CN107278046A - A kind of high speed placement system and the method that Tray disk materials are mounted using it - Google Patents
A kind of high speed placement system and the method that Tray disk materials are mounted using it Download PDFInfo
- Publication number
- CN107278046A CN107278046A CN201710718100.1A CN201710718100A CN107278046A CN 107278046 A CN107278046 A CN 107278046A CN 201710718100 A CN201710718100 A CN 201710718100A CN 107278046 A CN107278046 A CN 107278046A
- Authority
- CN
- China
- Prior art keywords
- axis mechanism
- high speed
- vacuum
- pallet
- placement system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Abstract
The invention discloses a kind of high speed placement system, attachment for realizing Tray disk materials, paster speed reaches more than 40,000 tablets hs, the high speed placement system includes frame, X-axis mechanism, Y-axis mechanism, placement head and pallet, the placement head uses rotary type multiheaded structure, the X-axis mechanism and Y-axis mechanism drive the placement head to be moved in X-axis and Y direction, and the pallet is arranged in the stroke range of the placement head, and Tray disks are placed in the pallet.The present invention creatively increases pallet on high speed placement system, it is combined with software control and hardware modifications, the line balancing rate of equipment is greatly improved, solve the problem of design defect of high speed placement system causes that Tray disk materials can not be produced, improve the operation production capacity of company, the utilization rate of equipment is improved, the satisfaction of client is improved.
Description
Technical field
The present invention relates to mount technology field, more particularly to a kind of high speed placement system and using its Tray disk things are mounted
The method of material
Background technology
Surface mounting technology (Surface Mounting Technology, abbreviation SMT) refers to without being inserted to printing twist drill
Fill hole, surface-assembled component (being also known as chip components and parts, such as IC, electric capacity, resistance etc.) patch is directly soldered to printing board surface rule
Position the mounting technology put.Surface mounting technology is applied on electronic product, not only makes product reliability height, possess more
Function, and make product progressively move towards lightweight, miniaturization.Development for a long time, makes the SMT technologies of today progressively become
In maturation, start to use at present extensively in every field such as manufacturing industry, computer industry and communication industries.Chip mounter conduct
Most important equipment on SMT production lines, the quality of chip mounter performance directly influences the operating efficiency of SMT production lines.
Chip mounter is in the material package mode of three kinds of specifications（Package, pipe dress, tray disks）, current whole SMT industry high-speed pasters
Tray disks material supply material feeding function is configured without on machine, the feeding style of existing high speed placement system is more to be carried in loader mode
For package material can only be pasted（Electric capacity, resistance, connector）, and use the Tray disk materials of other manner of packings（Sensor、Plcc）
It can not mount, Tray disks material, which needs to arrive above the multi-purpose machine with pallet box, to be produced.But, on the one hand, Multi Role Aircraft
On can only carry 1 pallet box, if pallet box in pallet place overfill, unnecessary pallet do not have position place production, it is necessary to
Increase carries the multifunctional patch machine equipment of pallet box to meet, and it is full to increase pallet apparatus above all high speed placement systems
Footrest disk material production, so adds production cost；On the one hand, the production efficiency of Multi Role Aircraft is less than high speed placement system, this
Sample can cause the wire body production time uneven, influence production capacity and efficiency；On the other hand, if last machine produces Tray disk things
Material, and this material exactly polarized（And after AOI）, need attachment screening cover to have the reverse wind of element above
, there is hidden danger of quality in danger.
The content of the invention
In order to make up the defect of prior art, the present invention is provided a kind of high speed placement system and Tray disk materials is entered using it
The method of row attachment.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of high speed placement system, the attachment for realizing Tray disk materials, paster speed reaches more than 40,000 tablets hs that this is at a high speed
Chip mounter includes frame, X-axis mechanism, Y-axis mechanism, placement head and pallet, and the placement head uses rotary type multiheaded structure, described
X-axis mechanism and Y-axis mechanism drive the placement head to be moved in X-axis and Y direction, and the pallet is arranged at the row of the placement head
In the range of journey, Tray disks are placed in the pallet.
Further, the pallet is open-topped rectangular parallelepiped structure, and the pallet is pasted by screw locking in high speed
On piece machine.
Further, the pallet is provided with anti-misoperation device, the direction for positioning Tray disks.
In daily paster process, work long hours and be easily caused visual fatigue or lack a sense of responsibility, if pallet
There is no fool-proof design, when operator tends to whole Tray disks placement direction occurring reverse when positioning Tray disks,
The reverse of electronic component polarity is may result in during paster, so as to cause the damage of circuit board.The present invention is by setting fool proof to fill
Put to avoid workman from putting back Tray disks, so as to improve operating efficiency and the qualification rate of product.Tool of the present invention to anti-misoperation device
Body structure is not construed as limiting.Those skilled in the art can be known according to common knowledge and prior art.
In the present invention, the Y-axis mechanism is arranged in the frame, and the X-axis mechanism is arranged on Y axis mechanisms, X-axis
Mechanism can be moved along Y direction, and the placement head is arranged in X-axis mechanism, and placement head can be moved along X-direction, this
Sample placement head just can arbitrarily be moved in the coordinate system that X-axis mechanism and Y-axis mechanism are constituted, and realize the positioning of sheet component.
The present invention is not construed as limiting to the concrete structure of X-axis mechanism and Y-axis mechanism, and those skilled in the art are according to common knowledge and existing skill
Art can be known, as long as realizing that the X-axis mechanism and Y-axis mechanism drive the placement head to be moved in X-axis and Y direction.
Further, the placement head includes the swivel head with 12 section device grating discs, DP motors, element photograph
Machine, Z-axis mechanism and suction nozzle, are installed after a suction nozzle, nozzle pick element by section device grating disc is Lai smart per section device grating disc
True angle position, makes the paster angle set in program invariable, it is ensured that paster precision.Preferably, the groove of the suction nozzle
Ball with section device grating disc is chimeric.The DP motors are used for the rotation for driving the section device grating disc, and the element shines
Camera is corresponding with the suction nozzle on placement head to be set, and the Z-axis mechanism is used to drive the placement head to move along Z-direction；Institute
Stating suction nozzle is used to adsorbing and being placed with element.
Further, the top and bottom of the Z-axis mechanism are respectively equipped with top light barrier and bottom light barrier；The Z-axis mechanism bag
Motor, the gear on machine shaft, the rack engaged with gear are included, the rack is perpendicular to machine shaft.
Further, the pneumatic means of the placement head includes Pneumatic vacuum loop, air blowing pneumatic circuit and vacuum/pneumatic
Air blowing switch unit.
Further, the Pneumatic vacuum loop includes vacuum generator and vacuum distribution；Compressed air is by described
Two-way vacuum is formed after vacuum generator, is connected to respectively by the first tracheae and the second tracheae on the vacuum distribution, institute
State the first tracheae smaller than the caliber of second tracheae, the vacuum distribution connects the first tracheae and the second tracheae with suction nozzle
It is logical.
Further, air blowing pneumatic circuit include magnetic valve, taken over by vacuum generator all the way compressed air through electromagnetism
Gas circuit point two-way after valve, wherein arriving vacuum/pneumatic blowing gas switch unit all the way.
Further, vacuum/pneumatic blowing gas switch unit includes stepper motor, eccentricity control disk and piston, the stepping
Motor drives the eccentricity control disk to rotate, and the eccentric wheel on the eccentricity control disk promotes or extracted the piston, so that real
The switching of existing vacuum/air blowing two states.When piston is pushed into, vacuum supply is cut off, available for material casting and paster process；
When piston is pulled out, supply of blowing is cut off, available for reclaiming process.
The present invention also provides a kind of method mounted using above-mentioned high speed placement system to Tray disk materials, including as follows
Step：
S1. feeding：Section device grating disc goes to the angle of feeding at DP motors first, and swivel head continues to rotate afterwards, meanwhile,
X-axis mechanism and Y-axis mechanism are also moved to target feeding position, when last in swivel head, X-axis mechanism, Y-axis mechanism reaches
To after signal outflow, Z-axis mechanism starts to move downward, and then the bottom light barrier of Z-axis mechanism, which is activated, sends a completion signal,
Stepper motor rotates 180 degree at once, and piston is drawn out, and section device connects vacuum, and vacuum passes on suction nozzle and material is picked up, and carries out
Feeding vacuum detecting；After the completion of vacuum detecting, remained stationary as after stepper motor rotation 180 degree, be simultaneously emitted by a completion signal,
Z-axis mechanism is just back moved upwards, and the top light barrier of Z axis, which is activated, sends a completion signal, and swivel head continues to rotate, entered
Next feeding circulation；
S2. it is placed with：After material on suction nozzle is taken a picture by device camera, section device grating disc goes at Dp motors and is placed with
Angle, swivel head continues to rotate, meanwhile, X-axis mechanism, Y-axis mechanism are also moved being placed with position to target, when swivel head,
Last in X-axis mechanism, Y-axis mechanism is completed after signal outflow, and progress is placed with vacuum detecting, and magnetic valve opens 60-70ms, with
This is while Z-axis mechanism starts to move downward, and and then the bottom light barrier of Z-axis mechanism, which is activated, sends a completion signal, stepping horse
Up to 180 degree is rotated at once, piston is pushed into, and section device connects air blowing gas circuit, and the material on suction nozzle is attached on circuit board；Stepping
After motor rotation 180 degree, remain stationary as, be simultaneously emitted by a completion signal, Z-axis mechanism is just back moved upwards, Z-axis mechanism
Top light barrier, which is activated, sends a completion signal, and swivel head continues to rotate, and circulation is placed with into next.
The present invention has the advantages that：
The present invention creatively increases pallet on high speed placement system, is combined with software control and hardware modifications, the life of equipment
Production balanced ratio is greatly improved, and solving the design defect of high speed placement system causes that asking for Tray disk materials can not be produced
Topic, improves the operation production capacity of company, improves the utilization rate of equipment, improve the satisfaction of client.
Brief description of the drawings
Fig. 1 is top view of the invention.
In figure：1st, high speed placement system, 2, pallet.
Embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Embodiment 1
A kind of high speed placement system, the attachment for realizing Tray disk materials, paster speed reaches more than 40,000 tablets hs that this is at a high speed
Chip mounter includes frame, X-axis mechanism, Y-axis mechanism, placement head and pallet, and the placement head uses rotary type multiheaded structure；It is described
Y-axis mechanism is arranged in the frame, and the X-axis mechanism is arranged on Y axis mechanisms, and the placement head is arranged on X-axis mechanism
On；The X-axis mechanism and Y-axis mechanism drive the placement head to be moved in X-axis and Y direction, and the pallet is arranged at the patch
In the stroke range of head, Tray disks are placed in the pallet.
The pallet is open-topped rectangular parallelepiped structure, and the pallet is by screw locking on high speed placement system；Institute
Pallet is stated provided with anti-misoperation device, the direction for positioning Tray disks.
The placement head includes swivel head, DP motors, device camera, Z-axis mechanism with 12 section device grating discs
And suction nozzle, a suction nozzle is installed per section device grating disc, the DP motors are used for the rotation for driving the section device grating disc, institute
Device camera setting corresponding with the suction nozzle on placement head is stated, the Z-axis mechanism is used to drive the placement head along Z-direction
Motion.
The top and bottom of the Z-axis mechanism are respectively equipped with top light barrier and bottom light barrier；The Z-axis mechanism includes electricity
Machine, the gear on machine shaft, the rack engaged with gear, the rack is perpendicular to machine shaft.
The pneumatic means of the placement head is changed including Pneumatic vacuum loop, air blowing pneumatic circuit and vacuum/pneumatic blowing autogenous cutting
Unit.The Pneumatic vacuum loop includes vacuum generator and vacuum distribution；Compressed air is after the vacuum generator
Two-way vacuum is formed, is connected to respectively by the first tracheae and the second tracheae on the vacuum distribution, the first tracheae ratio
The caliber of second tracheae is small, and the vacuum distribution connects the first tracheae and the second tracheae with suction nozzle.Blow pneumatic time
Road includes magnetic valve, and compressed air gas circuit point two-way after magnetic valve all the way is taken over by vacuum generator, wherein arriving true all the way
Sky/pneumatic blowing gas switch unit.Vacuum/pneumatic blowing gas switch unit includes stepper motor, eccentricity control disk and piston, the step
Entering motor drives the eccentricity control disk to rotate, and the eccentric wheel on the eccentricity control disk promotes or extracted the piston.
Embodiment 2
The method mounted using the high speed placement system in embodiment 1 to Tray disk materials, is comprised the following steps：
S1. feeding：Section device grating disc goes to the angle of feeding at DP motors first, and swivel head continues to rotate afterwards, meanwhile,
X-axis mechanism and Y-axis mechanism are also moved to target feeding position, when last in swivel head, X-axis mechanism, Y-axis mechanism reaches
To after signal outflow, Z-axis mechanism starts to move downward, and then the bottom light barrier of Z-axis mechanism, which is activated, sends a completion signal,
Stepper motor rotates 180 degree at once, and piston is drawn out, and section device connects vacuum, and vacuum passes on suction nozzle and material is picked up, and carries out
Feeding vacuum detecting；After the completion of vacuum detecting, remained stationary as after stepper motor rotation 180 degree, be simultaneously emitted by a completion signal,
Z-axis mechanism is just back moved upwards, and the top light barrier of Z axis, which is activated, sends a completion signal, and swivel head continues to rotate, entered
Next feeding circulation；
S2. it is placed with：After material on suction nozzle is taken a picture by device camera, section device grating disc goes at Dp motors and is placed with
Angle, swivel head continues to rotate, meanwhile, X-axis mechanism, Y-axis mechanism are also moved being placed with position to target, when swivel head,
Last in X-axis mechanism, Y-axis mechanism is completed after signal outflow, and progress is placed with vacuum detecting, and magnetic valve opens 60-70ms, with
This is while Z-axis mechanism starts to move downward, and and then the bottom light barrier of Z-axis mechanism, which is activated, sends a completion signal, stepping horse
Up to 180 degree is rotated at once, piston is pushed into, and section device connects air blowing gas circuit, and the material on suction nozzle is attached on circuit board；Stepping
After motor rotation 180 degree, remain stationary as, be simultaneously emitted by a completion signal, Z-axis mechanism is just back moved upwards, Z-axis mechanism
Top light barrier, which is activated, sends a completion signal, and swivel head continues to rotate, and circulation is placed with into next.
Embodiment described above only expresses embodiments of the present invention, and it describes more specific and detailed, but can not
Therefore the limitation to the scope of the claims of the present invention is interpreted as, as long as the skill obtained using the form of equivalent substitution or equivalent transformation
Art scheme, all should fall within the scope and spirit of the invention.
Claims (10)
1. a kind of high speed placement system, it is characterised in that it is used for the attachment for realizing Tray disk materials, paster speed reach 40,000/
More than hour, the high speed placement system includes frame, X-axis mechanism, Y-axis mechanism, placement head and pallet, and the placement head is using rotation
The many header structures of formula, the X-axis mechanism and Y-axis mechanism drive the placement head to be moved in X-axis and Y direction, and the pallet is set
In in the stroke range of the placement head, Tray disks are placed in the pallet.
2. high speed placement system as claimed in claim 1, it is characterised in that the pallet is open-topped rectangular parallelepiped structure,
The pallet is by screw locking on high speed placement system.
3. high speed placement system as claimed in claim 1, it is characterised in that the pallet is provided with anti-misoperation device, for positioning
The direction of Tray disks.
4. high speed placement system as claimed in claim 1, it is characterised in that the Y-axis mechanism is arranged in the frame, described
X-axis mechanism is arranged on Y axis mechanisms, and the placement head is arranged in X-axis mechanism.
5. high speed placement system as claimed in claim 1, it is characterised in that the placement head is included with 12 section device gratings
Swivel head, DP motors, device camera, Z-axis mechanism and the suction nozzle of disk, a suction nozzle, the DP are installed per section device grating disc
Motor is used for the rotation for driving the section device grating disc, and the device camera is corresponding with the suction nozzle on placement head to be set,
The Z-axis mechanism is used to drive the placement head to move along Z-direction.
6. high speed placement system as claimed in claim 5, it is characterised in that the top and bottom of the Z-axis mechanism are respectively equipped with
Top light barrier and bottom light barrier；The Z-axis mechanism includes motor, the gear on machine shaft, the tooth engaged with gear
Bar, the rack is perpendicular to machine shaft.
7. high speed placement system as claimed in claim 1, it is characterised in that the pneumatic means of the placement head includes Pneumatic vacuum
Loop, air blowing pneumatic circuit and vacuum/pneumatic blowing gas switch unit.
8. high speed placement system as claimed in claim 7, it is characterised in that the Pneumatic vacuum loop include vacuum generator and
Vacuum distribution；Compressed air forms two-way vacuum after the vacuum generator, passes through the first tracheae and the second gas respectively
Pipe is connected on the vacuum distribution, and first tracheae is smaller than the caliber of second tracheae, and the vacuum distribution will
First tracheae and the second tracheae are connected with suction nozzle；The air blowing pneumatic circuit includes magnetic valve, and one is taken over by vacuum generator
Road compressed air gas circuit point two-way after magnetic valve, wherein arriving vacuum/pneumatic blowing gas switch unit all the way.
9. high speed placement system as claimed in claim 8, it is characterised in that vacuum/pneumatic blowing gas switch unit includes stepping horse
Reach, eccentricity control disk and piston, the stepper motor drives the eccentricity control disk to rotate, the bias on the eccentricity control disk
Wheel promotes or extracted the piston.
10. a kind of method mounted using any one of the claim 1-9 high speed placement systems to Tray disk materials, including
Following steps：
S1. feeding：Section device grating disc goes to the angle of feeding at DP motors first, and swivel head continues to rotate afterwards, meanwhile,
X-axis mechanism and Y-axis mechanism are also moved to target feeding position, when last in swivel head, X-axis mechanism, Y-axis mechanism reaches
To after signal outflow, Z-axis mechanism starts to move downward, and then the bottom light barrier of Z-axis mechanism, which is activated, sends a completion signal,
Stepper motor rotates 180 degree at once, and piston is drawn out, and section device connects vacuum, and vacuum passes on suction nozzle and material is picked up, and carries out
Feeding vacuum detecting；After the completion of vacuum detecting, remained stationary as after stepper motor rotation 180 degree, be simultaneously emitted by a completion signal,
Z-axis mechanism is just back moved upwards, and the top light barrier of Z axis, which is activated, sends a completion signal, and swivel head continues to rotate, entered
Next feeding circulation；
S2. it is placed with：After material on suction nozzle is taken a picture by device camera, section device grating disc goes at Dp motors and is placed with
Angle, swivel head continues to rotate, meanwhile, X-axis mechanism, Y-axis mechanism are also moved being placed with position to target, when swivel head,
Last in X-axis mechanism, Y-axis mechanism is completed after signal outflow, and progress is placed with vacuum detecting, and magnetic valve opens 60-70ms, with
This is while Z-axis mechanism starts to move downward, and and then the bottom light barrier of Z-axis mechanism, which is activated, sends a completion signal, stepping horse
Up to 180 degree is rotated at once, piston is pushed into, and section device connects air blowing gas circuit, and the material on suction nozzle is attached on circuit board；Stepping
After motor rotation 180 degree, remain stationary as, be simultaneously emitted by a completion signal, Z-axis mechanism is just back moved upwards, Z-axis mechanism
Top light barrier, which is activated, sends a completion signal, and swivel head continues to rotate, and circulation is placed with into next.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710718100.1A CN107278046A (en) | 2017-08-21 | 2017-08-21 | A kind of high speed placement system and the method that Tray disk materials are mounted using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710718100.1A CN107278046A (en) | 2017-08-21 | 2017-08-21 | A kind of high speed placement system and the method that Tray disk materials are mounted using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107278046A true CN107278046A (en) | 2017-10-20 |
Family
ID=60080528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710718100.1A Pending CN107278046A (en) | 2017-08-21 | 2017-08-21 | A kind of high speed placement system and the method that Tray disk materials are mounted using it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107278046A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101909422A (en) * | 2009-06-05 | 2010-12-08 | 上海晨兴希姆通电子科技有限公司 | Method for realizing feeding of chip mounter by substituting tray for feeder |
| CN102638964A (en) * | 2011-02-08 | 2012-08-15 | 富士机械制造株式会社 | Multi-layer rotating head, circuit component mounting machine and use method thereof |
| CN103200786A (en) * | 2012-04-13 | 2013-07-10 | 深圳市腾世机电有限公司 | Pneumatic device of chip mounter |
| CN103809525A (en) * | 2014-01-26 | 2014-05-21 | 佛山市蓝箭电子股份有限公司 | Control system and control method for three-dimensional motion welding head of automatic die bonder |
| CN204191037U (en) * | 2014-11-06 | 2015-03-04 | 深圳市金百泽电子科技股份有限公司 | A kind of chip mounter Sleeve maintains tool box |
| WO2015059839A1 (en) * | 2013-10-21 | 2015-04-30 | Fuji Machine Mfg. Co., Ltd. | Method for mounting an electronic-component onto a substrate and electronic-component mounting machine |
| CN105188273A (en) * | 2015-07-29 | 2015-12-23 | 王硕 | Bulk LED high-speed chip mounter |
| CN105704941A (en) * | 2016-04-23 | 2016-06-22 | 葛瑜 | Automatic chip mounter for FPC |
| CN207040030U (en) * | 2017-08-21 | 2018-02-23 | 深圳市海能达通信有限公司 | A kind of high speed placement system |
-
2017
- 2017-08-21 CN CN201710718100.1A patent/CN107278046A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101909422A (en) * | 2009-06-05 | 2010-12-08 | 上海晨兴希姆通电子科技有限公司 | Method for realizing feeding of chip mounter by substituting tray for feeder |
| CN102638964A (en) * | 2011-02-08 | 2012-08-15 | 富士机械制造株式会社 | Multi-layer rotating head, circuit component mounting machine and use method thereof |
| CN103200786A (en) * | 2012-04-13 | 2013-07-10 | 深圳市腾世机电有限公司 | Pneumatic device of chip mounter |
| WO2015059839A1 (en) * | 2013-10-21 | 2015-04-30 | Fuji Machine Mfg. Co., Ltd. | Method for mounting an electronic-component onto a substrate and electronic-component mounting machine |
| CN103809525A (en) * | 2014-01-26 | 2014-05-21 | 佛山市蓝箭电子股份有限公司 | Control system and control method for three-dimensional motion welding head of automatic die bonder |
| CN204191037U (en) * | 2014-11-06 | 2015-03-04 | 深圳市金百泽电子科技股份有限公司 | A kind of chip mounter Sleeve maintains tool box |
| CN105188273A (en) * | 2015-07-29 | 2015-12-23 | 王硕 | Bulk LED high-speed chip mounter |
| CN105704941A (en) * | 2016-04-23 | 2016-06-22 | 葛瑜 | Automatic chip mounter for FPC |
| CN207040030U (en) * | 2017-08-21 | 2018-02-23 | 深圳市海能达通信有限公司 | A kind of high speed placement system |
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