CN101723304B - Microstructure with flexible circuit board and manufacturing method thereof - Google Patents
Microstructure with flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN101723304B CN101723304B CN2008101699817A CN200810169981A CN101723304B CN 101723304 B CN101723304 B CN 101723304B CN 2008101699817 A CN2008101699817 A CN 2008101699817A CN 200810169981 A CN200810169981 A CN 200810169981A CN 101723304 B CN101723304 B CN 101723304B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- micro
- structural
- supporting construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000010276 construction Methods 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 34
- 239000002861 polymer material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000013459 approach Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a microstructure with a flexible circuit board and a manufacturing method thereof. The microstructure with the flexible circuit board comprises a base plate, at least one support structure and the flexible circuit board, wherein the support structure is arranged on the base plate; the flexible circuit board is arranged on the support structure and is connected to the support structure; and a gap is formed among the flexible circuit board, the base plate and the support structure. By using the flexible circuit board to simplify the manufacturing process, the rate of good products and the competitiveness of the products are improved.
Description
Technical field
The present invention relates to a kind of micro-structural and forming method thereof, relate in particular to a kind of little sensor structure or micro-actuator structure and manufacturing approach thereof of utilizing flexible circuit board to manufacture.
Background technology
(the MEMS of prior micro-electromechanical system; Micro-Electro-Mechanical System) comprise actuator or sensor structure, its structure does not break away from the suspension structure (floating or suspended structure) that utilizes build micro-processing technology (Bulk micro-machining) and face type micro-processing technology (Surface micro-machining) to form basically.
In the micro-electromechanical technology development; The application of sensor has comprised for example pressure-sensing, inertia sensing, sensing flux, Thermal Infra-Red sensing or chemical sensing device and biological sensor or the like; Utilize actuator can do various application; For example on optics master passive device, for example minute surface phase-modulator, optical switch, optical attenuator, light frequency modulation filter, light frequency modulation is radium-shine and optical scanning minute surface or the like.Known active principle can be divided into modes such as static, electromagnetism, heat and piezoelectricity substantially.
Known fine structure material and manufacturing process; Mostly utilize traditional semiconductor manufacture to accomplish such as thin film deposition, exposure etching or the like; Last wet type or the dry etching of utilizing again accomplished last micro suspension structure, and its characteristic is all elements that complete at complete wafer (wafer).
Above-mentioned this semiconductor manufacture; Maximum shortcoming is; Form the wet type of micro-structural process or the process of dry etching sacrifice layer; Cause output yields problem easily, for example wet etching can make micro-structural because of the surface tension of liquid problem easily and bottom substrate adhere to each other promptly so-called adhesion effect (sticking effect).Moreover, in the time will wafer (wafer) being cut into single crystal grain (die), the cutting of can washing by water of traditional diamond cutter, the impulse force of water can destroy micro-structural and same (sticking) problem of adhesion that produces.
In encapsulation process, traditional vacuum suction mode is taken off crystal grain, also can cause structural deterioration.
At last, the material majority that utilizes semiconductor process flows to make is dielectric material, and making flow process is the high temperature flow process, has caused hot residual stress, can produce the structure gross distortion and increase the weight of the yields problem of micro-structural.
For this reason, address the above problem and be emphasis of the present invention.
Summary of the invention
For solving the yields problem of above-mentioned micro-structural, the present invention provides a kind of micro-structural of tool flexible circuit board, and it comprises a substrate, at least one supporting construction and a flexible circuit board.Supporting construction is positioned on the substrate.Flexible circuit board is positioned on the supporting construction and is connected to supporting construction.Substrate has an application circuit; Flexible circuit board is to be formed by polymer material layer and metallic circuit; Be formed with a gap between the metallic circuit of flexible circuit board, the application circuit of substrate and the supporting construction, to application circuit, a main part of said flexible circuit board has the function that receives physical quantity to metallic circuit through clearance plane; Wherein: said gap is an airtight gap, and the said main part of said flexible circuit board has the degree of freedom that one dimension moves; Or said gap is an open gap, and the said main part of said flexible circuit board has that one dimension moves, two dimension moves or the three-dimensional degree of freedom that moves.
The present invention also provides a kind of manufacturing approach of micro-structural of tool flexible circuit board, comprises following steps: on a substrate, form at least one supporting construction; And a flexible circuit board is installed at least one supporting construction, and make flexible circuit board be connected at least one supporting construction.Substrate has an application circuit; Flexible circuit board is to be formed by polymer material layer and metallic circuit; Be formed with a gap between the metallic circuit of flexible circuit board, the application circuit of substrate and at least one supporting construction; To application circuit, a main part of said flexible circuit board can be moved metallic circuit through clearance plane; And the polymer material layer of a part that removes said flexible circuit board to be to form peristome, to expose open gap, makes said main part have that one dimension moves, two dimension moves or the three-dimensional degree of freedom that moves simultaneously.
The present invention comes simplified manufacturing technique through flexible circuit board, promotes yield of products and competitiveness.
For letting the foregoing of the present invention can be more obviously understandable, hereinafter is special lifts a preferred embodiment, and conjunction with figs., elaborates.
Description of drawings
Fig. 1 shows the schematic side view according to the micro-structural of the tool flexible circuit board of first embodiment of the invention.
Fig. 2 shows the sketch map according to the manufacturing approach of the micro-structural of the tool flexible circuit board of first embodiment of the invention.
Fig. 3 shows the schematic top plan view according to the micro-structural of the tool flexible circuit board of second embodiment of the invention.
Fig. 4 shows the generalized section along Fig. 3 center line 4-4.
Drawing reference numeral:
S1: the signal of telecommunication
S2: actuated signal
10: substrate
12: application circuit
20: supporting construction
30: flexible circuit board
32: polymer material layer
34: metallic circuit
36: main part
38: peristome
40: the gap
Embodiment
Like Fig. 1 and shown in Figure 2, the micro-structural of the tool flexible circuit board of present embodiment can be used as sensor or actuator and use, and comprises a substrate 10, at least one supporting construction 20 and a flexible circuit board (Flexible Printed Circuit, FPC) 30.
At least one supporting construction 20 is to be made up of metal, particularly is made up of gold (Au).At least one supporting construction 20 is positioned on the substrate 10.Flexible circuit board 30 is to be formed by 32 of the polymer material layers that metallic circuit 34 reaches like pi (polyimide).Metallic circuit 34 and polymer material layer 32 can be single or multiple lifts, and the structure and the material that relate to flexible circuit board are known technology, do not give unnecessary details at this.Flexible circuit board 30 is positioned at least one supporting construction 20 and is connected at least one supporting construction 20.At this, supporting construction 20 is to be a circulus, in order to support flexible circuit board 30.Therefore, be formed with a gap 40 between flexible circuit board 30, substrate 10 and at least one supporting construction 20.
When present embodiment used as sensor, flexible circuit board 30 was to be electrically connected to substrate 10 through part or all of at least one supporting construction 20, and a main part 36 of flexible circuit board 30 has the function that receives physical quantity.At this, physical quantity can be thermal radiation, temperature, fluid rate, pressure and inertia or the like.The main part 36 of flexible circuit board 30 also can produce a displacement according to physical quantity, thereby causes situations such as distortion or rotation.
In order to have the function of sensor, substrate 10 also can have an application circuit 12, for example can application circuit (integrated circuit) 12 be made in substrate 10.It is connected to flexible circuit board 30 through at least one supporting construction 20, and application circuit 12 receives and handles physical quantity, and converts physical quantity to a signal of telecommunication S1, but this signal representation temperature, flow velocity, pressure or inertia etc.
When present embodiment used as actuator, flexible circuit board 30 received one and activates signal S2 so that a main part 36 of flexible circuit board 30 produces mobile.Likewise, substrate 10 can have an application circuit 12, and it is connected to flexible circuit board 30 through at least one supporting construction 20, the environmental change that application circuit 12 output actuated signal S2 or actuated signal S2 come from the outside.For example, micro-structural can be for optical frames, minute surface phase-modulator, optical switch, optical attenuator, light frequency modulation filter, light frequency modulation is radium-shine and optical scanning minute surface and other are used or the like.
Likewise, gap 40 can be open gap or airtight gap.When gap 40 is when belonging to airtight gap, the main part 36 of flexible circuit board 30 can also have the degree of freedom that one dimension moves.When gap 40 was open gap 40, the main part 36 of flexible circuit board 30 can also have the degree of freedom that one dimension moves or two dimension moves or three-dimensional moves.Flexible circuit board 30 can be to be formed by polymer material layer 32 and 34 of metallic circuits; And the polymer material layer 32 of flexible circuit board 30 has peristome 38 to expose open gap 40, and perhaps peristome is to be arranged at flexible circuit board 30 below (not shown).
As shown in Figure 2, the manufacturing approach of the micro-structural of tool flexible circuit board of the present invention comprises following steps.At first, on a substrate 10, form at least one supporting construction 20.Then, a flexible circuit board 30 is installed at least one supporting construction 20, and is made flexible circuit board 30 be connected at least one supporting construction 20.Be formed with a gap 40 between flexible circuit board 30, substrate 10 and at least one supporting construction 20.
Characteristic as for above each element or structure has been illustrated in foregoing, no longer repeats at this.
In order to form open gap; Aforesaid manufacturing approach can also comprise following steps: the polymer material layer 32 of a part that removes flexible circuit board 30 is to form peristome 38; To expose open gap 40, make main part 36 can also have the degree of freedom that one dimension moves, two dimension moves or three-dimensional moves simultaneously.In the case; Can utilize like radium-shine process technology; Particularly quasi-molecule radium-shine (excimer laser) or other machinery and chemical etching or plasma etching mode remove the polymer material layer 32 of a part to form peristome 38, like Fig. 3 and shown in Figure 4.It should be noted that metallic circuit 34 can be through defining shape in advance when the FPC soft board designs, during for example as pressure-sensing, metallic circuit 34 can be a planar metallic structure; And during as two dimension or three-dimensional acceleration sensing, metallic circuit 34 can be meant the design of forked design and collocation suitable opening portion 38.In the present embodiment, a part that belongs to metallic circuit 34 is designed to support the elongated leg (can be the elastic construction of bending, to strengthen the degree of freedom of micro-structural main part 36 motion more than two dimension) of micro-structural.
Flexible circuit board extensively used by industry and its technical development quite ripe.Therefore, through micro-structural of the present invention and manufacturing approach thereof, can solve several problems of above-mentioned known technology.At first, substrate 10 surfaces do not have any micro-structural, and the cutting of reference standards and crystal grain are drawn mode fully; And soft board and crystal grain are combined, early be exactly standard packaged type (COF for example, chip-on-film); The maximum spirit of the present invention is exactly the mode of production of ingenious combination this two; The shape that cooperates predefined soft board interior metal lead, the softpanel structure that has defined a suspension is above a gap, and the formation in gap is to engage with softpanel structure through the metal bond mode; Be the dry type manufacturing process fully, do not have conventional art to adhere to the problem of (Sticking).Simultaneously; Soft board and crystal grain juncture have also solved the encapsulation problem simultaneously; Can application circuit in micro-structural or the substrate be electrically connected to the external world (through connector or anisotropic conductive film (Anisotropic Conductive Film, ACF) combination), when this measure has also overcome cutting of above-mentioned conventional art or crystal grain absorption or the destruction problem during encapsulation through soft board; Providing of flexible circuit board can be simplified whole manufacturing process, and promotes yield of products and competitiveness.
The specific embodiment that in the detailed description of preferred embodiment, is proposed is only in order to convenient explanation technology contents of the present invention; But not with narrow sense of the present invention be limited to the foregoing description; In the situation that does not exceed spirit of the present invention and claim scope; The many variations of being done is implemented, and all belongs to scope of the present invention.
Claims (14)
1. the micro-structural of a tool flexible circuit board is characterized in that, the micro-structural of said tool flexible circuit board comprises:
One substrate has an application circuit;
At least one supporting construction is positioned on the said substrate; And
One flexible circuit board; Be positioned on said at least one supporting construction and be connected to said at least one supporting construction; Wherein said flexible circuit board is to be formed by polymer material layer and metallic circuit, is formed with a gap between the metallic circuit of said flexible circuit board, the application circuit of said substrate and the said at least one supporting construction, and said metallic circuit passes through said clearance plane to said application circuit; One main part of said flexible circuit board has the function that receives physical quantity, wherein:
Said gap is an airtight gap, and the said main part of said flexible circuit board has the degree of freedom that one dimension moves; Or
Said gap is an open gap, and the said main part of said flexible circuit board has the degree of freedom that one dimension moves, two dimension moves or three-dimensional moves.
2. the micro-structural of tool flexible circuit board as claimed in claim 1 is characterized in that, said flexible circuit board is to be electrically connected to said substrate through said at least one supporting construction partly.
3. the micro-structural of tool flexible circuit board as claimed in claim 1 is characterized in that, said physical quantity is thermal radiation, temperature, fluid rate, pressure or inertia.
4. the micro-structural of tool flexible circuit board as claimed in claim 1 is characterized in that, the said main part of said flexible circuit board also can produce a displacement according to said physical quantity.
5. the micro-structural of tool flexible circuit board as claimed in claim 1; It is characterized in that; The application circuit of said substrate is connected to said flexible circuit board through said at least one supporting construction, and said application circuit receives and handles said physical quantity, and converts said physical quantity to a signal of telecommunication.
6. the micro-structural of tool flexible circuit board as claimed in claim 1 is characterized in that, the said polymer material layer of said flexible circuit board and said metallic circuit have peristome to expose said open gap.
7. the micro-structural of tool flexible circuit board as claimed in claim 1 is characterized in that, the micro-structural of said tool flexible circuit board is applied to accelerometer, gyroscope, bolometer, fluid sensors, pressure sensor, strain gauge or tactile sensor.
8. the micro-structural of a tool flexible circuit board is characterized in that, the micro-structural of said tool flexible circuit board comprises:
One substrate has an application circuit;
At least one supporting construction is positioned on the said substrate; And
One flexible circuit board; Be positioned on said at least one supporting construction and be connected to said at least one supporting construction; Wherein said flexible circuit board is to be formed by polymer material layer and metallic circuit; Be formed with a gap between the metallic circuit of said flexible circuit board, the application circuit of said substrate and the said at least one supporting construction; To said application circuit, said flexible circuit board receives one and activates signal so that a main part of said flexible circuit board produces mobile said metallic circuit through said clearance plane.
9. the micro-structural of tool flexible circuit board as claimed in claim 8 is characterized in that, the application circuit of said substrate is connected to said flexible circuit board through said at least one supporting construction, and said application circuit is exported said actuated signal.
10. the micro-structural of tool flexible circuit board as claimed in claim 8 is characterized in that, the micro-structural of said tool flexible circuit board is optical frames, minute surface phase-modulator, optical switch, optical attenuator, light frequency modulation filter, light frequency modulation is radium-shine or the optical scanning minute surface.
11. the micro-structural of tool flexible circuit board as claimed in claim 8 is characterized in that, said substrate is made up of an insulating material, a macromolecular material or a kind of semi-conducting material.
12. the micro-structural of tool flexible circuit board as claimed in claim 8 is characterized in that, said at least one supporting construction is to be made up of metal.
13. the manufacturing approach of the micro-structural of a tool flexible circuit board is characterized in that, said method comprises following steps:
On a substrate, form at least one supporting construction, wherein, said substrate has an application circuit;
One flexible circuit board is installed on said at least one supporting construction; And make said flexible circuit board be connected to said at least one supporting construction; Wherein said flexible circuit board is to be formed by polymer material layer and metallic circuit; Be formed with a gap between the metallic circuit of said flexible circuit board, the application circuit of said substrate and the said at least one supporting construction, to said application circuit, a main part of said flexible circuit board can be moved said metallic circuit through said clearance plane; And
The polymer material layer of a part that removes said flexible circuit board to be to form peristome, to expose open gap, makes said main part have that one dimension moves, two dimension moves or the three-dimensional degree of freedom that moves simultaneously.
14. the manufacturing approach of the micro-structural of tool flexible circuit board as claimed in claim 13 is characterized in that, said method is the polymer material layer that removes the said part of said flexible circuit board through radium-shine processing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101699817A CN101723304B (en) | 2008-10-16 | 2008-10-16 | Microstructure with flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101699817A CN101723304B (en) | 2008-10-16 | 2008-10-16 | Microstructure with flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101723304A CN101723304A (en) | 2010-06-09 |
| CN101723304B true CN101723304B (en) | 2012-06-27 |
Family
ID=42444964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101699817A Expired - Fee Related CN101723304B (en) | 2008-10-16 | 2008-10-16 | Microstructure with flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101723304B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104267582A (en) * | 2014-09-29 | 2015-01-07 | 天津津芯微电子科技有限公司 | Circuit board system for DMD (Digital Micro-mirror Device) control |
| CN104332676B (en) * | 2014-10-10 | 2017-09-22 | 中国电子科技集团公司第四十一研究所 | A kind of pasting method of soft-medium microwave circuit |
-
2008
- 2008-10-16 CN CN2008101699817A patent/CN101723304B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101723304A (en) | 2010-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2165970B1 (en) | Substrate bonded MEMS sensor | |
| CN106959106B (en) | Fused quartz micro-hemispherical resonator gyroscope based on SOI packaging and processing method thereof | |
| EP2346083B1 (en) | Mems sensor | |
| JP2001196484A (en) | Manufacturing method of mems structure enabling wafer level vacuum packaging | |
| CN105137121A (en) | Preparation method of low-stress acceleration meter | |
| JP5175152B2 (en) | MEMS sensor | |
| JP2008101917A (en) | Package for pressure sensor | |
| JP2007218902A (en) | Discrete stress isolator | |
| CN105182005A (en) | Low stress accelerometer | |
| JP5237733B2 (en) | MEMS sensor | |
| CN101723304B (en) | Microstructure with flexible circuit board and manufacturing method thereof | |
| KR100661350B1 (en) | Mems devices package and method for manufacturing thereof | |
| US20080028856A1 (en) | Capacitive accelerating sensor bonding silicon substrate and glass substrate | |
| US7705412B2 (en) | SOI substrate and semiconductor acceleration sensor using the same | |
| US7470565B2 (en) | Method of wafer level packaging and cutting | |
| CN112938888B (en) | MEMS sensor chip packaging structure and method with stress adjustment | |
| US20200385264A1 (en) | Generating a mems device with glass cover and mems device | |
| WO2011118788A1 (en) | Method for manufacturing silicon substrate having glass embedded therein | |
| TWI384916B (en) | Micro structure with flexible printed circuit and method of manufacturing the same | |
| KR100519819B1 (en) | A method for manufacturing the micro inertia sensor | |
| JP4628018B2 (en) | Capacitive mechanical quantity sensor and manufacturing method thereof | |
| KR100759106B1 (en) | A method for bonding a mirror plate with an electrostatic actuator in a mems mirror | |
| Yu et al. | Yield improvement for anodic bonding with suspending structure | |
| KR100519818B1 (en) | A method for manufacturing the micro inertia sensor | |
| EP2873095B1 (en) | Semiconductor secured to substrate via hole in substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: MAOCHENG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHOU ZHENGSAN Effective date: 20141225 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20141225 Address after: Taipei City, Taiwan, China Patentee after: MAOCHENG TECHNOLOGY CO., LTD. Address before: Hsinchu City, Taiwan, China Patentee before: Zhou Zhengsan |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20171016 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |