KR102071366B1 - 유리판 적층체 및 그 제조 방법 - Google Patents

유리판 적층체 및 그 제조 방법 Download PDF

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Publication number
KR102071366B1
KR102071366B1 KR1020157000944A KR20157000944A KR102071366B1 KR 102071366 B1 KR102071366 B1 KR 102071366B1 KR 1020157000944 A KR1020157000944 A KR 1020157000944A KR 20157000944 A KR20157000944 A KR 20157000944A KR 102071366 B1 KR102071366 B1 KR 102071366B1
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South Korea
Prior art keywords
laser
glass plate
glass
melting
glass plates
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KR1020157000944A
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English (en)
Korean (ko)
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KR20150084755A (ko
Inventor
타카히데 후지이
나오토시 이나야마
Original Assignee
니폰 덴키 가라스 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B23/00—Re-forming shaped glass
    • C03B23/20—Uniting glass pieces by fusing without substantial reshaping
    • C03B23/24—Making hollow glass sheets or bricks
    • C03B23/245—Hollow glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/02—Annealing glass products in a discontinuous way
    • C03B25/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H01L51/524—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
KR1020157000944A 2012-11-13 2013-10-24 유리판 적층체 및 그 제조 방법 Active KR102071366B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-249305 2012-11-13
JP2012249305A JP5958823B2 (ja) 2012-11-13 2012-11-13 ガラス板積層体及びその製造方法
PCT/JP2013/078862 WO2014077102A1 (ja) 2012-11-13 2013-10-24 ガラス板積層体及びその製造方法

Publications (2)

Publication Number Publication Date
KR20150084755A KR20150084755A (ko) 2015-07-22
KR102071366B1 true KR102071366B1 (ko) 2020-01-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157000944A Active KR102071366B1 (ko) 2012-11-13 2013-10-24 유리판 적층체 및 그 제조 방법

Country Status (7)

Country Link
US (1) US9701565B2 (enExample)
EP (1) EP2921462B1 (enExample)
JP (1) JP5958823B2 (enExample)
KR (1) KR102071366B1 (enExample)
CN (1) CN104854045B (enExample)
TW (1) TWI579139B (enExample)
WO (1) WO2014077102A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6243641B2 (ja) * 2013-07-02 2017-12-06 三菱電線工業株式会社 ガラス構造体の製造方法
JP6631935B2 (ja) * 2015-01-05 2020-01-15 日本電気硝子株式会社 ガラス板の製造方法
JP2017186204A (ja) * 2016-04-07 2017-10-12 英興株式会社 シリカガラス溶接方法
US11203183B2 (en) 2016-09-27 2021-12-21 Vaon, Llc Single and multi-layer, flat glass-sensor structures
US11243192B2 (en) 2016-09-27 2022-02-08 Vaon, Llc 3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
US10821707B2 (en) * 2018-05-17 2020-11-03 Vaon, Llc Multi-layer, flat glass structures
KR102322397B1 (ko) * 2016-10-05 2021-11-05 니폰 덴키 가라스 가부시키가이샤 유리 수지 적층체의 제조 방법 및 유리 수지 적층체
WO2018147111A1 (ja) * 2017-02-07 2018-08-16 日本電気硝子株式会社 ガラスフィルムの製造方法
JP6931919B2 (ja) * 2017-08-31 2021-09-08 三星ダイヤモンド工業株式会社 ガラス基板の残留応力低減方法及びガラス基板の残留応力低減装置
JP6931918B2 (ja) * 2017-08-31 2021-09-08 三星ダイヤモンド工業株式会社 ガラス基板の端面処理方法及びガラス基板の端面処理装置
CN110627380A (zh) * 2019-09-16 2019-12-31 深圳市裕展精密科技有限公司 玻璃复合件、玻璃复合件的制备方法以及激光焊接设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281368A (ja) * 1999-03-31 2000-10-10 Shin Meiwa Ind Co Ltd ガラス板の製造方法
JP2008062263A (ja) 2006-09-06 2008-03-21 Imra America Inc 超短パルスレーザでの透明材料処理
WO2010097908A1 (ja) 2009-02-25 2010-09-02 セイコーインスツル株式会社 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2011037685A (ja) * 2009-08-17 2011-02-24 Nippon Electric Glass Co Ltd 素子封止体及びその製造方法並びに素子の封止方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3077462B2 (ja) * 1993-09-01 2000-08-14 日立電線株式会社 ガラスの切断方法
DE4444547C2 (de) * 1994-12-14 1997-02-27 Schott Rohrglas Gmbh Verfahren zum wärmeweichen Trennen von dünnwandigen Glasrohren oder -platten
AU2001227036A1 (en) 2000-01-31 2001-08-14 Touch Panel Systems K.K. Touch panel and method for using the same
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
JP4582502B2 (ja) * 2004-03-02 2010-11-17 日本電気硝子株式会社 タブレット一体型ガラス管
CN1693244A (zh) 2005-04-29 2005-11-09 陶礼德 玻璃真空板及其制造方法
DE102007008540A1 (de) * 2007-02-21 2008-08-28 Friedrich-Schiller-Universität Jena Verfahren zum Laser-gestützten Bonden, derart gebondete Substrate und deren Verwendung
JP5733600B2 (ja) 2009-07-03 2015-06-10 日本電気硝子株式会社 素子封止体の製造方法、及び素子封止体
TWI572480B (zh) * 2011-07-25 2017-03-01 康寧公司 經層壓及離子交換之強化玻璃疊層
WO2013039230A1 (ja) * 2011-09-15 2013-03-21 日本電気硝子株式会社 ガラス板切断方法
US9162919B2 (en) * 2012-02-28 2015-10-20 Corning Incorporated High strain point aluminosilicate glasses
US9914657B2 (en) * 2013-04-30 2018-03-13 Corning Incorporated Apparatus and method for thermal profile control in an isopipe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281368A (ja) * 1999-03-31 2000-10-10 Shin Meiwa Ind Co Ltd ガラス板の製造方法
JP2008062263A (ja) 2006-09-06 2008-03-21 Imra America Inc 超短パルスレーザでの透明材料処理
WO2010097908A1 (ja) 2009-02-25 2010-09-02 セイコーインスツル株式会社 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2011037685A (ja) * 2009-08-17 2011-02-24 Nippon Electric Glass Co Ltd 素子封止体及びその製造方法並びに素子の封止方法

Also Published As

Publication number Publication date
WO2014077102A1 (ja) 2014-05-22
EP2921462A4 (en) 2016-09-14
US20160272532A1 (en) 2016-09-22
JP2014097905A (ja) 2014-05-29
TW201425014A (zh) 2014-07-01
TWI579139B (zh) 2017-04-21
JP5958823B2 (ja) 2016-08-02
US9701565B2 (en) 2017-07-11
KR20150084755A (ko) 2015-07-22
CN104854045A (zh) 2015-08-19
EP2921462B1 (en) 2018-03-28
EP2921462A1 (en) 2015-09-23
CN104854045B (zh) 2017-12-19

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