CN105102565B - 粘合片 - Google Patents

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Publication number
CN105102565B
CN105102565B CN201480016192.3A CN201480016192A CN105102565B CN 105102565 B CN105102565 B CN 105102565B CN 201480016192 A CN201480016192 A CN 201480016192A CN 105102565 B CN105102565 B CN 105102565B
Authority
CN
China
Prior art keywords
adhesive
acrylate
adhesive layer
cutting
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480016192.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN105102565A (zh
Inventor
平山高正
北山和宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN105102565A publication Critical patent/CN105102565A/zh
Application granted granted Critical
Publication of CN105102565B publication Critical patent/CN105102565B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H10P72/7404—Wafer tapes, e.g. grinding or dicing support tapes the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
CN201480016192.3A 2013-03-15 2014-03-12 粘合片 Active CN105102565B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013053850 2013-03-15
JP2013-053850 2013-03-15
PCT/JP2014/056550 WO2014142194A1 (ja) 2013-03-15 2014-03-12 粘着シート

Publications (2)

Publication Number Publication Date
CN105102565A CN105102565A (zh) 2015-11-25
CN105102565B true CN105102565B (zh) 2018-03-06

Family

ID=51536845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480016192.3A Active CN105102565B (zh) 2013-03-15 2014-03-12 粘合片

Country Status (5)

Country Link
JP (2) JP5801010B2 (https=)
KR (1) KR101637862B1 (https=)
CN (1) CN105102565B (https=)
TW (1) TWI557206B (https=)
WO (1) WO2014142194A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101637862B1 (ko) * 2013-03-15 2016-07-07 닛토덴코 가부시키가이샤 점착 시트
JP6712916B2 (ja) * 2016-07-11 2020-06-24 日東電工株式会社 粘着シート
JP6783570B2 (ja) * 2016-07-11 2020-11-11 日東電工株式会社 粘着シート
US11183416B2 (en) * 2016-10-03 2021-11-23 Lintec Corporation Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
EP3572478B1 (en) * 2017-01-20 2024-01-10 Mitsui Chemicals Tohcello, Inc. Use of adhesive film and method of manufacturing electronic apparatus
JP6908395B2 (ja) * 2017-02-28 2021-07-28 日東電工株式会社 粘着テープ
JP7019333B2 (ja) * 2017-04-17 2022-02-15 日東電工株式会社 ダイシングダイボンドフィルム
JP6902394B2 (ja) * 2017-05-15 2021-07-14 ポリプラスチックス株式会社 シール性を有する複合成形品
JP6881139B2 (ja) * 2017-08-07 2021-06-02 三菱ケミカル株式会社 光硬化型粘着シート
JP7152233B2 (ja) * 2018-09-25 2022-10-12 日東電工株式会社 半導体保護用粘着テープ
JP7075326B2 (ja) * 2018-10-05 2022-05-25 日東電工株式会社 ダイシングダイボンドフィルム
JP7446773B2 (ja) * 2019-11-07 2024-03-11 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
JP7625784B2 (ja) * 2019-11-15 2025-02-04 株式会社レゾナック ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置の製造方法
JP2021123603A (ja) * 2020-01-31 2021-08-30 リンテック株式会社 粘着シート
JP7711937B2 (ja) * 2021-11-26 2025-07-23 日榮新化株式会社 粘着シート
JP7808467B2 (ja) * 2021-12-22 2026-01-29 日東電工株式会社 ダイシングダイボンドフィルム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1912038A (zh) * 2005-08-11 2007-02-14 日东电工株式会社 粘合片及其制造方法、以及制品的加工方法
CN1927978A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN1927977A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN101740351A (zh) * 2008-11-26 2010-06-16 日东电工株式会社 切割模片接合膜以及半导体器件的生产方法
CN102653663A (zh) * 2011-03-04 2012-09-05 日东电工株式会社 薄膜基板固定用粘合粘接片
CN102959030A (zh) * 2011-03-03 2013-03-06 日东电工株式会社 加热剥离型粘合片

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS6317981A (ja) * 1986-07-09 1988-01-25 F S K Kk 粘着シ−ト
JP3545447B2 (ja) * 1994-02-04 2004-07-21 大日本印刷株式会社 光拡散フィルム
JP4703833B2 (ja) 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP5057678B2 (ja) * 2006-03-17 2012-10-24 日東電工株式会社 熱剥離型粘着シート
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP5283838B2 (ja) * 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法
JP2008174658A (ja) * 2007-01-19 2008-07-31 Showa Denko Kk 粘着剤用組成物および該組成物を用いた粘着シート、粘着剤付き部材
JP2008266455A (ja) * 2007-04-20 2008-11-06 Nitto Denko Corp 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法
JP5204937B2 (ja) * 2007-06-18 2013-06-05 日東電工株式会社 光学部材用粘着剤組成物
JP2009173722A (ja) * 2008-01-23 2009-08-06 Toyo Ink Mfg Co Ltd 帯電防止性アクリル系感圧式接着剤および該感圧式接着剤を用いた帯電防止性感圧式接着フィルム
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
JP2012214585A (ja) * 2011-03-31 2012-11-08 Lintec Corp エネルギー線硬化型粘着剤用のアンカーコート剤組成物、コートフィルム、及び半導体ウエハ加工用粘着シート
JP2013196551A (ja) * 2012-03-22 2013-09-30 Toray Advanced Film Co Ltd タッチパネル用粘着シート、タッチパネルおよび表示装置
KR101637862B1 (ko) * 2013-03-15 2016-07-07 닛토덴코 가부시키가이샤 점착 시트

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1912038A (zh) * 2005-08-11 2007-02-14 日东电工株式会社 粘合片及其制造方法、以及制品的加工方法
CN1927978A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN1927977A (zh) * 2005-09-06 2007-03-14 日东电工株式会社 粘合片和使用该粘合片的制品的加工方法
CN101740351A (zh) * 2008-11-26 2010-06-16 日东电工株式会社 切割模片接合膜以及半导体器件的生产方法
CN102959030A (zh) * 2011-03-03 2013-03-06 日东电工株式会社 加热剥离型粘合片
CN102653663A (zh) * 2011-03-04 2012-09-05 日东电工株式会社 薄膜基板固定用粘合粘接片

Also Published As

Publication number Publication date
JP2016029161A (ja) 2016-03-03
JP5801010B2 (ja) 2015-10-28
KR101637862B1 (ko) 2016-07-07
WO2014142194A1 (ja) 2014-09-18
TW201441334A (zh) 2014-11-01
KR20150127089A (ko) 2015-11-16
JPWO2014142194A1 (ja) 2017-02-16
TWI557206B (zh) 2016-11-11
CN105102565A (zh) 2015-11-25
JP6525779B2 (ja) 2019-06-05

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