CN104968747B - 用于粘附半导体芯片的硅橡胶组合物 - Google Patents

用于粘附半导体芯片的硅橡胶组合物 Download PDF

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Publication number
CN104968747B
CN104968747B CN201480006315.5A CN201480006315A CN104968747B CN 104968747 B CN104968747 B CN 104968747B CN 201480006315 A CN201480006315 A CN 201480006315A CN 104968747 B CN104968747 B CN 104968747B
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composition
rubber composition
semiconductor chip
attaching semiconductor
organopolysiloxane
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Chinese (zh)
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CN104968747A (zh
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崔诚桓
柳装铉
李镕晙
李承桓
崔根默
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KCC Corp
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KCC Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Chemistry (AREA)
CN201480006315.5A 2013-01-29 2014-01-29 用于粘附半导体芯片的硅橡胶组合物 Active CN104968747B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20130009605 2013-01-29
KR10-2013-0009605 2013-01-29
PCT/KR2014/000858 WO2014119930A1 (fr) 2013-01-29 2014-01-29 Composition de caoutchouc de silicone pour faire adhérer une puce à semi-conducteur

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CN104968747A CN104968747A (zh) 2015-10-07
CN104968747B true CN104968747B (zh) 2017-03-08

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KR (1) KR101733529B1 (fr)
CN (1) CN104968747B (fr)
PH (1) PH12015501577B1 (fr)
WO (1) WO2014119930A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI663236B (zh) * 2014-10-16 2019-06-21 Dow Silicones Corporation 聚矽氧組合物及具有由該組合物製得之壓敏性黏著層的壓敏性黏著膜
TW201625754A (zh) * 2014-11-21 2016-07-16 艾倫塔斯有限公司 單一成份、儲存穩定、可硬化之聚矽氧組成物
CN106317894B (zh) * 2015-06-30 2019-03-29 比亚迪股份有限公司 有机硅组合物、反光涂层及其制备方法与包括其的光伏组件
KR20170047540A (ko) * 2015-10-23 2017-05-08 동우 화인켐 주식회사 실리콘 점착제 조성물
CN113227302B (zh) * 2018-12-07 2023-07-07 信越化学工业株式会社 紫外线固化型有机硅压敏粘合剂组合物及其固化物
JP7427542B2 (ja) * 2020-06-15 2024-02-05 信越化学工業株式会社 シリコーンゴムスポンジ組成物及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000129132A (ja) * 1998-10-28 2000-05-09 Dow Corning Corp シリコ―ン組成物、それらの製造法及びシリコ―ンエラストマ―
CN102174309A (zh) * 2011-01-13 2011-09-07 深圳市森日有机硅材料有限公司 一种无溶剂型的有机硅压敏胶粘剂及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001019928A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
US6121368A (en) * 1999-09-07 2000-09-19 Dow Corning Corporation Silicone composition and silicone pressure sensitive adhesive formed therefrom
JP5445415B2 (ja) * 2010-09-21 2014-03-19 信越化学工業株式会社 熱伝導性シリコーン接着剤組成物及び熱伝導性シリコーンエラストマー成形品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000129132A (ja) * 1998-10-28 2000-05-09 Dow Corning Corp シリコ―ン組成物、それらの製造法及びシリコ―ンエラストマ―
CN102174309A (zh) * 2011-01-13 2011-09-07 深圳市森日有机硅材料有限公司 一种无溶剂型的有机硅压敏胶粘剂及其制备方法

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Publication number Publication date
KR101733529B1 (ko) 2017-05-08
PH12015501577A1 (en) 2015-10-05
WO2014119930A1 (fr) 2014-08-07
PH12015501577B1 (en) 2015-10-05
KR20150105636A (ko) 2015-09-17
CN104968747A (zh) 2015-10-07

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