CN107466169B - LED chip mounter material feeding unit - Google Patents
LED chip mounter material feeding unit Download PDFInfo
- Publication number
- CN107466169B CN107466169B CN201610385519.5A CN201610385519A CN107466169B CN 107466169 B CN107466169 B CN 107466169B CN 201610385519 A CN201610385519 A CN 201610385519A CN 107466169 B CN107466169 B CN 107466169B
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- China
- Prior art keywords
- led lamp
- belt
- lamp beads
- track
- conveying
- Prior art date
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- 239000000463 material Substances 0.000 title claims abstract description 67
- 239000011324 bead Substances 0.000 claims abstract description 87
- 239000002699 waste material Substances 0.000 claims abstract description 48
- 238000003860 storage Methods 0.000 claims abstract description 33
- 238000003466 welding Methods 0.000 claims abstract description 9
- 230000005484 gravity Effects 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 230000001960 triggered effect Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a feeding device of an LED chip mounter carrying a tray, which is fixed on a bracket capable of moving X, Y, Z, and comprises: the device comprises a tray storage and material belt conveying device, an upper waste belt storage device, a lower waste belt (protective film) storage device, an LED lamp bead reverse conveying device and a photoelectric detector. When the driver provides a trigger pulse, the tray storage and material belt conveying device starts to convey the material belt to advance one lattice, and meanwhile, the upper waste belt storage device and the lower waste belt storage device are driven to pull the upper waste belt and the lower waste belt to move by the same length, LED lamp beads peeled from the material belt fall into the LED lamp bead reverse conveying device under the action of gravity, and slide to corresponding welding positions on the PCB board through the conveying device. According to the invention, the suction nozzle is not required to continuously take and feed materials between the material tray and the PCB, so that the feeding time and the electricity consumption are saved, and the surface mounting speed is improved.
Description
Technical Field
The invention relates to the technical field of LED chip mounters, in particular to a feeding device for an LED chip mounter.
Background
The LED chip mounter is a main device in an SMT production line, is also called an LED surface mounting system or an LED chip mounter, utilizes a control system to drive a mounting head to move, and sucks an original from a feeding part through a suction nozzle to accurately place surface mounting components on a PCB bonding pad so as to finish mounting. The feeding device of the traditional large-sized LED chip mounter mainly accurately and continuously feeds the mounted components to the material taking position of the LED chip mounter, and then the suction nozzle is used for taking materials and feeding, but the traditional feeding device has the following defects: 1) The material taking position and the material feeding position are far apart, and each time the material taking and material feeding suction nozzle needs to move a certain distance, the efficiency is low; 2) When the material belt conveys the mounted components, the feeding port depends on mechanical positioning, the required precision is higher, and the prior art is difficult to realize; 3) The structure is complex, and the economical efficiency is not high.
The mounting efficiency of the LED chip mounter is very important for the production of the LED chip mounter, the traditional LED chip mounter is provided with a suction nozzle, and the suction nozzle needs to be moved for a certain distance when the material taking operation and the material feeding operation are carried out each time, so that the mounting efficiency is low, and further improvement is needed.
Disclosure of Invention
The invention aims to overcome the defect of low material taking and feeding efficiency of the traditional LED chip mounter, and provides a more efficient and concise LED chip mounter feeding device. The technical problem to be solved is that the LED lamp beads are directly sent to corresponding welding positions on the PCB without taking materials from a material tray and feeding materials to the PCB by means of a suction nozzle, and the mounting of components is completed. Because the suction nozzle is not needed, the feeding device is simpler, and the mounting efficiency is improved.
The invention aims at solving the technical problems and adopts the following technical scheme that the feeding device of the LED chip mounter provided by the invention comprises a tray storage and material belt conveying device, an upper waste belt storage device, a lower waste belt storage device, an LED lamp bead reverse conveying device and a photoelectric detector. The material tray storage and material belt conveying device comprises a material tray storage device, a material belt conveying rail and a driver, wherein an upper waste belt storage device is arranged right of the material tray storage and material belt conveying rail, a lower waste belt (protective film) storage device is arranged right below the material tray storage and material belt conveying rail, and the lower waste belt (protective film) storage device is respectively used for storing an upper waste belt and a lower waste belt. The material belt is placed in an inverted mode in the material belt conveying track, when the driver provides a trigger pulse, the material disc storage and material belt conveying device receives a signal to start conveying the material belt to advance by one grid, meanwhile, the upper waste belt storage device and the lower waste belt storage device are driven to drive the upper waste belt and the lower waste belt to move by the same distance, the LED lamp bead reverse conveying device is placed right below the separation position of the upper waste belt and the lower waste belt, and the lower waste belt (protective film) on the material belt is uncovered by one grid, so that the LED lamp beads in the one grid lose protection and fall into the LED lamp bead reverse conveying track. The distance between the LED back conveying track and the separation position of the upper waste material belt and the lower waste material belt is short, the LED lamp beads cannot turn over after falling into the track, the welding tin surface of the lamp beads faces upwards, and the luminous surface faces downwards.
The technical problem of the invention is solved by adopting the following technical scheme, and the feeding device of the LED chip mounter provided by the invention comprises the conveying device for the back surface of the LED lamp bead and the photoelectric detector. The LED lamp bead back conveying device comprises an LED lamp bead back conveying rail and an ultrasonic oscillator, the front face of the LED lamp bead back conveying rail is semicircular, the ultrasonic oscillator and two photoelectric detectors are arranged on the right side of the LED lamp bead back conveying rail, an extensible small needle is arranged in the middle of the rail, and an opening slightly larger than the LED lamp bead is arranged above and below the rail respectively, so that the LED lamp bead can fall into and slide out of the rail. When the photoelectric detector detects that the LED lamp beads fall into the opening above the conveying track on the back surface of the LED lamp beads from the material belt, the ultrasonic oscillator starts to oscillate, so that the LED lamp beads can slide in the smooth semicircular track until the LED lamp beads slide out of the opening below the semicircular track and accurately fall on the corresponding welding position on the PCB; when the second photoelectric detector detects that the LED lamp beads slide out from the opening below the track, the ultrasonic oscillator is turned off, the whole LED back conveying track translates rightwards for a proper distance, so that the small needle is just aligned with the LED lamp beads just sliding onto the PCB, the lamp beads are pressed downwards, the whole track translates leftwards again to return to the original position, and the next LED lamp bead is continuously conveyed.
The technical problem is solved by adopting the following technical scheme, and the LED lamp bead back conveying track provided by the invention has a rectangular cross section and is only slightly larger in length and width than the LED lamp bead, so that the LED lamp bead does not turn over or fall down when moving in the back conveying track, but smoothly moves along the track. When the lamp beads just fall into the track, the soldering tin faces upwards, the luminous surface faces downwards, and when the lamp beads slide out of the track, as the movement track of the LED lamp beads in the track is semicircular, the lamp beads just face downwards, the luminous surface faces upwards, and then fall to the corresponding welding position on the PCB, so that the mounting requirement is met.
According to the technical scheme, the feeding device of the LED chip mounter has at least the following advantages: compared with the traditional LED chip mounter which relies on manual collection of an upper waste belt and a lower waste belt, the device can automatically convey and collect the material belt, the upper waste belt and the lower waste belt, and the functions are more perfect. Due to the fact that the LED lamp bead reverse side conveying device is arranged, the LED lamp beads can automatically fall to the corresponding welding positions on the PCB after falling into the conveying track through semi-circular movement, compared with the feeding device of a traditional LED chip mounter, the feeding device does not need to be installed with one LED lamp bead every time, the suction nozzle needs to move a distance to the operation of taking materials on the material belt and feeding materials on the PCB, feeding time and manufacturing cost are saved, and mounting efficiency is higher. The semicircular track design has the advantages that the soldering tin surface and the luminous surface are mutually exchanged in the moving process of the LED lamp beads in the track, and the mounting requirement of the lamp beads is met. In addition, in order to prevent the LED lamp beads from falling into the conveying track on the back surface of the LED lamp beads and then standing still, an ultrasonic oscillator is specially arranged to enable the LED lamp beads to move in the smooth track, so that the mounting of components is completed.
Drawings
Fig. 1 is a schematic plan view of a feeding device of an LED chip mounter according to an embodiment of the present invention.
Fig. 2 is a schematic structural view of a conveying track on the back of an LED lamp bead according to the present invention.
Fig. 3 is a schematic diagram illustrating an installation position of a feeding device of an LED chip mounter according to an embodiment of the present invention.
In the figure: 1. a tray reservoir; 2. feeding a waste material belt collecting and storing device; 3. a lower waste belt collecting and storing device; 4. a material belt conveying rail; 5. applying a waste material belt; 6. lower scrap tape (protective film); 7. a material belt; 8. LED lamp beads; 9. a small needle; 10. conveying rails on the back surfaces of the LED lamp beads; 11. an ultrasonic oscillator; 12. a first photodetector; 13. a second photodetector; 14. the back surface of the LED lamp bead is provided with an upper opening; 15. the lower opening of the conveying track on the back surface of the LED lamp bead; 100. feeding device of LED chip mounter; 101. a bracket; 102. chip mounter conveyer belt (for transporting the PCB board).
Detailed Description
In order to further explain the technical means and effects adopted by the invention to achieve the preset aim, the invention provides a feeding device of an LED chip mounter, which is further described in detail below with reference to the attached drawings and the preferred embodiment.
As shown in fig. 3, the feeding device 100 of the LED chip mounter is fixed on a bracket 101 capable of moving in the X, Y, Z direction, and a carrier belt 102 of the chip mounter for transporting the PCB board is arranged below the bracket.
As shown in fig. 1 and 2, the tray storage 1 is used for receiving the material belt 7, and when receiving a trigger pulse provided by the driver, the material belt is conveyed by the material belt conveying track 2 to advance by one lattice; while the upper and lower scrap tape storage means 2, 3 are driven to draw the upper and lower scrap tapes 5, 6 the same distance. The material belt is placed upside down in the material belt conveying track, and the lower waste material belt (protective film) on the material belt is uncovered to enable the LED lamp beads 8 in the lattice to lose protection and fall into the LED lamp bead back conveying track 10 from the upper opening 14 of the LED lamp bead back conveying track right below. After entering the track, the lamp bead solder faces upwards and the light emitting surface faces downwards. When the photoelectric detector I12 detects that the LED lamp beads fall into the track, the ultrasonic oscillator 11 starts to oscillate so as to enable the LED lamp beads to slide in the smooth semicircular track until the LED lamp beads slide out from the lower opening 15 of the conveying track on the back surface of the LED lamp beads and accurately fall into corresponding welding positions on the PCB; when the second photoelectric detector 13 detects that the LED lamp beads slide out from the opening below the track, the ultrasonic oscillator is turned off, the whole LED back conveying track translates rightwards for a proper distance, the small needle 9 is just aligned with the LED lamp beads just sliding onto the PCB, the lamp beads are pressed downwards, the whole track translates leftwards again to return to the original position, and the next LED lamp beads are continuously conveyed.
As shown in fig. 2, the conveying rail on the back of the LED lamp bead adopts a unique semicircular structure, the upper part and the lower part of the conveying rail are provided with openings slightly larger than the LED lamp bead, when the LED lamp bead just falls into the rail, the soldering tin faces upwards, and the luminous surface faces downwards; after the track motion, as the motion track is semicircular, the lamp beads are just opposite, the soldering tin faces downwards, the luminous faces upwards, and then fall into the corresponding welding positions on the PCB through the lower opening.
Claims (4)
1. The feeding device of the LED chip mounter comprises a tray storage and material belt conveying device, an upper waste material belt storage device, a lower waste material belt storage device, an LED lamp bead reverse conveying device and a photoelectric detector; the method is characterized in that: the material tray storage and material belt conveying device consists of a material tray storage, a material belt conveying track and a driver; an upper waste belt collecting and storing device for collecting upper waste belts is arranged right of the material tray storing and conveying device, and a lower waste belt collecting device for collecting lower waste belts is arranged right below the material tray storing and conveying device; when the driver sends a trigger pulse, the tray storage and material belt conveying device receives a signal to start conveying the material belt to advance for one grid, and meanwhile, the upper waste belt storage device and the lower waste belt storage device are driven to respectively pull the upper waste belt and the lower waste belt to move for the same distance, so that the lower waste belt on the material belt is uncovered for one grid, and the LED lamp beads in the one grid fall into the LED lamp bead reverse-phase conveying device due to the loss of protection of the film;
the material belt is placed upside down when conveyed in the material disc storage and material belt conveying device, so that the LED lamp beads can fall into the conveying track on the back surface of the LED lamp beads under the action of gravity after losing the protection of the lower waste belt; an LED lamp bead back conveying rail is arranged right below the separation position of the upper waste belt and the lower waste belt, the LED lamp bead back conveying rail is a smooth semicircular stainless steel guide rail, and an opening slightly larger than the LED lamp bead is formed right above and right below the guide rail, so that the LED lamp bead can fall into and slide out of the guide rail conveniently;
the conveying device comprises an LED lamp bead reverse conveying rail and an ultrasonic oscillator; the section of the track is rectangular, the length and the width of the rectangle are set according to the LED lamp beads of different types, and the length and the width of the rectangle are slightly larger than those of the LED lamp beads, so that the LED lamp beads can smoothly in the guide rail without rolling and falling; the front of the track is semicircular, when the LED lamp beads just fall into the track, the soldering tin faces upwards, the luminous surface faces downwards, when the lamp beads slide to the position right below the track in the reverse conveying track, the sliding path is semicircular, the lamp beads just face downwards, the luminous surface faces upwards, and then the lamp beads fall to the corresponding welding position on the PCB from the opening right below the track.
2. The feeding device of an LED chip mounter according to claim 1, wherein: the feeding device comprises a tray storage and material belt conveying device, an upper waste belt storage device and a lower waste belt storage device, and can respectively store a material belt, an upper waste belt and a lower waste belt, so that the feeding device is more perfect in function.
3. The feeding device of an LED chip mounter according to claim 1, wherein: an ultrasonic oscillator and two photoelectric detectors are arranged on the right side of the track, an extensible small needle is arranged in the middle of the track, and when the photoelectric detectors detect that the LED lamp beads fall into the conveying track on the back side of the LED lamp beads, the ultrasonic oscillator is triggered and started so that the LED lamp beads can slide in the smooth guide rail smoothly; when the photoelectric detector II detects that the LED lamp beads slide out of the track, the ultrasonic oscillator is turned off, then the whole guide rail translates rightwards for a proper distance, so that the small needle is just aligned with the LED lamp beads which just slide onto the PCB, the small needle is pressed downwards, the LED lamp beads are tightly attached to the PCB, and then the track translates leftwards to return to the original position, and the next LED lamp beads are continuously conveyed.
4. A feeding device for an LED chip mounter according to any one of claims 1 to 3, wherein: the feeding device does not need a suction nozzle to take materials on the material tray and to feed materials on the PCB, and the LED lamp beads can be directly conveyed to corresponding positions on the PCB through the LED lamp bead back conveying rail, so that time is saved, and economic benefit is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610385519.5A CN107466169B (en) | 2016-06-03 | 2016-06-03 | LED chip mounter material feeding unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610385519.5A CN107466169B (en) | 2016-06-03 | 2016-06-03 | LED chip mounter material feeding unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107466169A CN107466169A (en) | 2017-12-12 |
| CN107466169B true CN107466169B (en) | 2024-03-08 |
Family
ID=60544692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610385519.5A Active CN107466169B (en) | 2016-06-03 | 2016-06-03 | LED chip mounter material feeding unit |
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| Country | Link |
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| CN (1) | CN107466169B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135121B (en) * | 2018-01-30 | 2024-01-16 | 深圳市易通自动化设备有限公司 | Chip mounter |
| CN112475522A (en) * | 2020-11-18 | 2021-03-12 | 左嘉成 | LED lamp bead welding device |
| CN112423575B (en) * | 2020-12-04 | 2021-11-23 | 海盐县集佳建材有限公司 | Efficient surface mounting method for LED lamp beads |
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| CN107466169A (en) | 2017-12-12 |
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