CN104969304A - 用于电绝缘体的浸渍树脂、电绝缘体和用于制造电绝缘体的方法 - Google Patents
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Abstract
本发明涉及一种用于电绝缘体的浸渍树脂,所述浸渍树脂具有基础树脂、具有纳米级颗粒的填充材料和用于自由基聚合的活性稀释剂。本发明还涉及一种具有浸渍树脂的电绝缘体以及一种用于制造所述电绝缘体的方法。
Description
技术领域
本发明涉及一种用于电绝缘体的浸渍树脂、一种电绝缘体和一种用于制造电绝缘体的方法。
背景技术
电机械、例如马达和发电机具有电导体、主绝缘部和定子叠片组。主绝缘部用于将导体相对彼此、相对于定子叠片组和相对于周围环境电绝缘的目的。在电机械运转时,通过局部放电能够形成火花,所述火花能够在主绝缘部中形成所谓的“树枝状”通道。由于“树枝状”通道能够导致电击穿主绝缘部。通过在主绝缘部中应用具有高的局部放电抗性的云母实现防止局部放电的阻挡部。云母以小板状的,常规颗粒大小为几百微米至几毫米的云母颗粒的形式使用,其中云母颗粒被加工成云母纸。为提高强度和改进可加工性,应用电绝缘带,所述电绝缘带除了云母纸外具有载体结构。
为制造主绝缘部,电绝缘带围绕导体缠绕。接着借助合成树脂浸渍电绝缘带并且紧接着硬化合成树脂。为改进主绝缘部的局部放电抗性,已知应用纳米级颗粒,所述纳米级颗粒在浸渍前分散在合成树脂中。然而所述颗粒的存在缩短合成树脂的使用寿命。这尤其在合成树脂的逐渐的聚合中表现出来,其导致合成树脂的粘性上升进而使电绝缘带的浸渍变困难。
发明内容
本发明的目的是提供用于电绝缘体的浸渍树脂,其中不仅浸渍树脂而且电绝缘体具有长的使用寿命。
根据本发明的用于电绝缘体的浸渍树脂具有基础树脂、具有纳米级颗粒的填充材料和用于自由基聚合的活性稀释剂。活性稀释剂具有比基础树脂更低的粘性,由此与在具有相同粘性的、但不具有活性稀释剂的类似的浸渍树脂的情况相比,在根据本发明的浸渍树脂中能够实现纳米级颗粒的更高的质量份额。通过活性稀释剂的存在降低了浸渍树脂中的基础树脂的浓度,由此基础树脂的聚合速度降低进而有利地延长其使用寿命。
m(活性稀释剂)/(m(基础树脂)+m(活性稀释剂))的比例优选为0.3至0.7,尤其优选为0.4至0.6,其中m(基础树脂)和m(活性稀释剂)分别是在浸渍树脂中的基础树脂的质量和活性稀释剂的质量。借助该比例,在硬化的浸渍树脂强度高的同时,能够有利地在浸渍树脂中实现纳米级颗粒的尤其高的质量份额。
活性稀释剂优选是苯乙烯、乙烯基甲苯、尤其是邻乙烯基甲苯、间乙烯基甲苯和/或对乙烯基甲苯、丙烯酸烷基酯和/或烷二醇二丙烯酸酯、尤其是己二醇二丙烯酸酯、尤其是1,6-己二醇二丙烯酸酯。这些化合物有利地具有尤其低的粘性,那么苯乙烯的粘性例如位于0.7和0.8mPa*s之间进而比水的粘性低大约20%。
优选地,基础树脂是环氧树脂、聚酯酰亚胺、尤其是不饱和的聚酯酰亚胺、聚酯、尤其是不饱和的聚酯、和/或聚氨酯。环氧树脂优选具有双酚-A-二缩水甘油醚、双酚-F-二缩水甘油醚、酚醛树脂、脂肪族的环氧化物和/或脂环族的环氧化物。此外优选的是,环氧树脂具有环状的羧酸酐、尤其是马来酸酐、邻苯二甲酸酐、甲基六氢苯酸酐和/或六氢苯酸酐。此外优选的是,所述环氧树脂具有作为固化剂的胺。所有上述基础树脂为用于非自由基聚合的树脂,所述用于非自由基聚合的树脂不与用于自由基聚合的活性稀释剂反应。由此并且通过活性稀释剂的存在降低在浸渍树脂中的基础树脂的浓度,基础树脂的聚合速度降低。由此浸渍树脂在浸渍前有利地具有尤其长的使用寿命。
优选地,浸渍树脂具有用于交联基础树脂和活性稀释剂的交联剂,尤其是二环[2.2.1]庚-5-烯-2,3-二羧基酸酐、1-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐、2-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐、5-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐和/或7-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐作为交联剂。在浸渍树脂的硬化时,交联剂的烯烃基团在活性稀释剂的自由基链生长时共同地嵌入活性稀释剂的聚合的网络中。同时,交联剂的酸酐基团嵌入基础树脂的聚合的网络中。通过交联剂有利地得到硬化的浸渍树脂的高的强度。
优选地,所述浸渍树脂具有带有颗粒的第二填充材料,所述颗粒具有大约100nm至大约100μm的平均直径。纳米级的颗粒和/或第二填充材料的颗粒优选地是无机的颗粒,所述无机的颗粒具有尤其是氧化铝、氢氧化铝、二氧化硅、二氧化钛、稀土氧化物、碱金属氧化物、金属氮化物和/或层状硅酸盐、尤其是剥落的或者部分剥落的层状硅酸盐。纳米级的颗粒能够例如通过原位方法或者通过火焰热解方法来制造。层状硅酸盐能够不仅源于天然而且能够源于合成。用于所述颗粒的所提出的材料不加速活性稀释剂的聚合,使得浸渍树脂有利地具有长的使用寿命。纳米级的颗粒的平均颗粒直径优选地在大约1nm至大约100nm之间。通过因颗粒与烷基烷氧基硅烷、尤其是甲基三甲氧基硅烷、二甲基二甲氧基硅烷和/或三甲基甲氧基硅烷的反应而引起的颗粒表面的硅烷化,颗粒的表面能够被亲有机化,使得颗粒有利地与由羧酸酐和环氧乙烷的混合物更好地混合并且不那么强地加速基础树脂的聚合。
此外优选的是,表面被硅烷化,使得表面作为用于交联基础树脂和活性稀释剂的交联剂。
根据本发明的电绝缘体具有电绝缘带,优选具有由浸渍树脂浸透的云母和/或氧化铝的电绝缘带。
通过制造与不具有反应加速剂的、但具有相同粘性的类似的渍树脂相比具有更高的质量份额的纳米级的颗粒的根据本发明的浸渍树脂,也能够制造与具有类似的浸渍树脂的类似的电绝缘体相比具有更高质量份额的纳米级颗粒的电绝缘体。由此,该电绝缘体的使用寿命与类似的电绝缘体的使用寿命相比更长。此外,通过更高的质量份额的纳米级颗粒提高了电绝缘体的热导率,这进一步提高了它的使用寿命。
m(浸渍树脂)/(m(浸渍树脂)+m(电绝缘带))的比例优选为0.1至0.6,其中m(浸渍树脂)和m(电绝缘带)分别为电绝缘体中的浸渍树脂的质量和电绝缘带的质量。在此,当电绝缘带以“富含树脂方法”浸渍时,能够在电绝缘体中实现浸渍树脂的高的质量份额。在此,浸渍树脂借助于热压被压入电绝缘带中并且紧借助通过输送热来热压而被硬化。连同在浸渍树脂中的纳米级颗粒的高的可实现的质量份额一起,能够有利地实现电绝缘体中的超过50%的纳米级颗粒的质量份额。
优选地,电绝缘体的电绝缘带具有乙酰丙酮铬、环烷酸锌和/或具有结构式R1CO2-R2CO2-Zn2+的化合物作为反应加速剂,其中R1和R2分别彼此独立地为直连或者分枝的烷基团,尤其是C6-烷基、C7-烷基、C8-烷基、C9-烷基或者C10-烷基。反应加速剂加速基础树脂的聚合并且优选在浸渍前存在于电绝缘带中,使得基础树脂的聚合有利地在浸渍后才发生。具有结构式R1CO2-R2CO2-Zn2+的化合物与环烷酸锌相比,有利地得到更高的纯度并且具有更小的质量波动,使得电绝缘体的硬化与借助环烷酸锌相比能够有利更简单地实现。
优选地,电绝缘带具有自由基引发剂,尤其是过氧化烷、过氧化烷酰、过氧化芳、尤其是过氧化二异丙苯、和/或过氧化酰、尤其是2,5-二甲基-2,5-二苯甲酰过氧己烷和/或过氧化苯甲酰。自由基引发剂引发活性稀释剂的链生长并且优选在浸渍前已经存在于电绝缘带中,使得活性稀释剂的聚合有利地在浸渍之后才发生。反应引发剂的裂解进而链生长能够例如通过热输送或者通过用光、优选用紫外光辐照来引发。优选地,浸渍树脂具有苯醌作为用于自由基聚合的稳定剂。
用于制造电绝缘体的根据本发明的方法具有如下步骤:a)借助于a1)混合填充材料与活性稀释剂;a2)混合活性稀释剂与基础树脂来制备浸渍树脂;b)借助浸渍树脂浸透电绝缘带;c)硬化浸渍树脂。
首先通过混合填充材料与活性稀释剂,进行至少部分地覆盖纳米级的颗粒与活性稀释剂的表面,使得基础树脂至少部分地由纳米级的颗粒屏蔽,以至于纳米级的颗粒不那么强烈地加速基础树脂的聚合。因此,尽管存在纳米级的颗粒,但仍有利地得到浸渍树脂的长的使用寿命。
在浸渍期间或者在浸渍后,活性稀释剂全部或者部分地从浸渍树脂中除去是可考虑的。同样可考虑的是,活性稀释剂留在浸渍树脂中并且与浸渍树脂共同硬化。
用于制造电绝缘体的方法尤其具有如下步骤:a3)通过借助添加基础树脂的低聚物或者基础树脂的组分的低聚物,尤其具有至少两个环氧基团的环氧化物的低聚物,尤其双酚-A-二缩水甘油醚的低聚物和/或双酚-F-二缩水甘油醚的低聚物来提高粘性的方式调节浸渍树脂的粘性。通过粘性的调节能够有利地抑制在浸渍中的浸渍缺陷并且实现在电绝缘体中的浸渍树脂的最优质量份额。
具体实施方式
通过下面两个实例详细来阐述本发明。
在第一实施例中制备浸渍树脂,其中首先制造作为活性稀释剂的苯乙烯和填充材料的混合物,所述填充材料由平均颗粒直径为20nm的二氧化钛颗粒构成的颗粒组成。紧接着,混合物与由双酚-A-二缩水甘油醚和邻苯二甲酸酐构成的化学计量的混合物构成的基础树脂混合。在此,选择m(活性稀释剂)/(m(基础树脂)+m(活性稀释剂))的比例=0.4并且选择m(填充材料)/(m(填充材料)+m(活性稀释剂)+m(基础树脂))的比例=0.05至0.6,其中m(基础树脂)、m(活性稀释剂)和m(填充材料)分别为浸渍树脂中的基础树脂、活性稀释剂和填充材料的质量。
借助具有云母的电绝缘带卷绕电导体。电绝缘带具有作为用于基础树脂的反应加速剂的环烷酸锌并且具有作为用于活性稀释剂的反应引发剂的过氧化苯甲酰。电绝缘带由浸渍树脂以“富含树脂方法”浸透,使得m(浸渍树脂)/(m(浸渍树脂)+m(电绝缘带))的比例等于0.5,其中m(浸渍树脂)和m(电绝缘带)分别为浸渍树脂的质量和电绝缘带的质量。通过输送热来硬化浸渍树脂并且制成电绝缘体。
在第二实例中制备浸渍树脂,其中首先制备作为活性稀释剂的乙烯甲苯和填充材料的混合物,所述填充材料由平均颗粒直径为15nm的氧化铝颗粒构成。紧接着将该混合物与由双酚-F-二缩水甘油醚和马来酸酐的化学计量的混合物构成的基础树脂混合。在此,选择m(活性稀释剂)/(m(基础树脂)+m(活性稀释剂))的比例=0.6并且选择m(填充材料)/(m(填充材料)+m(活性稀释剂)+m(基础树脂))的比例=0.5,其中m(基础树脂)、m(活性稀释剂)和m(填充材料)分别为在浸渍树脂中的基础树脂、活性稀释剂和填充材料的质量。此外,浸渍树脂具有1质量百分比的甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐作为交联剂。
借助具有云母的电绝缘带卷绕电导体。电绝缘带具有作为用于基础树脂的反应加速剂的萘锌酸并且具有作为用于活性稀释剂的反应引发剂的过氧化苯甲酰。电绝缘带由浸渍树脂以“富含树脂方法”被浸透,使得m(浸渍树脂)/(m(浸渍树脂)+m(电绝缘带))的比例=0.5,其中m(浸渍树脂)和m(电绝缘带)分别为浸渍树脂的质量和电绝缘带的质量。通过输送热来硬化浸渍树脂并且制成电绝缘体。
虽然详尽地通过优选的实施例详尽说明和描述本发明,但是本发明不限制于公开的示例,并且其他的变型形式能够由本领域技术人员从中导出,而不脱离本发明的保护范围。
Claims (10)
1.一种用于电绝缘体的浸渍树脂,
所述浸渍树脂具有基础树脂、具有纳米级颗粒的填充材料和用于自由基聚合的活性稀释剂,其中所述浸渍树脂具有用于交联所述基础树脂和所述活性稀释剂的交联剂。
2.根据权利要求1所述的浸渍树脂,
其中m(活性稀释剂)/(m(基础树脂)+m(活性稀释剂))的比例为0.3至0.7,尤其优选为0.4至0.6,其中m(基础树脂)和m(活性稀释剂)分别是所述浸渍树脂中的基础树脂的质量和活性稀释剂的质量。
3.根据权利要求1或者2所述的浸渍树脂,
其中所述活性稀释剂是苯乙烯、乙烯基甲苯、尤其是邻乙烯基甲苯、间乙烯基甲苯和/或对乙烯基甲苯、丙烯酸烷基酯和/或烷二醇二丙烯酸酯、尤其是己二醇二丙烯酸酯、尤其是1,6-己二醇二丙烯酸酯。
4.根据权利要求1至3中任意一项所述的浸渍树脂,
其中所述基础树脂是环氧树脂、聚酯酰亚胺、尤其是不饱和的聚酯酰亚胺、聚酯、尤其是不饱和的聚酯、和/或聚氨酯。
5.根据权利要求1至4中任意一项所述的浸渍树脂,
其中所述交联剂是二环[2.2.1]庚-5-烯-2,3-二羧基酸酐、1-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐、2-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐、5-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐和/或7-甲基二环[2.2.1]庚-5-烯-2,3-二羧基酸酐。
6.根据权利要求1至5中任意一项所述的浸渍树脂,
其中所述纳米级颗粒是无机的颗粒,所述无机的颗粒尤其具有氧化铝、氢氧化铝、二氧化硅、二氧化钛、稀土氧化物、碱金属氧化物、金属氮化物和/或层状硅酸盐、尤其是剥落的或者部分剥落的层状硅酸盐。
7.一种电绝缘体,其具有电绝缘带,优选为具有云母和/或氧化铝的电绝缘带,所述电绝缘带由根据权利要求1至6中任意一项所述的浸渍树脂浸透。
8.根据权利要求7所述的电绝缘体,
其中m(浸渍树脂)/(m(浸渍树脂)+m(电绝缘带))的比例优选为0.1至0.6,其中m(浸渍树脂)和m(电绝缘带)分别为所述电绝缘体中的所述浸渍树脂的质量和所述电绝缘带的质量。
9.一种用于制造具有电绝缘带的电绝缘体的方法,其具有如下步骤:
a)借助于如下步骤制备浸渍树脂,所述浸渍树脂具有基础树脂、具有纳米级颗粒的填充材料和用于自由基聚合的活性稀释剂,
a1)混合所述填充材料与所述活性稀释剂;
a2)混合所述活性稀释剂与所述基础树脂;
b)借助所述浸渍树脂浸透所述电绝缘带;
c)硬化所述浸渍树脂。
10.根据权利要求9所述的方法,
其中所述方法具有如下步骤:
a3)通过借助添加所述基础树脂的低聚物或者所述基础树脂的组分的低聚物、尤其是具有至少两个环氧基团的环氧化物的低聚物、尤其是双酚-A-二缩水甘油醚的低聚物和/或双酚-F-二缩水甘油醚的低聚物来提高粘性的方式来调节所述浸渍树脂的粘性。
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- 2014-01-24 EP EP14703300.5A patent/EP2920795B1/de active Active
- 2014-01-24 RU RU2015137705A patent/RU2648981C2/ru not_active IP Right Cessation
- 2014-01-24 WO PCT/EP2014/051358 patent/WO2014118081A1/de active Application Filing
- 2014-01-24 CN CN201480007399.4A patent/CN104969304B/zh active Active
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Also Published As
Publication number | Publication date |
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JP2016511303A (ja) | 2016-04-14 |
WO2014118081A1 (de) | 2014-08-07 |
JP6147870B2 (ja) | 2017-06-14 |
CN104969304B (zh) | 2016-10-19 |
EP2920795A1 (de) | 2015-09-23 |
RU2015137705A (ru) | 2017-03-10 |
US9884950B2 (en) | 2018-02-06 |
RU2648981C2 (ru) | 2018-03-29 |
SA516371098B1 (ar) | 2017-10-23 |
SA515360836B1 (ar) | 2016-06-16 |
EP2763142A1 (de) | 2014-08-06 |
EP2920795B1 (de) | 2016-11-02 |
US20150361245A1 (en) | 2015-12-17 |
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