CN105027307B - 热电变换装置以及其制造方法 - Google Patents

热电变换装置以及其制造方法 Download PDF

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Publication number
CN105027307B
CN105027307B CN201480011304.6A CN201480011304A CN105027307B CN 105027307 B CN105027307 B CN 105027307B CN 201480011304 A CN201480011304 A CN 201480011304A CN 105027307 B CN105027307 B CN 105027307B
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CN
China
Prior art keywords
thermoelectric conversion
base material
insulating base
pattern
conversion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201480011304.6A
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English (en)
Chinese (zh)
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CN105027307A (zh
Inventor
白石芳彦
坂井田敦资
谷口敏尚
斋藤启太
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Denso Corp
Toyota Motor Corp
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Denso Corp
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Publication date
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Publication of CN105027307A publication Critical patent/CN105027307A/zh
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Publication of CN105027307B publication Critical patent/CN105027307B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Laminated Bodies (AREA)
CN201480011304.6A 2013-03-05 2014-03-05 热电变换装置以及其制造方法 Expired - Fee Related CN105027307B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013-043089 2013-03-05
JP2013043089 2013-03-05
JP2013-212413 2013-10-10
JP2013212413A JP6064861B2 (ja) 2013-03-05 2013-10-10 熱電変換装置の製造方法
PCT/JP2014/055635 WO2014136841A1 (ja) 2013-03-05 2014-03-05 熱電変換装置およびその製造方法

Publications (2)

Publication Number Publication Date
CN105027307A CN105027307A (zh) 2015-11-04
CN105027307B true CN105027307B (zh) 2017-12-26

Family

ID=51491350

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480011304.6A Expired - Fee Related CN105027307B (zh) 2013-03-05 2014-03-05 热电变换装置以及其制造方法

Country Status (7)

Country Link
US (1) US20160027984A1 (enExample)
EP (1) EP2966699A4 (enExample)
JP (1) JP6064861B2 (enExample)
KR (1) KR101887975B1 (enExample)
CN (1) CN105027307B (enExample)
TW (1) TWI535079B (enExample)
WO (1) WO2014136841A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014007376A (ja) * 2012-05-30 2014-01-16 Denso Corp 熱電変換装置
JP6183327B2 (ja) 2014-09-30 2017-08-23 株式会社デンソー 熱電変換装置
CN108886084A (zh) * 2016-03-31 2018-11-23 株式会社村田制作所 热电转换模块以及热电转换模块的制造方法
CN105870314B (zh) * 2016-04-26 2018-08-07 桂林电子科技大学 一种柔性硅基纳米薄膜热电器件
KR101931634B1 (ko) * 2016-06-01 2018-12-21 엘지이노텍 주식회사 열전 레그 및 이를 포함하는 열전 소자
DE102016209683A1 (de) * 2016-06-02 2017-12-07 Mahle International Gmbh Thermoelektrisches Modul
EP3550618B1 (en) * 2016-11-29 2020-10-07 KYOCERA Corporation Thermoelectric module
JP7203037B2 (ja) 2017-03-31 2023-01-12 スリーエム イノベイティブ プロパティズ カンパニー 固体半導体ダイを含む電子機器
AR113022A1 (es) 2017-09-29 2020-01-15 Lilly Co Eli Anticuerpo anti-pacap
JP6988630B2 (ja) * 2018-03-26 2022-01-05 株式会社デンソー 熱流束センサの製造方法
JP7315377B2 (ja) 2018-10-05 2023-07-26 株式会社Kelk 熱電モジュール
TWI869155B (zh) * 2024-01-08 2025-01-01 國立成功大學 可撓式熱電發電模組及其製作方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
JP2003309294A (ja) * 2002-02-12 2003-10-31 Komatsu Ltd 熱電モジュール
JP2005217353A (ja) * 2004-02-02 2005-08-11 Yokohama Teikoki Kk 熱電半導体素子、熱電変換モジュールおよびその製造方法
JP2006294931A (ja) * 2005-04-12 2006-10-26 Toyota Industries Corp 熱電モジュールの製造方法及び熱電モジュール
JP2009111137A (ja) * 2007-10-30 2009-05-21 Toyota Motor Corp 熱電変換部材の配列方法
JP2009170438A (ja) * 2007-10-23 2009-07-30 Ibiden Co Ltd 熱電変換装置の製造方法
CN101542763A (zh) * 2006-11-21 2009-09-23 赢创德固赛有限责任公司 热电元件、其制造方法及其使用
JP2010157645A (ja) * 2008-12-29 2010-07-15 National Institute Of Advanced Industrial Science & Technology 熱電発電ユニット

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179375A (ja) * 1988-01-05 1989-07-17 Agency Of Ind Science & Technol 熱電モジュール
DE69132779T2 (de) * 1990-04-20 2002-07-11 Matsushita Electric Industrial Co., Ltd. Vakuumisolierter thermoelektrischer Halbleiter und thermoelektrisches Bauelement, das P- und N-Typ thermoelektrische Halbleiter benutzt
JP2003282974A (ja) 2002-03-26 2003-10-03 Yamaha Corp 熱電変換モジュール
JP2004087913A (ja) * 2002-08-28 2004-03-18 Yamaha Corp 銅メッキセラミックス基板およびその製造方法ならびに銅メッキセラミックス基板を備えた熱電モジュール
JP2005223140A (ja) * 2004-02-05 2005-08-18 Toshiba Corp 熱電変換モジュール及び熱電変換システム
US20080289677A1 (en) * 2007-05-25 2008-11-27 Bsst Llc Composite thermoelectric materials and method of manufacture
JP2010050356A (ja) 2008-08-22 2010-03-04 Shin-Etsu Chemical Co Ltd ヘテロ接合太陽電池の製造方法及びヘテロ接合太陽電池
JP5733678B2 (ja) * 2010-12-24 2015-06-10 日立化成株式会社 熱電変換モジュールおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
JP2003309294A (ja) * 2002-02-12 2003-10-31 Komatsu Ltd 熱電モジュール
JP2005217353A (ja) * 2004-02-02 2005-08-11 Yokohama Teikoki Kk 熱電半導体素子、熱電変換モジュールおよびその製造方法
JP2006294931A (ja) * 2005-04-12 2006-10-26 Toyota Industries Corp 熱電モジュールの製造方法及び熱電モジュール
CN101542763A (zh) * 2006-11-21 2009-09-23 赢创德固赛有限责任公司 热电元件、其制造方法及其使用
JP2009170438A (ja) * 2007-10-23 2009-07-30 Ibiden Co Ltd 熱電変換装置の製造方法
JP2009111137A (ja) * 2007-10-30 2009-05-21 Toyota Motor Corp 熱電変換部材の配列方法
JP2010157645A (ja) * 2008-12-29 2010-07-15 National Institute Of Advanced Industrial Science & Technology 熱電発電ユニット

Also Published As

Publication number Publication date
CN105027307A (zh) 2015-11-04
KR101887975B1 (ko) 2018-08-14
KR20150113155A (ko) 2015-10-07
JP6064861B2 (ja) 2017-01-25
TWI535079B (zh) 2016-05-21
TW201501377A (zh) 2015-01-01
US20160027984A1 (en) 2016-01-28
EP2966699A8 (en) 2016-03-23
EP2966699A4 (en) 2017-02-01
WO2014136841A1 (ja) 2014-09-12
JP2014197660A (ja) 2014-10-16
EP2966699A1 (en) 2016-01-13

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Effective date of registration: 20200925

Address after: Aichi Prefecture, Japan

Patentee after: DENSO Corp.

Patentee after: Toyota Motor Corp.

Address before: Aichi Prefecture, Japan

Patentee before: DENSO Corp.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171226