CN104835772B - 一种qfn后贴膜球焊压板 - Google Patents

一种qfn后贴膜球焊压板 Download PDF

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CN104835772B
CN104835772B CN201510198631.3A CN201510198631A CN104835772B CN 104835772 B CN104835772 B CN 104835772B CN 201510198631 A CN201510198631 A CN 201510198631A CN 104835772 B CN104835772 B CN 104835772B
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pressing
bar
pressing plate
qfn
ball bonding
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CN104835772A (zh
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庄文凯
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75982—Shape

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本发明涉及一种QFN后贴膜球焊压板，它包括压板本体（1），所述压板本体（1）中心开设有压合窗口（5），所述压合窗口（5）左右两侧底部斜向下延伸设置有第二支撑块（8），所述第二支撑块（8）底部设置有纵向压合条（9），所述左右两侧纵向压合条（9）之间均匀设置有多条横向压合条（6），所述多条横向压合条（6）把纵向压合条（9）分成若干小段，所述每一小段纵向压合条底部设置有凸起部（12）。本发明一种QFN后贴膜球焊压板，结构简单，安装方便，不需要更改加工工艺，节约成本，压合效果更好，使用寿命长，使用稳定性好，可有效的解决QFN后贴膜框架管脚浮动问题，并有助于解决球焊第二点点断和作业性问题。

Description

一种QFN后贴膜球焊压板
技术领域
本发明涉及一种QFN后贴膜球焊压板，主要用于固定金属引线框架，在球焊过程中夹紧工作区域，使金属引线框架平整，属于半导体封装技术领域。
背景技术
在半导体封装的球焊工序生产过程中，如果球焊压板对QFN后贴膜框架的压合不够，会导致框架的管脚产生轻微浮动，从而影响作业过程中第二焊点的作业性，有虚焊、第二点针印不良和无法很好的自动化作业等缺陷。
目前封装厂在处理QFN后贴膜框架在球焊过程中管脚浮动的方法，主要是将球焊压板的窗口制作成网格状，做成三列开窗形式以增加其压合总体面积（参见图1）。但是采用三列开窗网格式球焊压板使用在QFN后贴膜框架的生产过程中会有以下缺点：
1、其球焊压板窗口中的直线条较薄，长期在机台温度循环的作用下易受热变形，从而影响整体压合，甚至引起压合点不稳而压伤框架；
2、在生产过程中难免会有框架沾污（装片胶，芯片残片等）的现象，会导致三列球焊压板的压合条损坏或者变形，从而影响压合效果；
3、三列网格式球焊压板的支撑不多，无法针对框架不平整（单元左右两边压合不稳）而进行压合的调节，寿命较短；
4、三列网格式球焊压板直线条较多，加工工艺较繁琐，加工成本比较高。
发明内容
本发明的目的在于克服上述不足，提供一种QFN后贴膜球焊压板，它能够为QFN后贴膜框架产品在球焊过程中提供平稳、安全、方便及自动化生产能力。
本发明的目的是这样实现的：一种QFN后贴膜球焊压板，它包括压板本体，所述压板本体中心开设有压合窗口，所述压合窗口左右两侧底部斜向下延伸设置有第二支撑块，所述第二支撑块位于压合窗口内侧，所述第二支撑块底部设置有纵向压合条，所述左右两侧纵向压合条之间均匀设置有多条横向压合条，所述多条横向压合条把纵向压合条分成若干小段，所述每一小段纵向压合条底部设置有凸起部，所述凸起部的高度为0.015~0.02mm。
所述压合窗口一侧设置有透气孔。
与现有技术相比，本发明具有以下有益效果：
1、本发明可有效的解决QFN后贴膜框架（尤其大颗产品）管脚浮动问题，并有助于解决球焊第二点点断和作业性问题；
2、本发明结构简单，安装方便，不需要更改加工工艺，节约成本。
3、与现有球焊压板压合相比，其压合更紧密，压合效果更好，使用寿命长，使用稳定性好。
附图说明
图1为目前QFN三列网格式球焊压板的结构示意图。
图2为本发明一种QFN后贴膜球焊压板的结构示意图。
图3为图2的横向剖视图。
图4为图3的I部放大图。
图5为图2的纵向剖视图。
图6为本发明一种QFN后贴膜球焊压板的工作状态示意图。
其中：
压板本体1
压合窗口5
横向压合条6
透气孔7
第二支撑块8
纵向压合条9
框架10
加热块11
凸起部12。
具体实施方式
参见图2~图6，本发明一种QFN后贴膜球焊压板，它包括压板本体1，所述压板本体1中心开设有压合窗口5，所述压合窗口5左右两侧底部斜向下延伸设置有第二支撑块8，所述第二支撑块8位于压合窗口5内侧，所述第二支撑块8底部设置有纵向压合条9，所述左右两侧纵向压合条9之间均匀设置有多条横向压合条6，所述多条横向压合条6把纵向压合条9分成若干小段，所述每一小段纵向压合条底部设置有凸起部12，所述凸起部12高度为0.015~0.02mm，所述压合窗口5一侧设置有透气孔7。
经过试验，纵向压合条凸出部分能够很好的压合左右两边，上下部分由直线条压合固定，支撑块体积增大延伸到框架压合面且加上改为单列窗口压合，有助于使用寿命大幅度提升。实际试验过程中体现对后贴膜压合效果较好，对于第二点焊线更稳定。

Claims (3)

1.一种QFN后贴膜球焊压板，其特征在于：它包括压板本体（1），所述压板本体（1）中心开设有压合窗口（5），所述压合窗口（5）左右两侧底部斜向下延伸设置有第二支撑块（8），所述第二支撑块（8）位于压合窗口（5）内侧，所述第二支撑块（8）底部设置有纵向压合条（9），所述左右两侧纵向压合条（9）之间均匀设置有多条横向压合条（6），所述多条横向压合条（6）把纵向压合条（9）分成若干小段，所述每一小段纵向压合条底部设置有凸起部（12）。
2.根据权利要求1所述的一种QFN后贴膜球焊压板，其特征在于：所述凸起部（12）高度为0.015~0.02mm。
3.根据权利要求1所述的一种QFN后贴膜球焊压板，其特征在于：所述压合窗口（5）一侧设置有透气孔（7）。
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CN107818933A (zh) * 2017-11-07 2018-03-20 上海飞骧电子科技有限公司 封装焊线加热组合单元及其进行封装的方法
CN110400758A (zh) * 2018-04-25 2019-11-01 无锡华润安盛科技有限公司 一种键合压板、键合方法及封装体

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CN204596772U (zh) * 2015-04-24 2015-08-26 江苏长电科技股份有限公司 一种qfn后贴膜球焊压板

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CN204160099U (zh) * 2014-09-15 2015-02-18 江苏长电科技股份有限公司 球焊机压焊夹具活动窗口开槽式固定组件
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