CN1050696C - 直接把芯片接合于散热装置的方法与装置 - Google Patents

直接把芯片接合于散热装置的方法与装置 Download PDF

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CN1050696C
CN1050696C CN95105032A CN95105032A CN1050696C CN 1050696 C CN1050696 C CN 1050696C CN 95105032 A CN95105032 A CN 95105032A CN 95105032 A CN95105032 A CN 95105032A CN 1050696 C CN1050696 C CN 1050696C
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chip
fixed
heat abstractor
solder
extension
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CN1120736A (zh
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安森·杰伊·考
斯蒂芬·H·梅斯内尔
福兰克·路易斯·帕姆皮奥
杰弗里·阿伦·奇茨
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International Business Machines Corp
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Abstract

本发明涉及把芯片直接与散热装置接合的新装置和方法。更具体地说，本发明实现了这样一种装置和方法，即使用一种双面、压敏、导热胶带直接把芯片或类似装置接合于一散热装置上。

Description

直接把芯片接合于散热装置的方法与装置
本专利申请与系列号为08/相关联。该专利申请题为“具有单一保护性外包装的芯片支架”，代理人卷号FI9-94-079，已转让给本专利申请的受让人。对那个专利的说明作为这里的参考。
一般地说，本发明是关于把芯片直接与散热装置接合的新装置和方法。更具体地说，本发明完成一种装置和方法，使用一种双面、压敏、导热胶带直接把芯片或类似装置接合于一散热装置上。
随着新技术的革新，半导体装置正在变得更小和更密集。然而，为了保持竞争力，电路密度的增大导致芯片总体包装对策的增加。所以芯片和芯片支架制造者们不断受到挑战，要求它们通过发现问题和排除问题来改进他们产品的质量，减小包装尺寸和重量，降低包装费用，提供改进的热效率和更好与更先进的芯片。尽管通过降低处理过程的可变性正在实现显著的改进以消除系统性问题，但单是处理过程的改进还不足以消除影响性能和可靠性的所有问题。
增强性和可靠性的一种方式是给集成电路芯片提供一个最短的和最有效的冷却途径。这可以通过把芯片实际放在尽可能靠近散热装置的地方。另一种方式是提供更有效的冷却手段。然而，当把芯片移到更接近于散热装置时，也得需要一种手段在芯片和散热装置之间提供可靠的热接触。在一些情况下，已经使用导热环氧树脂来提供芯片和散热装置之间的更好的热接触，在其他情况里已使用了某种导热型胶。
研究报告270号、出版号27014(1986年10月)披露了一种粘贴(stick-on)散热装置，该报告披露的内容在这里引用作为参考。通过把模块滑入散热装置使散热装置连接到模块上，而散热装置的边缘压紧模块使散热固定在模块上。它也披露一种方法，即也能使用粘胶或双面胶带放在散热器底面上以保证模块和散热装置之间的紧密接触。
美国专利第4,092,697号(Spacght)(其专利说明列入这里作为参考)披露在芯片和散热或散热器之间放置导热材料薄膜。
美国专利第4,233,645号(Balderes等人)披露在芯片和散热装置之间一块浸透适当液体的多孔材料来提供导热途径。
美国专利第4,849,856号(Funari等人)(其专利说明列入这里作为参考)披露一种芯片与散热装置直接连接处理，这里采用导热胶把散热装置直接固定到芯片上。
美国专利第4,939,570号(Bickford等人)(其专利说明列入这里作为参考)披露了另一种芯片与散热装置直接连接的处理方法，来采用导热胶把散热装置直接固定到芯片上。
美国专利第4,999,699号(Christie等人)(其专利说明列入这里作为参考)披露一种焊料连接，这里由焊料连接造成的支持片基和半导体装置之间的隙缝填充一种合成物，这种合成物是由凝固一种配制品得到的，这种配制品中含有环脂肪族的多环氧化合物(Cy-cloaliphatic polyepoxide)和/或可凝固的氰化盐酯(cyanate ester)或它们的预聚合物；填充剂的最大颗粒尺寸是31微米，而且至少是基本上没有阿尔法(α)粒子辐射。
美国专利第5,249,101号(Frey等人)(其专利说明列入这里作为参考)披露一种无盖芯片支承，它使用至少二个外包装。第一个外包装用于延长反装芯片(flip-chip)脆弱的生命。第二个外包装用于提供有限的环境保护。还需要第三个外包装供使用外部引出脚的支承在凝固之前包含第二外包装。披露的内容还有，外包装的CTE(热膨胀系数)为焊料球的CTE的30％以下。
然而，本发明的发明者们正在使用一种完全不同的途径去解决这一个老问题。他们正在使用一种双面、压敏、导热胶带直接把芯片连接到散热装置上、并在这二者之间提供可靠的热接触。
再有，他们已经披露一种新的方法和结构以保证散热装置和片基或芯片支承之间粘接的整体性。
本发明的结构和处理过程提供了若干超过先有技术的优点。例如，它提供了一种简化的模块结构，所以它利用较少的材料和组合处理步骤，并允许对组合的模块容易地进行加工和修理。
本发明是一种新的方法和设备供使用双面导热压敏粘胶带把芯片连接到散热装置上。本发明还实现了一种新的设备和方法以直接把散热装置连接到芯片和/或片基上。
所以，本发明的一个目的是提供一种设备和方法，它将在芯片和散热装置之间使用双面导热压散胶带提供一个直接的热通道。
本发明的另一目的是在芯片和散热装置之间提供一种双面导热压敏胶带以保证二者之间牢固的热接触。
本发明的又一目的是在芯片和散热装置之间有一个很经济又有效的导热路径。
本发明还有一个目的是增加片基或芯片支承上的可用面积，用于装置接合，例如有源装置(如芯片)或无源装置(如电容)等。
本发明的又一个目的是提供一种方法和设备以保证芯片和散热装置之间粘接的整体性。
本发明的另一目的是再制或修理已完成的或已组装的模块的能力。
所以，一方面本发明包含一种设备以提供至少一个芯片和至少一个散热装置之间的直接导热路径，这里所述设备由一种双面导热胶带构成，它把所述散热装置固定于所述至少一个芯片上。
另一方面，本发明包含一种方法以提供至少一个芯片和至少一个散热装置之间的直接导热路径，这里所述方法包含把至少是双面导热胶带的第一部分固定在所述芯片表面并把第二部分在至少是一部分所述散热装置上。
本发明的相信是新颖的那些特点以及本发明的特征性要素在所附权利要求中具体提出。附图只用于说明性目的，不是用来作为限定。然而，本发明本身，不论是组织还是操作方法，都可以通过参考下文中结合附图所作的详细描述而得到最好的理解。这些附图是：
图1是把芯片同散热装置接触的先有技术方案的示意图。
图2显示出本发明的一个最佳实施例。
图3是本发明的另一个最佳实施例。
图4是本发明的又一个最佳实施例。
图5是本发明的再一个最佳实施例。
IBM的多层陶瓷(MLC)电子组件属于工业界技术最先进的电子组件，然而，它们也很昂贵。本发明描述一种途径去降低这种组件的成本而没有损失或降低它们的性能。减少成本的组装方法有利地增加在市场上这类电子组件的可获得性。精通本门技术的人知道，增大组装密度通常是由更大地利用片基或模块这个“不动产”来实现的。
图1显示出把芯片20和散热装置10连接起来的一种先有技术方案。通常，首先通过片基或模块30上的垫片24上的多个焊接球22将芯片20连接到片基或模块上。片基30也能还有一个或多个电子装置(例如去耦电容28)也经过垫片24和焊料球22与片基30相连。对于一些应用，焊料球22和垫片24能用外包装26包装起来。通常使用导热材料16盖在芯片20的暴露表面，从而当盖14放在上面盖住芯片20时在芯片20和帽(或盖)14之间建立直接的热接触。通常提供帽密封垫18以把帽(或盖)14固定在片基或模块30上。现在可用散热装置胶12把散热装置固定在帽(或盖)114上。片基30通常经由I/O(输入/输出)装置32(例如垫片、插脚等)固定到母板或卡40上。
帽(或盖)14通常是金属或陶瓷帽，它放在芯片20上面，并且永久性固定在片基30的表面。这主要是为了防止芯片20、焊料球22、去耦电容28、外包装26以及在片基或模块30上的任何其他暴露的金属物或电路受到机械或化学伤害。众所周知，帽14的泄漏、或盖密封层中的泄漏、或盖14的错位，都可能造成不可恢复的模块成品率损失。这些损失对于昂贵的模块是显著的损失。在片基30的上表面需要一个像框形区域专用于以帽密封垫18来把帽14密封在片基30上。这个框形表面可以在2mm至6mm宽之间。所以，所有装置的放置，例如芯片20、去耦电容28都得限定于这一像框区之内，这通常只有否则会用于其他装置或较大装置的区域的大约50％和70％之间。此外，帽(或盖)14通常使模块总高度增加约30％至约50％。在芯片20和帽14之间必须放置导热剂16，以实现经由散热装置胶12到散热装置10的有效热传递路径。再有，帽(或盖)14的存在对已完成或组装好的模块增加了额外的重量。
图2给出本发明的一个最佳实施例。已经发现，对于某些应用而言，把散热装置直接接合到芯片20的上表面或暴露的表面是精明的。在过去已经试过各种方法，但一直没有发现，带有粘胶41和43的双面、压敏、导热胶带42提供了从芯片20到散热装置10的最好的导热路径。这种胶带42还提供了二次生产能力，因为能把散热装置10容易地取下来以再制或修正模块上的任何部件。
通常，在把芯片20的一个表面适当地固定在片基30上之后，把双面导热胶带42固定在芯片20的背面或者说没有焊接球的一面。这可以人工做或用适当的机器做。然后使散热装置10与双面导热胶带42的粘胶43接触并固定在它上面。对于大多数应用而言，散热装置10将挂在芯片20的边缘上，即散热装置20的外缘部分延伸到芯片20的外缘部分以外。应该小心不要让散热装置10影响可能放在片基30上或放在附近的其他电子部件。
如在图2中能清楚看取的那样，由于去掉了帽14、导热材料16、由密封垫18和散热装置粘胶12，在MLC组装技术中已得到了巨大的收益。同一芯片20现在更靠近散热装置或散热器10，于是现在芯片20将冷却得更快和更有效。此外，在片基30上现在能得到更大的“地皮”去放置更多或更大的电子部件。
本发明的简化的电子组件将代替现有的帽/密封/导热剂外包装系统。用于包装至少是焊料柱或球22一部分和垫片24的最佳外包装26是EPX5341外包装。EPX5341是IBM公司(Armonk，NY，美国)的注册商标。第一，它改善了焊料球或焊料柱的疲劳可靠性，第二，它提供了有效的屏防止环境和处理过程中的暴露。
图3给出本发明的另一个最佳实施例，这里芯片20在片基130上，而片基130与一卡或母板140相连。已经发现，对于某些应用而言，在用双面压敏导热胶带42把芯片20固定在散热装置10之前，把芯片20、片基130、第一外包装26的一部分用第二外包装50包装起来会更好。为了保证第二外包装50不会超过片基130的边缘，可以使用隔墙48，例如聚合物隔墙48。
环境保护可由第二外包装50提供，这种外包装如UV(紫外线)凝固的尿烷外套50(称为C5)，它罩在第一外套(如EPX5341)和暴露的片基金属物上。C5是IBM公司(Armonk，纽约，美国)的注册商标。通常C5是以液体形式配制的，在配制C5之前需要配制和凝固第三级聚合物，称为Hysol。Hysol是Dextez电子材料公司(In-dustry，CA，美国)的注册商标。Hysol能用作隔墙48能防止C5材料50凝固前的液体C5流过片基30的侧面。C5的另一个功能是保护脆弱的芯片引脚连接器47。应该注意，EPX5341和Hysol需要热凝固。
如图3所示，从片基130到卡或母板140的电连接是经由I/O装置47提供的，例如，导电夹47与卡140的垫片52相连。
图4给出本发明的另一个实施例，这里散热装置70有一个延伸部分63。延伸部分63有一个基本上是平的底面64。延伸部63应该是使散热装置70完全包围片基表面上的电子部件，如芯片20或去耦电容28。再有，延伸部63应该有足够的空间容纳双面导热胶带42，即至少粘胶43的一部分接触散热装置70的一部分，而至少粘胶41的一部分与至少是芯片20上表面的一部分接触。至少一个粘胶层60，例如丙烯酸点(dot)或糊，或环氧树酸或适当的聚合物60，或者加在片基30表面或者加在底面64上，然后利用这个粘胶丙烯酸点或糊60使散热装置70最好是固定在片基30的外围边缘表面。可以使用的一种丙烯酸60是LOCTITE OUTPUT384，这是Loctite公司(Newington，CT，美国)的注册商标。如果用足够量的粘胶60把散热装置70固定在片基30上，那么这还能提供对片基30表面上的由散热装置70包围的电子部件及其他提供环境保护。
图5是本发明的又一个最佳实施例。散热装置70有一唇或突舌65，它在延伸部63外围边缘延伸，而且还沿着至少是片基30外围边缘的一部分延伸。唇65保护散热装置170免于从片基30上敲掉。
由压敏胶带42造成的散热装置170和芯片20之间的连接整体由粘胶连接物60来保证。在一些应用中，由于存在唇或突舌65而不需要粘胶连接物60。再有，与片基30的外缘紧密配合的突舌防止在加载情况下的摇摆、扭转或其他运动。
本专利申请中披露的电子组件或模块的优点是很多的。例如，由于(a)较少的处理步骤去组装模块，(b)去掉了帽、帽密封、导热剂和相关步骤，(c)消除了由于帽错位和帽密封泄漏造成的产量损失等原因，组件的成本能被降低。
再有，所发明的结构提供了对片基顶表面的更有效的利用。因为现在几乎有百分之百的片基顶表面可用于电子部件和其他元件。此外，模块的总高度减小了30％至50％，因为去掉了盖帽，这允许有更多的空间用于冷却装置或允许设计者减小卡的间距。这种组装方案还允许散热装置与芯片直接连接，从而去掉了导热剂并进一步改善了模块的热性能。
使用双面导热胶带的另一个优点是模块的再制作或修理能力。散热装置能容易地从片基或芯片上拨下，而有源装置(如芯片)或无源装置(如去耦电容、散热装置等)或整个模块能再制作或修理。再有，在把散热装置取掉后也能再制作或修理片基表面上的任何电路。当然，一旦完成了再制作或修理，又能把散热装置连接上。
尽管已经结合最佳实施例具体描述了本发明，对于精通本门技术的人们而言，根据上面的描述，显然会有许多替换、修改和变型。所以认为所附权利要求接受任何这种替换、修改和变型作为落入本发明的真正范围和精神。

Claims (28)

1.一种在至少一个芯片和至少一个散热装置之间提供直接导热路径的装置，其特征在于一个双面导热胶带，该胶带把所述散热装置固定在所述至少一个芯片上。
2.如权利要求1的装置，其特征在于所述双面胶带是压敏的。
3.如权利要求1的装置，其特征在于使用至少一个第一电连接把至少所述芯片的一部分固定在片基上。
4.如权利要求3的装置，其特征在于所述至少一个第一电连接的至少一部分被至少一个外包装材料加以外包装。
5.如权利要求3的装置，其特征在于所述至少第一电连接是从焊料球、焊料柱、低熔点焊料或高熔点焊料这一组中选出的。
6.如权利要求3的装置，其特征在于所述片基至少有一个附加电子装置固定其上。
7.如权利要求6的装置，其特征在于所述至少一个附加电子装置是一个去耦电容。
8.如权利要求1的装置，其特征在于使用至少一个第一电连接把至少是所述芯片的一部分固定在片基上，所述片基本身又用至少一个第二电连接固定在一块卡上。
9.如权利要求8的装置，其特征在于所述第二电连接是从焊料球、焊料柱、低熔点焊料、高熔点焊料、垫片或夹子一组中选出的。
10.如权利要求1的装置，其特征在于所述芯片的至少一部分被固定于一片基上，所述片基有一个隔墙以保持至少一种外包装材料。
11.如权利要求3的装置，其特征在于一部分所述散热装置有一个延伸部分，所述延伸部分的至少一部分被固定在所述片基上。
12.如权利要求3的装置，其特征在于所述散热装置的至少一部分有一个延伸部分，所述延伸部分有一起出所述片基外围边缘的唇部。
13.如权利要求11的装置，其特征在于所述延伸部分有一个基面，所述基面的至少一部分用粘胶固定在所述片基外围边缘的至少一部分上。
14.如权利要求13的装置，其特征在于用于所述粘胶的材料是丙烯酸、环氧树脂、或聚合材料中选出的。
15.一种在至少一个芯片和至少一个散热装置之间提供直接导热路径的装置的制造方法，其特征在于所述方法包括：把至少是一双面导热胶带的第一部分固定在所述芯片的一个表面，并把第二部分固定在所述散热装置的至少一部分上。
16.如权利要求15的方法，其特征在于所述双面胶带是压敏的。
17.如权利要求15的方法，其特征在于所述芯片的至少一部分被用至少一个第一电连接固定于一片基上。
18.如权利要求17的方法，其特征在于所述至少一个第一电连接被至少一个外包装材料外包装。
19.如权利要求17的方法，其特征在于所述至少一个第一电连接是从焊料球、焊料柱、低熔点焊料、或高熔点焊料一组中选出的。
20.如权利要求17的方法，其特征在于所述片基有至少一个附加电子装置固定其上。
21.如权利要求20的方法，其特征在于所述至少一个附加电子装置是一个解耦电容。
22.如权利要求15的方法，其特征在于所述芯片的至少一部分被用至少一个第一电连接固定于一片基上，所述片基用至少一个第二电连接固定于一卡上。
23.如权利要求22的方法，其特征在于所述第二电连接是从焊料球、焊料注、低熔点焊料、高熔点焊料、垫片或夹子一组中选出的。
24.如权利要求15的方法，其特征在于所述芯片的至少一部分被固定于一片基上，所述片基有隔墙以保持至少一种外包装材料。
25.如权利要求17的方法，其特征在于至少一部分所述散热装置有一延伸部，至少一部分所述延伸部被固定于所述片基。
26.如权利要求17的方法，其特征在于所述散热装置的至少一部分有一延伸部分，所述延伸部分有一唇部延伸到所述片基外围边缘的外部。
27.如权利要求25的方法，其特征在于所述延伸部有一基面，至少所述基面的一部分用粘胶固定于所述片基外围边缘的至少一部分上。
28.如权利要求27的方法，其特征在于用作所粘胶的材料是从丙烯酸、环氧树脂或聚合材料组中选出的。
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KR960006721A (ko) 1996-02-23
EP0693780A2 (en) 1996-01-24
MY115354A (en) 2003-05-31
JPH0846098A (ja) 1996-02-16
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US5533256A (en) 1996-07-09
CN1120736A (zh) 1996-04-17
EP0693780A3 (en) 1997-05-28

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