, as shown in fig. 1, including graphite alkene base plate body (A), graphite alkene base plate body (A) top is fixed with heat conduction insulating glue film (B), there is electrically conductive heat conduction copper foil layer (C) heat conduction insulating glue film (B) top, electrically conductive heat conduction copper foil layer (C) top is equipped with white oil reservoir (D), there is solder (E) electrically conductive heat conduction copper foil layer (C) top, positive and negative pin passes through solder (E) and welds on electrically conductive heat conduction copper foil (C), white oil reservoir (D) top material has chip (G).
Optionally, the graphene insulation heat conduction plate is made of a polymer material filled with a high-thermal-conductivity and high-insulation ceramic medium. The thickness of the graphene substrate body is 0.3-20mm, the thickness of the conductive copper foil layer is 0.1-0.35mm, and a first protective film and a second protective film are respectively arranged on the upper end face and the lower end face of the graphene substrate body. The white oil is colorless transparent oily liquid, has no odor, has lubricity, and is insoluble in water and ethanol preparation.
Wherein, the utility model discloses well special-shaped shape that indicates that the lower surface of graphite alkene body has a plurality of archs or heat radiation fins.
The embodiment of the utility model provides an adopt the graphite alkene body to carry out the production of electronic substrate, utilize the high heat conductivity of graphite alkene, effectively improve the heat dispersion of base plate. And simultaneously, the utility model discloses a graphite alkene body utensil is corrosion-resistant, resistant strong acid and alkali, resistant high radiation's advantage, can use under multiple harsh condition, has safe in utilization, durable characteristics.
The embodiment of the utility model provides a manufacturing process of high heat conduction graphite alkene base plate includes following step:
A1. blanking: determining the size of a graphene body, and cutting a graphene raw material into a graphene substrate with a specific size by using a cutting machine, wherein the graphene substrate can be an independent radiator body or a special-shaped radiator structure;
A2. preprocessing a graphene body: putting the graphene body into a solution containing 3% -5% of NaOH at 35-60 ℃, and soaking for 35min to remove oil from the graphene body;
A3. cleaning and drying, namely putting the deoiled graphene body in A2 into a water tank, cleaning with clear water, and then putting the graphene body into a drying box for drying, wherein the drying temperature of the drying box can be set to 70-100 ℃;
A4. adhering heat-conducting insulating glue, and welding the heat-conducting insulating glue to the upper surface of the graphene body by using an adhering machine;
A5. primary vacuum pressing: the conductive copper foil layer is pressed on the insulating plate by utilizing the air pressure of a pressing machine, the pressing temperature of the vacuum pressing machine is set to be 160-200 ℃, the air pressure of the vacuum pressing machine is 0.4-0.8mp, and the pressing force of the vacuum pressing machine is 6-15 kg/cm;
A6. and (3) secondary vacuum pressing: uniformly laminating the silica gel layer on the upper end surface of the conductive copper foil layer by using a vacuum laminating machine, wherein the laminating temperature of the vacuum laminating machine is set to be 150-180 ℃, the air pressure of the vacuum laminating machine is 0.3-0.7mp, and the laminating force of the vacuum laminating machine is 6-15 kg/cm;
A7. welding a bonding chip: and coating the tin raw material in a chip base, so that the anode and the cathode of the chip are respectively connected with the copper foil conducting layer through the soldering tin raw material, and obtaining the high-thermal-conductivity graphene substrate.
Optionally, the embodiment of the present invention further includes A8. welding a heat dissipation graphene irregular sheet or a graphene body uniformly on the lower end surface of the graphene body by using a welding machine after a7 is completed; A9. and (3) inspecting and packaging: finally, carrying out appearance inspection, and packaging after the inspection is qualified.
The embodiment of the utility model provides an in the embodiment through adopting the A8 step, can further increase heat radiation structure such as heat radiation fins on high heat conduction graphene substrate's basis, effectively improve finished product substrate's heat dispersion, in the actual production process, if direct ground with high heat conduction graphene substrate sets up the dysmorphism structure, can lead to the dysmorphism fragile of high heat conduction graphene substrate to reduce the yield, the embodiment of the utility model provides an in adopt A8 step, further increase welding process once more on finished product substrate's basis, effectively realize the diversified effect of graphene substrate, and avoid the problem that the yield reduces.
It should be finally noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above embodiments, it should be understood by those skilled in the art that after reading the present specification, the technical personnel can still modify or equivalently replace the specific embodiments of the present invention, but these modifications or changes do not depart from the scope of the claims of the present application.
Claims (5)
1. The utility model provides a high heat conduction graphite alkene base plate, its characterized in that, high heat conduction graphite alkene base plate includes the graphite alkene body, graphite alkene body top is equipped with heat conduction insulating glue layer, electrically conductive copper foil layer, white oil insulating paint layer, chip from bottom to top in proper order, electrically conductive copper foil layer top is equipped with the positive negative pole pin of a plurality of from a left side to the right side, electrically conductive copper foil layer top is equipped with white oil insulating paint layer, chip fixed mounting is on the positive negative pole pin of electrically conductive copper foil layer.
2. The graphene substrate according to claim 1, wherein the graphene body is a ceramic dielectric filled graphene plate.
3. The graphene substrate with high thermal conductivity according to claim 1, wherein the thickness of the graphene body is 0.3-20mm, the graphene body is a plate or a special-shaped structure, the thickness of the conductive copper foil layer is 0.1-0.35mm, and the white oil is silicone oil.
4. The graphene substrate according to claim 1, wherein the upper and lower surfaces of the graphene body are further provided with a first protective film and a second protective film, respectively.
5. The graphene substrate with high thermal conductivity according to claim 1, wherein a solder layer is disposed between the positive and negative electrode pins and the conductive copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921478563.6U CN210986560U (en) | 2019-09-06 | 2019-09-06 | High heat conduction graphite alkene base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921478563.6U CN210986560U (en) | 2019-09-06 | 2019-09-06 | High heat conduction graphite alkene base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986560U true CN210986560U (en) | 2020-07-10 |
Family
ID=71421771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921478563.6U Active CN210986560U (en) | 2019-09-06 | 2019-09-06 | High heat conduction graphite alkene base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986560U (en) |
-
2019
- 2019-09-06 CN CN201921478563.6U patent/CN210986560U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2013086794A1 (en) | Flexible circuit substrate led two-dimensional array light source | |
| CN201827857U (en) | Heat conducting structure of LED light source | |
| CN102655714A (en) | Manufacturing process of metal substrate high-conductivity metal base circuit board | |
| CN102692000A (en) | Graphite base plate for LED (light emitting diode) high-power illumination module and manufacturing technology of graphite base plate | |
| CN203457035U (en) | Module power supply | |
| CN109379833A (en) | A kind of high heat conduction metal-based method for manufacturing circuit board | |
| CN107749399B (en) | Power chip packaging method and structure | |
| CN210986560U (en) | High heat conduction graphite alkene base plate | |
| CN102155634A (en) | LED (light emitting diode) lighting module and method for manufacturing LED lighting module | |
| CN102683546A (en) | Semiconductor package structure and manufacturing method thereof | |
| CN111163581A (en) | High-thermal-conductivity graphene substrate and preparation process thereof | |
| CN202034361U (en) | Semiconductor packaging structure | |
| CN110620094A (en) | Packaging structure and packaging process of power semiconductor device | |
| CN217363612U (en) | Heat pipe mounting structure of radiator | |
| CN212485342U (en) | SMD diode with reliable structure | |
| CN203941945U (en) | A kind of multilayer specular aluminium COB base plate for packaging | |
| CN111954368A (en) | Thermoelectric separation filling electroplated double-sided metal substrate and manufacturing method thereof | |
| CN210722996U (en) | Semiconductor chip packaging structure without bonding wires | |
| CN210745653U (en) | Metal substrate grounding structure of circuit board module | |
| CN208507478U (en) | A kind of nanometer of foil produces electrolytic capacitor | |
| CN202712257U (en) | Ceramic base material LED light source module support | |
| CN106385768B (en) | A kind of transparent medium wiring board and its manufacturing method | |
| CN105338734B (en) | Ceramic substrate circuit board and its manufacturing method | |
| CN209071327U (en) | A kind of high-voltage switch gear diode package structure | |
| CN107809884A (en) | A kind of high thermal conductivity aluminum matrix plate and its manufacturing process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |