CN105190893B - 发光结构和底座 - Google Patents

发光结构和底座 Download PDF

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Publication number
CN105190893B
CN105190893B CN201480016065.3A CN201480016065A CN105190893B CN 105190893 B CN105190893 B CN 105190893B CN 201480016065 A CN201480016065 A CN 201480016065A CN 105190893 B CN105190893 B CN 105190893B
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China
Prior art keywords
leds
base
light emitting
contact
led
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CN201480016065.3A
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English (en)
Chinese (zh)
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CN105190893A (zh
Inventor
K-H.H.曹
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Lumileds Holding BV
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Lumileds Holding BV
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Publication of CN105190893A publication Critical patent/CN105190893A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

Landscapes

  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
CN201480016065.3A 2013-03-15 2014-03-05 发光结构和底座 Active CN105190893B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361798858P 2013-03-15 2013-03-15
US61/798858 2013-03-15
PCT/IB2014/059466 WO2014141009A1 (en) 2013-03-15 2014-03-05 Light emitting structure and mount

Publications (2)

Publication Number Publication Date
CN105190893A CN105190893A (zh) 2015-12-23
CN105190893B true CN105190893B (zh) 2018-11-13

Family

ID=50390146

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480016065.3A Active CN105190893B (zh) 2013-03-15 2014-03-05 发光结构和底座

Country Status (7)

Country Link
US (2) US9478712B2 (cg-RX-API-DMAC7.html)
EP (1) EP2973714B1 (cg-RX-API-DMAC7.html)
JP (2) JP6649773B2 (cg-RX-API-DMAC7.html)
KR (1) KR101991960B1 (cg-RX-API-DMAC7.html)
CN (1) CN105190893B (cg-RX-API-DMAC7.html)
TW (1) TWI627739B (cg-RX-API-DMAC7.html)
WO (1) WO2014141009A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10490719B2 (en) * 2015-11-20 2019-11-26 Lumileds Holding B.V. Die bond pad design to enable different electrical configurations
JP6927970B2 (ja) * 2015-11-20 2021-09-01 ルミレッズ ホールディング ベーフェー 異なる電気的構成を可能にするダイボンドパッド設計
EP4160679B1 (en) 2020-04-28 2024-01-31 Nichia Corporation Light-emitting device
JP7114854B2 (ja) * 2020-04-28 2022-08-09 日亜化学工業株式会社 発光装置
CN111987200B (zh) * 2020-08-20 2022-07-01 厦门三安光电有限公司 发光二极管模组、背光模组和显示模组
CN120660465A (zh) * 2022-12-16 2025-09-16 亮锐有限责任公司 用于密集封装的阵列的管芯金属化

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080170396A1 (en) * 2006-11-09 2008-07-17 Cree, Inc. LED array and method for fabricating same
CN101846249A (zh) * 2005-06-28 2010-09-29 首尔Opto仪器股份有限公司 用于交流电力操作的发光装置
EP2442362A1 (en) * 2010-10-13 2012-04-18 Intematix Technology Center Corp. Light emitting device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP4438492B2 (ja) * 2003-09-11 2010-03-24 日亜化学工業株式会社 半導体装置およびその製造方法
EP1864339A4 (en) 2005-03-11 2010-12-29 Seoul Semiconductor Co Ltd LED CAPSULATION WITH A GROUP IN A SERIES OF SWITCHED LUMINAIRES
US8901575B2 (en) * 2005-08-09 2014-12-02 Seoul Viosys Co., Ltd. AC light emitting diode and method for fabricating the same
JP4856463B2 (ja) * 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
WO2008031280A1 (fr) * 2006-09-13 2008-03-20 Helio Optoelectronics Corporation Structure de diode électroluminescente
TWI419360B (zh) * 2008-08-11 2013-12-11 璨圓光電股份有限公司 Solid crystal light-emitting device having an insulating layer and a method for manufacturing the same
US8648359B2 (en) * 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
US9053958B2 (en) * 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
WO2013035024A1 (en) * 2011-09-06 2013-03-14 Koninklijke Philips Electronics N.V. Topology of distributing and connecting leds in a large area matrix
US8760068B1 (en) * 2011-09-07 2014-06-24 Iml International Driving LEDs in LCD backlight
JP2013118292A (ja) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US9039746B2 (en) * 2013-02-08 2015-05-26 Cree, Inc. Solid state light emitting devices including adjustable melatonin suppression effects

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101846249A (zh) * 2005-06-28 2010-09-29 首尔Opto仪器股份有限公司 用于交流电力操作的发光装置
US20080170396A1 (en) * 2006-11-09 2008-07-17 Cree, Inc. LED array and method for fabricating same
EP2442362A1 (en) * 2010-10-13 2012-04-18 Intematix Technology Center Corp. Light emitting device

Also Published As

Publication number Publication date
JP2016510180A (ja) 2016-04-04
JP6649773B2 (ja) 2020-02-19
US20170025470A1 (en) 2017-01-26
WO2014141009A1 (en) 2014-09-18
US10134805B2 (en) 2018-11-20
TW201503339A (zh) 2015-01-16
JP2020057821A (ja) 2020-04-09
KR20150132410A (ko) 2015-11-25
EP2973714B1 (en) 2019-05-08
US9478712B2 (en) 2016-10-25
EP2973714A1 (en) 2016-01-20
CN105190893A (zh) 2015-12-23
JP6928128B2 (ja) 2021-09-01
US20150380610A1 (en) 2015-12-31
TWI627739B (zh) 2018-06-21
KR101991960B1 (ko) 2019-06-25

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Applicant before: Koninkl Philips Electronics NV

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