CN104919586A - 模块及其制造方法 - Google Patents

模块及其制造方法 Download PDF

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Publication number
CN104919586A
CN104919586A CN201380070487.4A CN201380070487A CN104919586A CN 104919586 A CN104919586 A CN 104919586A CN 201380070487 A CN201380070487 A CN 201380070487A CN 104919586 A CN104919586 A CN 104919586A
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China
Prior art keywords
components
circuit board
electronic devices
interarea
resin
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CN201380070487.4A
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English (en)
Inventor
伊藤悟志
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of CN104919586A publication Critical patent/CN104919586A/zh
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Abstract

本发明的目的在于提供一种能提高布线基板与安装在该布线基板上的电子元器件的连接可靠性的模块。模块(1)包括：布线基板(2)；安装在该布线基板(2)的一个主面的电子元器件(3)；形成在布线基板(2)的一个主面的整个面并形成为将布线基板(2)的一个主面与电子元器件(3)之间的间隙填满的底部填充树脂层(4)；以及形成为覆盖底部填充树脂层(4)和电子元器件(3)的模塑树脂层(5)，底部填充树脂层(4)由含有粒径比布线基板(2)的一个主面与电子元器件(3)之间的间隔要小的填料的树脂形成。

Description

模块及其制造方法
技术领域
本发明涉及安装于布线基板的电子元器件被树脂层所覆盖的模块及其制造方法。
背景技术
近年来，作为在具备布线基板和电子元器件的模块中将电子元器件安装到布线基板表面的方法，广泛使用倒装芯片安装方法。该安装方法与利用引线键合的电子元器件的安装方法相比，能缩小电子元器件的安装面积，因此能实现模块的小型化。此外，由于能缩短用于连接电子元器件和布线基板的布线长度，因此能提高模块的电气特性。
然而，由于倒装芯片安装方法是在例如作为电子元器件的IC的电路形成面的电极上形成由焊料、Au等形成的凸点，并利用该凸点直接将IC与布线基板相连的方法，因此布线基板与电子元器件之间产生的应力容易集中在连接部，难以确保模块的连接可靠性。
为此，以往提出了一种通过在形成有布线基板与电子元器件的连接部的布线基板与电子元器件的间隙内填入底部填充树脂(underfill resin)，从而对连接部进行增强的模块(参照专利文献1)。
该模块100如图6所示，在布线基板101上以倒装芯片方式安装有IC等芯片102，并且在该芯片102的形成凸点103的形成面的相反侧的面上搭载有其它芯片104。此外，在该芯片104上侧的表面形成有电极，该电极与布线基板101的电极通过Au引线相连。并且，在IC等芯片102与布线基板101的间隙内填充有底部填充树脂105，并且在布线基板101上形成模塑树脂层106，以覆盖两芯片102、104以及Au引线。
通过如上述那样在倒装芯片安装的芯片102与布线基板101的间隙内填入底部填充树脂，使得在布线基板101与芯片102之间产生的应力不集中到连接部，而分散到底部填充树脂中，因此能提高布线基板101与芯片102的连接可靠性。此外，由于两芯片102、104以及Au引线被模塑树脂层106覆盖，因此能防止两芯片102、104以及Au引线因外部应力而损坏。
现有技术文献
专利文献
专利文献1：日本专利特开2007-67047号公报(参照段落0017～0020、图8等)
发明内容
发明所要解决的技术问题
然而，已知在上述那样的在布线基板101设置底部填充树脂105、模塑树脂层106的模块结构中会产生如下问题：模块100会因布线基板101与底部填充树脂105之间的线膨胀系数的差、或布线基板101与模塑树脂层106之间的线膨胀系数的差等而发生翘曲。通常，由于模塑树脂层106的容积比底部填充树脂105大，因此该模块100的翘曲尤其会受到模块树脂层106与布线基板101之间的线膨胀系数的差的影响。
为此，在专利文献1所记载的模块100中，通过使底部填充树脂105与模塑树脂层106的树脂包含线膨胀系数较低的填料(例如二氧化硅填料)来缩小布线基板101与底部填充树脂105以及模塑树脂层106之间的线膨胀系数的差，从而能减少模块100的翘曲。此时，对于底部填充树脂105，使用粒径比布线基板101与芯片102之间的间隔要小的填料，这不仅是为了提高底部填充区域的填充性，还用于降低线膨胀系数，并防止芯片102的设置凸点的电路形成面产生损伤。此外，对于模塑树脂层106，使用粒径比包含在底部填充树脂105中的填料要大的填料，以降低线膨胀系数。
然而，在以往的模块100中，由于模塑树脂层106的填料的粒径与底部填充树脂105的填料的粒径不同，因此底部填充树脂105的线膨胀系数与模塑树脂层106的线膨胀系数可能会不同，在这种情况下，在底部填充树脂105与模塑树脂层106的接触界面上会产生剥离，随着该剥离的发展，可能会导致模塑树脂层106与布线基板101的界面产生剥离。在该界面剥离会导致布线基板101与芯片102的连接部的连接不良、或焊料飞溅的问题，其中，焊料飞溅是指例如在芯片102的凸点103为焊料凸点的情况下，当芯片102的凸点103熔融时，熔融的凸点103在剥离的界面上传播从而与其它凸点103接触，导致相邻的凸点103之间发生短路，因此需要一种防止此类问题发生的技术。
本发明鉴于上述问题而完成，其目的在于提供一种能提高布线基板与安装于该布线基板的电子元器件之间的连接可靠性的模块。
解决技术问题所采用的技术手段
为了实现上述目的，本发明的模块的特征在于，包括：布线基板；电子元器件，该电子元器件安装于所述布线基板的一个主面；底部填充树脂层，该底部填充树脂层形成在所述布线基板的一个主面的整个面，并将所述布线基板的一个主面与所述电子元器件之间的间隙填满；以及模塑树脂层，该模塑树脂层形成为覆盖所述底部填充树脂层的至少一部分以及所述电子元器件，所述底部填充树脂层由含有粒径比所述布线基板的一个主面与所述电子元器件之间的间隔要小的填料的树脂形成。
通过如上述那样形成底部填充树脂层以将布线基板的一个主面与电子元器件之间的间隙填满，从而在例如以倒装芯片方式将电子元器件安装到布线基板的一个主面的情况下，电子元器件与布线基板之间产生的应力不会集中在连接部，而分散于底部填充树脂层的树脂，因此能提供电子元器件与布线基板的连接可靠性较高的模块。
此外，通过利用含有粒径比布线基板的一个主面与电子元器件之间的间隔要小的填料的树脂来形成底部填充树脂层，从而在向布线基板的一个主面与电子元器件之间的间隙填入底部填充树脂层的树脂时，填料不会造成妨碍，向该间隙填入底部填充树脂层的树脂的填充性得以提高，因此，能防止在布线基板的一个主面与电子元器件之间的间隙内产生会导致布线基板与电子元器件的连接可靠性降低的空隙。此外，在以倒装芯片方式安装电子元器件的情况下，能防止电子元器件的电路形成面因底部填充树脂层的填料而受损。
此外，通过在布线基板的一个主面的整个面形成底部填充树脂层，从而即使因底部填充树脂层与模塑树脂层间的线膨胀系数的差异而发生界面剥离的情况下，由于该界面剥离不会发展到布线基板与底部填充树脂层的界面，因此能防止以往那样布线基板与树脂层的界面剥离引起的布线基板与电子元器件的连接不良、以及因焊料飞溅引起的端子间(例如电子元器件的相邻端子之间)的短路等问题的产生。
此外，也可以在所述布线基板的一个主面安装有多个所述电子元器件，所述底部填充树脂层所含有的填料的粒径比所述布线基板的一个主面分别与各所述电子元器件的间隔中最小的间隔要小，所述底部填充树脂层的厚度形成为比所述布线基板的一个主面分别与各所述电子元器件的间隔中最大的间隔要厚。
通过如上述那样使底部填充树脂层的填料的粒径比布线基板的一个主面分别与各电子元器件的间隔中最小的间隔要小，从而在所有的电子元器件中，向与布线基板之间的间隙填入底部填充树脂层的树脂的填充性得以提高。此外，通过使底部填充树脂层的厚度形成得比布线基板的一个主面分别与各电子元器件的间隔中最大的间隔要厚，从而在各电子元器件各自的与布线基板的一个主面之间的间隙的整个区域内填充有树脂，因此各电子元器件与布线基板的连接可靠性得以提高。
此外，所述模塑树脂层也可以由多个层形成，该多个层分别含有粒径比所述底部填充树脂层的填料的粒径要大、且粒径互不相同的填料，所述各层可配置成：从所述底部填充树脂层起越是配置在上层侧的层，该层所含有的填料的粒径越大。
如上述那样，随着从底部填充树脂层起向上层侧行进，各层(包括底部填充树脂层)所含有的填料的粒径逐步增大，由此能缩小相邻的层之间的线膨胀系数的差，因此能抑制在相邻的层的边界产生界面剥离。
本发明的模块的制造方法的特征在于，包括：在布线基板的一个主面安装电子元器件的安装工序；在所述布线基板的所述一个主面的周边以包围所述电子元器件的方式配置树脂密封用夹具的配置工序；在所述树脂密封用夹具的包围区域内填充含有粒径比所述布线基板的一个主面与所述电子元器件之间的间隔要小的填料的液状树脂以作为底部填充树脂的填充工序；通过使所述液状树脂固化并去除所述树脂密封用夹具来形成底部填充树脂层的底部填充树脂层形成工序；以及形成模塑树脂层以覆盖所述底部填充树脂层以及所述电子元器件的模塑树脂层形成工序。
通过如上述那样使用含有粒径比布线基板的一个主面与电子元器件之间的间隔要小的填料的液状树脂作为底部填充树脂，从而提高向布线基板的一个主面与电子元器件之间的间隙填入液状树脂的填充性，因此能防止在该间隙产生空隙。此外，由于能利用在树脂密封用夹具的包围区域内填充液状树脂这样简单的方法在布线基板的一个主面的整个面形成底部填充树脂层，因此能容易地制造布线基板与电子元器件之间的连接可靠性较高的模块。
然而，例如在布线基板上安装多个电子元器件，并通过分配(dispensing)方式在各个电子元器件的每一个电子元器件形成底部填充树脂层的情况下，所安装的电子元器件的数量越多，用于形成底部填充树脂层的工时数越多，因而模块的制造成本会上升。此外，为了对每个电子元器件涂布底部填充树脂层的树脂，需要在电子元器件之间确保用于配置分配器的树脂注入口的空间，这会对电子元器件的高密度安装化造成妨碍。
然而，在本发明的模块的制造方法中，即使在将多个电子元器件安装到布线基板的情况下，也能通过向树脂密封用夹具的包围区域内填充液状树脂来一次性进行各电子元器件所有的底部填充，因此底部填充树脂层形成工序的工时数减少，能降低模块的制造成本。此外，由于无需用于配置分配器的树脂注入口的空间，因此也能支持电子元器件的高密度安装化。
本发明的模块的制造方法也可以包括：在布线基板的一个主面安装电子元器件的安装工序；在所述布线基板的一个主面的周边以包围所述电子元器件的方式配置树脂密封用夹具的配置工序；在所述树脂密封用夹具的包围区域内配置含有粒径比所述布线基板的一个主面与所述电子元器件之间的间隔要小的填料的粉末树脂以作为底部填充树脂的粉末树脂配置工序；对该粉末树脂进行整理以使所述粉末树脂均匀配置在所述包围区域内、并对所述粉末树脂进行整理以使所述粉末树脂填充于所述布线基板的一个主面与所述电子元器件之间的间隙的粉末整理工序；通过在使所述粉末树脂溶解后使其固化并去除所述树脂密封夹具来形成底部填充树脂层的底部填充树脂形成工序；以及形成模塑树脂层以覆盖所述底部填充树脂层以及所述电子元器件的模塑树脂层形成工序。
利用该结构，能使用粉末树脂来形成本发明的模块的底部填充树脂层。
发明效果
根据本发明，填满布线基板的一个主面与电子元器件之间的间隙的底部填充树脂层形成在布线基板的一个主面的整个面，且底部填充树脂层由含有粒径比布线基板的一个主面与电子元器件之间的间隔要小的填料的树脂形成。因此，即使在因底部填充树脂层的树脂与模塑树脂层间的树脂之间的线膨胀系数的差异而产生界面剥离的情况下，由于该界面剥离不会发展到布线基板与底部填充树脂层的界面，因此能防止以往那样布线基板与树脂层的界面剥离引起的布线基板与电子元器件的连接不良、以及因焊料飞溅引起的端子间(例如电子元器件的相邻端子之间)的短路等问题的产生，由此能提供布线基板与电子元器件的连接可靠性较高的模块。
附图说明
图1是本发明的实施方式1所涉及的模块的剖视图。
图2是用于说明图1的模块的制造方法的图。
图3是用于说明本发明的实施方式2的模块的制造方法的图。
图4是本发明的实施方式3所涉及的模块的剖视图。
图5是本发明的实施方式4所涉及的模块的剖视图。
图6是现有模块的剖视图。
具体实施方式
＜实施方式1＞
参照图1对本发明的实施方式1所涉及的模块1进行说明。图1是实施方式1的模块1的剖视图。
本实施方式的模块1如图1所示，包括：布线基板2；安装在该布线基板2的一个主面的电子元器件3；形成在布线基板2的一个主面的整个面、并将布线基板2的一个主面与电子元器件3之间的间隙填满的底部填充树脂层4；以及以覆盖电子元器件3和底部填充树脂层4的方式形成的模塑树脂层5。
布线基板2例如由玻璃环氧树脂基板、低温共烧陶瓷(LTCC)基板、玻璃基板等所构成，在其主面和/或内部形成有布线电极和/或过孔导体。另外，布线基板2也可以使用多层基板和单层基板中的某一种。
电子元器件3例如是由Si、GaAs等形成的半导体元件，利用焊料凸点6以倒装芯片方式安装在布线基板2的一个主面。另外，电子元器件3也可采用安装贴片电容器、贴片电感器、贴片电阻等的结构。
底部填充树脂层4利用使环氧树脂中含有由线膨胀系数比该环氧树脂要小的二氧化硅等形成的填料(二氧化硅填料)而得到的树脂(下面有时也称为底部填充树脂层4的树脂)来形成，并且如上所述，该底部填充树脂层4形成在布线基板2的一个主面的整个面，并将布线基板2的一个主面与电子元器件3之间的间隙填满。此时，底部填充树脂层4形成得比布线基板2的一个主面与电子元器件3之间的间隔h要厚(底部填充树脂层4的厚度h0＞h)。另外，也可以形成底部填充树脂层4，使得底部填充树脂层4的厚度h0和布线基板2的一个主面与电子元器件3之间的间隔h相同。
此外，底部填充树脂层4中含有的填料使用平均粒径比布线基板2的一个主面与电子元器件3之间的间隔h要小的填料。此时，为了改善将树脂填充到布线基板2的一个主面与电子元器件3之间的间隙内的填充性，优选使该填料的最大粒径小于布线基板2与电子元器件3之间的间隔h。
另外，作为底部填充树脂层4的树脂，除了环氧树脂以外，也能使用酚醛树脂、氰酸酯树脂、聚酰亚胺树脂、双马来酰亚胺树脂等。此外，作为底部填充树脂层4中含有的填料，除了二氧化硅填料以外，也能使用氧化铝填料、氮化铝填料、氮化硅填料、碳纤维等。
模塑树脂层5与底部填充树脂层4同样，利用使环氧树脂中含有由线膨胀系数比该环氧树脂小的二氧化硅等形成的填料(二氧化硅填料)而得到的树脂(下面有时也称为模塑树脂层5的树脂)来形成，该模塑树脂层5形成为覆盖底部填充树脂层4以及电子元器件3。此时，模塑树脂层5中所含有的填料使用平均粒径比底部填充树脂层4的填料的平均粒径要大的填料。此外，模塑树脂层5未必一定要形成为覆盖底部填充树脂层4的整个面，也可以形成为至少覆盖底部填充树脂层4的一部分以及电子元器件。
另外，作为模塑树脂层5的树脂，与底部填充树脂层4同样，除了环氧树脂以外，也能使用酚醛树脂、氰酸酯树脂、聚酰亚胺树脂、双马来酰亚胺树脂等。此外，作为模塑树脂层4中含有的填料，除了二氧化硅填料以外，也能使用氧化铝填料、氮化铝填料、氮化硅填料、碳纤维等。
接着，参照图2对本实施方式的模块1的制造方法进行说明。另外，图2是用于说明模块1的制造方法的图，图2(a)～图2(f)表示各个工序。此外，也能利用以下所示的模块1的制造方法制造后述的其它各实施方式的模块。
首先，如图2(a)所示，在布线基板2的一个主面以倒装芯片方式安装电子元器件3(安装工序)。此时，在布线基板2的一个主面的规定位置配置电子元器件3，然后，将配置了电子元器件3的布线基板2放入回流炉等使焊料凸点6熔融，从而将布线基板2与电子元器件3相连接。
接着，如图2(b)所示，在布线基板2的一个主面的周边以包围电子元器件3的方式配置并固定密封树脂用夹具7(配置工序)。该密封树脂用夹具7由橡胶树脂形成。
接着，如图2(c)所示，在密封树脂用夹具7的包围区域内填充液状树脂4a作为底部填充树脂(填充工序)。该液状树脂4a是形成底部填充树脂层4的树脂，在液状的环氧树脂中含有填料。此时，将液状树脂4a的量调整为适合在后述的底部填充树脂层形成工序中在布线基板2的一个主面的整个面形成底部填充树脂层4，并将布线基板2的一个主面与电子元器件3之间的间隙填满。另外，填料使用粒径比布线基板2的一个主面与电子元器件3之间的间隔要小的填料。
接着，如图2(d)所示，在130℃左右的温度下使液状树脂4a暂时固化，然后将密封树脂用夹具7去除，而后在180℃左右的温度下使液状树脂4a正式固化，从而形成底部填充树脂层4(底部填充树脂层形成工序)。此时，在使液状树脂4a正式固化时，液状树脂4a扩散至布线基板2的一个主面的整个面。另外，也不一定要去除密封树脂用夹具7。
接着，如图2(e)所示，将模塑用树脂5a配置成覆盖底部填充树脂层4以及电子元器件3。
接着，如图2(f)所示，通过在180℃左右的温度下使所配置的模塑用树脂5a固化，从而形成模塑树脂层5(模塑树脂层形成工序)，由此制造模块1。另外，模塑树脂层5的树脂是在环氧树脂中含有填料的树脂，该填料使用粒径比底部填充树脂层4的填料的粒径要大的填料。此外，能通过使用液状、粉末、固体的任一种形态的树脂作为模塑用树脂5a来形成模塑树脂层5。例如，在使用液状或粉末树脂作为模塑树脂5a的情况下，可以在将密封树脂用夹具7去除之前，在底部填充树脂层4以及电子元器件3上配置模塑用树脂5a，并使该模塑用树脂5a半固化或正式固化后，再将密封树脂用夹具7去除即可。
另外，关于将密封树脂用夹具7配置到布线基板2的一个主面的周边的配置工序，并不限于上述内容，例如也可以准备具有开口部比布线基板2的一个主面的轮廓大一圈的空腔的密封树脂用夹具7，并在该空腔内配置安装了电子元器件3的布线基板2。由此，能容易地在布线基板2的一个主面的整个面形成底部填充树脂层4。
因此，根据上述实施方式，通过形成底部填充树脂层4以将布线基板2的一个主面与倒装芯片安装的电子元器件3之间的间隙填满，从而使得在电子元器件3与布线基板2之间产生的应力不会集中到电子元器件3与布线基板2的连接部(焊料凸点6附近)，而分散到底部填充树脂层4的树脂，因此能提供电子元器件3与布线基板2的连接可靠性较高的模块1。
此外，通过利用含有粒径比布线基板2的一个主面与电子元器件3之间的间隔要小的填料的树脂形成底部填充树脂层4，从而在向布线基板2的一个主面与电子元器件3的间隙填入底部填充树脂层4的树脂时，填料不会造成妨碍，向该间隙填入底部填充树脂层4的树脂的填充性得以提高，因此，能防止在布线基板2的一个主面与电子元器件3之间的间隙内产生会导致布线基板2与电子元器件3的连接可靠性降低的空隙。此外，也能防止电子元器件3的电路形成面(与布线基板2相对的相对面)被底部填充树脂层4的填料损伤。
此外，通过在布线基板2的一个主面的整个面形成底部填充树脂层4，从而即使在因底部填充树脂层4与模塑树脂层5间的线膨胀系数的差异而产生界面剥离的情况下，由于该界面剥离不会发展到布线基板2与底部填充树脂层4的界面，因此能防止以往那样布线基板与树脂层的界面剥离引起的布线基板与电子元器件的连接不良、以及因焊料飞溅引起的端子间(例如电子元器件3的相邻端子(焊料凸点6)之间)的短路等问题的产生。
此外，以往，为了防止这种问题的产生，需要缩小底部填充树脂层4的填料的粒径与模塑树脂层5的填料的粒径的差，但若采用本实施方式的模块1，则通过在布线基板2的整个面形成底部填充树脂层4，能防止这种问题的产生，由此能使模塑树脂层5的填料的粒径比底部填充树脂层4的填料的粒径更大。由于填料与环氧树脂相比热传导率较高且线膨胀系数也较低，因此通过增大模塑树脂层5的填料的粒径能增大模塑树脂层5内的填料的容积，能提高模块1的散热特性，并能减少模块1的翘曲。
此外，在参照图2进行了说明的模块1的制造方法中，能通过在树脂密封用夹具7的包围区域内填充液状树脂这样简单的方法在布线基板2的一个主面的整个面形成底部填充树脂层4，因此能容易地制造布线基板2与电子元器件3的连接可靠性较高的模块1。
然而，例如在布线基板2上安装多个电子元器件3，并通过分配方式在各个电子元器件3的每一个上形成底部填充树脂层4的情况下，所安装的电子元器件3的数量越多，用于形成底部填充树脂层4的工时数越多，因而模块1的制造成本会上升。此外，为了对每个电子元器件3涂布底部填充树脂层4的树脂，需要在电子元器件3之间确保用于配置分配器的树脂注入口的空间，这会对电子元器件3的高密度安装化造成妨碍。
然而，若使用参照图2进行说明的模块1的制造方法，即使在将多个电子元器件3安装到布线基板2的情况下，也能通过向树脂密封用夹具7的包围区域内填充液状树脂4a来一次性地进行各电子元器件3所有的底部填充，因此底部填充树脂层形成工序的工时数得以减少，能降低模块1的制造成本。此外，由于无需用于配置分配器的树脂注入口的空间，因此也能支持电子元器件3的高密度安装化。
＜实施方式2＞
参照图3对本发明的实施方式2所涉及的模块1a进行说明。另外，图3是用于说明实施方式2的模块1a的制造方法的图，图3(a)～图3(f)表示各个工序。
本实施方式的模块1a与参照图1和图2进行了说明的实施方式1的模块1的不同点在于，在制造方法中，使用粉末树脂4b来形成底部填充树脂层4。其它结构与实施方式1的模块1相同，因此通过对该相同结构标注相同标号来省略其结构说明。
另外，图3所示的模块1a的制造方法的各工序中，图3(a)～(b)所示的工序对应于图2(a)～(b)所示的工序，图3(f)所示的工序对应于图2(e)，由于分别是相同的工序，因此省略说明。
模块1a的制造方法中，在经过图3(a)及图3(b)的各工序后，如图3(c)所示，在密封树脂用夹具7的包围区域内配置粉末树脂4b作为底部填充树脂(粉末树脂配置工序)。该粉末树脂4b通过混合由环氧树脂形成的粉末和填料而得到，该填料使用粒径比布线基板2的一个主面与电子元器件3之间的间隔要小的填料。此时，将粉末树脂4b的量调整为适合在后述的底部填充树脂层形成工序中在布线基板2的一个主面的整个面形成底部填充树脂层4，并将布线基板2的一个主面与电子元器件3之间的间隙填满。另外，在包围区域内配置粉末树脂4b例如能通过从布线基板2的上方侧进行散布等来进行。此外，如图3(c)所示，该工序中，处于布线基板2的一个主面与电子元器件3之间的间隙内未填充粉末树脂4b的状态。
接着，如图3(d)所示，通过使布线基板2等振动(例如超声波振动)，来整理粉末树脂4b，以使粉末树脂4b均匀地配置在密封树脂用夹具7的包围区域内，并对粉末树脂4b进行整理，以使粉末树脂4b填充到布线基板2的一个主面与电子元器件3之间的间隙(粉末整理工序)。
接着，如图3(e)所示，在130℃左右的温度下加热从而使粉末树脂4b溶解并暂时固化，然后将密封树脂用夹具7去除，而后在180℃左右的温度下使粉末树脂4b正式固化，从而形成底部填充树脂层4(底部填充树脂层形成工序)。此时，在使粉末树脂4b正式固化时，暂时固化的粉末树脂4b扩散至布线基板2的一个主面的整个面。
接着，利用与参照图2(e)进行了说明的模块1的模塑树脂形成工序相同的方法形成模塑树脂层5(参照图3(f))来制造模块1a。
另外，能利用混合粒径比布线基板2的一个主面与电子元器件3之间的间隔要小的填料、粒径比布线基板2的一个主面与电子元器件3之间的间隔要大的填料、以及粉末状的环氧树脂而得到的粉末树脂，来同时形成底部填充树脂层4以及模塑树脂层5。
具体而言，在安装了电子元器件3的布线基板2配置密封树脂用夹具7后，从布线基板2的上方侧散布混合了上述大小的填料和粉末状环氧树脂的粉末树脂，直到将电子元器件3埋没，并使布线基板2等振动。此时，粒径比布线基板2的一个主面与电子元器件3之间的间隙要小的填料进入到布线基板2的一个主面与电子元器件3之间的间隙，与环氧树脂一起形成底部填充树脂层4，粒径较大的填料则移动到底部填充树脂层4的上侧，与环氧树脂一起形成模塑树脂层5。通过如上述那样同时形成底部填充树脂层4和模塑树脂层5，从而能减少模块1的制造工时数，能降低模块1的制造成本。
因此，通过使用上述本发明的实施方式2的模块1a的制造方法，能利用粉末树脂4b来形成模块1a的底部填充树脂层4。
＜实施方式3＞
参照图4对本发明的实施方式3所涉及的模块1b进行说明。另外，图4是模块1b的剖视图。
本实施方式的模块1b与参照图1进行了说明的实施方式1的模块1的不同点如图4所示，模塑树脂层5为双层结构。其它结构与实施方式1的模块1相同，因此通过对该相同结构标注相同标号来省略其结构说明。
该情况下，模塑树脂层5由与底部填充树脂层4的上侧相邻配置的第一模塑树脂层5b、以及配置在该第一模塑树脂层5b的上侧的第二模塑树脂层5c形成。此外，第一模塑树脂层5b所含有的填料的粒径以及第二模塑树脂层5c所含有的填料的粒径均比底部填充树脂层4的填料的粒径要大，且第一模塑树脂层5b的填料的粒径比第二模塑树脂层5c的填料的粒径要小。即，构成为随着从底部填充树脂层4起向上层侧行进，各层4、5b、5c所含有的填料的粒径逐渐变大。
另外，模塑树脂层5不限于上述双层结构，也可以进一步增加层数。该情况下，可以设为越是配置在上层侧的层，该层所含有的填料的粒径越大。
通过采用这种结构，能缩小相邻层中的线膨胀系数的差，因此能防止相邻层之间的界面剥离，并能减少模块1b的翘曲。
＜实施方式4＞
参照图5对本发明的实施方式3所涉及的模块1c进行说明。另外，图5是模块1c的剖视图。
本实施方式所涉及的模块1c与参照图1进行了说明的实施方式1的模块1的不同之处在于，如图5所示，在布线基板2的一个主面安装有多个电子元器件3。其它结构与实施方式1相同，因此标注相同的标号并省略说明。
该情况下，在布线基板2的一个主面安装有一个半导体元件3a和两个贴片元器件3b作为电子元器件3。两个贴片元器件3b是贴片电容器、贴片电感器、贴片电阻等无源元器件。半导体元件3a通过倒装芯片安装方式来安装，两个贴片元器件3b分别利用公知的表面安装技术来安装。
此外，底部填充树脂层4所含有的填料使用粒径比布线基板2的一个主面分别与半导体元件3a、两个贴片元器件3b之间的间隔h、h1中最小的间隔h1要小的填料。此外，底部填充树脂层4的厚度形成为比布线基板2的一个主面分别与半导体元件3a、两个贴片元器件3b之间的间隔h、h1中最大的间隔h要厚(底部填充树脂层4的厚度h2＞h)。
通过如上述那样使底部填充树脂层4的填料的粒径比布线基板2的一个主面分别与各电子元器件3(半导体元件3a、贴片元器件3b)的间隔h、h1中最小的间隔h1要小，从而在所有的电子元器件3中，向与布线基板2之间的间隙填入底部填充树脂层4的树脂的填充性得以提高。此外，通过使底部填充树脂层4的厚度形成得比布线基板2的一个主面分别与各电子元器件3之间的间隔h、h1中最大的间隔h要厚，从而在各电子元器件3各自的与布线基板2的一个主面的间隙的整个区域均填充有树脂，因此各电子元器件3的各自与布线基板2的连接可靠性得以提高。
另外，本发明并不限于上述的各实施方式，只要不脱离其技术思想，可以进行上述实施方式以外的各种变更。
例如，在上述实施方式中，对使用液状树脂形成模塑树脂层5的情况进行了说明，但也可以使用例如粉末树脂、树脂片材来形成模塑树脂层5。
工业上的实用性
本发明能通用于布线基板2所安装的电子元器件3被树脂密封而成的各种模块。
标号说明
1，1a，1b，1c 模块
2 布线基板
3 电子元器件
3a  半导体元件(电子元器件)
3b  贴片元器件(电子元器件)
4   底部填充树脂层
4a  液状树脂
4b  粉末树脂
5   模塑树脂层
5a  模塑用树脂
5b  第一模塑树脂层
5c  第二模塑树脂层
7   树脂密封用夹具

Claims (5)

1.一种模块，其特征在于，包括：
布线基板；
电子元器件，该电子元器件安装于所述布线基板的一个主面；
底部填充树脂层，该底部填充树脂层形成于所述布线基板的一个主面的整个面，并形成为将所述布线基板的一个主面与所述电子元器件之间的间隙填满；以及
模塑树脂层，该模塑树脂层形成为覆盖所述底部填充树脂层的至少一部分以及所述电子元器件，
所述底部填充树脂层由含有填料的树脂形成，该填料的粒径比所述布线基板的一个主面与所述电子元器件之间的间隔要小。
2.如权利要求1所述的模块，其特征在于，
所述布线基板的一个主面安装有多个所述电子元器件，
所述底部填充树脂层所含有的填料的粒径比所述布线基板的一个主面分别与各所述电子元器件之间的间隔中最小的间隔要小，
所述底部填充树脂层的厚度形成为比所述布线基板的一个主面分别与各所述电子元器件之间的间隔中最大的间隔要厚。
3.如权利要求1或2所述的模块，其特征在于，
所述模塑树脂层由多个层形成，该多个层分别含有粒径比所述底部填充树脂层的填料的粒径要大、且粒径互不相同的填料，
所述各层配置成：从所述底部填充树脂层起越是配置在上层侧的层，该层所含有的填料的粒径越大。
4.一种模块的制造方法，其特征在于，包括：
在布线基板的一个主面安装电子元器件的安装工序；
在所述布线基板的所述一个主面的周边以包围所述电子元器件的方式配置树脂密封用夹具的配置工序；
在所述树脂密封用夹具的包围区域内填充含有填料的液状树脂以作为底部填充树脂的填充工序，所述填料的粒径比所述布线基板的一个主面与所述电子元器件之间的间隔要小；
通过使所述液状树脂固化并去除所述树脂密封用夹具来形成底部填充树脂层的底部填充树脂层形成工序；以及
以覆盖所述底部填充树脂层以及所述电子元器件的方式来形成模塑树脂层的模塑树脂层形成工序。
5.一种模块的制造方法，其特征在于，包括：
在布线基板的一个主面安装电子元器件的安装工序；
在所述布线基板的一个主面的周边以包围所述电子元器件的方式配置树脂密封用夹具的配置工序；
在所述树脂密封用夹具的包围区域内配置含有填料的粉末树脂以作为底部填充树脂的粉末树脂配置工序，所述填料的粒径比所述布线基板的一个主面与所述电子元器件之间的间隔要小；
对该粉末树脂进行整理以使所述粉末树脂均匀配置在所述包围区域内、并对所述粉末树脂进行整理以使所述粉末树脂填充于所述布线基板的一个主面与所述电子元器件之间的间隙的粉末整理工序；
通过在使所述粉末树脂溶解后使其固化并去除所述树脂密封夹具从而形成底部填充树脂层的底部填充树脂形成工序；以及
以覆盖所述底部填充树脂层以及所述电子元器件的方式来形成模塑树脂层的模塑树脂层形成工序。
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