CN104889596A - 一种低温无铅锡膏及其助焊膏的生产工艺 - Google Patents
一种低温无铅锡膏及其助焊膏的生产工艺 Download PDFInfo
- Publication number
- CN104889596A CN104889596A CN201510331421.7A CN201510331421A CN104889596A CN 104889596 A CN104889596 A CN 104889596A CN 201510331421 A CN201510331421 A CN 201510331421A CN 104889596 A CN104889596 A CN 104889596A
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- Prior art keywords
- low
- temperature lead
- weight
- free tin
- tin cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title abstract description 5
- 230000004907 flux Effects 0.000 title abstract 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 23
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 20
- 239000004952 Polyamide Substances 0.000 claims abstract description 16
- 239000004359 castor oil Substances 0.000 claims abstract description 16
- 235000019438 castor oil Nutrition 0.000 claims abstract description 16
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims abstract description 16
- 229920002647 polyamide Polymers 0.000 claims abstract description 16
- 239000002562 thickening agent Substances 0.000 claims abstract description 15
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 10
- 239000000956 alloy Substances 0.000 claims abstract description 10
- 150000001412 amines Chemical class 0.000 claims abstract description 8
- 150000007524 organic acids Chemical class 0.000 claims abstract description 8
- 239000004094 surface-active agent Substances 0.000 claims abstract description 8
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical group [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000006071 cream Substances 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 50
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 30
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 14
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 12
- 230000003213 activating effect Effects 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- SYHAHHTUPPCPTM-UHFFFAOYSA-N 2,2-dibromoethylbenzene Chemical compound BrC(Br)CC1=CC=CC=C1 SYHAHHTUPPCPTM-UHFFFAOYSA-N 0.000 claims description 8
- LVFFZQQWIZURIO-UHFFFAOYSA-N 2-phenylbutanedioic acid Chemical compound OC(=O)CC(C(O)=O)C1=CC=CC=C1 LVFFZQQWIZURIO-UHFFFAOYSA-N 0.000 claims description 8
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 8
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 claims description 8
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 claims description 8
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 8
- JLFNLZLINWHATN-UHFFFAOYSA-N pentaethylene glycol Chemical compound OCCOCCOCCOCCOCCO JLFNLZLINWHATN-UHFFFAOYSA-N 0.000 claims description 8
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 8
- 238000005352 clarification Methods 0.000 claims description 7
- 239000006210 lotion Substances 0.000 claims description 7
- 238000010792 warming Methods 0.000 claims description 7
- IFTGEZOPUAJVMG-UHFFFAOYSA-N 1,1-dibromobut-1-ene Chemical group CCC=C(Br)Br IFTGEZOPUAJVMG-UHFFFAOYSA-N 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 6
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 claims description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 6
- 239000011976 maleic acid Substances 0.000 claims description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 6
- CQXMAMUUWHYSIY-UHFFFAOYSA-N Lignoceric acid Natural products CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCC1=CC=C(O)C=C1 CQXMAMUUWHYSIY-UHFFFAOYSA-N 0.000 claims description 4
- 235000021353 Lignoceric acid Nutrition 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 4
- UZBQIPPOMKBLAS-UHFFFAOYSA-N diethylazanide Chemical compound CC[N-]CC UZBQIPPOMKBLAS-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 235000019260 propionic acid Nutrition 0.000 claims description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 4
- QZZGJDVWLFXDLK-UHFFFAOYSA-N tetracosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(O)=O QZZGJDVWLFXDLK-UHFFFAOYSA-N 0.000 claims description 4
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical group NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 2
- -1 tin bismuthino, tin bismuth copper Chemical group 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000009835 boiling Methods 0.000 abstract description 2
- 239000013543 active substance Substances 0.000 abstract 2
- QKAJPFXKNNXMIZ-UHFFFAOYSA-N [Bi].[Ag].[Sn] Chemical compound [Bi].[Ag].[Sn] QKAJPFXKNNXMIZ-UHFFFAOYSA-N 0.000 abstract 1
- ZWFRZGJUJSOHGL-UHFFFAOYSA-N [Bi].[Cu].[Sn] Chemical compound [Bi].[Cu].[Sn] ZWFRZGJUJSOHGL-UHFFFAOYSA-N 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Paints Or Removers (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510331421.7A CN104889596B (zh) | 2015-06-16 | 2015-06-16 | 一种低温无铅锡膏及其助焊膏的生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510331421.7A CN104889596B (zh) | 2015-06-16 | 2015-06-16 | 一种低温无铅锡膏及其助焊膏的生产工艺 |
Publications (2)
Publication Number | Publication Date |
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CN104889596A true CN104889596A (zh) | 2015-09-09 |
CN104889596B CN104889596B (zh) | 2017-12-12 |
Family
ID=54022782
Family Applications (1)
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CN201510331421.7A Active CN104889596B (zh) | 2015-06-16 | 2015-06-16 | 一种低温无铅锡膏及其助焊膏的生产工艺 |
Country Status (1)
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CN (1) | CN104889596B (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106141489A (zh) * | 2016-08-05 | 2016-11-23 | 苏州锡友微连电子科技有限公司 | 激光回流焊用的复合焊膏 |
CN106181134A (zh) * | 2016-08-05 | 2016-12-07 | 苏州锡友微连电子科技有限公司 | 激光回流焊用的焊膏的制备方法 |
CN106271186A (zh) * | 2016-08-31 | 2017-01-04 | 苏州恩斯泰金属科技有限公司 | 一种焊锡膏 |
CN106425153A (zh) * | 2016-10-28 | 2017-02-22 | 广东中实金属有限公司 | 一种含铋低银无铅焊锡膏 |
CN106514035A (zh) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | 钎焊用铝焊膏 |
CN106736005A (zh) * | 2017-01-12 | 2017-05-31 | 东莞市合点电子材料有限公司 | 无铅低温通孔专用环保锡膏 |
CN106736017A (zh) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | 低银铜基中温焊膏 |
CN106825980A (zh) * | 2017-01-12 | 2017-06-13 | 东莞市合点电子材料有限公司 | 散热器专用无卤素焊锡膏 |
CN106825995A (zh) * | 2015-09-30 | 2017-06-13 | 株式会社田村制作所 | 助焊剂组合物和焊膏 |
CN108747090A (zh) * | 2018-06-21 | 2018-11-06 | 上海华庆焊材技术有限公司 | 一种助焊胶及其制备方法、应用 |
CN111015011A (zh) * | 2019-12-30 | 2020-04-17 | 苏州优诺电子材料科技有限公司 | 一种高稳定焊锡膏及制备方法 |
US20220009042A1 (en) * | 2019-01-24 | 2022-01-13 | Koki Company Limited | Flux and solder paste |
CN115401356A (zh) * | 2021-10-21 | 2022-11-29 | 上海华庆焊材技术股份有限公司 | 一种水洗低温无铅锡膏及其制备方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0596396A (ja) * | 1991-10-03 | 1993-04-20 | Furukawa Electric Co Ltd:The | クリーム半田 |
JP2001138089A (ja) * | 1999-11-19 | 2001-05-22 | Nippon Genma:Kk | はんだ用フラックスおよびソルダペースト |
CN101077555A (zh) * | 2007-07-03 | 2007-11-28 | 东莞市特尔佳电子有限公司 | 点涂式焊锡膏的助焊剂 |
CN101380699A (zh) * | 2008-10-20 | 2009-03-11 | 西安理工大学 | 锡锌系无铅合金焊膏及其制备方法 |
CN101564805A (zh) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | 低银SnAgCu无铅焊膏用新型环保型助焊剂 |
CN101695794A (zh) * | 2009-10-23 | 2010-04-21 | 东莞市特尔佳电子有限公司 | 一种无卤锡铋铜焊锡膏及其制备方法 |
CN102069323A (zh) * | 2010-12-14 | 2011-05-25 | 东莞市特尔佳电子有限公司 | 一种用于通孔涂布作业的中温锡合金焊锡膏及其制备方法 |
CN102528328A (zh) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | 一种针筒无铅焊锡膏及制备方法 |
CN102990242A (zh) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | 一种低温无卤无铅焊锡膏 |
CN103111773A (zh) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | 一种无铅焊锡膏用助焊剂 |
-
2015
- 2015-06-16 CN CN201510331421.7A patent/CN104889596B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0596396A (ja) * | 1991-10-03 | 1993-04-20 | Furukawa Electric Co Ltd:The | クリーム半田 |
JP2001138089A (ja) * | 1999-11-19 | 2001-05-22 | Nippon Genma:Kk | はんだ用フラックスおよびソルダペースト |
CN101077555A (zh) * | 2007-07-03 | 2007-11-28 | 东莞市特尔佳电子有限公司 | 点涂式焊锡膏的助焊剂 |
CN101380699A (zh) * | 2008-10-20 | 2009-03-11 | 西安理工大学 | 锡锌系无铅合金焊膏及其制备方法 |
CN101564805A (zh) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | 低银SnAgCu无铅焊膏用新型环保型助焊剂 |
CN101695794A (zh) * | 2009-10-23 | 2010-04-21 | 东莞市特尔佳电子有限公司 | 一种无卤锡铋铜焊锡膏及其制备方法 |
CN102069323A (zh) * | 2010-12-14 | 2011-05-25 | 东莞市特尔佳电子有限公司 | 一种用于通孔涂布作业的中温锡合金焊锡膏及其制备方法 |
CN102990242A (zh) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | 一种低温无卤无铅焊锡膏 |
CN102528328A (zh) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | 一种针筒无铅焊锡膏及制备方法 |
CN103111773A (zh) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | 一种无铅焊锡膏用助焊剂 |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106825995A (zh) * | 2015-09-30 | 2017-06-13 | 株式会社田村制作所 | 助焊剂组合物和焊膏 |
CN106181134A (zh) * | 2016-08-05 | 2016-12-07 | 苏州锡友微连电子科技有限公司 | 激光回流焊用的焊膏的制备方法 |
CN106141489A (zh) * | 2016-08-05 | 2016-11-23 | 苏州锡友微连电子科技有限公司 | 激光回流焊用的复合焊膏 |
CN106271186A (zh) * | 2016-08-31 | 2017-01-04 | 苏州恩斯泰金属科技有限公司 | 一种焊锡膏 |
CN106271186B (zh) * | 2016-08-31 | 2019-11-08 | 苏州恩斯泰金属科技有限公司 | 一种焊锡膏 |
CN106425153A (zh) * | 2016-10-28 | 2017-02-22 | 广东中实金属有限公司 | 一种含铋低银无铅焊锡膏 |
CN106514035A (zh) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | 钎焊用铝焊膏 |
CN106736017A (zh) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | 低银铜基中温焊膏 |
CN106825980A (zh) * | 2017-01-12 | 2017-06-13 | 东莞市合点电子材料有限公司 | 散热器专用无卤素焊锡膏 |
CN106736005A (zh) * | 2017-01-12 | 2017-05-31 | 东莞市合点电子材料有限公司 | 无铅低温通孔专用环保锡膏 |
CN108747090A (zh) * | 2018-06-21 | 2018-11-06 | 上海华庆焊材技术有限公司 | 一种助焊胶及其制备方法、应用 |
CN108747090B (zh) * | 2018-06-21 | 2020-12-08 | 上海华庆焊材技术有限公司 | 一种助焊胶及其制备方法、应用 |
US20220009042A1 (en) * | 2019-01-24 | 2022-01-13 | Koki Company Limited | Flux and solder paste |
US11975411B2 (en) * | 2019-01-24 | 2024-05-07 | Koki Company Limited | Flux and solder paste |
CN111015011A (zh) * | 2019-12-30 | 2020-04-17 | 苏州优诺电子材料科技有限公司 | 一种高稳定焊锡膏及制备方法 |
CN115401356A (zh) * | 2021-10-21 | 2022-11-29 | 上海华庆焊材技术股份有限公司 | 一种水洗低温无铅锡膏及其制备方法 |
Also Published As
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CN104889596B (zh) | 2017-12-12 |
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