CN105164796A - 薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 - Google Patents
薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 Download PDFInfo
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- CN105164796A CN105164796A CN201480024084.0A CN201480024084A CN105164796A CN 105164796 A CN105164796 A CN 105164796A CN 201480024084 A CN201480024084 A CN 201480024084A CN 105164796 A CN105164796 A CN 105164796A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- Organic Chemistry (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
- Conductive Materials (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010353163.3A CN111500212A (zh) | 2013-04-30 | 2014-03-31 | 薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-095410 | 2013-04-30 | ||
JP2013095410A JP6033734B2 (ja) | 2013-04-30 | 2013-04-30 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
PCT/JP2014/059494 WO2014178252A1 (ja) | 2013-04-30 | 2014-03-31 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010353163.3A Division CN111500212A (zh) | 2013-04-30 | 2014-03-31 | 薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 |
Publications (1)
Publication Number | Publication Date |
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CN105164796A true CN105164796A (zh) | 2015-12-16 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010353163.3A Pending CN111500212A (zh) | 2013-04-30 | 2014-03-31 | 薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 |
CN201480024084.0A Pending CN105164796A (zh) | 2013-04-30 | 2014-03-31 | 薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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CN202010353163.3A Pending CN111500212A (zh) | 2013-04-30 | 2014-03-31 | 薄膜状胶粘剂、切割胶带一体型薄膜状胶粘剂以及半导体装置的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6033734B2 (ja) |
KR (1) | KR102212774B1 (ja) |
CN (2) | CN111500212A (ja) |
TW (1) | TWI627252B (ja) |
WO (1) | WO2014178252A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111344813A (zh) * | 2017-11-13 | 2020-06-26 | 日东电工株式会社 | 烧结接合用组合物、烧结接合用片、及带烧结接合用片的切割带 |
TWI762603B (zh) * | 2017-03-29 | 2022-05-01 | 日商日東電工股份有限公司 | 加熱接合用片材及附加熱接合用片材之切割帶 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015129226A (ja) * | 2014-01-08 | 2015-07-16 | 日東電工株式会社 | フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置 |
WO2015104986A1 (ja) * | 2014-01-08 | 2015-07-16 | 日東電工株式会社 | フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置 |
JP6396189B2 (ja) * | 2014-11-27 | 2018-09-26 | 日東電工株式会社 | 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法 |
JP2018514947A (ja) * | 2015-05-04 | 2018-06-07 | イーオープレックス リミテッド | ダイ取り付けパッドがないリードキャリア構造およびそれに形成されたパッケージ |
JP6967839B2 (ja) * | 2016-03-23 | 2021-11-17 | 日東電工株式会社 | 加熱接合用シート、ダイシングテープ付き加熱接合用シート、及び、接合体の製造方法、パワー半導体装置 |
CN109005665B (zh) * | 2016-03-30 | 2020-12-25 | 琳得科株式会社 | 半导体加工用片 |
JP6615150B2 (ja) * | 2017-05-01 | 2019-12-04 | 古河電気工業株式会社 | 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法 |
WO2018212171A1 (ja) * | 2017-05-17 | 2018-11-22 | リンテック株式会社 | 半導体装置及びその製造方法 |
JP6584543B2 (ja) * | 2018-01-23 | 2019-10-02 | 田中貴金属工業株式会社 | 導電性接着剤組成物 |
JP7139042B2 (ja) * | 2018-05-14 | 2022-09-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7139040B2 (ja) * | 2018-05-14 | 2022-09-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7139041B2 (ja) * | 2018-05-14 | 2022-09-20 | 株式会社ディスコ | ウェーハの加工方法 |
JP7413804B2 (ja) * | 2020-02-03 | 2024-01-16 | 三菱ケミカル株式会社 | 粘接着剤組成物、粘接着剤、粘接着シート、及び積層体 |
CN116569308A (zh) * | 2020-12-25 | 2023-08-08 | 株式会社力森诺科 | 膜状黏合剂及其制造方法、切割晶粒接合一体型膜、以及半导体装置及其制造方法 |
WO2024009589A1 (ja) * | 2022-07-08 | 2024-01-11 | ナミックス株式会社 | 導電性ペースト、電気回路、可撓性電気回路体及び成形体の製造方法 |
Citations (3)
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CN111344813B (zh) * | 2017-11-13 | 2023-02-28 | 日东电工株式会社 | 烧结接合用组合物、烧结接合用片、及带烧结接合用片的切割带 |
TWI814750B (zh) * | 2017-11-13 | 2023-09-11 | 日商日東電工股份有限公司 | 燒結接合用組合物、燒結接合用片材、及附有燒結接合用片材之切割帶 |
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CN111500212A (zh) | 2020-08-07 |
KR20160004270A (ko) | 2016-01-12 |
TW201444940A (zh) | 2014-12-01 |
JP6033734B2 (ja) | 2016-11-30 |
JP2014216611A (ja) | 2014-11-17 |
KR102212774B1 (ko) | 2021-02-05 |
WO2014178252A1 (ja) | 2014-11-06 |
TWI627252B (zh) | 2018-06-21 |
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