CN104854681B - 基板液体处理装置和基板液体处理方法 - Google Patents

基板液体处理装置和基板液体处理方法 Download PDF

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Publication number
CN104854681B
CN104854681B CN201380065321.3A CN201380065321A CN104854681B CN 104854681 B CN104854681 B CN 104854681B CN 201380065321 A CN201380065321 A CN 201380065321A CN 104854681 B CN104854681 B CN 104854681B
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China
Prior art keywords
substrate
purge
slit
back surface
peripheral
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CN201380065321.3A
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English (en)
Chinese (zh)
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CN104854681A (zh
Inventor
福田昌弘
久保明广
山本太郎
矢田健二
大河内厚
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201380065321.3A 2012-12-13 2013-12-12 基板液体处理装置和基板液体处理方法 Active CN104854681B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012271880A JP5973901B2 (ja) 2012-12-13 2012-12-13 基板液処理装置及び基板液処理方法
JP2012-271880 2012-12-13
PCT/JP2013/083367 WO2014092160A1 (ja) 2012-12-13 2013-12-12 基板液処理装置及び基板液処理方法

Publications (2)

Publication Number Publication Date
CN104854681A CN104854681A (zh) 2015-08-19
CN104854681B true CN104854681B (zh) 2017-04-19

Family

ID=50934443

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380065321.3A Active CN104854681B (zh) 2012-12-13 2013-12-12 基板液体处理装置和基板液体处理方法

Country Status (6)

Country Link
US (1) US9570327B2 (enExample)
JP (1) JP5973901B2 (enExample)
KR (1) KR101892796B1 (enExample)
CN (1) CN104854681B (enExample)
TW (1) TW201503227A (enExample)
WO (1) WO2014092160A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102000017B1 (ko) * 2017-07-21 2019-07-18 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102162188B1 (ko) * 2018-07-18 2020-10-07 세메스 주식회사 기판 처리 장치 및 방법
JP2020077755A (ja) * 2018-11-07 2020-05-21 株式会社Ｓｃｒｅｅｎホールディングス 処理カップユニットおよび基板処理装置
CN110459493B (zh) * 2019-08-21 2022-03-22 北京北方华创微电子装备有限公司 抽真空腔室及抽真空方法
CN112750719B (zh) * 2019-10-31 2023-12-12 上海微电子装备（集团）股份有限公司 一种硅片表面清洁装置和方法
KR20210101983A (ko) * 2020-02-11 2021-08-19 삼성전자주식회사 웨이퍼 검사 장치 및 이를 이용한 반도체 소자 제조 방법
JP2023102138A (ja) * 2022-01-11 2023-07-24 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及びプログラム
US12420313B2 (en) * 2022-08-09 2025-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Onsite cleaning system and method
CN115547812A (zh) * 2022-09-26 2022-12-30 华虹半导体(无锡)有限公司 防止接触孔内粘附层沉积前预清洗时形成水痕的方法
EP4404247A3 (en) * 2022-12-23 2024-08-14 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method
CN119334119A (zh) * 2023-07-20 2025-01-21 成都辰显光电有限公司 风干装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359220A (ja) * 2001-05-31 2002-12-13 Tokyo Electron Ltd 基板の処理装置
CN101207007A (zh) * 2006-12-20 2008-06-25 东京毅力科创株式会社 基板清洗装置、基板清洗方法及存储介质
CN101276739A (zh) * 2007-03-29 2008-10-01 东京毅力科创株式会社 基板处理系统和基板清洗装置
JP2012169572A (ja) * 2011-02-17 2012-09-06 Tokyo Electron Ltd 基板洗浄装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3171965B2 (ja) * 1992-10-19 2001-06-04 島田理化工業株式会社 スピン洗浄乾燥装置
JPH10172944A (ja) 1996-12-10 1998-06-26 Nittetsu Semiconductor Kk 半導体装置のフォトリソグラフィー工程におけるウエーハ裏面洗浄方法
JP4040270B2 (ja) * 2001-06-25 2008-01-30 東京エレクトロン株式会社 基板の処理装置
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
JP4607755B2 (ja) * 2005-12-19 2011-01-05 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359220A (ja) * 2001-05-31 2002-12-13 Tokyo Electron Ltd 基板の処理装置
CN101207007A (zh) * 2006-12-20 2008-06-25 东京毅力科创株式会社 基板清洗装置、基板清洗方法及存储介质
CN101276739A (zh) * 2007-03-29 2008-10-01 东京毅力科创株式会社 基板处理系统和基板清洗装置
JP2012169572A (ja) * 2011-02-17 2012-09-06 Tokyo Electron Ltd 基板洗浄装置

Also Published As

Publication number Publication date
KR101892796B1 (ko) 2018-08-28
WO2014092160A1 (ja) 2014-06-19
TW201503227A (zh) 2015-01-16
JP2014120489A (ja) 2014-06-30
TWI560743B (enExample) 2016-12-01
KR20150093699A (ko) 2015-08-18
US9570327B2 (en) 2017-02-14
JP5973901B2 (ja) 2016-08-23
CN104854681A (zh) 2015-08-19
US20150318193A1 (en) 2015-11-05

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