CN104854045B - 玻璃板层叠体及其制造方法 - Google Patents

玻璃板层叠体及其制造方法 Download PDF

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Publication number
CN104854045B
CN104854045B CN201380056195.5A CN201380056195A CN104854045B CN 104854045 B CN104854045 B CN 104854045B CN 201380056195 A CN201380056195 A CN 201380056195A CN 104854045 B CN104854045 B CN 104854045B
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CN
China
Prior art keywords
glass
glass plate
laser
fusing
glass plates
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Active
Application number
CN201380056195.5A
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English (en)
Chinese (zh)
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CN104854045A (zh
Inventor
藤居孝英
稻山尚利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
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Nippon Electric Glass Co Ltd
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Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Publication of CN104854045A publication Critical patent/CN104854045A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • C03B23/24—Making hollow glass sheets or bricks
    • C03B23/245—Hollow glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/02—Annealing glass products in a discontinuous way
    • C03B25/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
CN201380056195.5A 2012-11-13 2013-10-24 玻璃板层叠体及其制造方法 Active CN104854045B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012249305A JP5958823B2 (ja) 2012-11-13 2012-11-13 ガラス板積層体及びその製造方法
JP2012-249305 2012-11-13
PCT/JP2013/078862 WO2014077102A1 (ja) 2012-11-13 2013-10-24 ガラス板積層体及びその製造方法

Publications (2)

Publication Number Publication Date
CN104854045A CN104854045A (zh) 2015-08-19
CN104854045B true CN104854045B (zh) 2017-12-19

Family

ID=50731020

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380056195.5A Active CN104854045B (zh) 2012-11-13 2013-10-24 玻璃板层叠体及其制造方法

Country Status (7)

Country Link
US (1) US9701565B2 (enExample)
EP (1) EP2921462B1 (enExample)
JP (1) JP5958823B2 (enExample)
KR (1) KR102071366B1 (enExample)
CN (1) CN104854045B (enExample)
TW (1) TWI579139B (enExample)
WO (1) WO2014077102A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6243641B2 (ja) * 2013-07-02 2017-12-06 三菱電線工業株式会社 ガラス構造体の製造方法
JP6631935B2 (ja) * 2015-01-05 2020-01-15 日本電気硝子株式会社 ガラス板の製造方法
JP2017186204A (ja) * 2016-04-07 2017-10-12 英興株式会社 シリカガラス溶接方法
US10821707B2 (en) * 2018-05-17 2020-11-03 Vaon, Llc Multi-layer, flat glass structures
US11243192B2 (en) 2016-09-27 2022-02-08 Vaon, Llc 3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
US11203183B2 (en) 2016-09-27 2021-12-21 Vaon, Llc Single and multi-layer, flat glass-sensor structures
WO2018066508A1 (ja) * 2016-10-05 2018-04-12 日本電気硝子株式会社 ガラス樹脂積層体の製造方法及びガラス樹脂積層体
CN110177766B (zh) * 2017-02-07 2021-12-10 日本电气硝子株式会社 玻璃膜的制造方法
JP6931918B2 (ja) * 2017-08-31 2021-09-08 三星ダイヤモンド工業株式会社 ガラス基板の端面処理方法及びガラス基板の端面処理装置
JP6931919B2 (ja) * 2017-08-31 2021-09-08 三星ダイヤモンド工業株式会社 ガラス基板の残留応力低減方法及びガラス基板の残留応力低減装置
CN110627380A (zh) * 2019-09-16 2019-12-31 深圳市裕展精密科技有限公司 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001057638A1 (fr) * 2000-01-31 2001-08-09 Touch Panel Systems K.K. Ecran tactile et procede d'utilisation dudit ecran
CN1693244A (zh) * 2005-04-29 2005-11-09 陶礼德 玻璃真空板及其制造方法
US20100304151A1 (en) * 2007-02-21 2010-12-02 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method for laser-assisted bonding, substrates bonded in this manner and use thereof

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Publication number Priority date Publication date Assignee Title
JP3077462B2 (ja) * 1993-09-01 2000-08-14 日立電線株式会社 ガラスの切断方法
DE4444547C2 (de) * 1994-12-14 1997-02-27 Schott Rohrglas Gmbh Verfahren zum wärmeweichen Trennen von dünnwandigen Glasrohren oder -platten
JP2000281368A (ja) 1999-03-31 2000-10-10 Shin Meiwa Ind Co Ltd ガラス板の製造方法
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
JP4582502B2 (ja) * 2004-03-02 2010-11-17 日本電気硝子株式会社 タブレット一体型ガラス管
JP5522881B2 (ja) * 2006-09-06 2014-06-18 イムラ アメリカ インコーポレイテッド 材料を接合するための方法
WO2010097908A1 (ja) * 2009-02-25 2010-09-02 セイコーインスツル株式会社 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP5733600B2 (ja) 2009-07-03 2015-06-10 日本電気硝子株式会社 素子封止体の製造方法、及び素子封止体
JP5505857B2 (ja) * 2009-08-17 2014-05-28 日本電気硝子株式会社 素子封止体の製造方法、素子の封止方法、及び素子封止体
TWI572480B (zh) * 2011-07-25 2017-03-01 康寧公司 經層壓及離子交換之強化玻璃疊層
US9010151B2 (en) * 2011-09-15 2015-04-21 Nippon Electric Glass Co., Ltd. Glass sheet cutting method
US9162919B2 (en) * 2012-02-28 2015-10-20 Corning Incorporated High strain point aluminosilicate glasses
US9914657B2 (en) * 2013-04-30 2018-03-13 Corning Incorporated Apparatus and method for thermal profile control in an isopipe

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001057638A1 (fr) * 2000-01-31 2001-08-09 Touch Panel Systems K.K. Ecran tactile et procede d'utilisation dudit ecran
CN1693244A (zh) * 2005-04-29 2005-11-09 陶礼德 玻璃真空板及其制造方法
US20100304151A1 (en) * 2007-02-21 2010-12-02 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Method for laser-assisted bonding, substrates bonded in this manner and use thereof

Also Published As

Publication number Publication date
WO2014077102A1 (ja) 2014-05-22
TW201425014A (zh) 2014-07-01
EP2921462B1 (en) 2018-03-28
TWI579139B (zh) 2017-04-21
EP2921462A4 (en) 2016-09-14
US20160272532A1 (en) 2016-09-22
CN104854045A (zh) 2015-08-19
JP2014097905A (ja) 2014-05-29
EP2921462A1 (en) 2015-09-23
KR20150084755A (ko) 2015-07-22
US9701565B2 (en) 2017-07-11
KR102071366B1 (ko) 2020-01-30
JP5958823B2 (ja) 2016-08-02

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