CN105295753A - High-frequency adhesive glue laminated structure and preparation method thereof - Google Patents
High-frequency adhesive glue laminated structure and preparation method thereof Download PDFInfo
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- CN105295753A CN105295753A CN201410348306.6A CN201410348306A CN105295753A CN 105295753 A CN105295753 A CN 105295753A CN 201410348306 A CN201410348306 A CN 201410348306A CN 105295753 A CN105295753 A CN 105295753A
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Abstract
The invention discloses a high-frequency adhesive glue laminated structure. The high-frequency adhesive glue laminated structure comprises a first high-frequency glue layer, a second high-frequency glue layer and a third high-frequency glue layer, wherein each of the first, second and third high-frequency glue layers is made of a mixture of fluorine resin and thermosetting resin; the total thickness of the high-frequency adhesive glue laminated structure is 15-75 microns; in the first high-frequency glue layer, the fluorine resin accounts for 15-25% of the total solid, and the first high-frequency glue layer is 2-10 microns in thickness; in the second high-frequency glue layer, the fluorine resin accounts for 60-80% of the total solid, and the second high-frequency glue layer is 10-55 microns in thickness; in the third high-frequency glue layer, the fluorine resin accounts for 15-25% of the total solid, and the first high-frequency glue layer is 2-10 microns in thickness. The high-frequency adhesive glue laminated structure is very low in Dk and Df performance, and the Df value can reach up to 0.003, so that signal transmission loss can be greatly reduced to accordingly improve the signal transmission quality effectively, the possibility of message judgment error is reduced, and meanwhile, the high-frequency adhesive glue laminated structure is prepared according to a simple method.
Description
Technical field
The present invention relates to a kind of high frequency and stick together glue, glue is sticked together in particular to a kind of high frequency with low Dk and Df characteristic, can be used for the interlayer of signal circuit plate then, the loss of Signal transmissions can be reduced significantly, and then efficient raising signal transmission quality, the judgement reducing error messages occurs.
Background technology
The information communication demand of the high speeds such as the satellite communications such as early stage military affairs, the part support plate that high frequency characteristics is superior must be sought, especially the dielectric property of GHz band is very important, therefore the dielectric constant of product is low, when specific inductivity diminishes, transportation lag just shortens, namely transmission speed is accelerated, along with the open people's livelihood of bandwidth and the radio communication of business have the trend of past high frequency, comprise direct broadcast satellite system (DBS), Global Positioning System (GPS), anti-collision system for automobile (CA), wireless network card (WLANCard), the application demand such as cellular tower and digital microwave increases gradually, it can thus be appreciated that, high frequency communications substrate market will be extended to general people's livelihood purposes gradually.
Along with 3G wireless intelligence type mobile phone market is flourish in recent years, for meeting the frequency of more high workload, under high pixel camera camera lens and high-resolution screen demand, obtain and promote digit signal transmission speed between each treater further, be generally and pursue more high transmission speed, generally can take the time that reduction operating voltage rises with minimizing pulse, can reach even so and improve signal transmission speed, but also cause the significantly decay reducing operating voltage and cause anti-electromagnetic interference capability simultaneously, in addition the time reducing pulse rising causes (di/dt) in V=L (di/dt) relational expression significantly to improve, the Electromagnetic Interference in high GHz range of frequency is caused to produce probability, cause signal distortion when transmitting.
In order to tackle the demand, high frequency adhesion glue fishery products are also constantly developing thereupon.In the middle of the resin that low-k, low-dielectric loss baseplate material are used, it is tetrafluoroethylene (Polytetrafluoroethene that twentieth century is applied more in early days, or other fluorine-containing property resin PTFE), the baseplate material of this low polar resin, when measuring frequency 10GHz, Dk value (DielectricConstant, specific inductivity) is 2.1, Df value (DissipationFactor, dielectric loss factor) is 0.0004; Be used in u.s.a. military affairs equipment between 1975, in the core realm from then on centered by space flight, aviation, army's industry, obtain application all the year round.But the glass transition temp of fluorine resin is close to room temperature, make its dimensional stabilizing as general thermoplastic resin low, and not as the material of thermosetting resin in physical strength and heat conductivity etc., so must through many special pre-electroplating treatment in the making of printed circuit board, and its comparatively difficulty in forming process, mechanical workout.This makes fluorine resin base material cannot manufacture densification PCB (Printedcircuitboard, printed circuit board (PCB)) and high multiple stratification PCB product.
Summary of the invention
In order to solve the problem, the invention provides a kind of high frequency adhesion glue water layer stack structure, there is extremely low Dk, Df characteristic, the loss of Signal transmissions can be reduced significantly, and then efficient raising signal transmission quality, the judgement reducing error messages occurs, Practical Operation is better than traditional Teflon (Teflon) and LCP (LiquidCrystalPolymer, liquid crystal polymer) material, be specially adapted to the circuit board material of high-quality transmission demand, and this high frequency adhesion glue water layer stack structure is obtained by simple method.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of high frequency adhesion glue water layer stack structure, described high frequency adhesion glue water layer stack structure is made up of the first high frequency glue-line, the second high frequency glue-line and third high frequency glue-line, the material of described first high frequency glue-line, the second high frequency glue-line and third high frequency glue-line respectively comprises fluorine resin and thermosetting resin naturally, and the total thickness of described high frequency adhesion glue water layer stack structure is 15-75 micron;
Wherein, the ratio of the fluorine resin in described first high frequency glue-line is the 15-25% (weight percent) of total solids level, and the thickness of described first high frequency glue-line is 2-10 micron;
Wherein, the ratio of the fluorine resin in described second high frequency glue-line is the 60-80% (weight percent) of total solids level, and the thickness of described second high frequency glue-line is 10-55 micron;
Wherein, the ratio of the fluorine resin in described third high frequency glue-line is the 15-25% (weight percent) of total solids level, and the thickness of described third high frequency glue-line is 2-10 micron.
It is preferred that the thickness of described first high frequency glue-line and described third high glue-line is frequently identical and Df value is identical.
It is preferred that the thickness of described first high frequency glue-line is 5-8 micron, the thickness of described second high frequency glue-line is 15-50 micron, and the thickness of described third high frequency glue-line is 5-8 micron.
It is preferred that the total thickness of described high frequency adhesion glue water layer stack structure is 20-58 micron.
Further, the Df value of described high frequency adhesion glue water layer stack structure meets following relational expression: Df=Df
1× a/ (a+2b)+Df
2× 2b/ (a+2b),
Wherein, Df
1it is the Df value of the second high frequency glue-line;
Df
2it is first and third high frequency glue-line Df value separately;
A is the one-tenth-value thickness 1/10 of the second high frequency glue-line;
B is first and third high frequency glue-line one-tenth-value thickness 1/10 separately.
It is preferred that the Df value of described first and third high frequency glue-line is Df separately
2=0.006, the Df value of described second high frequency glue-line is Df
1=0.002, the Df value of described high frequency adhesion glue water layer stack structure is 0.003.It is preferred that the thickness of described first and third high frequency glue-line is b=5 micron separately, the thickness of described second high frequency glue-line is a=30 micron.
It is preferred that described thermosetting resin is selected from epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, gathers at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin.
It is preferred that described thermosetting resin is selected from phosphorus system resin.
The preparation method of above-mentioned high frequency adhesion glue water layer stack structure, carries out in the steps below:
Step one, be coated on release film by the first high frequency glue-line, after carrying out coating end baking oven, rolling is stand-by;
Step 2, by third high frequently glue-line be coated on other release film, carry out coating hold baking oven after rolling stand-by;
Step 3, the second high frequency glue-line is coated on the finished product of step 2, after carrying out baking oven baking, carries out pressing with the goods of step one and form last high frequency adhesion glue water layer stack structure finished product.
The invention has the beneficial effects as follows: high frequency adhesion glue water layer stack structure of the present invention is by the first high frequency glue-line, second high frequency glue-line and third high frequently glue-line are formed, described first high frequency glue-line, the material of the second high frequency glue-line and third high frequency glue-line is respectively mixed by fluorine resin and thermosetting resin naturally, by adjusting the thickness of the content of the fluorine resin of each floor height frequently in glue-line and each floor height glue-line frequently, this high frequency adhesion glue water layer stack structure is made to have extremely low Dk, Df characteristic, Df value can reach 0.003, the loss of Signal transmissions can be reduced significantly, and then efficient raising signal transmission quality, the judgement reducing error messages occurs, Practical Operation is better than traditional Teflon (Teflon) and LCP (LiquidCrystalPolymer, liquid crystal polymer) material, be specially adapted to the circuit board material of high-quality transmission demand, and this high frequency adhesion glue water layer stack structure is obtained by simple method.
Accompanying drawing explanation
Fig. 1 is high frequency adhesion glue water layer stack structure schematic diagram of the present invention.
Embodiment
Below by way of specific specific examples, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of high frequency adhesion glue water layer stack structure, described high frequency adhesion glue water layer stack structure is made up of the first high frequency glue-line 1, second high frequency glue-line 2 and third high frequency glue-line 3, and the material of described first high frequency glue-line, the second high frequency glue-line and third high frequency glue-line respectively comprises fluorine resin and thermosetting resin naturally;
Wherein, the ratio of the fluorine resin in described first high frequency glue-line is the 15-25% (weight percent) of total solids level, and the thickness of described first high frequency glue-line is 2-10 micron;
Wherein, the ratio of the fluorine resin in described second high frequency glue-line is the 60-80% (weight percent) of total solids level, and the thickness of described second high frequency glue-line is 10-55 micron;
Wherein, the ratio of the fluorine resin in described third high frequency glue-line is the 15-25% (weight percent) of total solids level, and the thickness of described third high frequency glue-line is 2-10 micron.
It is preferred that the thickness of described first high frequency glue-line and described third high glue-line is frequently identical and Df value is identical.
It is preferred that the thickness of described first high frequency glue-line is 5-8 micron, the thickness of described second high frequency glue-line is 15-50 micron, and the thickness of described third high frequency glue-line is 5-8 micron.
In order to make the flexible electric circuit board that this high frequency adhesion glue water layer stack structure sticks together, there is extremely low Dk and Df characteristic, high frequency adhesion glue water layer stack structure of the present invention can according to the needs of this flexible circuit copper clad laminate adjust high frequency adhesion glue water layer stack structure thickness and the amount of fluorine-containing property resin, reach that thickness is thin, bounce is good by this and the flexible electric circuit board that dielectric loss is little, the thickness of high frequency adhesion glue water layer stack structure of the present invention is 15 ~ 75 microns, preferably 20 ~ 58 microns.Thermosetting resin is wherein selected from epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, gathers at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin or phosphorus system resin.
And further, the Df value of described high frequency adhesion glue water layer stack structure meets following relational expression: Df=Df
1× a/ (a+2b)+Df
2× 2b/ (a+2b),
Wherein, Df
1it is the Df value of the second high frequency glue-line;
Df
2it is first and third high frequency glue-line Df value separately;
A is the one-tenth-value thickness 1/10 of the second high frequency glue-line;
B is first and third high frequency glue-line one-tenth-value thickness 1/10 separately.
Such as, when the Df value of described first and third high frequency glue-line is Df separately
2=0.006, the Df value of described second high frequency glue-line is Df
1=0.002, the thickness of described first and third high frequency glue-line is b=5 micron separately, and when the thickness of described second high frequency glue-line is a=30 micron, the Df value of described high frequency adhesion glue water layer stack structure can reach 0.003.
The present invention be stressed that described high frequency adhesion glue water layer stack structure meet in follow-up product product high-speed and high-efficiency transmission requirement, with reach reduce erroneous signals judge generation.
The preparation method of above-mentioned high frequency adhesion glue water layer stack structure, carries out in the steps below:
Step one, be coated on release film by the first high frequency glue-line, after carrying out coating end baking oven, rolling is stand-by;
Step 2, by third high frequently glue-line be coated on other release film, carry out coating hold baking oven after rolling stand-by;
Step 3, the second high frequency glue-line is coated on the finished product of step 2, after carrying out baking oven baking, carries out pressing with the goods of step one and form last high frequency adhesion glue water layer stack structure finished product.
The high frequency adhesion glue water layer stack structure of this example is compared to Teflon system and LCP system, when being applied to Double-sided copper clad laminate, the Double-sided copper clad laminate that institute's pressing obtains has following characteristic: can in the operational condition operation compared with low temperature, be beneficial to downstream client operation, there is splendid dimensional stability, there is splendid resistance to chemical reagents and thermotolerance, there is splendid high thermal resistance and bonding force, the splendid opering characteristic of electric apparatus, the high frequency adhesion glue water layer Df value that the design produces can reach 0.003, in conjunction with excellent product performance, splendid operability, be in domestic and international leading ranks, it is a product having competitive power.
Claims (10)
1. a high frequency adhesion glue water layer stack structure, it is characterized in that: described high frequency adhesion glue water layer stack structure is made up of the first high frequency glue-line, the second high frequency glue-line and third high frequency glue-line, the material of described first high frequency glue-line, the second high frequency glue-line and third high frequency glue-line respectively comprises fluorine resin and thermosetting resin naturally, and the total thickness of described high frequency adhesion glue water layer stack structure is 15-75 micron;
Wherein, the ratio of the fluorine resin in described first high frequency glue-line is the 15-25% (weight percent) of total solids level, and the thickness of described first high frequency glue-line is 2-10 micron;
Wherein, the ratio of the fluorine resin in described second high frequency glue-line is the 60-80% (weight percent) of total solids level, and the thickness of described second high frequency glue-line is 10-55 micron;
Wherein, the ratio of the fluorine resin in described third high frequency glue-line is the 15-25% (weight percent) of total solids level, and the thickness of described third high frequency glue-line is 2-10 micron.
2. high frequency adhesion glue water layer stack structure as claimed in claim 1, is characterized in that: the thickness of described first high frequency glue-line and described third high frequency glue-line is identical and Df value is identical.
3. high frequency adhesion glue water layer stack structure as claimed in claim 1, it is characterized in that: the thickness of described first high frequency glue-line is 5-8 micron, the thickness of described second high frequency glue-line is 15-50 micron, and the thickness of described third high frequency glue-line is 5-8 micron.
4. high frequency adhesion glue water layer stack structure as claimed in claim 1, is characterized in that: the total thickness of described high frequency adhesion glue water layer stack structure is 20-58 micron.
5. high frequency adhesion glue water layer stack structure as claimed in claim 2, is characterized in that: the Df value of described high frequency adhesion glue water layer stack structure meets following relational expression: Df=Df
1× a/ (a+2b)+Df
2× 2b/ (a+2b),
Wherein, Df
1it is the Df value of the second high frequency glue-line;
Df
2it is first and third high frequency glue-line Df value separately;
A is the one-tenth-value thickness 1/10 of the second high frequency glue-line;
B is first and third high frequency glue-line one-tenth-value thickness 1/10 separately.
6. high frequency adhesion glue water layer stack structure as claimed in claim 5, is characterized in that: the Df value of described first and third high frequency glue-line is Df separately
2=0.006, the Df value of described second high frequency glue-line is Df
1=0.002, the Df value of described high frequency adhesion glue water layer stack structure is 0.003.
7. high frequency adhesion glue water layer stack structure as claimed in claim 6, is characterized in that: the thickness of described first and third high frequency glue-line is b=5 micron separately, and the thickness of described second high frequency glue-line is a=30 micron.
8. high frequency adhesion glue water layer stack structure as claimed in claim 1, is characterized in that: described thermosetting resin is selected from epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, gathers at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin.
9. high frequency adhesion glue water layer stack structure as claimed in claim 1, is characterized in that: described thermosetting resin is selected from phosphorus system resin.
10. a preparation method for high frequency adhesion glue water layer stack structure as claimed in any one of claims 1-9 wherein, is characterized in that: carry out in the steps below:
Step one, be coated on release film by the first high frequency glue-line, after carrying out coating end baking oven, rolling is stand-by;
Step 2, by third high frequently glue-line be coated on other release film, carry out coating hold baking oven after rolling stand-by;
Step 3, the second high frequency glue-line is coated on the finished product of step 2, after carrying out baking oven baking, carries out pressing with the goods of step one and form last high frequency adhesion glue water layer stack structure finished product.
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| CN201410348306.6A CN105295753B (en) | 2014-07-22 | 2014-07-22 | High frequency sticks together glue layer stack structure and preparation method thereof |
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| CN201410348306.6A CN105295753B (en) | 2014-07-22 | 2014-07-22 | High frequency sticks together glue layer stack structure and preparation method thereof |
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| CN105295753B CN105295753B (en) | 2017-12-19 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106221619A (en) * | 2016-07-29 | 2016-12-14 | 无锡市华泰医药包装有限公司 | Medicinal Composite Double aluminum packaging film |
| CN108504294A (en) * | 2017-02-24 | 2018-09-07 | 昆山雅森电子材料科技有限公司 | A kind of coloured ultra-thin cover film of high frequency and preparation method |
| CN110467890A (en) * | 2019-07-16 | 2019-11-19 | 广州慧谷工程材料有限公司 | Pressure sensitive adhesive tape and preparation method thereof, the resin combination for being used to prepare pressure sensitive adhesive tape |
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| WO2012176789A1 (en) * | 2011-06-20 | 2012-12-27 | 日東電工株式会社 | Capacitive touch panel |
| CN103096612A (en) * | 2011-11-01 | 2013-05-08 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure |
| CN103635015A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012176789A1 (en) * | 2011-06-20 | 2012-12-27 | 日東電工株式会社 | Capacitive touch panel |
| CN103096612A (en) * | 2011-11-01 | 2013-05-08 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure |
| CN103635015A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106221619A (en) * | 2016-07-29 | 2016-12-14 | 无锡市华泰医药包装有限公司 | Medicinal Composite Double aluminum packaging film |
| CN108504294A (en) * | 2017-02-24 | 2018-09-07 | 昆山雅森电子材料科技有限公司 | A kind of coloured ultra-thin cover film of high frequency and preparation method |
| CN110467890A (en) * | 2019-07-16 | 2019-11-19 | 广州慧谷工程材料有限公司 | Pressure sensitive adhesive tape and preparation method thereof, the resin combination for being used to prepare pressure sensitive adhesive tape |
| CN110467890B (en) * | 2019-07-16 | 2021-09-17 | 广州慧谷工程材料有限公司 | Pressure-sensitive adhesive tape, method for producing same, and resin composition for producing pressure-sensitive adhesive tape |
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