TWI579139B - 玻璃板積層體及其製造方法 - Google Patents
玻璃板積層體及其製造方法 Download PDFInfo
- Publication number
- TWI579139B TWI579139B TW102140197A TW102140197A TWI579139B TW I579139 B TWI579139 B TW I579139B TW 102140197 A TW102140197 A TW 102140197A TW 102140197 A TW102140197 A TW 102140197A TW I579139 B TWI579139 B TW I579139B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass
- laser
- sheet laminate
- glass sheet
- surface contact
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/24—Making hollow glass sheets or bricks
- C03B23/245—Hollow glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/02—Annealing glass products in a discontinuous way
- C03B25/025—Glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012249305A JP5958823B2 (ja) | 2012-11-13 | 2012-11-13 | ガラス板積層体及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201425014A TW201425014A (zh) | 2014-07-01 |
| TWI579139B true TWI579139B (zh) | 2017-04-21 |
Family
ID=50731020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102140197A TWI579139B (zh) | 2012-11-13 | 2013-11-06 | 玻璃板積層體及其製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9701565B2 (enExample) |
| EP (1) | EP2921462B1 (enExample) |
| JP (1) | JP5958823B2 (enExample) |
| KR (1) | KR102071366B1 (enExample) |
| CN (1) | CN104854045B (enExample) |
| TW (1) | TWI579139B (enExample) |
| WO (1) | WO2014077102A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6243641B2 (ja) * | 2013-07-02 | 2017-12-06 | 三菱電線工業株式会社 | ガラス構造体の製造方法 |
| JP6631935B2 (ja) * | 2015-01-05 | 2020-01-15 | 日本電気硝子株式会社 | ガラス板の製造方法 |
| JP2017186204A (ja) * | 2016-04-07 | 2017-10-12 | 英興株式会社 | シリカガラス溶接方法 |
| US11243192B2 (en) | 2016-09-27 | 2022-02-08 | Vaon, Llc | 3-D glass printable hand-held gas chromatograph for biomedical and environmental applications |
| US10821707B2 (en) * | 2018-05-17 | 2020-11-03 | Vaon, Llc | Multi-layer, flat glass structures |
| US11203183B2 (en) | 2016-09-27 | 2021-12-21 | Vaon, Llc | Single and multi-layer, flat glass-sensor structures |
| WO2018066508A1 (ja) * | 2016-10-05 | 2018-04-12 | 日本電気硝子株式会社 | ガラス樹脂積層体の製造方法及びガラス樹脂積層体 |
| JP6929525B2 (ja) * | 2017-02-07 | 2021-09-01 | 日本電気硝子株式会社 | ガラスフィルムの製造方法 |
| JP6931918B2 (ja) * | 2017-08-31 | 2021-09-08 | 三星ダイヤモンド工業株式会社 | ガラス基板の端面処理方法及びガラス基板の端面処理装置 |
| JP6931919B2 (ja) * | 2017-08-31 | 2021-09-08 | 三星ダイヤモンド工業株式会社 | ガラス基板の残留応力低減方法及びガラス基板の残留応力低減装置 |
| CN110627380A (zh) * | 2019-09-16 | 2019-12-31 | 深圳市裕展精密科技有限公司 | 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备 |
| DE102020117194B4 (de) * | 2020-06-30 | 2023-06-22 | Schott Ag | Hermetisch verschlossene Umhäusung und Verfahren zu deren Herstellung |
| CN116101970A (zh) * | 2022-09-07 | 2023-05-12 | 中国航空工业集团公司北京长城计量测试技术研究所 | 一种微型原子气室的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000281368A (ja) * | 1999-03-31 | 2000-10-10 | Shin Meiwa Ind Co Ltd | ガラス板の製造方法 |
| JP2011037685A (ja) * | 2009-08-17 | 2011-02-24 | Nippon Electric Glass Co Ltd | 素子封止体及びその製造方法並びに素子の封止方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3077462B2 (ja) * | 1993-09-01 | 2000-08-14 | 日立電線株式会社 | ガラスの切断方法 |
| DE4444547C2 (de) * | 1994-12-14 | 1997-02-27 | Schott Rohrglas Gmbh | Verfahren zum wärmeweichen Trennen von dünnwandigen Glasrohren oder -platten |
| WO2001057638A1 (fr) * | 2000-01-31 | 2001-08-09 | Touch Panel Systems K.K. | Ecran tactile et procede d'utilisation dudit ecran |
| US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
| JP4582502B2 (ja) * | 2004-03-02 | 2010-11-17 | 日本電気硝子株式会社 | タブレット一体型ガラス管 |
| CN1693244A (zh) * | 2005-04-29 | 2005-11-09 | 陶礼德 | 玻璃真空板及其制造方法 |
| JP5522881B2 (ja) | 2006-09-06 | 2014-06-18 | イムラ アメリカ インコーポレイテッド | 材料を接合するための方法 |
| DE102007008540A1 (de) * | 2007-02-21 | 2008-08-28 | Friedrich-Schiller-Universität Jena | Verfahren zum Laser-gestützten Bonden, derart gebondete Substrate und deren Verwendung |
| CN102388000A (zh) * | 2009-02-25 | 2012-03-21 | 精工电子有限公司 | 接合玻璃的切断方法、封装件的制造方法、封装件、压电振动器、振荡器、电子设备及电波钟 |
| JP5733600B2 (ja) * | 2009-07-03 | 2015-06-10 | 日本電気硝子株式会社 | 素子封止体の製造方法、及び素子封止体 |
| TWI572480B (zh) * | 2011-07-25 | 2017-03-01 | 康寧公司 | 經層壓及離子交換之強化玻璃疊層 |
| WO2013039230A1 (ja) * | 2011-09-15 | 2013-03-21 | 日本電気硝子株式会社 | ガラス板切断方法 |
| US9162919B2 (en) * | 2012-02-28 | 2015-10-20 | Corning Incorporated | High strain point aluminosilicate glasses |
| US9914657B2 (en) * | 2013-04-30 | 2018-03-13 | Corning Incorporated | Apparatus and method for thermal profile control in an isopipe |
-
2012
- 2012-11-13 JP JP2012249305A patent/JP5958823B2/ja active Active
-
2013
- 2013-10-24 KR KR1020157000944A patent/KR102071366B1/ko active Active
- 2013-10-24 CN CN201380056195.5A patent/CN104854045B/zh active Active
- 2013-10-24 WO PCT/JP2013/078862 patent/WO2014077102A1/ja not_active Ceased
- 2013-10-24 EP EP13854877.1A patent/EP2921462B1/en active Active
- 2013-10-24 US US14/442,498 patent/US9701565B2/en active Active
- 2013-11-06 TW TW102140197A patent/TWI579139B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000281368A (ja) * | 1999-03-31 | 2000-10-10 | Shin Meiwa Ind Co Ltd | ガラス板の製造方法 |
| JP2011037685A (ja) * | 2009-08-17 | 2011-02-24 | Nippon Electric Glass Co Ltd | 素子封止体及びその製造方法並びに素子の封止方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160272532A1 (en) | 2016-09-22 |
| TW201425014A (zh) | 2014-07-01 |
| CN104854045B (zh) | 2017-12-19 |
| US9701565B2 (en) | 2017-07-11 |
| KR20150084755A (ko) | 2015-07-22 |
| JP2014097905A (ja) | 2014-05-29 |
| KR102071366B1 (ko) | 2020-01-30 |
| EP2921462A1 (en) | 2015-09-23 |
| JP5958823B2 (ja) | 2016-08-02 |
| WO2014077102A1 (ja) | 2014-05-22 |
| CN104854045A (zh) | 2015-08-19 |
| EP2921462A4 (en) | 2016-09-14 |
| EP2921462B1 (en) | 2018-03-28 |
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