WO2014002919A1 - Agent de revêtement, équipement électrique-électronique, et procédé de protection de parties métalliques de l'équipement électrique-électronique - Google Patents

Agent de revêtement, équipement électrique-électronique, et procédé de protection de parties métalliques de l'équipement électrique-électronique Download PDF

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Publication number
WO2014002919A1
WO2014002919A1 PCT/JP2013/067164 JP2013067164W WO2014002919A1 WO 2014002919 A1 WO2014002919 A1 WO 2014002919A1 JP 2013067164 W JP2013067164 W JP 2013067164W WO 2014002919 A1 WO2014002919 A1 WO 2014002919A1
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group
groups
polycyclic aromatic
condensed polycyclic
coating agent
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PCT/JP2013/067164
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English (en)
Inventor
Yoshitsugu Morita
Masaaki Amako
Michitaka Suto
Katsuya Baba
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Dow Corning Toray Co., Ltd.
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Priority to KR1020147036466A priority Critical patent/KR102145008B1/ko
Publication of WO2014002919A1 publication Critical patent/WO2014002919A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • the present invention relates to a coating agent, an electrical-electronic equipment where metal parts are protected by a cured product of the coating agent, and a method for protecting a metal part of an electrical-electronic equipment by the coating agent.
  • Coating agents composed of curable_silicone ompositions have-been-used-for- protecting electrical-electronic equipments from moisture and dirt.
  • metal parts such as the electrodes of electrical-electronic equipment, electrical circuits on the circuit board, and the like are made of a substance that readily corrodes due to a corrosive substance, there has been a problem in that such metal parts become corroded due to corrosive substances present in the surrounding environment.
  • the object of the present invention is to provide a coating agent for suppression of corrosion of metal parts of electrical-electronic equipment by corrosive substances, to provide an electrical-electronic equipment in which corrosion of metal parts by corrosive substances is suppressed, and to provide a method for suppressing corrosion of metal parts of an electrical-electronic equipment by corrosive substances. Disclosure of Invention
  • the coating agent of the present invention comprises an organopolysiloxane having a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • the electrical-electronic equipment of the present invention is covered by a cured product of the coating agent.
  • the method for protecting a metal part of an electrical-electronic equipment of the present invention comprises the steps of: applying the coating agent to a metal part of an electrical-electronic equipment to be subjected to exposure to a corrosive substance; and curing the coating agent.
  • the coating agent of the present invention can suppress corrosion of metal parts of electrical-electronic equipment by a corrosive substance. Moreover, the
  • electrical-electronic _e.q.uiprnent-o.f-the-present-i-n-vent-i-on is characterized n that-corrosion ⁇ of ⁇ the metal part by the corrosive substance is suppressed. Furthermore, the method for protection of the present invention can suppress corrosion of metal parts of electrical- electronic equipment by a corrosive substance.
  • Figure 1 A is a photograph showing the appearance of a copper plate prior to a corrosion test.
  • Figure IB is a photograph showing the appearance of a copper plate covered by a coating agent prepared according to Comparative Example 1.
  • Figure 1C is a photograph showing the appearance of a copper plate covered by a coating agent prepared according to Practical Example 3.
  • Figure 2A is a photograph showing the appearance of a copper plate after a corrosion test.
  • Figure 2B is a photograph showing the appearance of a copper plate covered by a coating agent prepared according to Comparative Example 1.
  • Figure 2C is a photograph showing the appearance of a copper plate covered by a coating agent prepared according to Practical Example 3.
  • Figure 3 is a photograph showing change over time of appearance of the LED produced in Practical Example 1 during the corrosion test.
  • Figure 4 is a photograph showing change over time of appearance of the LED produced in Practical Example 2 during the corrosion test.
  • Figure 5 is a photograph showing change over time of appearance of the LED produced in Practical Example 3 during the corrosion test.
  • Figure 6 is a photograph showing change over time of appearance of the LED produced in Comparative Example 1 during the corrosion test.
  • the coating agent of the present invention is composed of a curable silicone composition comprising an organopolysiloxane having a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • a curable silicone composition comprising an organopolysiloxane having a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • this condensed polycyclic aromatic group include a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, and such condensed polyaromatic groups where a hydrogen atom is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine
  • the condensed polycyclic aromatic group is preferably the naphthyl group.
  • examples of the group including a condensed polycyclic aromatic group include alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group, an anthracenyl ethyl group, a phenanthryl ethyl group, a pyrenyl ethyl group, and the like; and such groups where a hydrogen atom in the condensed polycyclic aromatic group is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • the alkyl group including a condensed polycyclic aromatic group is particularly preferably the naphth
  • organopolysiloxane having an alkyl group including a condensed polycyclic aromatic group has relatively low viscosity and is characterized as being able to lower viscosity of the present coating agent.
  • the other group bonding to the silicon atoms in this organopolysiloxane is exemplified by alkyl groups, alkenyl groups, phenyl groups, a hydrogen atom, hydroxyl groups, and alkoxy groups.
  • alkyl groups include a methyl group, an ethyl group, a propyl group, and a butyl group; and the alkyl group is preferably the methyl group.
  • Examples of this alkenyl group include a vinyl group, an allyl group, and a butenyl group; and the alkenyl group is preferably the vinyl group.
  • this alkoxy group include a methoxy group, an ethoxy group, and a propoxy group.
  • organopolysiloxane represented by the following average unit formula is preferable.
  • R 1 are alkyl groups, alkenyl groups, phenyl groups or hydrogen atoms.
  • alkyl group for R 1 include a methyl group, an ethyl group, a propyl group, and a butyl group. Of these, a methyl group is preferable.
  • alkenyl group for R 1 include a vinyl group, an allyl group, and a butenyl group. Of these, a vinyl group is preferable.
  • R is an alkyl group, an alkenyl group, a phenyl group, a hydrogen atom, or is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • alkyl group for R 2 include the groups represented by R 1 .
  • alkenyl group for R 2 include the groups represented by R 1 .
  • Examples of the condensed polycyclic aromatic group for R 2 include a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, and such condensed polycyclic aromatic groups where a hydrogen atom is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • the condensed polycyclic aromatic group for R 2 is preferably the naphthyl group.
  • Examples of the group including a condensed polycyclic aromatic group for R 2 include alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group, an anthracenyl ethyl group, a phenanthryl ethyl group, a pyrenyl ethyl group, and the like; and such groups where a hydrogen atom in the condensed polycyclic aromatic group is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group,
  • the group including a condensed polycyclic aromatic group for R 2 is particularly preferably the naphthyl ethyl group.
  • An organopolysiloxane where R is an alkyl group including a condensed polycyclic aromatic group has relatively low viscosity, and this organopolysiloxane is characterized as being able to lower viscosity of the present coating agent.
  • At least one R 1 or R 2 in a molecule is an alkenyl group or hydrogen atom.
  • at least one R 2 in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • at least 50 mol% of R 2 in a molecule are condensed polycyclic aromatic groups or a group including a condensed polycyclic aromatic group.
  • "a”, “b”, “c”, and “d” are numbers that respectively satisfy: 0.05 ⁇ a ⁇ 0.7, 0 ⁇ b ⁇ 0.4, 0.3 ⁇ c ⁇ 0.9, 0 ⁇ d ⁇ 0.2, and a + b + c + d - 1.
  • "a”, “b”, “c”, and “d” are numbers that respectively satisfy: 0.1 ⁇ a ⁇ 0.6, 0 ⁇ b ⁇ 0.3,
  • this organopolysiloxane is represented by the above average unit formula, a small amount of the hydroxyl groups or methoxy groups, ethoxy groups, or the like alkoxy groups may be bonded to silicon atoms in the molecule.
  • organopolysiloxane having silicon-bonded hydroxyl groups or silicon-bonded alkoxy groups may result in improved adhesivity of the present coating agent, may result in improved adhesion of the cured product of the coating agent to the substrate, or may result in improvement of compatibility with other components included in the coating agent.
  • silane compound (I) represented by the general formula:
  • R 3 is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • Examples of the condensed polycyclic aromatic group for R 3 include a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, and such condensed polycyclic aromatic groups where a hydrogen atom is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • the naphthyl group is preferable.
  • Examples of the group including a condensed polycyclic aromatic group for R 3 include alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group, an anthracenyl ethyl group, a phenanthryl ethyl group, a pyrenyl ethyl group, and the like; and such groups where a hydrogen atom in the condensed polycyclic aromatic group is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group,
  • the group including a condensed polycyclic aromatic group for R 3 is particularly preferably the naphthyl ethyl group.
  • X is an alkoxy group, an acyloxy group, a halogen atom, or a hydroxyl group.
  • alkoxy group for X include a methoxy group, an ethoxy group, and a propoxy group.
  • examples of the acyloxy group for X include an acetoxy group.
  • Examples of the halogen atom for X include a chlorine atom, and a bromine atom.
  • This type of silane compound (I) is exemplified by naphthyltrimethoxysilane, anthracenyl trimethoxysilane, phenanthryl trimethoxysilane, pyrenyl trimethoxysilane, naphthyltriethoxysilane, anthracenyl triethoxysilane, phenanthryl triethoxysilane, pyrenyl triethoxysilane, naphthyl ethyl trimethoxysilane, naphthyl propyl trimethoxysilane, anthracenyl ethyl trimethoxysilane, or similar alkoxysilanes; naphthyl triacetoxysilane, anthracenyl triacetoxysilane, phenanthryl triacetoxysilane, pyrenyl triacetoxysilane, or similar acyloxysilanes; naphthyl
  • R 4 is a raw material for introducing M units of siloxane into the obtained organopolysiloxane.
  • R 4 are alkyl groups, alkenyl groups, or phenyl groups.
  • the alkyl group for R 4 include a methyl group, an ethyl group, and a propyl group. Of these, a methyl group is preferable.
  • the alkenyl group for R 4 include a vinyl group, an allyl group, and a butenyl group. Of these, a vinyl group is preferable.
  • This type of disiloxane (II) is exemplified by l j-divinvl-tetramethvldisiloxane, l ,3-divinyl-l ,3-diphenyl-dimethyldisiloxane, l-vinyl-pentamethyldisiloxane, l-vinyl-1 ,3- diphenyl-trimethyldisiloxane, and 1 ,3-diphenyl-tetramethyldisiloxane,
  • this disiloxane (II) is preferably a disiloxane having an alkenyl group.
  • R 4 is synonymous with the groups described above.
  • X is synonymous with the groups described above.
  • diphenylvinylmethoxysilane dimethylvinylethoxysilane, methylphenylvinylethoxysilane, diphenylvinylethoxysilane, trimethylmethoxysilane, dimethylphenylmethoxysilane, or similar alkoxysilanes; dimethylvinylacetoxysilane, methylphenylvinylacetoxysilane, diphenylvinylacetoxysilane, trimethylacetoxysilane, dimethylphenylacetoxysilane, or similar acyloxysilanes; dimethylvinyl chlorosilane, methylphenylvinyl chlorosilane, diphenylvinyl chlorosilane, trimethyl chlorosilane, methylphenyl chlorosilane, or similar halosilanes; and dimethylvinylsilanol, methylphenylvinylsilanol, diphenylvinylsilanol
  • R 4 is synonymous with the groups described above.
  • X is synonymous with the groups described above.
  • n are integers from 2 to 4.
  • This type of silane compound (IV) is exemplified by trimethylmethoxysilane, trimethylethoxysilane, methyldiphenylmethoxysilane, methyldiphenylethoxysilane, dimethyldimethoxysilane, methylphenyldimethoxysilane, diphenyldimethoxysilane, methyltrimethoxysilane, phenyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, or similar alkoxysilanes; trimethylacetoxysilane, methyldiphenylacetoxysilane,
  • dimethyldiacetoxysilane methylphenyldiacetoxysilane, diphenyldiacetoxysilane, methyltriacetoxysilane, phenyltriacetoxysilane, tetraacetoxysilane, or similar
  • acetoxysilanes trimethylchlorosilane, methyldiphenylchlorosilane, dimethyldichlorosilane, methylphenyldichlorosilane, diphenyldichlorosilane, methyltrichlorosilane,
  • phenyltrichlorosilane, tetrachlorosilane, or similar halosilanes and trimethylsilanol, methyldiphenylsilanol, dimethyldihydroxysilane, methylphenyldihydroxysilane, diphenyldihydroxysilane, methyltrihydroxysilane, phenyltrihydroxysilane, or similar hydroxysilanes.
  • At least one of components (II) to (IV) used in the reaction of the preparation method must have an alkenyl group.
  • the preparation method is characterized as performing hydrolysis and condensation reaction of the silane compound (I), the disiloxane (II) and/or the silane compound (III), and as may be required, the silane compound (IV), in the presence of an acid or a base.
  • the charged ratio of each of the components is the ratio such that the obtained organopolysiloxane has the average unit formula below:
  • R 4 is synonymous with the groups described above.
  • R 5 is a group represented by R 3 or is a group represented by R 4 .
  • at least one R 4 or R 5 in a molecule is an alkenyl group.
  • At least one R 5 in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • "a”, "b”, “c”, and “d” are numbers that respectively satisfy: 0.01 ⁇ a ⁇ 0.8, 0 ⁇ b ⁇ 0.5, 0.2 ⁇ c ⁇ 0.9, 0 ⁇ d ⁇ 0.2, and
  • a + b + c + d l .
  • Acids that may be used are exemplified by hydrochloric acid, acetic acid, formic acid, nitric acid, oxalic acid, sulfuric acid, phosphoric acid, polyphosphoric acid, polycarboxylic acid, trifluoromethane sulfonic acid, and ion exchange resins.
  • the utilized base is exemplified by potassium hydroxide, sodium hydroxide, or similar inorganic bases; and triethylamine, diethylamine, monoethanolamine, diethanolamine, triethanolamine, ammonia water, tetramethylammonium hydroxide, alkoxysilanes having an amino group, aminopropyltrimethoxysilane, or similar organic base compounds.
  • an organic solvent may be used in the preparation method.
  • The_ utilized organic solvent is exemplified by ethers, ketones, acetates, aromatic or aliphatic hydrocarbons, ⁇ -butyrolactone, or the like; and mixtures of two or more types of such solvents.
  • Preferred organic solvents are exemplified by propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol mono-t-butyl ether, ⁇ -butyrolactone, toluene, and xylene.
  • water or a mixed solution of water and alcohol is preferably added.
  • Methanol and ethanol are preferred examples of the alcohol. If an organic solvent is used and this reaction is promoted by heating, the reaction is preferably performed at the reflux temperature of the organic solvent.
  • R 3 is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group; and examples thereof are the same as the groups described above.
  • X is an alkoxy group, an acyloxy group, a halogen atom, or a hydroxyl group; and examples thereof are the same as the groups described above. Examples of such silane compound (I) are the same as the compounds described above.
  • R 6 are alkyl groups, phenyl groups or hydrogen atoms. Examples of the alkyl group for R 6 include a methyl group, an ethy ⁇ group ⁇ and a propyLgroup ⁇
  • This type of disiloxane (V) is exemplified by 1 , 1 ,3,3-tetramethyldisiloxane,
  • this disiloxane (V) is preferably a disiloxane having a silicon-bonded hydrogen atom.
  • R 6 is synonymous with the groups described above.
  • X is synonymous with the groups described above.
  • This type of silane compound (VI) is exemplified by dimethylmethoxysilane, methylphenylmethoxysilane, diphenylmethoxysilane, dimethylethoxysilane,
  • dimethylphenylmethoxysilane or similar alkoxysilanes; dimethylacetoxysilane, methylphenylacetoxysilane, diphenylacetoxysilane, trimethylacetoxysilane,
  • silane compound (VI) is preferably a silane compound having a silicon-bonded hydrogen atom.
  • R 6 is synonymous with the groups described above.
  • X is synonymous with the groups described above.
  • n are integers from 2 to 4.
  • This type of silane compound (VII) is exemplified by trimethylmethoxysilane, trimethylethoxysilane, methyldiphenylmethoxysilane, methyldiphenylethoxysilane, dimethyldimethoxysilane, methylphenyldimethoxysilane, diphenyldimethoxysilane, methyltrimethoxysilane, phenyltrimethoxysilane, tetramethoxysilane, tetraethoxysilane, or similar alkoxysilanes; trimethylacetoxysilane, methyldiphenylacetoxysilane,
  • dimethyldiacetoxysilane methylphenyldiacetoxysilane, diphenyldiacetoxysilane, methyltriacetoxysilane, phenyltriacetoxysilane, tetraacetoxysilane, or similar
  • methyldiphenylchlorosilane dimethyldichlorosilane, methylphenyldichlorosilane, diphenyldichlorosilane, methyltrichlorosilane, phenyltrichlorosilane, tetrachlorosilane, or similar halosilanes; and trimethylsilanol, methyldiphenylsilanol, dimethyldihydroxysilane, methylphenyldihydroxysilane, diphenyldihydroxysilane, methyltrihydroxysilane, phenyltrihydroxysilane, or similar hydroxysilanes.
  • At least one component among components (V) to (VII) used in the reaction of the preparation method must have a silicon-bonded hydrogen atom.
  • the preparation method is characterized in that a hydrolysis and condensation reaction, in the presence of an acid, is performed using the silane compound (I), the disiloxane (V) and/or the silane compound (VI), and as may be required, the silane compound (VII).
  • the charged ratio of each of the components is the ratio such that the obtained organopolysiloxane has the average unit formula below:
  • R 6 is a group synonymous with the groups described above.
  • R 7 is a group represented by R 3 or is a group represented by R 6 .
  • At least one R or R in a molecule is a hydrogen atom. At least one R in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group. Further, in the formula, "a”, “b”, “c”, and “d” are numbers that respectively satisfy: 0.01 ⁇ a ⁇ 0.8, 0 ⁇ b ⁇ 0.5, 0.2 ⁇ c ⁇ 0.9, 0 ⁇ d ⁇ 0.2, and
  • a + b + c + d 1.
  • Acids that may be used are exemplified by hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, polyphosphoric acid, trifluoromethane sulfonic acid, or similar strong acids; acetic acid, formic acid, oxalic acid, polycarboxylic acid, or similar carboxylic acids; and acetic acid anhydride, or similar carboxylic acid anhydrides.
  • An organic solvent may be used in the preparation method.
  • Examples of the utilized organic solvent are the same as the solvents described above.
  • water or a mixed solution of water and alcohol is preferably added.
  • Methanol and ethanol are preferred examples of the alcohol. If an organic solvent is used and this reaction is promoted by heating, the reaction is preferably performed at the reflux temperature of the organic solvent.
  • the present coating agent is composed of a curable silicone composition comprising the above described organopolysiloxane.
  • curing is performed by a reaction exemplified by hydrosilylation reactions, condensation reactions, and radical reaction using organic peroxides.
  • the curing mechanism is preferably a hydrosilylation reaction due to rapid curing.
  • the coating agent composed of this hydrosilylation reaction silicone composition is exemplified by coating agents comprising:
  • R.” are alkyl groups, alkenyl groups, or phenyl groups
  • R 21 are groups recited for R 1 ', condensed polycyclic aromatic groups, or groups including a condensed polycyclic aromatic group, provided that at least one R 1 1 or R 21 in a molecule is an alkenyl group and at least one R in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group
  • R 21 are groups recited for R 1 ', condensed polycyclic aromatic groups, or groups including
  • organopolysiloxane for component (A) is represented by the average unit formula:
  • R 1 1 are alkyl groups, alkenyl groups, or phenyl groups.
  • Examples of the alkyl group for R 1 1 include the same groups described for R 1 . Of these, a methyl group is preferable.
  • Examples of the alkenyl group for R 1 1 include the same groups described for R 1 . Of these, a vinyl group is preferable.
  • R 21 is the group represented by R 1 ', or is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • alkyl group for R include the same groups described for R 1 .
  • alkenyl group for R 21 include the same groups described for R 1 .
  • Examples of the condensed polycyclic aromatic group for R 1 include a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, and such condensed polycyclic aromatic groups where a hydrogen atom is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • the condensed polycyclic aromatic group for R 21 is preferably the naphthyl group.
  • Examples of the group including a condensed polycyclic aromatic group for R 21 include alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group, an anthracenyl ethyl group, a phenanthryl ethyl group, a pyrenyl ethyl group, and the like; and such groups where a hydrogen atom in the condensed polycyclic aromatic group is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • alkyl groups including a condensed polycyclic aromatic group such as a naphthyl ethyl group, a naphthyl propyl group,
  • the group including a condensed polycyclic aromatic group for R 21 is particularly preferably the naphthyl ethyl group.
  • An organopolysiloxane where R 21 is an alkyl groups including a condensed polycyclic aromatic group has relatively low viscosity and has the effect of making possible the lowering of viscosity of the present coating agent.
  • At least one R 1 1 or R 21 in a molecule is an alkenyl group.
  • at least one R 21 in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • Preferably at least 50 mol% of R 21 in a molecule are condensed polycyclic aromatic groups or groups including condensed polycyclic aromatic groups.
  • "a”, “b”, “c”, and “d” are numbers that respectively satisfy: 0.1 ⁇ a ⁇ 0.6, 0 ⁇ b ⁇ 0.3,
  • component (A) is represented by the above average unit formula, a small amount of the hydroxyl groups or methoxy groups, ethoxy groups, or the like alkoxy groups may be bonded to silicon atoms in the molecule.
  • Component (A) having silicon- bonded hydroxyl groups or silicon-bonded alkoxy groups may result in improved adhesivity of the present coating agent, may result in improved adhesion of the cured product of the coating agent to the substrate, or may result in improvement of compatibility with other components included in the present coating agent.
  • component (B) No particular limitation is placed on the organopolysiloxane of component (B) as long as the organopolysiloxane has a silicon-bonded hydrogen atom.
  • the bonding position of the silicon-bonded hydrogen atom in component (B) is exemplified by molecular chain terminal silicon atoms and/or silicon atoms in the molecular chain.
  • the other groups bonded to the silicon atom in component (B) are exemplified by a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, or similar alkyl groups; a phenyl group, a tolyl group, a xylyl group, a naphthyl group, or similar aryl groups; a benzyl group, a phenethyl group, or similar aralkyl groups; and a chloromethyl group, a 3-chloropropyl group, a 3,3,3-trifluoropropyl group, or similar halogenated alkyl groups; and such other groups are preferably the methyl group or phenyl group.
  • Component (B) may have a straight, branched, cyclic, net-like, or a partially branched straight chain molecular structure.
  • This type of organopolysiloxane for component (B) is exemplified by a methylhydrogenpolysiloxane capped at both molecular terminals with trimethylsiloxy groups, a copolymer of dimethylsiloxane and methylhydrogensiloxane capped at both molecular terminals with trimethylsiloxy groups, a copolymer of dimethylsiloxane, methylhydrogensiloxane, and methylphenylsiloxane capped at both molecular
  • organopolysiloxane copolymers composed of siloxane units represented by the general formula R' 3 SiOi /2 and siloxane units represented by the general formula R' 2 HSiOi/ 2 and siloxane units represented by the formula S1O4/2,
  • organopolysiloxane copolymers composed of siloxane units represented by the general formula R' 2 HSiOi /2 and siloxane units represented by the formula Si0 4/2 ,
  • organopolysiloxane copolymers composed of siloxane units represented by the general formula R'HSi0 2 / 2 , organopolysiloxane copolymers composed of siloxane units represented by the general formula R'Si0 3/2 or siloxane units represented by the formula HSi0 3/2 , and mixtures of two or more such organopolysiloxanes.
  • R' in the formula is a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, or a similar alkyl group; a phenyl group, a tolyl group, a xylyl group, naphthyl group, or a similar aryl group; a benzyl group, a phenethyl group, or similar aralkyl group; or a chloromethyl group, a 3-chloropropyl group, a 3,3,3- trifluoropropyl group, or a similar halogenated alkyl group.
  • hydrosilylation reaction catalyst for component (C) examples include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts.
  • Platinum-based catalysts are preferred due to the ability to remarkably promote curing of the present coating agent.
  • the platinum-based catalyst include a platinum fine powder, chloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum- alkenylsiloxane complex, a platinum-olefm complex and a platinum-carbonyl complex, with a platinum-alkenylsiloxane complex being preferred.
  • the coating agent for example, if the organopolysiloxane having a condensed polycyclilc aromatic group or a group including a condensed polycyclic aromatic group has a silicon-bonded hydrogen atom, the coating agent is exemplified by a coating agent comprising:
  • R 12 are alkyl groups, phenyl groups, or hydrogen atoms
  • R 22 are groups recited for R , condensed polycyclic aromatic groups, or groups including a condensed polycyclic aromatic group, provided that at least one R , or R in a molecule is a hydrogen atom and at least one R in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group
  • organopolysiloxane for component (D) is represented by the average unit formula:
  • R 12 are alkyl groups, phenyl groups or hydrogen atoms.
  • Examples of the alkyl group for R 12 include the same groups described for R 1 . Of these, the methyl group is preferable.
  • R 22 is represented by R 12 , or is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • alkyl group for R 22 include the same groups described for R l .
  • Examples of the condensed polycyclic aromatic group for R 22 include a naphthyl group, an anthracenyl group, a phenanthryl group, a pyrenyl group, and such condensed polycyclic aromatic groups where a hydrogen atom is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; by an alkoxy group such as a methoxy group, an ethoxy group, and the like; or by a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • the condensed polycyclic aromatic group is preferably the naphthyl group.
  • alkyl group including a condensed polycyclic aromatic group for R 22 examples include alkyl groups containing condensed polycyclic aromatic groups such as a naphthyl ethyl group, a naphthyl propyl group, an anthracenyl ethyl group, a phenanthryl ethyl group, a pyrenyl ethyl group, and the like, and such groups where a hydrogen atom of the condensed polycyclic aromatic group is replaced by an alkyl group such as a methyl group, an ethyl group, and the like; an alkoxy group such as a methoxy group, an ethoxy group, and the like; or a halogen atom such as a chlorine atom, a bromine atom, and the like.
  • alkyl groups containing condensed polycyclic aromatic groups such as a naphthyl ethyl group, a naphthyl propyl group, an anth
  • Organopolysiloxanes where R 22 is an alkyl group including a condensed polycyclic aromatic group have relatively low viscosity and have the effect of making it possible to lower viscosity of the present coating agent.
  • At least one R or R in a molecule is the hydrogen atom.
  • at least one R in a molecule is a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group.
  • Preferably at least 50 mol% of R 22 in a molecule are condensed polycyclic aromatic groups or groups including a condensed polycyclic aromatic group.
  • "a”, “b”, “c”, and “d” are numbers that respectively satisfy: 0.1 ⁇ a ⁇ 0.6, 0 ⁇ b ⁇ 0.3,
  • component (D) is represented by the above average unit formula, a small amount of the hydroxyl groups or methoxy groups, ethoxy groups, or the like alkoxy groups may be bonded to silicon atoms in the molecule.
  • Component (D) having silicon- bonded hydroxyl groups or silicon-bonded alkoxy groups may result in improved adhesivity of the present coating agent, may result in improved adhesion of the cured product of the coating agent to the substrate, or may result in improvement of compatibility with other components included in the present coating agent.
  • the organopolysiloxane for component (E) has an alkenyl group.
  • the alkenyl group in component (E) include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, and a heptenyl group. Of these, a vinyl group is preferable.
  • Groups bonding to silicon atom other than alkenyl groups in component (E) are exemplified by a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, or a similar alkyl group; a phenyl group, a tolyl group, a xylyl group, a naphthyl group, or a similar aryl group; a benzyl group, a phenethyl group, or a similar aralkyl group; and a chloromethyl group, a 3-chloropropyl group, a 3,3,3-trifluoropropyl group, or a similar halogenated alkyl group; and the groups are preferably the methyl group or phenyl group.
  • Component (E) may have a straight, branched, cyclic, net-like, or a partially
  • organopolysiloxane for component (E) is exemplified by a copolymer of dimethylsiloxane and methylvinylsiloxane capped at both molecular terminals with trimethylsiloxy groups, methylvinylpolysiloxane capped at both molecular terminals with trimethylsiloxy groups, copolymer of dimethylsiloxane,
  • R' in the formula is synonymous with the groups described above.
  • R" in the formula is an alkenyl group and is exemplified by a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, and a heptenyl group.
  • hydrosilylation-reaction catalyst examples include those described above.
  • a coating agent may be prepared that comproses components (A), (D), and (C). Components (A), (D), and (C) are as described above.
  • organopolysiloxane having the silicon-bonded hydrogen atom this amount preferably results in the mole ratio of silicon-bonded hydrogen atoms relative to alkenyl groups in the present coating agent being in the range of 0.1 to 5, and particularly preferably in the range of 0.5 to 2.
  • component (C) Although no particular limitation is placed on the content of component (C) as long as there is an amount sufficient to promote curing of the present coating agent.
  • the content of component (C) in the present coating agent, based on the catalyst metals in component (C), is preferably in the range of 0.01 to 500 ppm, further preferably result in the range of 0.01 to 100 ppm, and particularly preferably result in the range of 0.01 to 50 ppm in terms of mass units.
  • the present coating agent may include an adhesion-imparting agent for improvement of the adhesivity of the present coating agent.
  • Preferred adhesion- imparting agents are organosilicon compounds having at least one alkoxy group bonded to a silicon atom in a molecule. This alkoxy group is exemplified by a methoxy group, an ethoxy group, a propoxy group, a butoxy group, and a methoxyethoxy group; and the methoxy group is particularly preferred.
  • groups bonding to a silicon atom other than alkoxy groups in this organosilicon compound are exemplified by substituted or non-substituted monovalent hydrocarbon groups such as alkyl groups, alkenyl groups, aryl groups, aralkyl groups, halogenated alkyl groups, and the like; epoxy group-containing monovalent organic groups such as 3-glycidoxypropyl groups, 4-glycidoxybutyl groups, or similar glycidoxyalkyl groups; 2-(3,4-epoxycyclohexyl)ethyl groups, 3 -(3, 4- epoxycyclohexyl)propyl groups, or similar epoxycyclohexylalkyl groups; and 4- oxiranylbutyl groups, 8-oxiranyloctyl groups, or similar oxiranylalkyl groups; acrylic group-containing monovalent organic groups such as 3-methacryloxypropyl groups, and the like; and hydrogen atoms.
  • monovalent hydrocarbon groups such as alky
  • This organosilicon compound preferably has a silicon- bonded alkenyl group or silicon-bonded hydrogen atom. Moreover, due to the ability to impart good adhesion with respect to various types of substrates, this organosilicon compound preferably has at least one epoxy group-containing monovalent organic group in a molecule.
  • This type of organosilicon compound is exemplified by organosilane compounds, organosiloxane oligomers and alkyl silicates. Molecular structure of the organosiloxane oligomer or alkyl silicate is exemplified by a linear structure, partially branched linear structure, branched chain structure, ring-shaped structure, and net-shaped structure.
  • a linear chain structure, branched chain structure, and net-shaped structure are particularly preferred.
  • This type of organosilicon compound is exemplified by silane compounds such as 3-glycidoxypropyltrimethoxysilane, 2-(3,4- epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloxy propyltrimethoxy silane, and the like; siloxane compounds having at least one of silicon-bonded alkenyl groups or silicon- bonded hydrogen atoms, and at least one silicon-bonded alkoxy group in a molecule;
  • silane compound or siloxane compound having at least one silicon-bonded alkoxy group and a siloxane compound having at least one silicon-bonded hydroxyl group and at least one silicon-bonded alkenyl group in a molecule
  • siloxane compound having at least one silicon-bonded hydroxyl group and at least one silicon-bonded alkenyl group in a molecule and methyl polysilicate, ethyl polysilicate, and epoxy group-containing ethyl polysilicate.
  • the concentration relative to 100 parts by weight of the total present coating agent is preferably in the range of 0.01 to 10 parts by weight.
  • a reaction inhibitor for example, an alkyne alcohol such as 2-methyl-3-butyn- 2-ol, 3,5-dimethyl-l-hexyn-3-ol and 2-phenyl-3-butyn-2-ol; an ene-yne compound such as 3-methyl-3-penten-l -yne and 3,5-dimethyl-3-hexen-l-yne; or l ,3,5,7-tetramethyl-l ,3,5,7- tetravinylcyclotetrasiloxane, 1 ,3,5,7-tetramethyl-l ,3,5,7-tetrahexenylcyclotetrasiloxane or a benzotriazole may be incorporated as an optional component in the present coating agent.
  • an alkyne alcohol such as 2-methyl-3-butyn- 2-ol, 3,5-dimethyl-l-hexyn-3-ol and 2-phenyl-3-butyn-2-ol
  • a content of the reaction inhibitor is not limited, but is preferably from 0.0001 to 5 parts by weight per 100 parts by weight of the present coating agent.
  • the present coating agent may include as an additional optional component a phosphor.
  • This phosphor is exemplified by substances widely used in light emitting diodes (LED), such as yellow, red, green, and blue light-emitting phosphors such as oxide type phosphors, oxynitride type phosphors, nitride type phosphors, sulfide type phosphors, oxysulfide type phosphors, and the like.
  • the oxide type phosphor is exemplified by cerium ion-containing yttrium, aluminum, and garnet type YAG type green colored to yellow colored light emitting phosphors; cerium ion-containing terbium, aluminum, and garnet based TAG type yellow colored light emitting phosphors; and cerium or europium-ion containing silicate-based green to yellow light emitting phosphors.
  • the oxynitride type phosphor is exemplified by europium ion-containing silicon, aluminum, oxygen, and nitrogen type, or sialon type, red to green colored light emitting phosphors.
  • the nitride type phosphor is exemplified by europium ion-containing calcium strontium, aluminum, silicon, and nitrogen type, or CASN type, red light emitting phosphors.
  • the sulfide type phosphor is exemplified by copper ion-containing or aluminum ion-containing ZnS type green light emitting phosphors.
  • the oxysulfide type phosphor is exemplified by europium ion-containing Y 2 0 2 S type red light emitting phosphors. These phosphors may be used as one type or as a mixture of two or more types.
  • the content of this phosphor in the present coating agent is not limited, but is preferably in the range of 0.1 to 70 wt.%, and further preferably is in the range of 1 to 20 wt.%.
  • An inorganic filler such as silica, glass, alumina, zinc oxide and the like; an organic resin fine powder of a polymethacrylate resin and the like; a heat-resistant agent, a dye, a pigment, a flame retardant, a solvent and the like may be incorporated as optional components in the coating agent at levels that do not impair the objective of the present invention.
  • the coating agent preferably is heated to cause rapid curing.
  • the heating temperature is preferably from 50 to 200°C.
  • the electrical-electronic equipment of the present invention is characterized in that the electrical-electronic equipment is covered by a cured product of the coating agent.
  • a metal part of electrical-electronic equipment is covered by a cured product of the coating agent.
  • This type of electrical-electronic equipment is exemplified by plasma displays, liquid crystal displays, organic electroluminescent displays, and LEDs.
  • the metal part of this type of electrical-electronic equipment is exemplified by electrodes, electrical circuits on circuit boards, and LED reflectors.
  • Metals of this type of metal part of concern due to corrosion by a corrosive substance are exemplified by silver, copper, aluminum, and alloys of such metals.
  • the method of the present invention is a method that suppresses corrosion by applying the coating agent onto a metal part of electrical-electronic equipment exposed to a corrosive substance, and thereafter cures the coating agent to suppress corrosion of the metal part by the corrosive substance.
  • This electrical-electronic equipment is exemplified by plasma displays, liquid crystal displays, organic electroluminescent displays, and LEDs.
  • the metal part of this type of electrical-electronic equipment is exemplified by electrodes, electrical circuits on circuit boards, and LED reflectors.
  • Metals of this type of metal part of concern due to corrosion by a corrosive substance are exemplified by silver, copper, aluminum, and alloys of such metals.
  • the corrosive substance is exemplified by sulfur and sulfur- containing compounds.
  • sulfur-containing compounds include hydrogen sulfide, sulfur dioxide gas, sulfuric acid mist, and mercaptan gases.
  • Such corrosive substances are often present in the environment during use or manufacture of electrical-electronic equipment and parts thereof. Also, such corrosive substances may be generated from such internal parts or materials during the use of the electrical-electronic equipment.
  • the coating agent is applied to the metal part of the electrical-electronic equipment exposed to the corrosive substance. Prior to application of the coating agent, as may be required, the current- conducting part may be cleaned.
  • the application method of the coating agent is not limited, and this application method is exemplified by application by a dispenser, application by a scraper, and application by a brush.
  • the thickness of the coating agent applied to the metal part is preferably within the range of 100 ⁇ to 5 mm.
  • the thickness of the coating agent applied to the metal part is less than the lower limit described above, the obtained cured product cannot sufficiently suppress corrosion of the metal part by the corrosive substance.
  • the upper limit of the range described above is exceeded, a marked improvement effect is not seen in the suppression of corrosion of the metal part due to the corrosive substance.
  • the coating agent is cured.
  • curing at room temperature is preferred in order not to heat the electrical-electronic equipment.
  • curing of the coating agent is promoted by heating. If the coating agent is cured at room temperature, curing is preferably allowed to take place for several minutes to about 1 week.
  • the surface of a copper plate was sanded using sandpaper, and then was washed using acetone. Thereafter, the coating agent was applied at 1 mm thickness, and the coated copper plate was heated for 60 minutes in an oven at 150°C to cure the coating and produce the test piece.
  • a LED chip with 1 mm ⁇ 1 mm square size (MKO 4545C manufactured by
  • Bridgelux Inc. was placed on a central die mount part of a LED lead frame with 5 mm ⁇ 5 mm square size (TTI-5074 manufactured by I-Chiun Precision Industry Co., Ltd.) surrounded by a polyphthalamide (PPA) resin case. Thereafter, the LED chip and inner leads were electrically connected by gold bonding wires with 1.5 mil diameter to produce an LED.
  • TTI-5074 manufactured by I-Chiun Precision Industry Co., Ltd.
  • PPA polyphthalamide
  • this LED was placed in a hermetically sealable glass container of 450 mL volume containing 1.2 g of sulfur. After the container was allowed to sit for 1 16 hours or 428 hours at 80°C, 150 mA of electrical current was passed through the LED using a 2600 Sourcemeter manufactured by Keithley Instruments Inc. Light intensity of the LED was measured using an ISP 250 (250 mm) integrating sphere and a CAS- 140 CT spectrometer (both manufactured by Instrument Systems GmbH). Furthermore, comparison was made by taking the pre-test light emission intensity to be 100%.
  • organopolysiloxane represented by the average unit formula: (MePh 2 Si0 1/2 )o.o8 (MePhViSiOi /2 ) 0 . 3 2 (NaphSiO 3/2 ) 0 60
  • Weight average molecular weight (Mw) of this organopolysiloxane was 1 ,000.
  • the mixture was reacted for 1 hour at this temperature. Thereafter, 0.30 g (5.4 mmol) of potassium hydroxide was added, and atmospheric pressure distillation was performed while heating to a reaction temperature of 120°C. The mixture was reactedTor 1 hour at this temperature. The system was cooled down to room temperature, and then 0.40 g (6.7 mmol) of acetic acid was added to perform the neutralization reaction. The generated salt was removed by filtration. The low boiling point substances were removed from the obtained transparent solution by heating under vacuum to obtain 56.7 g (99.3% yield) of a colorless transparent viscous liquid.
  • Weight average molecular weight (Mw) of this organopolysiloxane was 1 ,100.
  • this liquid was found to be an organopolysiloxane of the following average unit formula:
  • Weight average molecular weight (Mw) of this organopolysiloxane was 660.
  • This coating agent was used to perform corrosion test of a copper plate prepared in the aforementioned manner. Moreover, corrosion test was performed using an LED produced in the aforementioned manner using this coating agent. Results of this test are shown in Table 1. Moreover, the change of appearance of the LED over time during corrosion test is shown in Figure 3.
  • This coating agent was used to perform corrosion test of a copper plate prepared in the aforementioned manner. Moreover, corrosion test was performed using an LED produced in the aforementioned manner using this coating agent. Results of this test are shown in Table 1. Moreover, the change of appearance of the LED over time during corrosion test is shown in Figure 4.
  • This coating agent was used to perform corrosion test of a copper plate prepared in the aforementioned manner.
  • Figure IB shows a photograph of the test piece prior to corrosion test.
  • Figure 2B shows a photograph of the test piece after corrosion test.
  • corrosion test was performed using an LED produced in the
  • the coating agent of the present invention is able to suppress corrosion of metal parts of electrical-electronic equipment caused by a corrosive substance.
  • the coating agent of the present invention is thus suitable as a coating agent of electrical- electronic equipment such as an LED and the like utilizing a metal that is readily corroded, such as copper, silver, aluminum, and the like.

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Abstract

La présente invention concerne un agent de revêtement composé d'un organopolysiloxane ayant un groupe aromatique polycyclique condensé ou un groupe comprenant un groupe aromatique polycyclique condensé, un équipement électrique-électronique revêtu par un produit durci de l'agent de revêtement, et un procédé de protection de parties métalliques d'un équipement électrique-électronique par l'application de l'agent de revêtement. L'agent de revêtement est apte à supprimer la corrosion des parties métalliques de l'équipement électrique-électronique provoquée par une substance corrosive.
PCT/JP2013/067164 2012-06-28 2013-06-18 Agent de revêtement, équipement électrique-électronique, et procédé de protection de parties métalliques de l'équipement électrique-électronique WO2014002919A1 (fr)

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JP6022236B2 (ja) 2016-11-09
KR102145008B1 (ko) 2020-08-18

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