CN105188273A - Bulk LED high-speed chip mounter - Google Patents
Bulk LED high-speed chip mounter Download PDFInfo
- Publication number
- CN105188273A CN105188273A CN201510452585.5A CN201510452585A CN105188273A CN 105188273 A CN105188273 A CN 105188273A CN 201510452585 A CN201510452585 A CN 201510452585A CN 105188273 A CN105188273 A CN 105188273A
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- China
- Prior art keywords
- nozzle
- led lamp
- bulk
- axis
- led
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a bulk LED high-speed chip mounter, which comprises a conveying belt, a board conveying mechanical arm, vibrating disks, Y-axis modules,X-axis modules and mounter heads, wherein the conveying belt and the board conveying mechanical arm are used for conveying PCB, and positioning the PCB; bulk LED lamp beads are placed on the vibrating disks, the vibrating disks are in butt joint with a linear vibrator, and the vibrating disks and the linear vibrator are matched with each other for carrying out forward-reverse and horizontal-vertical screening on positions of the LED lamp beads, fill-up material and positive-negative polarity identification and signal feedback; the Y-axis modules adjust Y axial distance between the mounter heads to match positions of the LED lamp beads on the PCB; the X-axis modules adjust X axial positions of the mounter heads; and the mounter heads are provided with suction nozzles, and are provided with detectors for detecting whether the suction nozzles suction the LED lamp beads. The bulk LED high-speed chip mounter has the advantages that: 1, braid LEDs are not adopted; 2, the bulk material feeding disk is convenient in material loading and stable in operation; 3, waste materials cannot be produced; 4, 16 suction nozzles are used for suctioning simultaneously, 4 mounter heads are used for mounting simultaneously, and the efficiency is high; 5, and thrown materials are mounted repeatedly, thus LED material consumption cannot be caused.
Description
Technical field
The invention belongs to and relate to LED paster production field, relate to a kind of LED high speed placement system in bulk.
Technical field
LED chip mounter is that a kind of LED lamp bead being carried from charging tray or material strip sucks up, and be attached to the automation equipment of printing on the circuit board of tin cream according to the position set and angle, wherein the circuit board of print solder paste can send plate online automatically.Conventional patch machine gets LED lamp bead in braid, LED lamp bead is wanted to be attached in braid by machine in advance, uses package braid LED lamp bead, by a feed mechanism (also known as " flying to reach "), picked up by placement head, be placed into position correct on circuit board according to the position of programming and angle.Traditional LED chip mounter LED lamp bead needs the braider braid packaging process of specialty, and encapsulation uses adhesive tape and the attached material of lacquer disk(-sc); . need auxiliary material feeder mechanism (flying to reach) feeding; Consume plastic cement braid and lacquer disk(-sc), produce rubbish, increase loss.
Summary of the invention
The present invention is in order to overcome the defect of prior art, and proposition can bulk cargo, the one that efficiency is high LED high speed placement system in bulk.
Adopt following technical scheme: a kind of LED high speed placement system in bulk for this reason, comprise conveyer belt, send plate manipulator, vibrating disk, Y-axis module, X-axis module, placement head, the plane transmitting zone face is y-axis with direct of travel, vertically travels direction for x-axis, described conveyer belt, send plate manipulator to carry pcb board, and pcb board to be located; Described vibrating disk places LED lamp bead in bulk, and vibrating disk docking is directly shaken device, and vibrating disk and the device that directly shakes coordinate and carry out anyway, anyhow screening to the position of LED lamp bead, full material and polarity identification anyway, feedback signal; Y-axis spacing between described Y-axis module adjustment placement head is to mate LED lamp bead position on pcb board; X-axis module regulates the X axis position of placement head to mate LED lamp bead position on pcb board; Described placement head is provided with nozzle, and the selection of nozzle is realized by Xuan Zui mechanism, and Xuan Zui mechanism is provided with rotation positioning motor, and each nozzle rotates according to specified angle, and placement head is provided with and detects the detector whether nozzle is drawn onto LED lamp bead.
Described vibrating disk has four, and Y-axis module has three, and X-axis module has two.Placement head has four.Nozzle on each placement head has four, and by controlled positioning motor, Xuan Zui mechanism rotates that six positions realize that four nozzles are selected entirely respectively, Quan Buxuan, six kinds of states selecting the first nozzle, select the second nozzle, select the 3rd nozzle, select the 4th nozzle.
Described conveyer belt is provided with hold-down mechanism.Hold-down mechanism is pinch roller.
The described plate manipulator that send drives by motor the foundation location forming Y-axis, and is provided with pneumatic clamping gear grips pcb board.Pinch roller and pneumatic clamping mechanism coordinate location clamping pcb board, realize alternately sending plate to locate, realize the attachment operation of long circuit board.
Beneficial effect of the present invention: 1, do not use braid LED; 2, the charging of bulk cargo supply disk is convenient, stable; 3, do not produce waste material, inhale together for 4,16,4 are pasted work together, and efficiency is high; 5, material casting repeats attachment, without LED material loss.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is schematic top plan view of the present invention;
Fig. 3 is conveyer mechanism schematic diagram of the present invention;
Fig. 4 of the present inventionly send plate manipulator mechanism schematic diagram;
Fig. 5 is vibrating disk of the present invention, directly shakes device schematic diagram;
Fig. 6 is Y-axis module schematic diagram of the present invention;
Fig. 7 is X-axis module schematic diagram of the present invention;
Fig. 8 is placement head structural representation of the present invention.
Embodiment
A kind of LED high speed placement system in bulk, comprise conveyer belt 1, send plate manipulator 2, vibrating disk, Y-axis module, X-axis module, placement head, the plane that conveyer belt is 1 is y-axis with direct of travel, vertically travels direction for x-axis, described conveyer belt 1, send plate manipulator 2 to carry pcb board 16, and pcb board 16 is located; Described vibrating disk places LED lamp bead in bulk, and vibrating disk docking is directly shaken device, and vibrating disk and the device that directly shakes coordinate and carry out anyway, anyhow screening to the position of LED lamp bead, full material and polarity identification anyway, feedback signal; Y-axis spacing between described Y-axis module adjustment placement head is to mate LED lamp bead position on pcb board; X-axis module regulates the X axis position of placement head to mate LED lamp bead position on pcb board; Described placement head is provided with nozzle, and the selection of nozzle is realized by Xuan Zui mechanism, and Xuan Zui mechanism is provided with rotation positioning motor, and each nozzle rotates according to specified angle, and placement head is provided with and detects the detector whether nozzle is drawn onto LED lamp bead.Vibrating disk has four, and be respectively vibrating disk 3,4,5,6, Y-axis module has three, and be respectively Y-axis module 7,8,9, X-axis module has two, is respectively X-axis module 10,11.Placement head has four, respectively placement head 12,13,14,15.Nozzle on each placement head has four, and by controlled positioning motor, Xuan Zui mechanism rotates that six positions realize that four nozzles are selected entirely respectively, Quan Buxuan, six kinds of states selecting the first nozzle, select the second nozzle, select the 3rd nozzle, select the 4th nozzle.Conveyer belt 1 is provided with hold-down mechanism.Hold-down mechanism is pinch roller.Send plate manipulator 2 to drive by motor the foundation location forming Y-axis, and pneumatic clamping gear grips pcb board 16 is installed.When circuit board is long, pinch roller and pneumatic clamping mechanism coordinate location clamping pcb board 16, realize alternately sending plate to locate, realize the attachment operation of long circuit board.
As shown in the figure: conveyer belt 1 is with the material loading sending plate manipulator 2 to form pcb board and send Slab element, is arranged on base plate, ensures the stable feeding of pcb board, locate and move; By four vibrating disks and directly shake on combination 3,4,5,6 fixed base plate, realize anyway, anyhow screening the position of LED lamp bead, full material and polarity identification anyway, feedback signal; The Y-axis unit be made up of Y-axis module 7,8,9, according to desired location, ensures that on the Y-direction pitch match pcb board between four placement heads, LED lamp bead position is accurate; By X-axis module 10,11 unit, the X being responsible for two placement heads is respectively accurate to position; Placement head 12,13,14,15 realizes the automatic selection of four nozzles, synchronously draws LED lamp bead, and rotate according to specified angle, whether nozzle is drawn onto the detection of LED lamp bead, is finally correctly placed on pcb board 16.Each mechanism's collaborative work, realizes following motion flow.
Concrete motion flow is: four vibrating disks and directly shake combination 3,4,5,6 all the time end wait to expect; Pcb board send plate to put in place through conveyer belt 1, and manipulator 2 captures, and moves to tram, suspends, treats paster; Placement head 12,13,14,15 is by the end of data mobile to each vibrating disk and combination 3,4,5,6 of directly shaking, and four placement heads amount to 16 nozzles and draw 16 LED lamp bead simultaneously; Coordinated with X-axis module 10,11 by Y-axis module 7,8,9, the intrinsic coordinates provided via system, move to the position of respective correct placement LED lamp bead; The LED polarity signal that placement head 12,13,14,15 provides via system, judges whether to rotate and corrects polarity; Then placement head moves down, every subsynchronous subsides 4 LED lamp bead; 16 LED lamp bead are pasted for 4 times, repeat the paster that above do action completes setting regions, long pcb board 16 is pushed down by hold-down mechanism, plate manipulator 2 clamping plate mechanism is sent to unclamp and return, pneumatic clamping mechanism clamps circuit board again, start next Chip Area paster, whole paster is complete, and circuit board is sent automatically.
Claims (8)
1. a LED high speed placement system in bulk, it is characterized in that: comprise conveyer belt (1), send plate manipulator (2), vibrating disk, Y-axis module, X-axis module, placement head, the plane in conveyer belt (1) face is y-axis with direct of travel, vertically travels direction for x-axis, described conveyer belt (1), send plate manipulator (2) to carry pcb board (16), and pcb board (16) to be located; Described vibrating disk places LED lamp bead in bulk, and vibrating disk docking is directly shaken device, and vibrating disk and the device that directly shakes coordinate and carry out anyway, anyhow screening to the position of LED lamp bead, full material and polarity identification anyway, feedback signal; Y-axis spacing between described Y-axis module adjustment placement head is to mate LED lamp bead position on pcb board; X-axis module regulates the X axis position of placement head to mate LED lamp bead position on pcb board; Described placement head is provided with nozzle, and the selection of nozzle is realized by Xuan Zui mechanism, and Xuan Zui mechanism is provided with rotation positioning motor, and each nozzle rotates according to specified angle, and placement head is provided with and detects the detector whether nozzle is drawn onto LED lamp bead.
2. LED high speed placement system in bulk according to claim 1, is characterized in that: described vibrating disk has four, is respectively vibrating disk (3,4,5,6), Y-axis module has three, be respectively Y-axis module (7,8,9), X-axis module has two, is respectively X-axis module (10,11).
3. LED high speed placement system in bulk according to claim 1, is characterized in that: described placement head has four, respectively placement head (12,13,14,15).
4. LED high speed placement system in bulk according to claim 3, it is characterized in that: the nozzle on each placement head has four, by controlled positioning motor, Xuan Zui mechanism rotate that six positions realize that four nozzles are selected entirely respectively, Quan Buxuan, six kinds of states selecting the first nozzle, select the second nozzle, select the 3rd nozzle, select the 4th nozzle.
5. LED high speed placement system in bulk according to claim 1, is characterized in that: conveyer belt (1) is provided with hold-down mechanism.
6. LED high speed placement system in bulk according to claim 5, is characterized in that: hold-down mechanism is pinch roller.
7. LED high speed placement system in bulk according to claim 1, is characterized in that: send plate manipulator (2) to drive by motor the foundation location forming Y-axis, and be provided with pneumatic clamping gear grips pcb board (16).
8. LED high speed placement system in bulk according to claim 7, is characterized in that: be also provided with pinch roller, and pinch roller and pneumatic clamping mechanism coordinate location clamping pcb board (16), realizes alternately sending plate to locate, realizes the attachment operation of long circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510452585.5A CN105188273A (en) | 2015-07-29 | 2015-07-29 | Bulk LED high-speed chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510452585.5A CN105188273A (en) | 2015-07-29 | 2015-07-29 | Bulk LED high-speed chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105188273A true CN105188273A (en) | 2015-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510452585.5A Pending CN105188273A (en) | 2015-07-29 | 2015-07-29 | Bulk LED high-speed chip mounter |
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| CN (1) | CN105188273A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105730983A (en) * | 2016-04-28 | 2016-07-06 | 陈浩涛 | Full-automatic board sending mechanism for LED plug-in board |
| CN106287295A (en) * | 2016-08-27 | 2017-01-04 | 赵红春 | The manufacture method of a kind of copper wire lamp and copper wire lamp |
| CN107278046A (en) * | 2017-08-21 | 2017-10-20 | 深圳市海能达通信有限公司 | A kind of high speed placement system and the method that Tray disk materials are mounted using it |
| CN107466169A (en) * | 2016-06-03 | 2017-12-12 | 西华大学 | A kind of LED chip mounter feed device |
| CN107889372A (en) * | 2017-11-28 | 2018-04-06 | 深圳市森阳智能制造装备有限公司 | Chip mounter slab feeding mechanism and chip mounter |
| CN108538753A (en) * | 2018-03-06 | 2018-09-14 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
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| US20040244915A1 (en) * | 2003-06-03 | 2004-12-09 | Asm Automation Assembly Ltd | Semiconductor apparatus with multiple delivery devices for components |
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| CN102595803A (en) * | 2012-03-08 | 2012-07-18 | 中国科学院合肥物质科学研究院 | Multi-head array-type high-speed parallel chip mounter for LED (light-emitting diode) |
| CN202535650U (en) * | 2012-02-22 | 2012-11-14 | 钟啸风 | Reversing device for surface mounted elements |
| CN202587619U (en) * | 2012-05-25 | 2012-12-05 | 杭州中为光电技术股份有限公司 | LED mounting processing device adopting vibrating feeding mode |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105730983A (en) * | 2016-04-28 | 2016-07-06 | 陈浩涛 | Full-automatic board sending mechanism for LED plug-in board |
| CN107466169A (en) * | 2016-06-03 | 2017-12-12 | 西华大学 | A kind of LED chip mounter feed device |
| CN107466169B (en) * | 2016-06-03 | 2024-03-08 | 深圳万知达科技有限公司 | LED chip mounter material feeding unit |
| CN106287295A (en) * | 2016-08-27 | 2017-01-04 | 赵红春 | The manufacture method of a kind of copper wire lamp and copper wire lamp |
| CN106287295B (en) * | 2016-08-27 | 2019-09-13 | 江西瑞儿威科技有限公司 | A kind of manufacturing method and copper wire lamp of copper wire lamp |
| CN107278046A (en) * | 2017-08-21 | 2017-10-20 | 深圳市海能达通信有限公司 | A kind of high speed placement system and the method that Tray disk materials are mounted using it |
| CN107889372A (en) * | 2017-11-28 | 2018-04-06 | 深圳市森阳智能制造装备有限公司 | Chip mounter slab feeding mechanism and chip mounter |
| CN107889372B (en) * | 2017-11-28 | 2023-11-17 | 深圳市森阳智能制造装备有限公司 | Board feeding mechanism of chip mounter and chip mounter |
| CN108538753A (en) * | 2018-03-06 | 2018-09-14 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
| CN108538753B (en) * | 2018-03-06 | 2019-07-23 | 绍兴舜宇照明工程有限公司 | A kind of LED chip mounter |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151223 |